JPS6158278B2 - - Google Patents
Info
- Publication number
 - JPS6158278B2 JPS6158278B2 JP57230269A JP23026982A JPS6158278B2 JP S6158278 B2 JPS6158278 B2 JP S6158278B2 JP 57230269 A JP57230269 A JP 57230269A JP 23026982 A JP23026982 A JP 23026982A JP S6158278 B2 JPS6158278 B2 JP S6158278B2
 - Authority
 - JP
 - Japan
 - Prior art keywords
 - tape
 - wrapped
 - supply plate
 - claw
 - wound
 - Prior art date
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Expired
 
Links
Landscapes
- Nonmetal Cutting Devices (AREA)
 - Adhesive Tape Dispensing Devices (AREA)
 - Advancing Webs (AREA)
 
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP23026982A JPS59124599A (ja) | 1982-12-28 | 1982-12-28 | テ−プの送り込み切断巻付装置 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP23026982A JPS59124599A (ja) | 1982-12-28 | 1982-12-28 | テ−プの送り込み切断巻付装置 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS59124599A JPS59124599A (ja) | 1984-07-18 | 
| JPS6158278B2 true JPS6158278B2 (forum.php) | 1986-12-10 | 
Family
ID=16905148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP23026982A Granted JPS59124599A (ja) | 1982-12-28 | 1982-12-28 | テ−プの送り込み切断巻付装置 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPS59124599A (forum.php) | 
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS6327576U (forum.php) * | 1986-08-05 | 1988-02-23 | ||
| US6881615B2 (en) | 1988-09-28 | 2005-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for crystallizing semiconductor material without exposing it to air | 
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS6244866U (forum.php) * | 1985-09-07 | 1987-03-18 | ||
| JP2894933B2 (ja) * | 1993-12-08 | 1999-05-24 | 日特エンジニアリング株式会社 | テーピングユニット | 
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS56793B2 (forum.php) * | 1974-10-24 | 1981-01-09 | 
- 
        1982
        
- 1982-12-28 JP JP23026982A patent/JPS59124599A/ja active Granted
 
 
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS6327576U (forum.php) * | 1986-08-05 | 1988-02-23 | ||
| US6881615B2 (en) | 1988-09-28 | 2005-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for crystallizing semiconductor material without exposing it to air | 
| US7435635B2 (en) | 1988-09-28 | 2008-10-14 | Semiconductor Energy Laboratory Co., Ltd. | Method for crystallizing semiconductor material | 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPS59124599A (ja) | 1984-07-18 | 
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