JPS61500341A - Method and apparatus for positioning elements relative to a workpiece - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Method and device for positioning a blank on a workpiece The present invention provides a method and apparatus for positioning a blank on a workpiece. Regarding the method for positioning the elements, from the magazine or storage or from the magazine elements from a particular magazine or store selected from a group of magazines or stores. removing the elements, moving the elements to the work piece, and accurately predetermining the elements. the work piece. The present invention further relates to the above-mentioned method. Regarding equipment suitable for performing storage unit, magazine or group of storage units, element pickup and holding unit at least one element moving part comprising a material, at least one element moving part adapted to receive a work piece; a work piece receiving and holding station; or movable between the storage section and the workpiece receiving station.

A preferred field of application of the invention is the manufacture of electronic circuits, in particular the manufacture of electronic components on support elements. V, is the field in which it is placed. For example, printed circuit boards, hybrid circuits, etc. can be used as supporting elements. A ceramic substrate or similar work piece can be considered. support like this The element is a flat conductive carrier made of epoxy resin, ceramic material or similar. The rear board has a surface with a pattern of conductive traces and Minute electrical or electronic elements, such as resistors and capacitors.

A plurality of connection points are provided for receiving transistors and the like. Especially for hybrid circuits. Due to the extremely small dimensions and tight configuration of the Can be placed in the desired position before bonding to connection points and conductor traces provided on the element surface It is extremely important to ensure that the location is as accurate as possible.

Achieve a highly automated and economical manufacturing method for such electronic circuits as possible. It is known that automatically assembled agricultural machinery is used for automatically selects selected elements from a magazine or group of magazines. Pick up the elements from a certain magazine, send these elements to the circuit board, and finally the elements It is arranged precisely at a predetermined position on the surface of the circuit board. Until today With the knowledge obtained from the known technology, it is possible to control this moving part, and this to move the elements from the magazine to the work piece with the desired degree of precision. Ru. On the other hand, however, the position of the elements in the magazine cannot be as precise as desired. Therefore, the pick-up position of the element by the moving device is not guaranteed. I have to point out that there are cases where the position of Mika is shifted from the axis of the position. In other words, this means that the pickup of the moving part and the holding member The element to be displayed may be shifted from the desired apparent position or may be tilted. It means something.

With the aim of correcting this positional deviation, the element is lifted in an incorrect position. In order to shift the child to the theoretical position axis, i.e. the axis of symmetry is the theoretical position of the moving part. Has a centering element to comfortably shift the element until it aligns with the axis It was proposed to provide pick-up means for the moving part. Such devices are for example Disclosed in U.S. Pat. No. 4,135°630, it is not possible to remove the This course teaches the configuration for center positioning of electronic elements placed on a shifted circuit board. It shows. According to this, the elements placed on the circuit board are held with an offset position, and that the circuit board surface is The structure was designed with the idea that there would be no Conditions that result in such inaccurate placement In order to avoid The element removed from the magazine by using This means that the center position can be accurately determined with respect to the center axis of the hook.

This method and this device each operate in an essentially satisfactory manner. but However, the theoretically required apparent position when gripping electronic devices that are usually extremely small in size is Mechanical shifting into position requires mechanically complex and expensive components. child Center locators such as Because there are no It gets wet.

In addition, significant wear will occur that impairs the precision work of the center positioning part, and further damage to the element will occur. It must be noted that breakage or damage may occur under certain conditions. This public Another difficulty with knowledge structures is that the acceleration or non-acceleration of work requires extremely high It's worth it. Arranging multiple elements on a circuit board in a short rhythm In order to ) must be extremely powerful.

Finally, in order to center position the elements with different dimensions, pick up the moving part. We provide center positioning parts with multiple different dimensions that can be removably connected to parts. This is a major drawback in known structures. Furthermore the undesirable and time-consuming task of replacing such center locators; The relatively high cost and cost of keeping different centering parts in stock Investment must also be considered.

The first object of the present invention is to allow pickup from a magazine without exhibiting the above-mentioned drawbacks. quickly and with extremely high precision the The objective is to provide a method for This necessitates the use of complex and expensive central positioning elements. It must be made unnecessary.

Therefore, the method of arranging the element according to the invention on a workpiece is described in the subclaim of claim 1. This relates to the method described in the memorandum. To solve the above objects of the present invention In order to measure it, it is necessary to have the features described in the characteristic part of the claims. Suggested.

