JPS5816065A - Vacuum plating device - Google Patents
Vacuum plating deviceInfo
- Publication number
- JPS5816065A JPS5816065A JP11473081A JP11473081A JPS5816065A JP S5816065 A JPS5816065 A JP S5816065A JP 11473081 A JP11473081 A JP 11473081A JP 11473081 A JP11473081 A JP 11473081A JP S5816065 A JPS5816065 A JP S5816065A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- vacuum
- cover
- vacuum plating
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0005—Separation of the coating from the substrate
Abstract
Description
【発明の詳細な説明】
本発明は、真空蒸着法、イオンブレーティング法等に用
いられる真空メッキ装置において、真空メッキ対象物で
ある被メツキ材以外に飛来するメッキ金属蒸気を回収す
るための無効メッキ材料回収板の材質に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides an ineffective method for recovering plating metal vapor that flies to a material other than the material to be vacuum plated in a vacuum plating apparatus used in a vacuum evaporation method, an ion blating method, etc. Regarding the material of the plating material recovery plate.
真空中で、コバルト、コバルト合金、その他のメッキ金
属蒸気、を鋼ストリップなどの被メッキ材の表面に飛来
させ、被メツキ材表面上に、前記金属の真空メッキ層を
形成させる真空メッキ装置において、一般に、メッキ金
属蒸気流の飛散面積が。In a vacuum plating apparatus that causes cobalt, cobalt alloy, or other plating metal vapor to fly onto the surface of a material to be plated such as a steel strip in a vacuum to form a vacuum plating layer of the metal on the surface of the material to be plated, Generally, the scattering area of the plating metal vapor flow.
被メツキ材表面のメッキ金属蒸気衝突面積より大きいた
め、メッキ金属蒸気の大部分は、被メッキ材へ付着せず
、無効な金属蒸気として、その給気真空メッキ材料の歩
留りの低下をまねく。また、前記した無効な金属蒸気は
、真空槽内の付属設備や真空槽壁に飛来し、蒸着層とし
て蓄積する。この蓄積した蒸着層は、連続して、長時間
真空メッキ装置を操業させた際には、量的に多大となり
。Since it is larger than the plating metal vapor collision area on the surface of the plated material, most of the plating metal vapor does not adhere to the plated material and becomes ineffective metal vapor, leading to a decrease in the yield of the supplied air vacuum plating material. In addition, the above-mentioned ineffective metal vapor flies onto the attached equipment in the vacuum chamber and the walls of the vacuum chamber, and accumulates as a vapor deposited layer. This accumulated vapor deposited layer becomes large in quantity when the vacuum plating apparatus is operated continuously for a long time.
真空操作中の粉塵の要因となる。そこで品質の安定化を
図るために各操業毎に、その蓄積した蒸着層を除去する
必要がある。また、真空メッキ法の材料歩留りの向上を
図るためには、前記した真空槽内の付属設備や真空槽壁
土に蓄積した無効メッキ金属蒸気の蒸着層を回収し、真
空メッキ蒸発材料に再生した後、再使用することが適切
である。Causes dust during vacuum operation. Therefore, in order to stabilize the quality, it is necessary to remove the accumulated deposited layer after each operation. In addition, in order to improve the material yield of the vacuum plating method, it is necessary to collect the evaporated layer of ineffective plating metal vapor accumulated on the attached equipment in the vacuum chamber and the wall soil of the vacuum chamber, and regenerate it into vacuum plating evaporation material. , it is appropriate to reuse.
又回収効率を上げるためには粉末状態より層状に積層し
た状態の方が有利である。In addition, in order to increase recovery efficiency, it is more advantageous to use a layered state than a powder state.
