JPH04269483A - Electronic part mounting socket - Google Patents

Abstract

PURPOSE:To provide an electronic part mounting socket for inserting and mounting the lead of an electronic part to be mounted on a printed wiring board, which allows the high density mounting of electronic parts, facilitates the adding and changing work of the electronic parts, and allows to carry out the test inspection in the state where all the electronic parts are electrified. CONSTITUTION:A slender rectangular parallelepedic housing 21 separable into plug units by V-shaped groove 22 parts arranged on side walls, a plug array 20 having terminals 25 to be inserted and fitted to through holes 9 protruded and arranged on the lower end surface of the respective plug units, a slender rectangular parallelepedic housing 11 separable into socket units by V-shaped groove 12 parts arranged on the side walls, a socket array 10 having contact shoes 15 in which the leads of electronic parts are inserted and fitted, and flexible cables 30 for connecting the terminals 25 of the plug units and the corresponding contact shoes 15 of the socket units are provided.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting socket into which leads of electronic components to be mounted on a printed wiring board are inserted.

[0002] Printed wiring boards mounted on recent electronic devices are required to have high-density packaging of circuit components such as semiconductor devices.

0003

2. Description of the Related Art In response to the demand for high-density packaging, circuit components 3 have conventionally been mounted on a printed wiring board 1 at a high density, as shown in FIG. On the other hand, a large circuit component such as a semiconductor device 2 has a pair of tall IC sockets 5 mounted on a printed wiring board 1, and the semiconductor device 2 is mounted so as to bridge the pair of IC sockets 5.

[0004] A short and small circuit component 4 such as a capacitor, a resistor, or an IC is mounted between the IC sockets 5 below the semiconductor device 2 in a so-called two-story mounting.

[0005] Another solution is shown in FIG. In FIG. 9, 1-2 is a sub-printed wiring board that is smaller in shape than printed wiring board 1. In FIG. Spacing posts 7 are planted on the printed wiring board 1 corresponding to each of the four corners of the sub-printed wiring board 1-2, and the sub-printed wiring board 1-2 is placed on the spacing posts 7 with the mounting surface facing downward. and sub-printed wiring board 1-2
By inserting machine screws into the holes and screwing them into the screw holes of the spacing column 7, the sub printed wiring board 1-2 is mounted and fixed in parallel to the printed wiring board 1, resulting in so-called stack mounting.

Note that the printed wiring board 1 and the sub printed wiring board 1-
2 through a flexible printed board (not shown) or the like.

[0007]

[Problems to be Solved by the Invention] In order to additionally mount electronic components in both of the above-mentioned printed wiring board structures, it is necessary to provide an area on the printed wiring board that will be occupied by the expected additional components as an empty area. A pattern or through hole was previously provided in the empty area.

[0008] That is, in the conventional mounting structure, there was a possibility that higher density would be hindered. In addition, without creating the above-mentioned empty area, it is possible to search for a soldering point from a predetermined through hole or pattern to be additionally mounted, solder the lead wire, and then add the end of the lead wire to the electronic component to be additionally mounted. It was connected to the lead. Such means not only make it difficult to additionally mount electronic components, but also pose a risk that appropriate soldering locations may not be found.

On the other hand, when testing and inspecting mounted components, in the former case, that is, the two-story mounting structure, the circuit components mounted below cannot be inspected unless the semiconductor device mounted via the IC socket is removed. Therefore, there is a problem in that the connection circuit between the semiconductor device and the circuit component is disconnected.

In the latter case, that is, in the stack mounting structure, even if the sub-printed wiring board is removed from the spacing column, the printed wiring board and the sub-printed wiring board are connected through the flexible printed board. Therefore, it is possible to test and inspect electronic components mounted on the printed wiring board and the sub-printed wiring board in a energized state.

