JP2949675B2 - Conductive resin composition for injection molding - Google Patents

Conductive resin composition for injection molding

Info

Publication number
JP2949675B2
JP2949675B2 JP3289295A JP28929591A JP2949675B2 JP 2949675 B2 JP2949675 B2 JP 2949675B2 JP 3289295 A JP3289295 A JP 3289295A JP 28929591 A JP28929591 A JP 28929591A JP 2949675 B2 JP2949675 B2 JP 2949675B2
Authority
JP
Japan
Prior art keywords
weight
injection molding
conductive resin
resin composition
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3289295A
Other languages
Japanese (ja)
Other versions
JPH05101709A (en
Inventor
一郎 山元
修三 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainichiseika Color and Chemicals Mfg Co Ltd
Original Assignee
Dainichiseika Color and Chemicals Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17741336&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP2949675(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dainichiseika Color and Chemicals Mfg Co Ltd filed Critical Dainichiseika Color and Chemicals Mfg Co Ltd
Priority to JP3289295A priority Critical patent/JP2949675B2/en
Publication of JPH05101709A publication Critical patent/JPH05101709A/en
Application granted granted Critical
Publication of JP2949675B2 publication Critical patent/JP2949675B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、IC製造工程において
使用されるトレー、コンテナなどの搬送容器あるいは基
盤実装ラインで用いられるラック類を形成するために有
効な射出成形用導電性樹脂組成物に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive resin composition for injection molding which is effective for forming trays, containers and other transport containers used in an IC manufacturing process, or racks used in a board mounting line. .

【0002】[0002]

【従来の技術】従来、ICの製造工程で搬送に使用され
るトレー、コンテナなどの容器、あるいは基盤実装ライ
ンで用いられるラック類を成形する材料としては、主に
ポリスチレンやポリプロピレンをベースにした導電性コ
ンパウンドが実用されている。ところが、近年における
IC実装工程はライン環境がますます高密度化・高速化
しており、そのうえIC自体も高熱に曝されることも多
くなってきている。このような環境変化に伴って、例え
ば封止材に含まれる水分によって材料にクラックが発生
する等の不都合な現象を招くことがある。このため、I
C製造工程や基盤実装ラインで使用される容器、ラック
類などには一層の耐熱性能が要求されている。また、工
程の自動化・ロボット化に対応するために寸法精度も高
める必要がある。
2. Description of the Related Art Conventionally, as a material for forming containers such as trays and containers used for transportation in an IC manufacturing process, or racks used in a board mounting line, conductive materials based on polystyrene or polypropylene are mainly used. Sex compounds have been put to practical use. However, in recent years, in the IC mounting process, the line environment has been increasing in density and speed, and moreover, the IC itself is often exposed to high heat. Such a change in the environment may cause inconvenient phenomena such as cracking of the material due to moisture contained in the sealing material. Therefore, I
Containers and racks used in the C manufacturing process and the substrate mounting line are required to have higher heat resistance. It is also necessary to increase dimensional accuracy in order to respond to automation and robotization of the process.

【0003】これに対し、従来コンパウンド樹脂として
汎用されているポリスチレンは寸法精度の面では問題は
少ないものの、熱変形温度が実使用温度で約80℃が限界
であるため上記の要求特性を満足しない欠点がある。こ
の欠点を解消する組成として、ポリスチレンに代えてポ
リプロピレンにマイカまたはタルクを配合したものも提
案(特開昭58−206646号公報、特開昭58−108242号公
報) されている。しかしながら、この成分組成では耐熱
性の点では実用レベルに達するが、熱履歴による寸法変
化収縮が進行し易く、寸法安定性に難がある。この種の
無機充填材で強化したポリプロピレン系の導電性樹脂材
料では、成形後に収縮安定化を図るためのアニーリング
処理を施したのちに実用に供しても、繰り返しの熱履歴
により収縮が収まらず、経時的に寸法公差を外れてしま
ったり、収縮の進行に伴って材料に反りや捻じれなどの
変形も発生し易くなる問題点がある。
On the other hand, polystyrene, which has been widely used as a conventional compound resin, has few problems in terms of dimensional accuracy, but does not satisfy the above-mentioned required characteristics because the heat deformation temperature is limited to about 80 ° C. at the actual use temperature. There are drawbacks. As a composition for solving this drawback, a composition in which mica or talc is blended with polypropylene in place of polystyrene has also been proposed (JP-A-58-206646 and JP-A-58-108242). However, this component composition reaches a practical level in terms of heat resistance, but shrinks in dimensional change due to heat history, and has poor dimensional stability. In a polypropylene-based conductive resin material reinforced with this kind of inorganic filler, even after being subjected to an annealing treatment for stabilizing shrinkage after molding, the shrinkage does not stop due to repeated heat history, even if it is put to practical use. There is a problem that the dimensional tolerance is deviated with time, and the material is liable to be deformed such as warp or twist with the progress of shrinkage.