Therefore, in the method according to the present invention, once the device has been backed up, it can be adjusted to a desired state. Re-position the P device at a logically optimal position, that is, place its center on the holding means of the moving part. This is to avoid adopting a configuration that matches a more theoretical positional axis.

In contrast, the offset value and, if necessary, the tilt of the element with respect to said position axis Determine the skew angle and determine the movement path of the element and/or workpiece following this step. by changing or modifying the position of the element so that the element is finally positioned on the workpiece or is configured to be placed in a predetermined position within the workpiece. Provide a center positioning part Since this is not necessary, the moving part of the element moving part becomes much smaller. corrective maneuver Whether it is modifying the moving path of the element moving part or modifying the position of the workpiece, In any case, the control part of the necessary equipment, for example, by means of a purposeful supplement to the control program. Supplementary control measures are not required.

According to the method of the present invention, the element position can be scanned without placing the element. It is carried out while being held in a moving means. The element is from a magazine or a group of magazines. The selected magazine is removed and the work piece is sent to the moving position scanning section. scanning The part scans the amount of deviation of the element with respect to the theoretical positioning axis and sends a correction signal to the υ control part. to influence the travel path of the moving part and/or the position of the work piece. or modify it.

In the simplest case, only the deviation from the apparent position in the horizontal plane is determined. All you have to do is set it. This means that the elements being picked up from the magazine are placed in the first horizontal position. exactly on a directional axis, but perpendicular to a second axis perpendicular to said axis. This is the case when the location is uncertain. Normally, two mutual The position of the elements picked up from the magazine in the direction perpendicular to It is necessary to determine whether the position is misaligned. Such scanning will be explained in detail later. To explain in detail, this can be done by a scanning section.

In some cases it is necessary not only to determine the displacement of the element in the X and Y directions, but also to determine the possible tilting. Preferably, the skew deviation is also determined. This also depends on the position scanning unit. will be carried out.

The position scanning unit generates an error signal related to the tilt angle deviation and a correction signal derived from this. The signal activates the drive and corrects the element to the correct angular position.

In any case, the position scanning unit generates a correction signal or a number of correction signals, which The elements are repositioned so that they are placed in the correct position on the workpiece. This fix The moving path of the element moving unit, the position of the work piece, or or you can choose to have it affect both at the same time, in which case the movement It has the meaning of R optimization of the movement of the part.

Finally, it should be mentioned that the position of the element in the Z axis can be similarly determined. No. The scanning section can read the actual position of the element, including its height. and gives another correction signal, thereby placing the element perfectly smoothly on the surface of the workpiece. can do.

Another object of the invention is to provide a method suitable for implementing the method for positioning an element relative to a workpiece. Provided is a device according to the preamble of claim 8, whereby a device for removing from a magazine; The removed components are quickly and extremely accurately placed on a work piece, e.g. an electronic circuit board. The object is to enable the arrangement without having the above-mentioned difficulties. such a device must be such that complex, heavy and expensive center locating parts are not required. stomach.

Furthermore, such a device is compatible with elements of any size, thereby allowing elements of different sizes to be accommodated. Eliminates the need for operators to replace the center positioning part every time a child is handled. We must ensure that Finally, no elements are handled by such equipment. In this case, the device will remain undamaged and will last for a long period of time. It must maintain basic accuracy.

According to the present invention, such an object is achieved by having the structure shown in the characterizing part of claim 8. The problem is solved by providing a device that does this.

In the device according to the present invention, it is further provided that once the pickup is brought up, it is aligned with the mounting axis. Avoid using a configuration that In contrast, with respect to the position axis Determine the deviation value of the element and, if necessary, the tilt deviation angle, and continue at this stage. By changing or modifying the moving path of the element to be attached and/or the position of the work piece, so that it is finally placed in place on or in the workpiece with extremely high precision. It is composed of

As already mentioned, there is no need to provide a center positioning part, so element movement is easy. The amount of movement vJ of the element becomes much smaller: This means that the element moving part produces the same drive performance. The dimensions of the drive part can be reduced, or if the same working time is required. The result is the advantage of being able to reduce the The correction operation is to correct the moving path of the element moving part. In any case, the control of the necessary equipment must be No additional control means are necessary.

