JPS6153912U - - Google Patents
Info
- Publication number
- JPS6153912U JPS6153912U JP13858084U JP13858084U JPS6153912U JP S6153912 U JPS6153912 U JP S6153912U JP 13858084 U JP13858084 U JP 13858084U JP 13858084 U JP13858084 U JP 13858084U JP S6153912 U JPS6153912 U JP S6153912U
- Authority
- JP
- Japan
- Prior art keywords
- coil
- circuit board
- printed circuit
- heat
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図は本考案に係る薄帯コイルのプリント基
板への取付構造を示す一部拡大断面図、第２図、
第３図は従来の取付構造を示し、第２図は１つの
例を示す斜視図、第３図は他の例を示し、ａは斜
視図、ｂは同上の一部拡大断面図である。
１…コイル、２…プリント基板、２ａ…パター
ン、３…半田、４…耐熱絶縁層。
Fig. 1 is a partially enlarged cross-sectional view showing the mounting structure of the ribbon coil on the printed circuit board according to the present invention; Fig. 2;
FIG. 3 shows a conventional mounting structure, FIG. 2 is a perspective view of one example, and FIG. 3 is another example, in which a is a perspective view and b is a partially enlarged sectional view of the same. DESCRIPTION OF SYMBOLS 1... Coil, 2... Printed circuit board, 2a... Pattern, 3... Solder, 4... Heat-resistant insulating layer.
Claims (1)
温度より高い耐熱温度の耐熱絶縁層を塗布すると
共に、該耐熱絶縁層側をプリント基板に接触した
状態で載置し、該プリント基板のパターンと前記
コイルの最内、外周面とを半田により接続したこ
とを特徴とする薄帯コイルのプリント基板への取
付構造。 A heat-resistant insulating layer having a heat-resistant temperature higher than the solder melting temperature is applied to at least one end face of the ribbon coil, and the heat-resistant insulating layer side is placed in contact with a printed circuit board, so that the pattern of the printed circuit board and the coil A structure for attaching a thin strip coil to a printed circuit board, characterized in that the innermost and outer peripheral surfaces of the coil are connected by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13858084U JPH0227523Y2 (en) | 1984-09-14 | 1984-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13858084U JPH0227523Y2 (en) | 1984-09-14 | 1984-09-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6153912U true JPS6153912U (en) | 1986-04-11 |
| JPH0227523Y2 JPH0227523Y2 (en) | 1990-07-25 |
Family
ID=30696968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13858084U Expired JPH0227523Y2 (en) | 1984-09-14 | 1984-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227523Y2 (en) |
-
1984
- 1984-09-14 JP JP13858084U patent/JPH0227523Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0227523Y2 (en) | 1990-07-25 |
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