However, since the sub-printed wiring board is removed and attached by turning a large number of screws, there is a problem in that the setup for testing and inspection is troublesome. The present invention was created in view of these points, and enables high-density mounting of electronic components, facilitates the addition and replacement of electronic components, and allows testing and inspection of all electronic components to be carried out in a energized state. The purpose is to provide a socket for mounting electronic components.

0012

[Means for Solving the Problems] In order to achieve the above object, the present invention provides V
An elongated rectangular parallelepiped housing 21 that can be separated into individual plugs 20X at the groove 22, and terminals 25 for insertion into the through holes 9 of the printed wiring board 1 protrude and are arranged on the lower end surface of each individual plug 20X. A plug array 20 consisting of terminals 25 is provided.

On the other hand, there is an elongated rectangular parallelepiped housing 11 that can be separated into individual sockets 10X by V-shaped grooves 12 arranged on the side wall, and leads of electronic components are inserted inside the housing of each socket unit 10X. A socket array 10 consisting of contacts 15 is provided.

The terminal 25 of the plug unit 20X and the corresponding contactor 15 of the socket unit 10X are connected by a flexible electric wire 30. In addition, as shown in FIG. 3, there is also an elongated rectangular parallelepiped housing 21 that can be separated into a single plug 20X by V-shaped grooves 22 arranged on the side wall, and a housing 21 for insertion into the through hole 9 of the printed wiring board 1. terminal 25
A plug array 20 consisting of terminals 25 projected and arranged is provided on the lower end surface of each plug unit 20X.

On the other hand, in the V-shaped grooves 12 arranged on the side wall, the socket alone 10-1X or the socket alone 10-2X
A pair of sockets consisting of an elongated rectangular parallelepiped-shaped housing 11 that can be separated into two parts, and a contactor 15 that is installed inside the housing of each socket unit 10-1X or socket unit 10-2X and into which leads of electronic components are inserted. Arrays 10-1 and 10-2 are provided.

[0016] A flexible electric wire 30-1 or a flexible electric wire is connected between the terminals 25 of the individual plugs of the plug array 20 and the contacts 15 of the corresponding individual sockets of the socket arrays 10-1 and 10-2. 30-2 is connected.

Alternatively, the above-mentioned flexible electric wire may be constructed from a flexible printed board. Furthermore, each of the above-described plug arrays 20 is a press-fit type terminal. In addition, as illustrated in FIG. 5, the socket array 1
Side wall of each single socket of 0 and plug array 2
A protrusion 28 is provided on the side wall of each individual plug of 0.
will be established.

On the other hand, supporter element plates 55 each having a hole 51 in its center are connected to a supporter plate 50 in a vertical line via a V-shaped groove 52. Then, the holes 51 of the lower supporter element plate 55 of the supporter plate 50 are fitted into the projections 28 of the plug array 20, and the holes 51 of the uppermost supporter element plate 55 are fitted into the projections 28 of the socket array 10. A socket array 10 and a plug array 20 are configured to be detachably connected.

[0019]

[Operation] According to the present invention, as illustrated in FIG. 2, each plug array 20 of a pair of electronic component mounting sockets
are mounted on a printed wiring board 1 facing each other at a predetermined interval, and a relatively large electronic component (for example, a semiconductor device 2) is plugged into a pair of socket arrays 10 facing each other so as to be bridged. Can be done.

That is, since other circuit components 3 can be mounted in the area between the pair of plug arrays 20 on the printed wiring board 1, the mounting density of electronic components can be substantially increased. Further, since the socket array and the plug array are connected by flexible wires, the electronic component mounted in the socket array by plug-in can be moved laterally while remaining energized. Therefore, it is possible not only to test and inspect the large electronic component itself, but also to visually inspect the circuit component 3 mounted below the electronic component.

