JPS6159352U - - Google Patents
Info
- Publication number
- JPS6159352U JPS6159352U JP14307884U JP14307884U JPS6159352U JP S6159352 U JPS6159352 U JP S6159352U JP 14307884 U JP14307884 U JP 14307884U JP 14307884 U JP14307884 U JP 14307884U JP S6159352 U JPS6159352 U JP S6159352U
- Authority
- JP
- Japan
- Prior art keywords
- cooling device
- immersion cooling
- condenser
- substrates
- boiling point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 6
- 238000009835 boiling Methods 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の浸漬冷却装置の一実施例を示
す要部縦断面図、第２図は第１図の浸漬冷却装置
の横断面図、第３図は従来の浸漬冷却装置を示す
縦断面図、第４図は第３図の浸漬冷却装置の横断
面図である。
１…きよう体、２…ガイド、３…支持板、４…
プリント板、６…発熱素子、７…低沸点冷媒、８
…凝縮器、９，１０…コネクタ、１１…ケーブル
、１２，２５…上昇流、１３，２６…落下流、２
１…前後側面板、２２…上昇流スペース、２３…
側面板、２４…下降流スペース、２７…下降流、
２８…潜行流。
Fig. 1 is a vertical cross-sectional view of essential parts showing an embodiment of the immersion cooling device of the present invention, Fig. 2 is a cross-sectional view of the immersion cooling device of Fig. 1, and Fig. 3 is a longitudinal cross-sectional view of a conventional immersion cooling device. 4 is a cross-sectional view of the immersion cooling device of FIG. 3; FIG. 1... body, 2... guide, 3... support plate, 4...
Printed board, 6... Heat generating element, 7... Low boiling point refrigerant, 8
...Condenser, 9,10...Connector, 11...Cable, 12,25...Upflow, 13,26...Downflow, 2
1... Front and rear side plates, 22... Updraft space, 23...
Side plate, 24...downflow space, 27...downflow,
28...Insidious current.
Claims (1)
浸漬して沸騰により発生する蒸気を凝縮器にて凝
縮する浸漬冷却装置において、隣合う前記基板は
向い合わせ又は背合わせに配置されており、前記
凝縮器は前記基板の背面側の上方に集中的に設け
られていることを特徴とする浸漬冷却装置。 In an immersion cooling device in which a plurality of substrates mounted with heating elements are immersed in a low boiling point refrigerant and vapor generated by boiling is condensed in a condenser, adjacent substrates are arranged facing each other or back to back, An immersion cooling device characterized in that the condenser is centrally provided above the back side of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984143078U JPH039338Y2 (en) | 1984-09-21 | 1984-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984143078U JPH039338Y2 (en) | 1984-09-21 | 1984-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6159352U true JPS6159352U (en) | 1986-04-21 |
| JPH039338Y2 JPH039338Y2 (en) | 1991-03-08 |
Family
ID=30701391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984143078U Expired JPH039338Y2 (en) | 1984-09-21 | 1984-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH039338Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51112460U (en) * | 1975-03-07 | 1976-09-11 | ||
| JPS53124774A (en) * | 1977-04-06 | 1978-10-31 | Hitachi Ltd | Printed circuit board cooling and mounting structure |
-
1984
- 1984-09-21 JP JP1984143078U patent/JPH039338Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51112460U (en) * | 1975-03-07 | 1976-09-11 | ||
| JPS53124774A (en) * | 1977-04-06 | 1978-10-31 | Hitachi Ltd | Printed circuit board cooling and mounting structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH039338Y2 (en) | 1991-03-08 |
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