【0004】[0004]

【発明が解決しようとする課題】本発明者らは、上記の
問題点を解決するために鋭意研究を重ねた結果、無機充
填材としてマイカを用いて強化したポリプロピレン系を
ベースにした成分組成に特定の有機系造核材を配合する
と、成形後における熱変形温度が向上し、また寸法安定
性が速やかに進行するとともにその後の繰り返し加熱に
よる寸法変化も極めて少なくなる事実を確認した。
SUMMARY OF THE INVENTION The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that a polypropylene-based component composition reinforced with mica as an inorganic filler has been used. It has been confirmed that when a specific organic nucleating material is added, the heat deformation temperature after molding is improved, the dimensional stability is rapidly advanced, and the dimensional change due to repeated heating is extremely small.

【0005】本発明は前記の知見に基づいて開発された
もので、その目的は、乾燥、信頼性試験、ハンダ付け後
工程等において 120〜150 ℃程度の実使用温度環境に曝
された場合にも熱履歴による寸法変化が極めて少ない耐
熱ICトレー、ラック、コンテナー等の成形用として好
適な射出成形用の導電性樹脂組成物を提供することにあ
る。
The present invention has been developed on the basis of the above findings, and its object is to provide a method for drying, reliability tests, post-soldering processes, etc., when exposed to an actual use temperature environment of about 120 to 150 ° C. Another object of the present invention is to provide a conductive resin composition for injection molding suitable for molding heat-resistant IC trays, racks, containers, and the like, in which dimensional changes due to heat history are extremely small.

【0006】[0006]

【課題を解決するための手段】上記の目的を達成するた
めの本発明による射出成形用導電性樹脂組成物は、ポリ
プロピレン樹脂40〜70重量%、マイカ20〜50重
量%、平均粒子径が100mμ以下で吸油量が50ml
/100g以上のカーボンブラック5〜30重量%およ
び有機系造核剤0.1〜3重量%を配合してなる組成で
あって、熱変形温度(ASTM D−684:4.6k
gf/cm)が140℃以上、体積固有抵抗(SRI
S2301)が1×10Ωcm以下の特性を備えるこ
とを構成上の特徴とする。
In order to achieve the above object, the conductive resin composition for injection molding according to the present invention comprises 40 to 70% by weight of a polypropylene resin, 20 to 50% by weight of mica, and an average particle diameter of 100 μm. Below 50ml oil absorption
/ 100 g or more of carbon black of 5 to 30% by weight and an organic nucleating agent of 0.1 to 3% by weight, and a heat distortion temperature (ASTM D-684: 4.6 k)
gf / cm 2 ) is 140 ° C. or higher and volume resistivity (SRI)
The configuration is characterized in that S2301) has a characteristic of 1 × 10 6 Ωcm or less.

【0007】本発明の組成ベースとなるポリプロピレン
樹脂としては、耐熱性および成形性の観点からホモポリ
マーまたはブロックポリマーが使用され、特にMFRが
1以上のものを1種以上選択することが好適である。補
強材となる無機充填材は140℃以上の熱変形温度を得
るためにマイカを用いることが必要であり、またタルク
と併用することもできる。マイカは外観、摩耗剥離、ウ
エルド物性などを向上させるために平均粒径100μm
以下の微粒子を用いることが好ましい。導電性付与材料
となるカーボンブラックには、ファーネスブラックおよ
びアセチレンブラックをそれぞれ単独または組み合わせ
て用いることができるが、導電性付与能力の点から平均
粒子径100μm以下、吸油量50ml/100g以上
の特性を備えるものが好適に使用される。
As the polypropylene resin as the composition base of the present invention, a homopolymer or a block polymer is used from the viewpoint of heat resistance and moldability, and it is particularly preferable to select one or more having a MFR of 1 or more. . It is necessary to use mica for the inorganic filler as a reinforcing material in order to obtain a heat deformation temperature of 140 ° C. or higher, and it is also possible to use it together with talc. Mica has an average particle size of 100 μm to improve appearance, abrasion peeling, and weld properties.
It is preferable to use the following fine particles. Furnace black and acetylene black can be used alone or in combination as the carbon black serving as the conductivity-imparting material. However, from the viewpoint of the conductivity-imparting ability, characteristics of an average particle diameter of 100 μm or less and an oil absorption of 50 ml / 100 g or more are required. Those provided are preferably used.