Note that since the electronic components mounted on the socket array 10 are plugged in, maintenance and replacement of these electronic components is easy. On the other hand, according to the invention of claim 2, FIG.
As illustrated in , plug units 20A and 20B are mounted on the printed wiring board 1, and one socket unit 10-1A is connected to one plug unit 20A, and one socket unit 10-1B is connected to the other plug unit 20B.
The circuit component 4-1 is mounted so as to be bridged with the other socket unit 10-2 connected to one plug unit 20A.
A and the other socket unit 10-2B connected to the other plug unit 20B are connected to other circuit components 4-
2A can be implemented.

That is, it is easy to additionally mount electronic components in parallel. Further, according to the invention of claim 3, as illustrated in FIG.
0 and the socket array 10 are connected. Therefore, the position of the electronic component mounted plug-in so as to bridge the pair of socket arrays is fixed.

[0023]

[Example] Fig. 1 is a diagram showing the principle of claim 1, Fig. 2 is a perspective view of an embodiment of the invention, Fig. 3 is a diagram showing the principle of the invention of claim 2, and Fig. 4 is a diagram showing another embodiment of the invention. 5 is a perspective view of the embodiment of the invention according to claim 3, (A) is a perspective view of the supporter plate, (B) is a side view of the plug array, and (C) is a side view when mounted. , Figure 6 is a detailed diagram of the plug array, (A)
(B) is a perspective view shown in separated form, (B) is a side sectional view, (
C) is a perspective view of key points, FIG. 7 is a detailed view of the socket array, (A) is a perspective view shown in separated form, and (B) is a perspective view of the socket array.
is a cross-sectional view of key points.

In FIG. 1, reference numeral 21 denotes a molded housing 21 in the shape of an elongated rectangular parallelepiped. The housing 21 has V-shaped grooves 22 at equal pitches on each of the left and right side walls.
By bending this V-shaped groove 22 portion, the plug can be separated into a single plug 20X.

A terminal 25 connected to the end of the coated flexible electric wire 30 is provided in the housing of each plug unit 20X, and its lower part protrudes from the lower end surface of the plug unit 20X. A plug array 20 is constructed by being inserted into the through hole 9 and soldered.

Although the flexible electric wire 30 may be a single wire without any problem, it is preferable to use a flexible printed board because the connection workability is good and the wiring can be arranged. Furthermore, the terminals 25 of the plug array 20 can be connected to the printed wiring board 1 of the plug array 20 by press-fitting them into the through holes 9 and making them terminals that are connected to the inner wall conductors of the through holes, so-called press-fit type terminals. installation becomes easier.

On the other hand, reference numeral 11 denotes a molded housing 11 in the shape of an elongated rectangular parallelepiped. The housing 11 is
V-shaped grooves 12 are provided on each of the left and right side walls at equal pitches, and by bending the V-shaped grooves 12, the socket can be separated into individual sockets 10X.

The socket array 10 is constructed by providing a hole in the housing of each socket 10X with an opening at the top, placing a contact 15 in the hole, and plugging in the lead of an electronic component. .

Note that the lower part of the contactor 15 is connected to a flexible electric wire 30 (
or the wires of a flexible printed board). The electronic component mounting socket constructed of the socket array 10, plug array 20, and flexible wire 30 as described above is used, for example, as shown in FIG. 2.

In FIG. 2, reference numeral 2 denotes a semiconductor device which is a relatively large electronic component. To mount this semiconductor device 2 on the printed wiring board 1, a pair of electronic component mounting sockets according to the present invention are used.

The respective terminals of one plug array 20 are inserted into corresponding through holes and mounted on the printed wiring board 1, and the other plug array 20 is placed at a position facing the former with a predetermined interval. Each terminal is inserted into a corresponding through hole and mounted on a printed wiring board 1.

[0032]The semiconductor device 2 is then mounted on the electronic component mounting socket by bridge-linking the semiconductor device 2 to a pair of socket arrays 10 facing each other and plugging the leads 8 into the contacts.

Other circuit components 3 are mounted in the area between the pair of plug arrays 20 mounted on the printed wiring board 1. Therefore, electronic components are mounted on the printed wiring board 1 in multiple stages, resulting in substantially high-density mounting.

