JPS6157906B2 - - Google Patents
Info
- Publication number
- JPS6157906B2 JPS6157906B2 JP18206981A JP18206981A JPS6157906B2 JP S6157906 B2 JPS6157906 B2 JP S6157906B2 JP 18206981 A JP18206981 A JP 18206981A JP 18206981 A JP18206981 A JP 18206981A JP S6157906 B2 JPS6157906 B2 JP S6157906B2
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- plating
- cover
- plated
- vacuum chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 238000001704 evaporation Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 239000007769 metal material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Description
本発明は、真空蒸着法、イオンプレーテイング
法等に用いられる真空メツキ装置において、真空
メツキ対象物である被メツキ材以外に飛来するメ
ツキ金属蒸気を回収するための装置に関するもの
である。
一般に真空中で、コバルト，コバルト合金等の
蒸発材料４を蒸発源となるるつぼ３で加熱するこ
とにより蒸発させ、このメツキ金属蒸気を鋼スト
リツプなどの被メツキ材５の表面に飛来させ、被
メツキ材５の表面上に、前記金属の真空メツキ層
を形成ささせる真空メツキ装置において、メツキ
金属蒸気流の飛散面積が、被メツキ材表面のメツ
キ金属蒸気衝突面積より大きいため、メツキ金属
蒸気の大部分は、被メツキ材５へ付着せず、無効
なメツキ金属蒸気として、真空槽内１で飛散し、
その結果、真空メツキ材料の歩留りの低下をまね
く。また、前記した無効な金属蒸気は、真空槽内
の付属設備や真空槽１壁に飛来し、蒸着層として
蓄積する。この蓄積し、付着した金属層は、連続
して長時間真空メツキ装置を操業させた際には、
量的に多大となり、真空操作中の粉塵の要因とな
る。そこで品質の安定化を図るために各操業毎に
その蓄積した蒸着層を除去する必要がある。ま
た、真空メツキ法の材料歩留りの向上を図るため
には、前記した真空槽内の付属設備や真空槽壁の
表面に蓄積した金属層を回収し、真空メツキに適
した状態の蒸発材料４に再生した後、再使用する
ことが適切である。又、回収効率を上げるために
は粉末状態よりも層状に積層した状態の方が有利
である。
従来、この対策としては、すなわち第１図に示
すようにクロムメツキ鋼板等の金属平板を用い、
真空槽１内の付属設備や真空槽１壁の形状に合う
カバー２を設け、このカバー２表面上に無効メツ
キ金属蒸気を層状に付着させて、この蓄積した金
属層が、量的に増加した時点で、真空メツキの操
業を停止し、新しいカバー２と交換して、再び操
業を行なう方法がとられていた。
しかしながら、上記方法によれば、カバー２表
面に蓄積した金属材料層をカバー２表面から除去
する際に機械的衝撃等を用いて剥離しなければな
らないために、その金属材料層は粉末状態で剥離
すると同時に、カバー２表面にも多くの起伏が生
じ、カバー２の再使用が困難となる。さらに粉末
状態のため回収効率の低下、作業環境の低下とい
う欠点を有していた。
本発明は、上記の従来の欠点を改善するもので
あり、機械的衝撃等を必要とせず、容易に、真空
槽壁、真空槽内付属設備表面およびカバー表面に
蓄積した金属層を層状で剥離することが可能であ
る方法および装置を提供するものである。
以下、本発明の一実施例を第２図により詳細に
説明する。６は、無効真空メツキ金属蒸気を捕獲
するためのカバー、７はカーボン皮膜である。カ
ーボン皮膜７は、粒径0.5μｍ程度のカーボン粉
末、エポキシ樹脂及び溶剤を混ぜ合わせたペース
ト状のものを塗布することによつて形成した。上
記構成において、被メツキ材を樹脂フイルム、真
空メツキ材料をコバルト合金とし、真空メツキを
実施した。真空メツキ終了後、無効メツキ金属蒸
気を捕獲したカーボン皮膜で覆われたカバー６か
ら無効金属蒸気付着層を剥離するためには、０〜
0.028Kg／mm2の小さい衝撃力で容易に剥離するこ
とができた。すなわち、機械的衝撃をほとんど与
えずに容易に剥離，回収することができた。本発
明の効果を明確にするために従来から使用されて
いるカバー２材質，鋼板，銅板，ステンレス，ク
ロムメツキ鋼板，ニツケルメツキ鋼板、銅メツキ
鋼板について、同様のテストを実施した。その比
較検討結果を第１表に示す。第１表において、
0.028Kg／mm2の衝撃力によつて剥離しないものを
×印で示し、０〜0.028Kg／mm2の間で剥離するも
のを〇印で示す。この結果より、カーボン皮膜が
形成されたカバーが、無効真空メツキ材料回収板
として、非常に有効であることを示す。
The present invention relates to a vacuum plating apparatus used in vacuum evaporation methods, ion plating methods, etc., for collecting plating metal vapor that flies away from materials other than the material to be vacuum plated. Generally, in a vacuum, an evaporation material 4 such as cobalt or cobalt alloy is evaporated by heating it in a crucible 3 serving as an evaporation source, and this plating metal vapor is flown onto the surface of a material 5 to be plated such as a steel strip, and the material 4 to be plated is In the vacuum plating device that forms the vacuum plating layer of metal on the surface of the material 5, the scattering area of the plating metal vapor flow is larger than the collision area of the plating metal vapor on the surface of the material to be plated. The part does not adhere to the material to be plated 5 and scatters in the vacuum chamber 1 as an ineffective plating metal vapor,
As a result, the yield of vacuum plating material decreases. Moreover, the above-mentioned ineffective metal vapor flies to the attached equipment in the vacuum chamber and the wall of the vacuum chamber, and accumulates as a vapor deposited layer. This accumulated and adhered metal layer is removed when the vacuum plating equipment is operated continuously for a long time.