【0008】これら主成分の好適な配合比率は、ポリプ
ロピレン樹脂40〜70重量%、マイカ20〜50重量
%、カーボンブラック5〜30重量%であり、用途目的
に応じてこの範囲内で適宜に設定する。特に前記配合比
率の下限は重要で、ポリプロピレン樹脂が40重量%を
下廻ると成形性が悪化し、マイカが20重量%未満では
140℃(ASTM D−648:4.6kgf/cm
)以上の熱変形温度を確保することが困難となり、ま
たカーボンブラックが5重量%を下廻ると体積固有抵抗
値(SRIS2301)を1×10Ωcm以下にシフ
トさせることができなくなる。
The preferred compounding ratio of these main components is 40 to 70% by weight of a polypropylene resin, 20 to 50% by weight of mica, and 5 to 30% by weight of carbon black. I do. Particularly, the lower limit of the compounding ratio is important. If the polypropylene resin is less than 40% by weight, the moldability deteriorates, and if the mica is less than 20% by weight, 140 ° C. (ASTM D-648: 4.6 kgf / cm)
2 ) It is difficult to secure the heat deformation temperature above, and if the carbon black is less than 5% by weight, the volume resistivity (SRIS2301) cannot be shifted to 1 × 10 6 Ωcm or less.

【0009】主成分に配合する有機系造核剤は寸法安定
性に寄与する成分で、ヒドロキシ−ジ(ターシャリーブ
チル安息香酸)アルミニウム、燐酸2,2′−メチレン
ビス(4,6−ジ−tert−ブチルフェニル) ナトリウム
または低級アルキル置換ジベンジリデンソルビトールが
選択的に使用される。該有機系造核剤の添加量は、0.1
重量%から寸法安定化の効果が発揮されるが、その効果
は一定量で飽和する。したがって、0.1 〜3重量%、好
ましくは 0.1〜1重量%の範囲に設定される。
The organic nucleating agent blended in the main component is a component that contributes to dimensional stability, and includes aluminum hydroxy-di (tert-butylbenzoate) and 2,2'-methylenebis (4,6-di-tert-phosphate). -Butylphenyl) sodium or lower alkyl-substituted dibenzylidene sorbitol is optionally used. The amount of the organic nucleating agent added is 0.1
The effect of dimensional stabilization is exhibited from the weight%, but the effect is saturated at a certain amount. Therefore, it is set in the range of 0.1 to 3% by weight, preferably 0.1 to 1% by weight.

【0010】上記の成分組成には、必要に応じて酸化防
止剤、安定剤、分散剤、カップリング剤等を添加したの
ち、バンバリーミキサー、二軸押出機、加圧ニーダー等
の装置を用いて混練し、本発明の射出成形用導電性樹脂
組成物を得る。
After adding an antioxidant, a stabilizer, a dispersant, a coupling agent and the like to the above-mentioned component composition, if necessary, using a device such as a Banbury mixer, a twin-screw extruder, and a pressure kneader. The mixture is kneaded to obtain the conductive resin composition for injection molding of the present invention.

【0011】[0011]

【作用】本発明によれば、主成分となるポリプロピレン
樹脂、マイカおよび平均粒子径が100μm以下で吸油
量が50ml/100g以上のカーボンブラックからな
る組成が熱変形の阻止および導電性の付与に機能し、更
に有機系造核剤の配合作用で材質の寸法変化が効果的に
改善される。
According to the present invention, a composition comprising a main component of polypropylene resin, mica and carbon black having an average particle diameter of 100 μm or less and an oil absorption of 50 ml / 100 g or more functions to prevent thermal deformation and impart conductivity. In addition, the dimensional change of the material is effectively improved by the action of blending the organic nucleating agent.

