JPS6159862B2 - - Google Patents
Info
- Publication number
- JPS6159862B2 JPS6159862B2 JP8912980A JP8912980A JPS6159862B2 JP S6159862 B2 JPS6159862 B2 JP S6159862B2 JP 8912980 A JP8912980 A JP 8912980A JP 8912980 A JP8912980 A JP 8912980A JP S6159862 B2 JPS6159862 B2 JP S6159862B2
- Authority
- JP
- Japan
- Prior art keywords
- vibration
- workpiece
- tool
- cutting
- machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 7
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Automatic Control Of Machine Tools (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8912980A JPS5715653A (en) | 1980-07-02 | 1980-07-02 | Vibration detecting method for machine tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8912980A JPS5715653A (en) | 1980-07-02 | 1980-07-02 | Vibration detecting method for machine tool |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5715653A JPS5715653A (en) | 1982-01-27 |
| JPS6159862B2 true JPS6159862B2 (en, 2012) | 1986-12-18 |
Family
ID=13962267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8912980A Granted JPS5715653A (en) | 1980-07-02 | 1980-07-02 | Vibration detecting method for machine tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5715653A (en, 2012) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6982488B2 (en) | 1999-08-24 | 2006-01-03 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61103720A (ja) * | 1984-10-29 | 1986-05-22 | Isuzu Motors Ltd | 歯車仕上加工機におけるカツタ制御法 |
| US6719503B1 (en) * | 2001-09-07 | 2004-04-13 | Unova Ip Corp | Tuned damped absorber support |
| WO2024185699A1 (ja) * | 2023-03-03 | 2024-09-12 | 株式会社デンソー | 工具異常検出システム |
-
1980
- 1980-07-02 JP JP8912980A patent/JPS5715653A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US6982488B2 (en) | 1999-08-24 | 2006-01-03 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7211900B2 (en) | 1999-08-24 | 2007-05-01 | Amkor Technology, Inc. | Thin semiconductor package including stacked dies |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5715653A (en) | 1982-01-27 |
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