JPS6151059A - Electrical conductive thermoplastic resin composition - Google Patents
Electrical conductive thermoplastic resin compositionInfo
- Publication number
- JPS6151059A JPS6151059A JP17044984A JP17044984A JPS6151059A JP S6151059 A JPS6151059 A JP S6151059A JP 17044984 A JP17044984 A JP 17044984A JP 17044984 A JP17044984 A JP 17044984A JP S6151059 A JPS6151059 A JP S6151059A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- resin composition
- halogen
- conductive thermoplastic
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の技術分野]
本発明は、難燃性かつ導電性に優れた導電性熱可塑性樹
脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a conductive thermoplastic resin composition that is flame retardant and has excellent conductivity.
[発明の技術的背景とその問題点]
近年の電子I類型の普及に伴ない、電子様器を電−磁波
障害から保viする問題が国内外を問わず急速にクロー
ズアップされるようになってきた。 そのため電子41
!器を電磁波シールドする各種材料の研究が盛んに行わ
れている。 この電磁波シールド材の一連の研究の中で
最近特に注目されているものは、射出成形を対象として
金属繊維、金属フレーク、金属粉末等の金属フィラーを
熱可塑性樹脂に混練した極めて抵抗値の低い導電性樹脂
組成物があげられる。 この組成物を用いれば他のシー
ルド方法よりも簡単で作業性も良く、極めてすぐれたシ
ールド効果を有する成形物が提供される。[Technical background of the invention and its problems] With the spread of electronic type I in recent years, the problem of protecting electronic devices from electromagnetic interference has rapidly become a focus both in Japan and abroad. It's here. Therefore, electron 41
! Research is being actively conducted on various materials that can shield vessels from electromagnetic waves. Among a series of studies on electromagnetic shielding materials, one that has recently attracted particular attention is a highly conductive material with extremely low resistance that is made by kneading metal fillers such as metal fibers, metal flakes, and metal powder into thermoplastic resin for injection molding. Examples include polyurethane resin compositions. If this composition is used, it is simpler and easier to work with than other shielding methods, and a molded article having an extremely excellent shielding effect can be provided.
しかしながら、導電性熱可塑性樹脂組成物において難燃
性付与のためハロゲン系難燃剤が含有されている場合は
、成形時の加熱によりハロゲン系難燃剤が分解してハロ
ゲンが離脱する。 離脱したハロゲンは、吸湿して強酸
となり金属フィラー表面を腐食さuICす、或いは金属
と反応してハロゲン化金属どなる。 この結果樹脂成形
物の体171抵抗が増大し導電性が阻害される火点があ
る。However, when a halogen-based flame retardant is contained in the conductive thermoplastic resin composition to impart flame retardancy, the halogen-based flame retardant is decomposed by heating during molding, and the halogen is released. The released halogen absorbs moisture and becomes a strong acid that corrodes the surface of the metal filler, or reacts with the metal to form a metal halide. As a result, the resistance of the resin molded body 171 increases and there is a flash point where conductivity is inhibited.
特に高温で処理されると導電性の低下が著しく、所期の
シールド効果が眠りられないという問題があった。In particular, when treated at high temperatures, the conductivity decreases significantly and the desired shielding effect cannot be achieved.
[発明の目的〕
本発明の目的は、ハロゲン系難燃剤が含有されていても
導電性が低下しない、待に品温においても安定し、優れ
た導電性を有したシールド効果の高い導電性熱可塑性樹
脂組成物を提供しようとするものである。[Objective of the Invention] The object of the present invention is to provide a conductive thermal conductive material with high shielding effect, which does not reduce its conductivity even when it contains a halogenated flame retardant, is stable even at product temperature, and has excellent conductivity. The present invention aims to provide a plastic resin composition.
[発明の概要]
本発明は、上記の欠点を解消するために鋭意研究を重ね
た結果、有機錫化合物を用いることによってGTr性の
低下を防止できることを見いだしたものである。[Summary of the Invention] In the present invention, as a result of extensive research to eliminate the above-mentioned drawbacks, it has been discovered that deterioration of GTr properties can be prevented by using an organic tin compound.
即ち、本発明は、(A)熱可塑性樹脂、(B)ハロゲン
系難燃剤、(C)導電性付与剤および(D)有機錫化合
物を必須成分とすることを特徴とする導電性熱可塑性樹
脂組成物である。That is, the present invention provides a conductive thermoplastic resin characterized in that it contains (A) a thermoplastic resin, (B) a halogen flame retardant, (C) a conductivity imparting agent, and (D) an organotin compound as essential components. It is a composition.