【0012】このような作用が相乗して、熱変形温度
(ASTM D−648:4.6kgf/cm)14
0℃以上、体積固有抵抗値(SRIS2301)1×1
Ωcm以下であり、かつ成形後のアニーリング時に
おける寸法安定化が速やかで繰り返し熱履歴による寸法
変化が極めて少ないという特有の効果が付与される。
[0012] Such an action is synergistic, and the heat distortion temperature (ASTM D-648: 4.6 kgf / cm 2 ) 14
0 ° C or higher, volume resistivity (SRIS2301) 1 × 1
0 6 [Omega] cm or less and unique advantageous effect that the dimensional change due to dimensional stabilization is rapidly repeated thermal history during annealing after molding is very low is applied.

【0013】[0013]

【実施例】以下、本発明の実施例を比較例と対比して説
明する。
Hereinafter, examples of the present invention will be described in comparison with comparative examples.

【0014】実施例1〜9、比較例1〜4 表1に示す組成の成分を、1.71容量のバンバリーミ
キサーを用いて均一に溶融混練した。混練物をミキシン
グロールでシート化し、角ペレタイザーで角形ペレット
に造粒化した。ついで、角形ペレットを射出成形機で棒
状(205mm×12.8mm×6.4mm)に成形
し、22±2℃の室内に24時間放置して評価試料を得
た。
Examples 1 to 9 and Comparative Examples 1 to 4 Components having the compositions shown in Table 1 were uniformly melt-kneaded using a 1.71 volume Banbury mixer. The kneaded material was formed into a sheet by a mixing roll and granulated into a square pellet by a square pelletizer. Then, the square pellet was formed into a rod shape (205 mm × 12.8 mm × 6.4 mm) by an injection molding machine, and left in a room at 22 ± 2 ° C. for 24 hours to obtain an evaluation sample.

【0015】[0015]

【表1】 [Table 1]

【0016】なお、表1に示した成分のうち、ポリプロ
ピレン(PP)樹脂のHはMFR8のホモポリマー〔三
井東圧化学(株)製、三井ノーブレンJHHG〕、Bは
MFR8のブロックポリマー〔三井東圧化学(株)製、
三井ノーブレンBJHHG〕である。無機充填材のう
ち、Mはマイカ〔プレコ社製、プレコマイカS−32
5〕、Tはタルク〔村松産業(株)製、ハイフィラータ
ルク16〕である。カーボンブラック(CB)のうち、
Fはファーネスブラック〔平均粒子径31mμ、吸油量
360ml/100g ;ライオン(株)製、ケッチェ
ンブラックEC〕、Aはアセチレンブラック〔平均粒子
径41mμ、吸油量212ml/100g;電気化学工
業(株)製、デンカブラック〕である。有機系造核剤の
うち、Hはヒドロキシージ(tert−ブチル安息香
酸)アルミニウム〔シェル化学社製〕、Rは燐酸2,
2’ −メチレンビス(4,6−ジ−tert−ブチル
フェニル)ナトリウム〔旭電化(株)製、マークNA−
11〕、Mはメチル置換ジベンジリデンソルビトール
〔新日本理化(株)製、ゲルオールMD〕である。そし
て酸化防止剤はチバガイギー社製のイルガノックス10
10である。
In the components shown in Table 1, H of the polypropylene (PP) resin is a homopolymer of MFR8 [Mitsui Noblen JHHG manufactured by Mitsui Toatsu Chemicals, Inc.], and B is a block polymer of MFR8 [Mitsui Pressure Chemical Co., Ltd.
Mitsui Noblen BJHHG]. Among the inorganic fillers, M is mica [Preco Squid S-32, manufactured by Pleco.
5], T is talc [manufactured by Muramatsu Sangyo Co., Ltd., high filler talc 16]. Of carbon black (CB),
F is furnace black [average particle diameter 31 mμ, oil absorption 360 ml / 100 g; Ketchen Black EC manufactured by Lion Corporation], A is acetylene black [average particle diameter 41 mμ, oil absorption 212 ml / 100 g; Denki Kagaku Kogyo Co., Ltd.] Manufactured by Denka Black Co., Ltd.). Among organic nucleating agents, H is aluminum hydroxydi (tert-butylbenzoate) [manufactured by Shell Chemical Co., Ltd.], and R is phosphoric acid 2,2.
2'-methylenebis (4,6-di-tert-butylphenyl) sodium [Mark NA-, manufactured by Asahi Denka Co., Ltd.
11], M is methyl-substituted dibenzylidene sorbitol [Gelol MD, manufactured by Shin Nippon Rika Co., Ltd.]. The antioxidant is Irganox 10 manufactured by Ciba-Geigy.
It is 10.

