JPS6154878B2 - - Google Patents
Info
- Publication number
- JPS6154878B2 JPS6154878B2 JP9002984A JP9002984A JPS6154878B2 JP S6154878 B2 JPS6154878 B2 JP S6154878B2 JP 9002984 A JP9002984 A JP 9002984A JP 9002984 A JP9002984 A JP 9002984A JP S6154878 B2 JPS6154878 B2 JP S6154878B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- mask
- separator
- partial plating
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 108
- 239000007788 liquid Substances 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 10
- 230000000873 masking effect Effects 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 230000004907 flux Effects 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 1
- 230000008685 targeting Effects 0.000 claims 1
- 238000004891 communication Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000003754 machining Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920001875 Ebonite Polymers 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- -1 fluororesin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9002984A JPS60234991A (ja) | 1984-05-02 | 1984-05-02 | セパレ−タ利用の部分メツキ方法及びその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9002984A JPS60234991A (ja) | 1984-05-02 | 1984-05-02 | セパレ−タ利用の部分メツキ方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60234991A JPS60234991A (ja) | 1985-11-21 |
| JPS6154878B2 true JPS6154878B2 (enrdf_load_stackoverflow) | 1986-11-25 |
Family
ID=13987244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9002984A Granted JPS60234991A (ja) | 1984-05-02 | 1984-05-02 | セパレ−タ利用の部分メツキ方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60234991A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL9000098A (nl) * | 1990-01-16 | 1991-08-16 | Burndy Electra Nv | Inrichting voor het plateren van elektrische contactelementen. |
-
1984
- 1984-05-02 JP JP9002984A patent/JPS60234991A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60234991A (ja) | 1985-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1267563A (en) | Impulse ink jet print head and method of making same | |
| US4287029A (en) | Plating process | |
| JPH04234666A (ja) | 加熱インク噴射プリントヘッド | |
| KR930019413A (ko) | 압전부재를 이용한 프린터헤드의 제조방법 | |
| JPS6154878B2 (enrdf_load_stackoverflow) | ||
| GB998739A (en) | Improvements in or relating to electrodes for electrolytic hole sinking | |
| US4826580A (en) | Method and apparatus for finishing cut surface of work produced by wire cut discharge process | |
| JPH02502984A (ja) | 差込みケーシングを備えたサンドイッチ−インキ印字ヘッド | |
| JPS5827993A (ja) | 微小部分メツキ方法及びその装置 | |
| JPS6214235B2 (enrdf_load_stackoverflow) | ||
| KR20140136700A (ko) | 전해 도금 장치 | |
| US4409071A (en) | Masking for selective electroplating jet method | |
| JP4644528B2 (ja) | 部分めっき装置及び部分めっき方法 | |
| JPH0598489A (ja) | リードフレームの両面部分めつき装置 | |
| JPH0354887A (ja) | プリント基板の微小孔処理方法及びその装置 | |
| JPH086196B2 (ja) | 部分めつき装置 | |
| CN221022773U (zh) | 印刷网板及锡膏印刷机 | |
| TWI850584B (zh) | 表面處理裝置 | |
| EP0055316B1 (en) | A plating apparatus | |
| JPS6353279B2 (enrdf_load_stackoverflow) | ||
| EP1236575A3 (en) | Liquid ejecting head, liquid ejecting method, and method for manufacturing liquid ejecting head | |
| JPH0834119A (ja) | インクジェットヘッドの製造方法 | |
| US3445617A (en) | Electro-erosive method and apparatus for making a die member complemental to a die member of the rule type | |
| JP3031478B2 (ja) | ウェハの鍍金方法およびその装置 | |
| JPS5837189A (ja) | マルチ方式の部分メッキ装置 |