本発明に用いる(A)熱可塑性樹脂としては、ポリエチ
レン樹脂、ポリプロピレン樹脂、ポリ塩化ビニル樹脂、
ポリスチレン−ブタジェン樹脂、アクリロニドルーブタ
ジェン−スチレン樹脂、ポリカーボネート樹脂、ポリア
ミド樹脂、ポリアセタール樹脂、ポリスルホン樹脂、ポ
リフェニレンスルファイド樹脂、変性ポリフェニレンオ
キサイド樹脂等が挙げられ、これらは単独もしくは混合
して使用することができる。The thermoplastic resin (A) used in the present invention includes polyethylene resin, polypropylene resin, polyvinyl chloride resin,
Examples include polystyrene-butadiene resin, acrylonidol-butadiene-styrene resin, polycarbonate resin, polyamide resin, polyacetal resin, polysulfone resin, polyphenylene sulfide resin, modified polyphenylene oxide resin, etc., and these may be used alone or in combination. Can be done.
本発明に用いる(B)ハロゲン系難燃剤としては、テト
ラブロムビスフェノールA1パークロロペンタシクロデ
カン、塩素化パラフィン等が挙げられ、これらは単独又
は2種以上混合して使用される。 難燃剤としてハロゲ
ン系のff1l[燃剤が用いられるが、相剰効果を高め
るために、三酸化アンチモンや、トリフェニルフォスフ
ェート、トリアルキルフェニルフォスフェート、ジアル
キルモノフェニルフォスフェートなどの有機燐化合物を
併用することができる。Examples of the halogen flame retardant (B) used in the present invention include tetrabromobisphenol A1 perchloropentacyclodecane, chlorinated paraffin, and the like, which may be used alone or in combination of two or more. Halogen-based ff1l [flame agent is used as a flame retardant, but in order to enhance the additive effect, organic phosphorus compounds such as antimony trioxide, triphenyl phosphate, trialkyl phenyl phosphate, and dialkyl monophenyl phosphate are used in combination. can do.
本発明に用いる(C)L9ffi性付与剤として番よ、
銀、銅、ニッケル、ステンレス笠の金属粉末、又はアル
ミニウム、アルミニウム合金、銅、ニッケル黄銅、青銅
、vI鉄、鋼、ステンレス等の金PAm紺が挙げられ、
これらは単独もしくは2種以上の混合系として用いられ
゛る。As the (C)L9ffi property imparting agent used in the present invention,
Examples include metal powders of silver, copper, nickel, stainless steel, or gold PAm navy blue of aluminum, aluminum alloy, copper, nickel brass, bronze, vI iron, steel, stainless steel, etc.
These may be used alone or as a mixture of two or more.
本発明に用いる(D)有は錫化合物は、次の各式
%式%)
(式中、Rはアルキル基、アリル基、アルキル−791
1塁を、AはカルボンIIQ a導体、メルカプタン誘
導体、フェノキシ基、アルコキシキ笠の硫黄原子又は酸
素原子を含む炭化水素基以外の有曙基をそれぞれ表ず〉
で示されるものである。 具体的な化合物としては、ジ
ブチルスズジラウレート、ジブチルスズジブチルマレニ
−1−、ビス(ジノルマルブヂルスズモノラウレート)
マレニー]・、ジメチルスズドデシルメルカプタイド等
が挙げられ、これらは単独又は2種以上混合して用いら
れる。The tin compound (D) used in the present invention has the following formula% (% formula%) (wherein R is an alkyl group, an allyl group, an alkyl-791
1st base, A represents a carbon IIQ a conductor, a mercaptan derivative, a phenoxy group, an alkoxy group other than a hydrocarbon group containing a sulfur atom or an oxygen atom, respectively.
This is shown in . Specific compounds include dibutyltin dilaurate, dibutyltin dibutylmaleny-1-, and bis(dinormalbutyltin monolaurate).
Maleny], dimethyltin dodecyl mercaptide, etc., and these may be used alone or in a mixture of two or more.
右lX1錫化合物の配合mは、ハロゲン系難燃剤に対し
て0.5〜5重量%含有することが好ましい。It is preferable that the blend m of the right lX1 tin compound contains 0.5 to 5% by weight based on the halogen flame retardant.
配合母がo、slz%未満では導電性の安定に効果なく
、また5重量%を超えると特性がそれ以上向上しないば
かりかコストアップとなり好ましくない。If the content of the blending matrix is less than O.Slz%, it will not be effective in stabilizing the conductivity, and if it exceeds 5% by weight, not only will the properties not improve any further, but the cost will increase, which is not preferable.