【0017】ついで、各評価試料につき各種の特性を測
定し、その結果を表2に示した。なお、特性の測定条件
等は次によった。 (1) MFR:230 ℃、5kgf の条件でおこなった。 (2) 熱変形温度:ASTM D−648(4.6kgf/cm2)
によった。 (3) 表面抵抗:加熱前の表面におけるプルーブ電極抵抗
〔三菱油化社製、ロレスタCP Aタイプ〕を測定し
た。 (4) 体積固有抵抗:射出成形した厚さ2mmのプレートよ
り打ち抜いた試験片に対し、SRIS 2301 に準拠して
測定した。 (5) 加熱収縮率(%):1回の収縮率は(成形寸法)−
(1回加熱後寸法)/(成形寸法)×100 の式で算出
し、5回の収縮率は(1回加熱後寸法)−(5回加熱後
寸法)/(1回加熱後寸法)×100 の式で算出した。 (6) 寸法安定性:各評価試料を135 ℃に設定したギヤオ
ーブン中で1時間加熱したのち22℃±2℃の室内に12時
間以上放置し、長手方向の寸法をノギスで測定した。こ
の手順を5回繰り返して寸法の変動を評価した。
Next, various characteristics of each evaluation sample were measured, and the results are shown in Table 2. The measurement conditions of the characteristics were as follows. (1) MFR: 230 ° C., 5 kgf. (2) Heat deformation temperature: ASTM D-648 (4.6 kgf / cm 2 )
According to (3) Surface resistance: The probe electrode resistance (Loresta CPA type, manufactured by Mitsubishi Yuka Co., Ltd.) on the surface before heating was measured. (4) Volume resistivity: Measured in accordance with SRIS 2301 on a test piece punched from a 2 mm thick injection molded plate. (5) Heat shrinkage (%): The shrinkage at one time is (molding size)-
Calculate with the formula of (Dimension after heating) / (Molding dimension) × 100, and the shrinkage rate of 5 times is (Dimension after heating once) − (Dimension after heating five times) / (Dimension after heating once) × It was calculated by the formula of 100. (6) Dimensional stability: Each evaluation sample was heated in a gear oven set at 135 ° C. for 1 hour, then left in a room at 22 ° C. ± 2 ° C. for 12 hours or more, and the longitudinal dimension was measured with a vernier caliper. This procedure was repeated five times to evaluate the dimensional change.

【0018】[0018]

【表2】 [Table 2]

【0019】表2の結果から、実施例による射出成形用
導電性組成物はいずれも熱変形温度が140℃を越え、
表面抵抗値が10Ω以下、体積固有抵抗が1×10
−6以下であって、特に比較例品に比べて5回の加熱収
縮率が低く、寸法安定性が良好であることが判明する。
From the results shown in Table 2, the conductive compositions for injection molding according to the examples all have a heat distortion temperature exceeding 140 ° C.
Surface resistance value is 10 5 Ω or less, volume resistivity is 1 × 10
-6 or less, which indicates that the heat shrinkage rate of five times is lower than that of the comparative example, and that the dimensional stability is good.