従来、この対策として、図面に示すように真空槽１の壁
面や、真空槽１内付属設備等の表面の無効メッキ金属蒸
気の飛来がある空間に、クロムメッキ鋼板やＪＩＳ規格
５ＵＳ３０４等の金属平板を用い、真空槽内の付属設備
や真空槽壁の形状に合うカバー２を設け、このカバー２
表面上に無効メッキ金属蒸気を蓄積させて捕促し、この
蓄積した蒸着層が量的に増加した時点で、真空メッキの
操業を停止し、新たなカバー２′と交換して、再び操業
を行なう方法がとられていた。Conventionally, as a countermeasure against this problem, as shown in the drawing, ineffective plating on the walls of the vacuum chamber 1 and on the surfaces of attached equipment inside the vacuum chamber 1, etc. In the space where metal vapor is blown, flat metal plates such as chrome-plated steel plates and JIS standard 5 US 304 were installed. , install a cover 2 that matches the shape of the attached equipment inside the vacuum chamber and the vacuum chamber wall, and install this cover 2.
Ineffective plating metal vapor is accumulated and captured on the surface, and when the accumulated vapor deposition layer increases in quantity, the vacuum plating operation is stopped, a new cover 2' is replaced, and the operation is started again. A method was taken.
しかしながら、上記方法によれば、カバー２表面に蓄積
した金属材料層を剥離する際に機械的衝撃等によって剥
離しなければならないために、その金属材料層は粉末状
態で剥離すること＼なるため回収作業能率が悪くかつ作
業環境も良いとは言えない。又カバー２についても機械
的衝撃等を加えるためにカバー２が変形したり、表面に
多くの起伏が生じ再使用が不可能である。という欠点を
有する。However, according to the above method, since the metal material layer accumulated on the surface of the cover 2 must be peeled off by mechanical impact, etc., the metal material layer is peeled off in a powder state, so it cannot be recovered. Work efficiency is poor and the work environment is not good. Further, the cover 2 may be deformed due to mechanical impact or the like, and many undulations may occur on the surface, making it impossible to reuse it. It has the following drawback.
１１１
そこで本発明は機械的衝撃等を必要とせず、容易にカバ
ー２表面に蓄積した無効メッキ金属蒸気層を層状で剥離
し、回収することを可能とする無効真空メッキ材料回収
板の材質を提供するものである。111 Therefore, the present invention provides a material for an invalid vacuum plating material recovery plate that makes it possible to easily peel off and recover the invalid plating metal vapor layer accumulated on the surface of the cover 2 in layers without requiring mechanical impact or the like. It is something to do.
以゛下本発明の一実施例について述べる。図において１
は真空φ≠幽槽、２は無効真空メッキ材料回収板となる
カバー、３はメッキ金属蒸気を発生させるための蒸発源
となるるつぼ、４はメッキ溶融金属、６は被メッキ材を
示す。この構成において、被メッキ材６にポリエステル
、溶融金属４にコバルト合金を使用し、電子ビーム加熱
によって溶解し、かつカバー２の材料としてＪＩＳ規格
５ＵＳ４３０を使用して真空メッキを実施した。An embodiment of the present invention will be described below. In the figure 1
2 is a cover serving as an ineffective vacuum plating material recovery plate, 3 is a crucible serving as an evaporation source for generating plating metal vapor, 4 is a plating molten metal, and 6 is a material to be plated. In this configuration, polyester was used as the material to be plated 6, cobalt alloy was used as the molten metal 4, which was melted by electron beam heating, and vacuum plating was performed using JIS standard 5US430 as the material of the cover 2.
真空メッキ終了後、カバー２表面に蓄積した無効メッキ
金属材料の密着力を衝撃負荷テストで調べた結果、０−
００２８〜／／ＭＩで層状で剥離した、すなわち機械的
衝撃をほとんど与えずに容易に剥離１回収することがで
きた。After the vacuum plating was completed, the adhesion of the ineffective plating metal material accumulated on the surface of the cover 2 was examined by an impact load test, and the result was 0-
At 0028~//MI, the film was peeled off in a layered manner, that is, it was possible to easily recover the peeling rate with almost no mechanical impact.
