JPS6158182A - Ic socket - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a dual in-line package type IC socket for mounting an integrated circuit.

[Technical background of the invention and its problems]

A conventional dual in-line knockage (hereinafter referred to as DIP) type IC socket has two rows of @poles 1a in one socket 1, as shown in FIG.

1b..., as shown in FIG.
One DIP socket 3 was used for each DIP IC2. In the figure, 4 is a circuit board (for example, a burn-in bead), 5 . . . is a mounted component such as a bypass capacitor, and S . . . is a terminal for circuit wiring. However, this DIP type IC socket has the following drawbacks.

(1) Since the length and width of the IC socket are fixed, the I
Different types of IC sockets are required depending on the size of C.

(2) A test device (1) in which the IC is operated by applying power, input signals, etc. in a tank set at a specific temperature by heating air with a heat generator and circulating the air using a blower. When used in a burn-in device (hereinafter referred to as a burn-in device), there is air circulation on the surface of the tool inserted into the socket, but the IC
Since the back surface is in contact with or close to the socket, there is almost no air circulation. Therefore, a temperature difference occurs between the front and back surfaces of the IC.

(3) A system that requires space for the pin-contact capacitor and external load that are mounted in correspondence with the IC inserted into the IC socket, as well as the space required for the test mounting board to change the power input/output line. , it was not possible to increase the packaging density.

[Purpose of the invention]

The present invention was made in view of the above circumstances, and can be commonly used for all DIP type ICs with different package sizes, improves component mounting density, and improves the ambient temperature distribution of actual devices. A process that can be used to stabilize the
The purpose is to provide sockets.

[Summary of the invention]

As shown in FIG. 1, the DIP-IC socket of the present invention has a convex cross section, and has a total of two rows of electrodes, each row of leads of a separate IC being inserted into and contacted with both stepped surfaces of the socket. As shown in FIG.
and a second socket piece (hereinafter referred to as a B-type socket piece) having a single row of electrode structure into which one row of leads are inserted and contacted. By using these socket pieces in combination, it is possible to - A plurality of DIP-IC sockets are configured on the card.

Furthermore, if these sockets are arranged as shown in Figure 4 to provide a space where other components can be mounted, wiring can be mounted and changed, and K is used for production, burn-in equipment, etc., the air on the back of the IC can be removed. By enabling circulation, it is effective for temperature distribution in the premises - chemotaxis, and it is possible to change the width G of the IC socket even with different DIP/IC sizes.
It becomes available for use.

Further, as shown in FIG. 2, the B-shaped socket piece has a single row groove structure with guide pins at both ends and several places in the middle to prevent the socket from tipping over or tilting.

Moreover, by adopting the beat IP/IC socket structure, it can be used in common for all DIP molds with different package sizes, and it also improves component mounting density and improves the performance of actual equipment C. It is possible to measure the constant ambient temperature distribution, etc.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

The structure of a socket according to an embodiment of the present invention is shown in FIGS. 1 and 2. In the present invention, there are two types of sockets: a doll socket piece 10 shown in FIGS. 1(a) to (c) and a B-shaped socket piece 20 shown in FIGS. 2(a) to (c). The pieces are used to form sockets for DIP type ICs in all package sizes. In the figure, 11..., 21.
. . . are electrodes into which the leads of the actual device C are inserted, and the A-shaped socket with a convex cross section shown in FIG.・・・
. It forms a structure in which ... is provided. 12... are terminals provided corresponding to the electrodes 11...K, and 22... are terminals provided corresponding to the electrodes 21...

In addition, the B-shaped socket piece 20 shown in FIG. 2 has terminals 22 arranged in parallel with the arrangement of terminals 22 provided corresponding to one row of electrodes 21, in order to prevent the socket from tipping over or tilting. Several idle leads 23... are provided.

3 to 5 respectively show the socket piece 10...
, 20... In the figure, 31 is the actual device O, 32 is the board (mounted board),
33 is a mounted component such as a pinox capacitor and an external load.

The B-type socket piece 20 shown in FIG.
To prevent the socket from tipping over and tilting due to O lead pressure,
Guide leads 23 are installed at both ends and in the middle of the socket.
It has a socket structure with one row of '1 holes with... attached to it,
As shown in FIG. 4, it is used at both ends of the mounting board 32.

The doll socket piece 10 shown in FIG. 1 has a socket structure with a convex cross section and two rows of electrodes, and as shown in FIG.
It is used for areas other than both ends of the mounting board 32.

