JPS6159350U - - Google Patents
Info
- Publication number
- JPS6159350U JPS6159350U JP14307684U JP14307684U JPS6159350U JP S6159350 U JPS6159350 U JP S6159350U JP 14307684 U JP14307684 U JP 14307684U JP 14307684 U JP14307684 U JP 14307684U JP S6159350 U JPS6159350 U JP S6159350U
- Authority
- JP
- Japan
- Prior art keywords
- flow chamber
- cooling device
- immersion cooling
- substrate
- ascending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 7
- 238000007654 immersion Methods 0.000 claims description 7
- 239000003507 refrigerant Substances 0.000 claims description 2
- 230000001174 ascending effect Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000009835 boiling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の浸漬冷却装置の一実施例を示
す要部斜視図、第２図は第１図の浸漬冷却装置の
縦断面図、第３図は第１図の浸漬冷却装置の横断
面図、第４図は本考案の他の実施例を示す要部斜
視図、第５図は従来の浸漬冷却装置を示す縦断面
図、第６図は第５図の浸漬冷却装置の横断面図で
ある。
１…きよう体、２…ガイド、３…支持板、４…
プリント板、６…発熱素子、７…低沸点冷媒、８
…凝縮器、９，１０…コネクタ、１１…ケーブル
、１２，２６…上昇流、１３…落下流、２１…側
面板、２２…整流板、２３…前後側面板、２４…
上昇流室、２５…下降流室、２７…下降流。
Fig. 1 is a perspective view of essential parts showing an embodiment of the immersion cooling device of the present invention, Fig. 2 is a vertical sectional view of the immersion cooling device of Fig. 1, and Fig. 3 is a cross-sectional view of the immersion cooling device of Fig. 1. 4 is a perspective view of essential parts showing another embodiment of the present invention, FIG. 5 is a vertical sectional view showing a conventional immersion cooling device, and FIG. 6 is a cross section of the immersion cooling device shown in FIG. 5. It is a diagram. 1... body, 2... guide, 3... support plate, 4...
Printed board, 6... Heat generating element, 7... Low boiling point refrigerant, 8
... Condenser, 9, 10... Connector, 11... Cable, 12, 26... Upward flow, 13... Falling flow, 21... Side plate, 22... Rectifier plate, 23... Front and rear side plates, 24...
Upflow chamber, 25...downflow chamber, 27...downflow.
Claims (1)
する浸漬冷却装置において、前記基板の両面の周
囲に上昇流室と、該上昇流室に隣接して下降流室
とを画成すると共に、前記上昇流室と該下降流室
とが上部及び下部で相互に連通していることを特
徴とする浸漬冷却装置。 In an immersion cooling device that cools a substrate on which a heating element is mounted by immersing it in a refrigerant, an ascending flow chamber is defined around both sides of the substrate, and a descending flow chamber is defined adjacent to the ascending flow chamber; An immersion cooling device characterized in that the upward flow chamber and the downward flow chamber communicate with each other at upper and lower portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14307684U JPS6159350U (en) | 1984-09-21 | 1984-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14307684U JPS6159350U (en) | 1984-09-21 | 1984-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6159350U true JPS6159350U (en) | 1986-04-21 |
Family
ID=30701389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14307684U Pending JPS6159350U (en) | 1984-09-21 | 1984-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6159350U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01103854A (en) * | 1987-07-10 | 1989-04-20 | Hitachi Ltd | Cooling device for semiconductor and cooling method |
| US10999951B2 (en) | 2018-12-26 | 2021-05-04 | Fujitsu Limited | Electronic device and housing unit for electronic device |
| WO2023157717A1 (en) * | 2022-02-21 | 2023-08-24 | 株式会社デンソー | Cooling device |
-
1984
- 1984-09-21 JP JP14307684U patent/JPS6159350U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01103854A (en) * | 1987-07-10 | 1989-04-20 | Hitachi Ltd | Cooling device for semiconductor and cooling method |
| US10999951B2 (en) | 2018-12-26 | 2021-05-04 | Fujitsu Limited | Electronic device and housing unit for electronic device |
| WO2023157717A1 (en) * | 2022-02-21 | 2023-08-24 | 株式会社デンソー | Cooling device |
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