JPS6153990U - - Google Patents

Info

Publication number
JPS6153990U
JPS6153990U JP1984138492U JP13849284U JPS6153990U JP S6153990 U JPS6153990 U JP S6153990U JP 1984138492 U JP1984138492 U JP 1984138492U JP 13849284 U JP13849284 U JP 13849284U JP S6153990 U JPS6153990 U JP S6153990U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
cooling
semiconductor device
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984138492U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984138492U priority Critical patent/JPS6153990U/ja
Publication of JPS6153990U publication Critical patent/JPS6153990U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP1984138492U 1984-09-11 1984-09-11 Pending JPS6153990U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984138492U JPS6153990U (enrdf_load_stackoverflow) 1984-09-11 1984-09-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984138492U JPS6153990U (enrdf_load_stackoverflow) 1984-09-11 1984-09-11

Publications (1)

Publication Number Publication Date
JPS6153990U true JPS6153990U (enrdf_load_stackoverflow) 1986-04-11

Family

ID=30696883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984138492U Pending JPS6153990U (enrdf_load_stackoverflow) 1984-09-11 1984-09-11

Country Status (1)

Country Link
JP (1) JPS6153990U (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619694A (en) * 1979-07-26 1981-02-24 Mitsubishi Electric Corp Method of dissipating heat of circuit part
JPS5822746B2 (ja) * 1981-05-14 1983-05-11 株式会社東芝 クリ−ニング装置
JPS58188188A (ja) * 1982-04-27 1983-11-02 富士通株式会社 プリント配線板放熱構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619694A (en) * 1979-07-26 1981-02-24 Mitsubishi Electric Corp Method of dissipating heat of circuit part
JPS5822746B2 (ja) * 1981-05-14 1983-05-11 株式会社東芝 クリ−ニング装置
JPS58188188A (ja) * 1982-04-27 1983-11-02 富士通株式会社 プリント配線板放熱構造

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