Furthermore, since the socket array 10 and the plug array 20 are connected by the flexible printed board 31, the semiconductor device 2 mounted on the pair of socket arrays 10 by plug-in can be moved sideways while still being energized. Can be done. Therefore, it is possible not only to test and inspect the large electronic component itself, but also to visually inspect the circuit component 3 mounted below the electronic component.

The structure of the plug array will be described in detail below with reference to FIG. In FIG. 6, the housing 21 includes two
a female housing half 21-1 that is divided and has a recess 24 in the dividing surface of the housing of each plug;
A recess 24 is formed on the dividing surface of the housing of each individual plug.
A male housing half 21-2 has a protrusion (not shown) that fits into the housing half 21-2, and a V-shaped groove 22 is formed on the outer side wall of each housing half 21-1, 21-2.
is provided.

Terminals 25 are formed by insert molding on the dividing surface of the housing half 21-1 to extend vertically through each plug. The terminal 25 includes an elongated plate-shaped main body part 25a embedded in the housing half body 21-1, and a main body part 25a.
It consists of a pin part 25b whose lower part extends and projects from the lower end surface of the housing, and a pressure contact 25c which is formed perpendicularly to the upper part of the main body part 25a and has a slit running horizontally along the center line.

[0037] Therefore, the flexible printed board 31
When the lower end of the housing half body 21-1 and the housing half body 21-2 are sandwiched, and the protrusion of the housing half body 21-2 is press-fitted into the corresponding recess 24 of the housing half body 21-1, both parts are separated. The surfaces of the flexible printed board 31 are brought into close contact and fixed together, and the wire 32 of the flexible printed board 31 is press-fitted into the slit of the pressure contact 25c, thereby connecting the wire 32 and the terminal 2.
5 is connected.

Next, the structure of the socket array will be described in detail with reference to FIG. In FIG. 7, the housing 22 includes two
Female housing half 11- which is divided and has a recess 14-1 in the dividing surface of each socket housing.
1, and a male housing half 11-2 having a protrusion 14-2 that fits into the recess 14-1 on the dividing surface of the housing of each socket, and each of the housing halves 11-1, 11 A V-shaped groove 12 is provided on the outer side wall of -2.

[0039] On the divided surface of the housing half body 11-1, a contact 15 that vertically passes through each socket is molded by insert molding. The contact 15 is connected to the housing half 11
A cylindrical main body part 15a embedded in -1 and a main body part 1
An elongated plate part 15b whose lower part is extended, and a plate part 1
The pressure contact 15c is formed perpendicularly to the lower part of the contact 5b and has a slit running horizontally along the center line.

On the other hand, numeral 16 is a cylindrical plug made of a metal material into which leads of electronic components are inserted. The plug body 16 is composed of an upper part that is press-fitted into the cylinder of the main body part 15a, and a lower part in the shape of a tapered conical cylinder having a plurality of notches.
6 is press-fitted into the cylinder of the main body 15a of the contactor 15.

On the other hand, the upper end of the flexible printed board 31 is connected to the housing half 11-1 and the housing half 11-1.
2 and the protrusion 14-2 of the housing half 11-2.
When the housing half 11-1 is press-fitted into the recess 14-1 of the corresponding housing half 11-1, the two divided surfaces are brought into close contact and fixed together, and the wire 32 of the flexible printed board 31 is press-fitted into the slit of the pressure contact 15c. Then, the wire 32 and the terminal 15 are connected.

When the leads of electronic components are inserted into the contacts 15 of the socket array 10 assembled in this way,
Since the plug body 16 removably holds the lead, the lead and the contact 15 are connected.

The invention of claim 2 will be explained with reference to FIG. In FIG. 3, the plug array 20 has a housing 2 in the shape of an elongated rectangular parallelepiped, which is molded as described above.
1, the housing 21 is provided with V-shaped grooves 22 at equal pitches on each of the left and right side walls, and can be separated into individual plugs 20X by bending the V-shaped grooves 22.