一般に導電性付与剤は、空気中の酸素により酸化される
ため、酸化防止剤である例えば0抑チタネ一ト化合物や
アミン系化合物でその金属表面を処理すると導電性の発
現に有効である。 ところがハロゲン系烈燃剤含有の導
電性熱可塑性樹脂組成物においては、加熱すると導電性
が発現しにくくまた安定した導電性が+r+られず、体
積抵抗率が増大する。 この理由について明確ではない
が難燃剤であるハロゲン系化合物に原因があると推察さ
れる。 すなわら(1)ハロゲン化時の硫酸触媒の残菌
、(2)低分子ハロゲン化物の存在、(3)熱により離
脱したハロゲン等であると考えられ、これらが導電性付
与剤の金属表面に作用し金属間の接触抵抗が増加するも
のと推測される。Generally, conductivity-imparting agents are oxidized by oxygen in the air, so treating the metal surface with an antioxidant such as a zero-inhibiting titanate compound or an amine compound is effective in developing conductivity. However, in a conductive thermoplastic resin composition containing a halogen-based flame retardant, when heated, it is difficult to develop conductivity, stable conductivity is not achieved, and the volume resistivity increases. Although the reason for this is not clear, it is presumed that the halogen compound, which is a flame retardant, is responsible. This is thought to be caused by (1) residual bacteria from the sulfuric acid catalyst during halogenation, (2) the presence of low-molecular-weight halides, and (3) halogen released by heat, and these are likely to cause damage to the metal surface of the conductivity imparting agent. It is presumed that this increases the contact resistance between metals.
本発明の最も重要な点は、ハロゲン系難燃剤を含有する
導電性熱可塑性樹脂組成物に有機錫化合物を配合するこ
とである。 この有機錫化合物の配合によって混線加工
時や成形品の熱安定性試験においても体積抵抗が変化し
にくく安定であることを見いだした。The most important point of the present invention is that an organic tin compound is blended into a conductive thermoplastic resin composition containing a halogen flame retardant. It has been found that by blending this organotin compound, the volume resistivity does not change easily and is stable even during cross-wire processing and thermal stability tests of molded products.
抵抗が安定となる理由は(i)加熱により分解離脱した
ハロゲンが有機錫化合物と反応し、ハロゲンを遊離さU
ず安定化させる。 (ii)有機錫化合物がハロゲン
結合部に付加し、脱ハロゲン現象を防ぐことによって安
定するものと推察される。The reason why the resistance is stable is that (i) the halogen decomposed and released by heating reacts with the organic tin compound, liberating the halogen.
Stabilize. (ii) It is presumed that the organotin compound is added to the halogen bond and stabilizes by preventing dehalogenation.
本発明の導電性熱可塑性樹脂組成物は重連の各成分を配
合し均一に混練して製造され、各成分の配合順序等に特
に制限はない。 熱可塑性樹脂、ハロゲン系が燃剤およ
び導電性付与剤を混合した後、150〜180℃で混練
してベレットを作成し、このベレットに有機錫化合物を
添加し組成物を製造できる。 またハ〔1ゲン系難燃剤
を混合すると同時に有機錫化合物を配合混練してもよい
。The conductive thermoplastic resin composition of the present invention is produced by blending multiple components and kneading them uniformly, and there is no particular restriction on the order of blending the components. After mixing the thermoplastic resin, the halogen-based fuel, and the conductivity imparting agent, the mixture is kneaded at 150 to 180°C to form a pellet, and an organic tin compound is added to the pellet to produce a composition. Furthermore, an organic tin compound may be mixed and kneaded at the same time as the 1-gene flame retardant is mixed.
本発明の導電性熱可塑性樹脂組成物は、熱可塑性樹脂、
ハロゲン系難燃剤、導電性付与剤および有機錫化合物を
必須成分とするが、必要に応じてその他の滑剤、可塑剤
等を添加することができる。The conductive thermoplastic resin composition of the present invention comprises a thermoplastic resin,
Although a halogen flame retardant, a conductivity imparting agent, and an organic tin compound are essential components, other lubricants, plasticizers, etc. can be added as necessary.
この組成物は真空成形、押出成形、射出成形、カレンダ
ー成形によって用途に応じた各種形状の成、 形体とす
ることができ、特に電子機器、通信機器、医v:1.■
器、計測機器等の材料として有用である。This composition can be formed into various shapes and forms depending on the application by vacuum forming, extrusion molding, injection molding, and calendar molding, and is particularly suitable for electronic equipment, communication equipment, medical equipment, etc. ■
It is useful as a material for instruments, measuring instruments, etc.
