JPS6155771B2 - - Google Patents

Info

Publication number
JPS6155771B2
JPS6155771B2 JP54079198A JP7919879A JPS6155771B2 JP S6155771 B2 JPS6155771 B2 JP S6155771B2 JP 54079198 A JP54079198 A JP 54079198A JP 7919879 A JP7919879 A JP 7919879A JP S6155771 B2 JPS6155771 B2 JP S6155771B2
Authority
JP
Japan
Prior art keywords
cavity
package
pellet
ceramic package
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54079198A
Other languages
English (en)
Japanese (ja)
Other versions
JPS564253A (en
Inventor
Toshikazu Oshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7919879A priority Critical patent/JPS564253A/ja
Publication of JPS564253A publication Critical patent/JPS564253A/ja
Publication of JPS6155771B2 publication Critical patent/JPS6155771B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Die Bonding (AREA)
JP7919879A 1979-06-25 1979-06-25 Device for assembling electronic parts Granted JPS564253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7919879A JPS564253A (en) 1979-06-25 1979-06-25 Device for assembling electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7919879A JPS564253A (en) 1979-06-25 1979-06-25 Device for assembling electronic parts

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP60134043A Division JPS6116536A (ja) 1985-06-21 1985-06-21 ペレツトボンデイング装置
JP22631587A Division JPS6372132A (ja) 1987-09-11 1987-09-11 半導体ペレットの取り付け方法

Publications (2)

Publication Number Publication Date
JPS564253A JPS564253A (en) 1981-01-17
JPS6155771B2 true JPS6155771B2 (https=) 1986-11-29

Family

ID=13683262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7919879A Granted JPS564253A (en) 1979-06-25 1979-06-25 Device for assembling electronic parts

Country Status (1)

Country Link
JP (1) JPS564253A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178333A (en) * 1981-04-27 1982-11-02 Hitachi Ltd Pellet bonder
JPS60130130A (ja) * 1983-12-19 1985-07-11 Marine Instr Co Ltd サ−マル基板のダイボンデイング方法

Also Published As

Publication number Publication date
JPS564253A (en) 1981-01-17

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