[0044] Two coated flexible electric wires 30-1, 3 are placed inside the housing of each plug unit 20X.
A terminal 25 connected to the terminal 0-2 is provided, the lower part of which protrudes from the lower end surface of the plug unit 20X, and is inserted into the through hole 9 of the printed wiring board 1 and soldered.

Although the flexible electric wires 30-1 and 30-2 can be made of single wires, it is preferable to use a flexible printed board because the connection workability is good and the wiring can be arranged. Furthermore, the terminal 25A of the plug array 20,
By using a so-called press-fit type terminal, mounting of the plug array 20 on the printed wiring board 1 becomes easier.

On the other hand, 10-1 and 10-2 are a pair of socket arrays having the same shape. The socket array 10-1 includes a molded elongated rectangular parallelepiped housing 11.
The housing 11 has V-shaped grooves 12 provided at equal pitches on each of the left and right side walls, and can be separated into individual sockets 10-1X by bending the V-shaped grooves 12. .

A hole opening at the top is provided in the housing of each socket unit 10-1X, and the contact 1 is inserted into this hole.
A socket array 10-1 is constructed by installing a socket 5 inside and plugging leads of electronic components thereinto.

The lower portions of the contacts 15 of the socket array 10-1 are connected to flexible electric wires 30-1 connected to the corresponding terminals 25 of the plug array 20. The socket array 10-2 has the same structure, and its housing 11 can be separated into individual sockets 10-2X. The lower portions of the contacts 15 of the socket array 10-2 are connected to flexible electric wires 30-2 connected to the corresponding terminals 25 of the plug array 20.

As described above, the socket array 10-1, 1
0-2, plug array 20 and flexible electric wire 30-1,
The electronic component mounting socket composed of 30-2 is
For example, it is used as shown in FIG.

FIG. 4 shows an example in which a circuit component 4-2 is additionally mounted in parallel to a circuit component 4-1. plug array 20
is separated into a single plug 20A and a single plug 20B, and flexible printed boards 31-1, 31-2
Correspondingly, the socket array 10-1 is divided into a single socket 10-1A and a single socket 10-1B, and the socket array 10-2 is divided into a single socket 10-2A and a single socket 10-2B. It is separated into

The terminals of the plug unit 20A and the plug unit 20B are inserted into the respective through holes and mounted on the printed wiring board 1. Then, the circuit component 4-1 inserts each lead 8 into the contact so as to bridge the socket unit 10-1A and the socket unit 10-1B, and the other circuit component 4-2 connects the socket unit 10-1A to the socket unit 10-2A. Each lead 8 is inserted into the contact so as to bridge the socket unit 10-2B.

In FIG. 5, 28 is the socket array 1
These pin-shaped protrusions each have an elastic head and are provided on the side wall of the single socket of 0 and the side wall of the single plug of plug array 20, respectively.

[0053] Reference numeral 50 is a rectangular support plate made of synthetic resin whose width is equal to the width of a single socket (the width of a single plug is equal to the width of a single socket). By providing parallel V-shaped grooves 52,
Supporter element plates 55 are arranged vertically in a line. A hole 51 into which the protrusion 28 can be fitted is provided in the center of each supporter element plate 55.

On the other hand, each terminal of the plug array 20 is inserted into the corresponding through hole and mounted on the printed wiring board 1, and the other plug array 20 is placed at a position opposite to the former with a predetermined interval. Each terminal is inserted into a corresponding through hole and mounted on a printed wiring board 1. and,
The semiconductor device 2 is mounted on an electronic component mounting socket by bridge-linking the semiconductor device 2 to a pair of socket arrays 10 facing each other and plugging the leads 8 into the contacts. Further, other circuit components 3 are mounted in the area between the pair of plug arrays 20 mounted on the printed wiring board 1.