According to the invention, the scanning part is arranged at a distance above the work piece receiving and holding means. and is substantially coaxial therewith. Therefore, the element moving part can be placed on the work piece for a short time. Preferably, the element held by the element 8vJ means is stopped at a position scanning position. It is possible to stop what is on the part.

During this brief stop, the theoretical position axis, i.e. the element relative to its normal position, is Determine the actual position and generate a correction signal. This correction signal is applied in the X and Y directions. represents the deviation of the element relative to the element and, if necessary, its inclination. The scanning section is the control means of the device It is operably connected to the li, thereby receiving these correction signals and holding it in the moving part. Modifications may be made to the moving path of the element being moved, the position of the workpiece, or both.

Another possibility is that the position scanning means is located under the element pickup and holding member of the element moving means. and substantially coaxially therewith. like this The configuration allows determining possible displacement of the element without the need to interrupt the movement of the element moving means. can be done. As far as the use of deviation and correction signals is concerned, the above mentioned facts are similar. This applies to

Of course, there are various possibilities as to the actual configuration of the scanning section. Preferred embodiment In this case, the position scanning means has a frame member and is arranged on or in the work piece. The pickup and holding member of the element moving means that holds the element pass through the inside of this frame member. It is configured to As already mentioned, when the element is inside the frame member, It is necessary to stop the movement of the moving means. At this moment, the element is in the frame. While passing through the material, its actual position is scanned and deviations from the predetermined position are determined. A correction signal is issued based on the results of this measurement.

Scanning can be done with or without contacting the element. In case of contact 4 At least some of the frame side group members have position scanning needles, and these needles are connected to the frame side group members. It is located at the center of the member and is held movably in the vertical direction with respect to the frame side group member. rank Each of the positioning and scanning needles is freely operable with a drive and measuring unit provided in the frame side element. The needle can be moved toward the center of the frame side member to measure the amount of movement. It is. When the needle tip contacts the side surface, the movement of the needle is determined and a correction signal is issued, This reflects the actual position of the element and influences the control means.

In the second case, the scanning is carried out without contacting the element, i.e. by the laser beam. Ru. In this case as well, there are various possibilities and the claims are limited individually, and the subsequent Each actual percentage is individually stated in each aspect. Do not touch the element here. It has more general and fundamental advantages (e.g. no wear of the measuring means) and also It is possible to scan the tilted position of the element with respect to the determining axis, and also in the X and Y directions. I will just point out that the deviation from the apparent position can be measured. Note that the height of the element It is also possible to determine the actual position with respect to the height.

Below, some actual FM aspects of the device and method of the present invention and the attached drawings are explained. This will be explained in more detail with reference to .

In the drawing: FIG. 1 is an overall side view of a structure for positioning elements; Figure 2 shows a workpiece holding station and element magazine group corresponding to the structure shown in Figure 1. Plan view: Figures 3 to 5 are explanatory diagrams showing the positions of the elements inside the scanning section: FIG. 6 is an explanatory plan view of the first embodiment of the scanning section, and the positions of the elements are in mechanical contact. Figure 7 shows the position of the element being scanned without touching the element. An explanatory plan view of the second embodiment of the scanning unit configured to scan: FIG. 8 shows the position of the element. Explanatory plan view of a third embodiment of a scanning unit that scans without contacting an element ; FIG. 9 is an explanatory plan view of the embodiment of FIG. 8 showing a state in which the element is tilted; Figure 10 shows the scanning section that scans the position of the element without touching the element. Explanatory plan view of the four embodiments: and FIG. FIG. 2 is an explanatory plan view of the actual 1M aspect of FIG.

As can be seen from FIG. 1, the device according to the invention has a console 1, on the top of which A workbench 2 is provided as a means for receiving and holding a workpiece. Workbench 2 is It has a drive means (not shown), the drive means is operably connected to the workbench, and the drive means is operable. The workbench 2 can be moved in the direction of arrow X and the direction of arrow Y (see Figure 2). Ru. Both movement directions X and Y are rectangular to each other and move substantially on a horizontal plane. .

The workpiece 3 is placed on the workbench 2 and held thereon so as not to move. this In the example, the work piece 3 is a printed circuit board or substrate, i.e. for the production of electronic circuits. It is a ceramic material. The work platform 2 has positioning and holding means 4, which It engages with the work piece 3 placed on the table 2. Work so as not to move the work piece 3. Make 19υj to fix it on table 2.