本発明の効果を明確にするために従来から使用されてい
るカバー２材質、鋼板、銅板、オーステナイト系ステン
レスであるＪＩＳ規格５ＵＳ３０４゜Ｃｒメッキ鋼板、
Ｎｉメッキ鋼板、Ｃｕメッキ鋼板について同様のテスト
を実施した。その比較検討結果を表に示す。表において
０．０２８＋１ｐ、乙−の衝重力によって剥離しないも
のをＸ印で示し、０〜０，０２８Ｋｐ／−の間で剥離す
るせのを○印で示す。この結果より５ＵＳ４３０が無効
真空メッキ材料回収板として非常に有効であることを示
す。In order to clarify the effects of the present invention, the cover 2 materials conventionally used are steel plate, copper plate, austenitic stainless steel JIS standard 5US304° Cr-plated steel plate,
Similar tests were conducted on Ni-plated steel sheets and Cu-plated steel sheets. The results of the comparative study are shown in the table. In the table, those that do not peel off due to the impact force of 0.028+1p/- are marked with an X, and those that peel off between 0 and 0,028 Kp/- are marked with a circle. This result shows that 5US430 is very effective as an invalid vacuum plating material recovery plate.
表
以上述べた通り、本発明は従来の真空メッキにおける無
効真空メッキ金属材料の回収方法の欠点を改善したもの
であシ、真空メッキの量産化において非常に効果を示す
ものと言える。As described above, the present invention improves the drawbacks of the conventional vacuum plating method for recovering invalid vacuum plated metal materials, and can be said to be very effective in mass production of vacuum plating.
１・・・・・・真空槽、２・・・・・・カバー、４・・
・・・・メッキ釜属、５・・・・・・被メッキ材。1...Vacuum chamber, 2...Cover, 4...
...Plating pot, 5... Material to be plated.
Claims (1)
、かつ加熱され飛散し、所定の被メッキ材に密着する蒸
発材料と、蒸発材料の周囲に位置し、材質がフェライト
系ステンレス、又はマルテンサイト系ステンレスからな
るカバーとを有することを特徴とする真空メッキ装置。A vacuum chamber that maintains a vacuum state, an evaporation material provided in the vacuum chamber that is heated and scattered, and adheres to the specified material to be plated, and a material located around the evaporation material that is made of ferritic stainless steel or A vacuum plating device characterized by having a cover made of martensitic stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11473081A JPS5816065A (en) | 1981-07-22 | 1981-07-22 | Vacuum plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11473081A JPS5816065A (en) | 1981-07-22 | 1981-07-22 | Vacuum plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5816065A true JPS5816065A (en) | 1983-01-29 |
Family
ID=14645186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11473081A Pending JPS5816065A (en) | 1981-07-22 | 1981-07-22 | Vacuum plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5816065A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59145564U (en) * | 1983-03-18 | 1984-09-28 | 株式会社日立製作所 | sputtering equipment |
| US7196064B2 (en) | 1996-08-09 | 2007-03-27 | Mannatech, Inc. | Compositions of plant carbohydrates as dietary supplements |
| JP4678643B2 (en) * | 1999-08-04 | 2011-04-27 | ゼネラル・エレクトリック・カンパニイ | Electron beam physical vapor deposition coating apparatus and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50130649A (en) * | 1974-04-03 | 1975-10-16 | ||
| JPS5136548B1 (en) * | 1971-02-01 | 1976-10-08 | ||
| JPS5631565B2 (en) * | 1978-10-31 | 1981-07-22 |
-
1981
- 1981-07-22 JP JP11473081A patent/JPS5816065A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5136548B1 (en) * | 1971-02-01 | 1976-10-08 | ||
| JPS50130649A (en) * | 1974-04-03 | 1975-10-16 | ||
| JPS5631565B2 (en) * | 1978-10-31 | 1981-07-22 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59145564U (en) * | 1983-03-18 | 1984-09-28 | 株式会社日立製作所 | sputtering equipment |
| US7196064B2 (en) | 1996-08-09 | 2007-03-27 | Mannatech, Inc. | Compositions of plant carbohydrates as dietary supplements |
| JP4678643B2 (en) * | 1999-08-04 | 2011-04-27 | ゼネラル・エレクトリック・カンパニイ | Electron beam physical vapor deposition coating apparatus and method |
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