As shown in FIG. 5C, a plurality of supporter plates 50 having the same number of supporter element plates 55 are formed in the V-shaped groove 52, and the holes 51 of the lower supporter element plates 55 of the supporter plates 50 are formed. , plug array 20 on printed wiring board 1
By fitting the hole 51 of the uppermost supporter element plate 55 into the protrusion 28 of the socket array 10, the socket array 10 and the plug array 20 are removably connected. A semiconductor device 2 is held and fixed above.

[0056]

As described above, by using the electronic component mounting socket of the present invention, electronic components can be mounted on a printed wiring board at high density. In addition, it is easy to add and replace electronic components, and tests and inspections can be carried out with all electronic components energized, which is an excellent practical effect.

[Brief explanation of the drawing]

[Figure 1] Diagram showing the principle of claim 1

[Figure 2] Perspective view of an embodiment of the present invention

[Figure 3] Diagram showing the principle of the invention of claim 2

[Figure 4]
A perspective view of another embodiment of the invention

FIG. 5 is a diagram of an embodiment of the invention of claim 3, in which (A) is a perspective view of a supporter plate (B
) is a side view of the plug array (C) is a side view when mounted

[Figure 6] Detailed view of the plug array, (A) is a perspective view showing the separated form (B) is a side sectional view (C) is a perspective view of key points

[Figure 7] Detailed view of the socket array; (A) is a perspective view showing the isolated form; (B) is a cross-sectional view of key points.

[Figure 8] Perspective view of conventional example

[Figure 9] Perspective view of another conventional example

[Explanation of symbols]

1 printed wiring board,
2 semiconductor devices, 3 circuit components,
4-1, 4-2 Circuit parts, 10, 10-1, 10
-2 Socket array, 20 Plug array, 20X, 20A, 20B Single plug, 11, 21 Housing, 12, 22, 52 V-shaped groove,
30, 30-1, 30-2 Flexible electric wire, 31 Flexible printed board,
25 terminal, 15 contactor,
50 Supporter plate, 55 Supporter element plate, 51 Hole, 2
8 protrusion, 10X, 10-1X, 10-2X, 10-
1A, 10-1B, 10-2A, 10-2B socket alone,

Claims (3)

[Claims] Claim 1: A slender rectangular parallelepiped housing (
21), and the terminals (25
) and a plug array (20) having Vs arranged on the side wall.
An elongated rectangular parallelepiped housing (11) that can be separated into individual sockets at the groove (12), and contacts for inserting leads of electronic components, which are installed in holes parallel to each other in the upper end surface of each socket. A socket array (10) having a contact (15), and a flexible electric wire (30) connecting between the terminal (25) of the plug and the corresponding contact (15) of the socket. A socket for mounting electronic components. 2. An elongated rectangular housing (
21), and terminals (
25), an elongated rectangular parallelepiped housing (11) that can be separated into individual sockets by the V-shaped grooves (12) arranged on the side wall, and parallel parallelepipeds on the upper end surface of each socket. A pair of socket arrays (10-1, 10-2) each having a contact (15) installed in a hole in which a lead of an electronic component is inserted, a terminal (25) of the plug alone, and the socket of both. Array (10
-1, 10-2) Corresponding socket single contact 1
Flexible electric wires (30-1, 30-2) connecting between the sockets for mounting electronic components. 3. Projections (28) formed on the side walls of the individual sockets of the socket array (10) and the side walls of the individual plugs of the plug array (20) according to claim 1 or 2, and the respective centers. A supporter element plate (55) having a hole (51) in the portion thereof is provided with a supporter plate (50) connected in a vertical line through a V-shaped groove (52),
The lower supporter element plate (55) of the supporter plate (50)
The hole (51) is inserted into the protrusion (28) of the plug array (20).
into the hole (51) of the uppermost supporter element plate (55).
) is fitted onto the protrusion (28) of the socket array (10), whereby the socket array (10) and the plug array (20) are removably connected. socket.