Further, the IC insertion method is used to insert lead row M of IC-7 and lead row N of IC-2, as shown in FIG.

O and D of the A-type socket piece 10 shown in FIG. 1 and O and D of the B-type socket piece 20 shown in FIG. 2 have the same dimensions, and the dimension of D is as shown in FIG. capacitor,
When mounting parts such as external loads, the mounting height should be as high as possible, and there is no need to fix the socket length. Also,
As shown in FIG. 3, the pitch between the leads of E and F is the same, making it possible to connect sockets with the same width.

Figure 4 shows how to install parts such as sockets, capacitors, and external loads. Socket width G1 shown in No. 41.4
The socket length H is not fixed between the electrodes like the conventional socket shown in Figure 7, so by varying the dimensions G and H when mounting the socket board, all DIP
It can be used for type IC.

With this, conventionally, when mounting DIP/ICs of different sizes in sockets, the I
There was a problem in that a C socket had to be prepared, which increased the cost of the remaining sockets, but this inconvenience was solved and the connector piece 10 of each type of A type and B type...
, 20, etc. can be used with all DIP-ICs, reducing costs.

In addition, on the test mounting board, the space shown in Figure 4(b) can be used as a space for mounting components such as capacitors, and for changing power input/output wiring, and as shown in Figure 7. The mounting density can be greatly improved compared to the conventional mounting means shown in FIG.

This makes it possible to effectively utilize the mounting space of the board 32, thereby increasing the number of mounting tests per test and reducing the cost per IC.

When using a burn-in device, etc., in the conventional socket shown in Fig. 7, the part that was in a sealed state can be tested by raising C shown in Figs. 1 and 2 to a height that allows air to flow. I
Since air circulation on the front and back sides of C is possible, mounting IC
The ambient temperature distribution can be made constant.

〔Effect of the invention〕

As described in detail above, by using the machine 0 socket of the present invention, it can be used commonly for all DIP molds 0 with different cage sizes, and it is possible to improve the component mounting density. , the ambient temperature distribution of the mounted IC can be made constant.

[Brief explanation of drawings]

Figure 1 (,) to (c) and Figure 2 (a) to (C)
1(a) is a plan view showing a doll socket piece, and FIG.
b) is a side view of the same figure, Fig. 2(c) is a sectional view taken along the line A-A of Fig. 2(a), Fig. 2(,) is a plan view showing the B-shaped bracket and the top piece, and Fig. 2(b) ) is the same side view, the same figure (c) is the same figure (a)
It is a 1-fold view along the BB line. Figures 3 to 5 respectively show the mounting state of the socket in the above embodiment. Figure 3 is a diagram showing the connecting hole of the socket, and Figure 4 (a) is a plan view showing the IC mounting state. FIG. 5(b) is a sectional view taken along the line C-a in FIG. 5(a), and FIG. 5 is a diagram for explaining the IC mounting means. Figure 6(a) shows the conventional ■
A plan view showing the 0-socket Fin structure, the same figure (b) is the same side view, the same figure (C) is a cross-sectional view along the D-D line of the same figure (,),
FIG. 7(a) is a plan view showing an IC mounting state using a conventional socket, and FIG. 7(b) is a sectional view taken along line E-g in FIG. 7(a). 10... Doll socket piece (first socket piece), 20
...B-shaped socket piece (second socket piece), 11...
・、2ノ...、...electrode、12...、22...
,...terminals, 23...,... are idle leads. Applicant's agent Patent attorney Suzue Takehikofue 1 Mouth No. 30

Claims (3)

[Claims] (1) A first socket piece having a convex cross-section and having rows of electrodes each arranged in contact with leads of separate DIP ICs on both stepped surfaces formed parallel to the bottom surface of the socket piece; , an IC socket for a DIP type IC, which has an L-shaped cross section and includes a second socket piece having a stepped surface portion arranged with a row of electrodes that contact the DIP type IC lead. (2) The IC socket according to claim 1, wherein a guide pin is provided protruding from the bottom surface of the second socket piece. (3) The width of each of the stepped surface portions of the first and second socket pieces is set to 1/2 or less of the width of the mounted IC, and two socket pieces placed adjacent to each other are mounted on the socket pieces. I
2. The IC socket according to claim 1, wherein a gap is formed between the IC socket and the back surface of the IC socket.