【0020】[0020]

【発明の効果】以上のとおり、本発明によれば成形後の
加熱による寸法変化による寸法収縮が速やかに終了し、
かつ繰り返し加熱による寸法変化が極めて軽微な射出成
形用導電性樹脂組成物を提供することが可能となる。し
たがって、例えば耐熱ICトレーのアニール工程の合理
化および品質向上に大きく寄与することが期待される。
As described above, according to the present invention, dimensional shrinkage due to dimensional change due to heating after molding is quickly completed,
In addition, it is possible to provide a conductive resin composition for injection molding in which dimensional change due to repeated heating is extremely small. Therefore, it is expected to greatly contribute to, for example, the rationalization of the annealing step of the heat-resistant IC tray and the improvement of the quality.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 ポリプロピレン樹脂40〜70重量%
マイカ20〜50重量%、平均粒子径が100mμ以下
で吸油量が50ml/100g以上のカーボンブラック
5〜30重量%および有機系造核剤0.1〜3重量%
配合してなる組成であって、熱変形温度(ASTM D
−684:4.6kgf/cm)が140℃以上、体
積固有抵抗(SRIS2301)が1×10Ωcm以
下の特性を備えることを特徴とする射出成形用導電性樹
脂組成物。
(1) 40 to 70% by weight of a polypropylene resin,
20-50% by weight of mica, carbon black having an average particle diameter of 100 mμ or less and an oil absorption of 50 ml / 100 g or more
A composition comprising 5 to 30% by weight and 0.1 to 3% by weight of an organic nucleating agent, and having a heat distortion temperature (ASTM D
-684: 4.6 kgf / cm 2 ) having a characteristic of 140 ° C. or more and a volume resistivity (SRIS2301) of 1 × 10 6 Ωcm or less, which is a conductive resin composition for injection molding.
JP3289295A 1991-10-08 1991-10-08 Conductive resin composition for injection molding Expired - Lifetime JP2949675B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3289295A JP2949675B2 (en) 1991-10-08 1991-10-08 Conductive resin composition for injection molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3289295A JP2949675B2 (en) 1991-10-08 1991-10-08 Conductive resin composition for injection molding

Publications (2)

Publication Number Publication Date
JPH05101709A JPH05101709A (en) 1993-04-23
JP2949675B2 true JP2949675B2 (en) 1999-09-20

Family

ID=17741336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3289295A Expired - Lifetime JP2949675B2 (en) 1991-10-08 1991-10-08 Conductive resin composition for injection molding

Country Status (1)

Country Link
JP (1) JP2949675B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4258412A1 (en) * 2022-04-07 2023-10-11 Hilti Aktiengesellschaft Discharge device for battery pack

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6395252A (en) * 1986-10-13 1988-04-26 Mitsui Toatsu Chem Inc Polypropylene resin composition

Also Published As

Publication number Publication date
JPH05101709A (en) 1993-04-23

Similar Documents

Publication Publication Date Title
EP2049586B1 (en) Improved thermal conductive polymeric ptc compositions
KR100258498B1 (en) Liquid crystal polester resin composition and molded article
EP1458814B1 (en) Polyamide resin compositions with electromagnetic interference shielding properties and articles formed therefrom
JPH03121157A (en) Flame-retardant resin composition and molded article for electrical component
JP2949675B2 (en) Conductive resin composition for injection molding
EP0666575A1 (en) Electroconductive resin composition
EP0451803A1 (en) Conductive polysulfone resin composition and high-heat-resistant, conductive semi-conductor article molded from same
JP4789312B2 (en) PCB cassette
JPH0315667B2 (en)
JPH03188158A (en) Antistatic polyphenylene ether resin composition and method for imparting antistatic property
JP2002220507A (en) Phenol resin molding material
JPS60115622A (en) Epoxy resin composition
JPH0645733B2 (en) Conductive polypropylene composition
KR101267830B1 (en) Elastomer composition
JP3299313B2 (en) Heat-resistant conductive resin composition
JPS62100553A (en) Electrically conductive polyphenylene ether based resin composition
JPH01201356A (en) Conductive polyacetal resin composition
JPS61294702A (en) Manufacture of polyolefin based conducting resin composition
EP0058916B1 (en) Electroconductive polyolefin resin composition
JPH10182887A (en) Conductive rubber composition
JPS6185460A (en) Electrically-conductive resin composition
JPH05214249A (en) Poly(arylene sulfide) mixture composition
JPS6151059A (en) Electrical conductive thermoplastic resin composition
JP4438473B2 (en) Epoxy resin composition and semiconductor device using the same
JPS60173027A (en) Electroconductive polyolefin resin composition

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20070709

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080709

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090709

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090709

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100709

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110709

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120709

Year of fee payment: 13

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120709

Year of fee payment: 13