The amount is large and causes dust during vacuum operation. Therefore, in order to stabilize the quality, it is necessary to remove the deposited layer after each operation. In addition, in order to improve the material yield of the vacuum plating method, the metal layer accumulated on the attached equipment in the vacuum chamber and the surface of the vacuum chamber wall is recovered, and the evaporation material 4 is converted into a material suitable for vacuum plating. After playing, it is appropriate to reuse. In addition, in order to increase recovery efficiency, it is more advantageous to use a layered state than a powder state. Conventionally, as a countermeasure for this, a flat metal plate such as a chrome-plated steel plate was used, as shown in Figure 1.
A cover 2 that matches the shape of the attached equipment in the vacuum chamber 1 and the wall of the vacuum chamber 1 is provided, and a layer of ineffective plating metal vapor is deposited on the surface of the cover 2, so that the accumulated metal layer is increased in quantity. At that point, the vacuum plating operation was stopped, the cover 2 was replaced with a new one, and the operation was started again. However, according to the above method, when removing the metal material layer accumulated on the surface of the cover 2, the metal material layer must be peeled off using mechanical impact or the like, so the metal material layer is peeled off in a powder state. At the same time, many undulations occur on the surface of the cover 2, making it difficult to reuse the cover 2. Furthermore, since it is in a powdered state, it has the drawbacks of reduced collection efficiency and poor working environment. The present invention improves the above-mentioned conventional drawbacks, and can easily peel off the metal layer accumulated on the vacuum chamber wall, the surface of the attached equipment in the vacuum chamber, and the cover surface in layers without requiring mechanical impact or the like. The present invention provides a method and apparatus that can perform the following steps. Hereinafter, one embodiment of the present invention will be explained in detail with reference to FIG. 6 is a cover for capturing ineffective vacuum plating metal vapor, and 7 is a carbon film. The carbon film 7 was formed by applying a paste made by mixing carbon powder with a particle size of about 0.5 μm, an epoxy resin, and a solvent. In the above configuration, vacuum plating was performed using a resin film as the material to be plated and a cobalt alloy as the vacuum plating material. After vacuum plating is completed, in order to peel off the ineffective metal vapor adhesion layer from the cover 6 covered with the carbon film that has captured the ineffective plating metal vapor,
It could be easily peeled off with a small impact force of 0.028Kg/mm 2 . That is, it could be easily peeled off and recovered with almost no mechanical impact. In order to clarify the effects of the present invention, similar tests were conducted on cover 2 materials conventionally used: steel plate, copper plate, stainless steel, chrome plated steel plate, nickel plated steel plate, and copper plated steel plate. The comparative study results are shown in Table 1. In Table 1,
Those that do not peel off under an impact force of 0.028 Kg/mm 2 are marked with an x mark, and those that peel off between 0 and 0.028 Kg/mm 2 are marked with an ○ mark. This result shows that the cover on which the carbon film is formed is very effective as an ineffective vacuum plating material recovery plate.