[発明の実施例]
本発明の実施例について具体的に説明するが、本発明は
これらの実施例に限定されるものではない。[Examples of the Invention] Examples of the present invention will be specifically described, but the present invention is not limited to these Examples.
実施例 1〜4
スヂレンーブタジエン樹脂100部に、難燃剤どして2
,2−ビス(4−ヒドロキシエチル−3,5−ジブロモ
フェニル)プロパン15部、三酸化アンチモン5部、お
よび導電性付与剤として直径0.02mm 。Examples 1 to 4 Add 2 flame retardants to 100 parts of styrene-butadiene resin.
, 15 parts of 2-bis(4-hydroxyethyl-3,5-dibromophenyl)propane, 5 parts of antimony trioxide, and a diameter of 0.02 mm as a conductivity imparting agent.
長さ3mmの銅繊維10部を配合し、押出混練機で15
0〜180℃の温度で混練し、直径2mm 、長さ5m
mのベレットにした。 次いで有機錫化合物としてジメ
チルスズドデシルメルカプタイドを難燃剤に対して第1
表に示すように1〜5f4ffi%を配合して導電性熱
可塑性樹脂組成物を製造した。Blend 10 parts of copper fibers with a length of 3 mm and mix with an extrusion kneader to
Kneaded at a temperature of 0 to 180℃, diameter 2mm, length 5m
I decided on a m beret. Next, dimethyltin dodecyl mercaptide was added as an organotin compound to the flame retardant.
A conductive thermoplastic resin composition was prepared by blending 1 to 5f4ffi% as shown in the table.
得られた組成物をスクリューインラインタイプの射出成
形別を用い、金型温度35〜45℃、シリンダー先端温
度185℃、中間温度190℃で射出成形し平板を成形
した。 この平板について常態体積抵。The obtained composition was injection molded into a flat plate using a screw in-line type injection molding machine at a mold temperature of 35 to 45°C, a cylinder tip temperature of 185°C, and an intermediate temperature of 190°C. The normal volume resistance of this flat plate.
抗および加熱処L!!(80℃x 1ooo+−+ >
俊の体積抵抗をJ Is−に−6911に準じて測定し
た。 その結果を第1表に示した。 同時に有機錫化合
物の配合されていない導電性熱可塑性樹脂組成物を比較
例1として試験したのでその結果も第1表に示した。Anti- and heat treatment L! ! (80℃ x 1ooo+-+ >
Shun's volume resistivity was measured according to JIS-6911. The results are shown in Table 1. At the same time, a conductive thermoplastic resin composition containing no organic tin compound was tested as Comparative Example 1, and the results are also shown in Table 1.
第1表
実施例 5〜7
ポリプロピレン樹脂100部に、デ「燃剤として塩素化
パラフィン15部、三酸化アンチモン5部、導電性付与
剤としてチタネートで表面処理を行った平均粒8!5μ
lのカーボニルニッケル粉末10部、チタネートで表面
処理した直径30μm、長さ6+nmのステンレス繊維
10部、および有機錫化合物のビス(ジノルマルブチル
スズモノラウレート)マレエート0.5〜3重471%
を配合し、押出混練機で185℃の温度で混練し、直径
1.5mm、長さ3++onの導電性樹脂組成物のベレ
ットを製造した。 このベレットを用いて型締圧力5ト
ンのスクリューインラインの射出成形機を用い、金型温
度45℃、シリング−先端温度180℃、中間温度19
0℃、後部温度160℃で射出成形して平板を作成した
。 この平板について常態と、ヒートナイクル1!(−
30℃×30分、80℃×30分を10サイクルくり返
す)の導電性をJ Is−に−6900に準じて試験し
た。 □同時に有機錫化合物の配合されていない
ものを比較例2とし導電性の試験を行った。 その結果
も第2表に示した。Table 1 Examples 5 to 7 100 parts of polypropylene resin, 15 parts of chlorinated paraffin as a refueling agent, 5 parts of antimony trioxide, and an average particle size of 8!5μ surface-treated with titanate as a conductivity imparting agent.
