JPS6157555U - - Google Patents
Info
- Publication number
- JPS6157555U JPS6157555U JP1984143239U JP14323984U JPS6157555U JP S6157555 U JPS6157555 U JP S6157555U JP 1984143239 U JP1984143239 U JP 1984143239U JP 14323984 U JP14323984 U JP 14323984U JP S6157555 U JPS6157555 U JP S6157555U
- Authority
- JP
- Japan
- Prior art keywords
- board
- electronic component
- component mounting
- electronic components
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000011247 coating layer Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984143239U JPH039341Y2 (US08066781-20111129-C00013.png) | 1984-09-20 | 1984-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984143239U JPH039341Y2 (US08066781-20111129-C00013.png) | 1984-09-20 | 1984-09-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6157555U true JPS6157555U (US08066781-20111129-C00013.png) | 1986-04-17 |
| JPH039341Y2 JPH039341Y2 (US08066781-20111129-C00013.png) | 1991-03-08 |
Family
ID=30701541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984143239U Expired JPH039341Y2 (US08066781-20111129-C00013.png) | 1984-09-20 | 1984-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH039341Y2 (US08066781-20111129-C00013.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50143072A (US08066781-20111129-C00013.png) * | 1974-05-08 | 1975-11-18 | ||
| JPS5593286A (en) * | 1979-01-10 | 1980-07-15 | Hitachi Ltd | Electronic circuit and method of fabricating same |
-
1984
- 1984-09-20 JP JP1984143239U patent/JPH039341Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50143072A (US08066781-20111129-C00013.png) * | 1974-05-08 | 1975-11-18 | ||
| JPS5593286A (en) * | 1979-01-10 | 1980-07-15 | Hitachi Ltd | Electronic circuit and method of fabricating same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH039341Y2 (US08066781-20111129-C00013.png) | 1991-03-08 |