【表】
以上本発明は、従来の真空メツキにおける無効
真空メツキ金属材料の回収方法の欠点を改善した
ものであり、真空メツキの量産化において非常に
効果を示す。[Table] The present invention improves the drawbacks of the conventional vacuum plating method for recovering ineffective vacuum plating metal materials, and is very effective in mass production of vacuum plating.
第１図は従来のメツキ装置の断面図、第２図は
本発明の一実施例におけるカバーの断面図であ
る。
１……真空槽、５……被メツキ材、４……蒸発
材料、６……カバー、７……カーボン皮膜。
FIG. 1 is a sectional view of a conventional plating device, and FIG. 2 is a sectional view of a cover in an embodiment of the present invention. 1... Vacuum chamber, 5... Material to be plated, 4... Evaporation material, 6... Cover, 7... Carbon film.
Claims (1)
に設けられ、かつ加熱されて飛散し、所定の被メ
ツキ材に密着する蒸発材料と、蒸発材料の周囲に
設けられ、表面にカーボン膜が形成されているカ
バーとからなる真空メツキ装置。1. A vacuum chamber that maintains a vacuum state, an evaporation material that is provided in the vacuum chamber and that is heated and scattered and adheres to the specified material to be plated, and a carbon film that is provided around the evaporation material and has a carbon film on the surface. A vacuum plating device consisting of a formed cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18206981A JPS5884970A (en) | 1981-11-12 | 1981-11-12 | Vacuum plating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18206981A JPS5884970A (en) | 1981-11-12 | 1981-11-12 | Vacuum plating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5884970A JPS5884970A (en) | 1983-05-21 |
| JPS6157906B2 true JPS6157906B2 (en) | 1986-12-09 |
Family
ID=16111802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18206981A Granted JPS5884970A (en) | 1981-11-12 | 1981-11-12 | Vacuum plating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5884970A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316562A (en) * | 1989-06-14 | 1991-01-24 | Terumo Corp | Fluid measuring probe |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6067663A (en) * | 1983-09-21 | 1985-04-18 | Konishiroku Photo Ind Co Ltd | Thin film forming apparatus |
| FR2582319B1 (en) * | 1985-05-22 | 1992-10-23 | Barbier Benard & Turenne | NICKEL DEPOSIT SYSTEM BY VACUUM EVAPORATION, PARTICULARLY FOR THE PREPARATION OF NEUTRON GUIDES |
| JPS62109970A (en) * | 1985-11-08 | 1987-05-21 | Matsushita Electronics Corp | Method for removing deposit in vacuum deposition vessel |
-
1981
- 1981-11-12 JP JP18206981A patent/JPS5884970A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316562A (en) * | 1989-06-14 | 1991-01-24 | Terumo Corp | Fluid measuring probe |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5884970A (en) | 1983-05-21 |
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