10 parts of carbonyl nickel powder, 10 parts of titanate-treated stainless steel fiber with a diameter of 30 μm and a length of 6+ nm, and 471% of the organotin compound bis(di-n-butyltin monolaurate) maleate 0.5 to 3 times.
were mixed and kneaded using an extrusion kneader at a temperature of 185° C. to produce pellets of a conductive resin composition with a diameter of 1.5 mm and a length of 3++ on. Using this pellet, a screw-in-line injection molding machine with a mold clamping pressure of 5 tons was used, the mold temperature was 45℃, the shilling-tip temperature was 180℃, and the intermediate temperature was 19℃.
A flat plate was made by injection molding at 0°C and a rear temperature of 160°C. About this flat plate, it is normal and Heat Nicle 1! (−
Conductivity was tested in accordance with J Is-6900 (repeating 10 cycles of 30°C x 30 minutes and 80°C x 30 minutes). □At the same time, a conductivity test was conducted using a sample containing no organic tin compound as Comparative Example 2. The results are also shown in Table 2.
第2表
第1表J3よびf82表から明らかなように、実施例の
導電性は加熱後においても諸特性が低下せず安定してお
り、本発明の著しい効果が確認された。As is clear from Table 2, Table 1, J3 and f82, the electrical conductivity of the Examples was stable without deterioration of various properties even after heating, confirming the remarkable effects of the present invention.
[発明の効果]
ハロゲン系難燃剤を含有している導電性熱可塑性樹脂組
成物において、有gi錫化合物を配合することによって
ハロゲンのIl!li脱を防止し安定した導電性が得ら
れ、特に加熱後に45いても導電性が低下することのな
い優れた導電性を示し、この導電性熱可塑性樹脂組成物
を用いることによってシールド効果の高い電子機器、通
信機器、計測は器を得ることができる。[Effects of the Invention] In a conductive thermoplastic resin composition containing a halogen-based flame retardant, by blending a gi tin compound, halogen Il! It prevents desorption of li and provides stable conductivity. In particular, it shows excellent conductivity without decreasing conductivity even after heating, and by using this conductive thermoplastic resin composition, it has a high shielding effect. Electronic equipment, communication equipment, and measurement equipment can be obtained.
Claims (1)
C)導電性付与剤、および(D)有機錫化合物を必須成
分とすることを特徴とする導電性熱可塑性樹脂組成物。 2 有機錫化合物が、ハロゲン系難燃剤に対して0.5
〜5重量%含有されていることを特徴とする特許請求の
範囲第1項記載の導電性熱可塑性樹脂組成物。[Scope of Claims] 1 (A) thermoplastic resin, (B) halogen flame retardant, (
A conductive thermoplastic resin composition comprising C) a conductivity imparting agent and (D) an organotin compound as essential components. 2 Organotin compound is 0.5% compared to halogen flame retardant
The conductive thermoplastic resin composition according to claim 1, wherein the conductive thermoplastic resin composition contains 5% by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17044984A JPS6151059A (en) | 1984-08-17 | 1984-08-17 | Electrical conductive thermoplastic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17044984A JPS6151059A (en) | 1984-08-17 | 1984-08-17 | Electrical conductive thermoplastic resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6151059A true JPS6151059A (en) | 1986-03-13 |
Family
ID=15905133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17044984A Pending JPS6151059A (en) | 1984-08-17 | 1984-08-17 | Electrical conductive thermoplastic resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6151059A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0410701A2 (en) * | 1989-07-28 | 1991-01-30 | Raytheon Company | Gasket impervious to electromagnetic energy |
US8684460B2 (en) | 2011-06-15 | 2014-04-01 | Brose Fahrzeugteile Gmbh & Co. Kg, Coburg | Backrest structure for a seat with lumbar support and curving element comprising a pre-tensioning connecting element |
CN104877328A (en) * | 2015-05-21 | 2015-09-02 | 赵冯 | Plastic mobile phone shell |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57168A (en) * | 1980-05-31 | 1982-01-05 | Matsushita Electric Works Ltd | Flame-retardant plastic composition |
-
1984
- 1984-08-17 JP JP17044984A patent/JPS6151059A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57168A (en) * | 1980-05-31 | 1982-01-05 | Matsushita Electric Works Ltd | Flame-retardant plastic composition |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0410701A2 (en) * | 1989-07-28 | 1991-01-30 | Raytheon Company | Gasket impervious to electromagnetic energy |
US8684460B2 (en) | 2011-06-15 | 2014-04-01 | Brose Fahrzeugteile Gmbh & Co. Kg, Coburg | Backrest structure for a seat with lumbar support and curving element comprising a pre-tensioning connecting element |
CN104877328A (en) * | 2015-05-21 | 2015-09-02 | 赵冯 | Plastic mobile phone shell |
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