Another console 5, which is part of the apparatus shown in FIGS. It is arranged at a certain distance from the sole 1 and has a magazine 6 of a large number of elements. Ru. The console has a stock member 7 from which extends a tape 8, and The console 5 has a large number of elements 9a, 9b..., and the elements are placed on the tape 8. glued to the surface. Of course, other types of element magazines 6, such as storage bins, etc. (not shown). In addition to this, there is also a guide for magazine scanning. Several supplementary auxiliary scanning means are provided, but do not fall within the scope of the present invention. It is not shown because it is not intended to be The configuration of these auxiliary means can be chosen by a person skilled in the art. I think I can do it.

As can be seen from FIG. 1, the guide support member 10 is arranged on the two consoles 1.5 and guides the element moving section 11.

The element moving part 11 has a sliding carriage member 12, which is guided in the direction of arrow A. It can move along the support member 10. Preferably, the guiding support member 10 and sliding The structure consisting of the movable carriage member 12 is moved in the direction of arrow B, which is perpendicular to the arrow. to move to.

The element moving part 11 has a member 13 for picking up and holding, and this member is a hollow suction member. It has a pulling needle 14, which picks up the elements 9a...9d separated from the element magazine 6. up and hold. The hollow interior of the suction needle 14 is connected to a page air source (not shown). Ru. When the tip of the needle 14 comes into contact with the top surface of the element 9 to be separated from the magazine, a vacuum is created. is activated and the element 9 sticks to the needle 14. To enable this operation The entire element pickup and holding member 13 is aligned in the direction of arrow C in its height direction. Make it possible to move in the direction. This means that the needle 14 is lowered from the position shown in FIG. reaches the predetermined position of the element 9, and picks up the element by the above-mentioned vacuum suction effect. It means to be able to hold it. When the selected element is held at the needle tip, The element pickup and holding member 13 moves upward.

As already mentioned, the element moving section 11 moves in the direction of the arrow A, that is, the -th position on the position scanning section 15. It is movable along the guiding support member 10 from a position (shown in dotted lines in FIG. 1). position The scanning section 15 is located directly above the workbench and is substantially frame-shaped. This is held in needle 14. The element 9 is introduced into the position scanning section 15 and passes through it together with the needle 14. It means scales.

For details of the position scanning section 15, see some embodiments shown in FIGS. 6 to 11. I will explain it later in sequence. In any case, this position scanning unit 15 is LAW the actual position of the element with respect to the position axis and check whether it deviates from this. and is in a position to generate a correction signal based on the measured value.

3 to 5 show the elements in the frame position scanning unit 15 with respect to the vertically extending position axis P. Fig. 2 schematically shows different positions of the child 9; The elements shown in FIG. Therefore, not only the X-axis but also the Y-axis are theoretically in the correct apparent position and are tilted. On the other hand, the elements shown in Figures 4 and 5 are tilted and cannot be linearly aligned. It's deviated.

In the state not shown in FIG. 4, the position scanning unit 15 detects the inclination angle of the element 9 with respect to the apparent angle. It recognizes the degree, issues a correction signal, and moves the needle 14 until the element 9 occupies the position shown in FIG. Alternatively, the element pickup and holding member 13 are rotated. Furthermore, this position scanning section 15 indicates the axial position deviation (Fig. 5) of the element 9 in the directions of arrows X and Y on the horizontal plane. can also be recognized.

In the state shown in FIG. 5, the element 9 moves in the direction of the arrow is shifted from its apparent position by a distance value y. After this deviation value is determined, the position The position scanning section 15 outputs two correction signals, which are sent to the control unit of the device. , thereby correcting the moving path of the element moving unit 11 in the direction of arrows A and/or B. Or, correct the position of the workbench 2 in the X direction and/or Y direction. Or modify these combinations.

This method is actually carried out as follows: the element moving unit 11 is a device shown in FIG. It is on top of the selected magazine 6. The suction needle 14 descends in the direction of arrow C. The tip of the element 90 contacts the surface of the element 90 and is moved away from the magazine 6 to the work piece 3. become. In this case, the vacuum source is activated and the element 9C sticks to the tip of the needle 14. child The rear needle 14 is retracted to the position shown in FIG. Usually picked up like this The element 9C is located exactly at the center of the tip of the needle 14 with respect to the solid axis passing through the center of the needle. It is not attracted to the position and may be shifted somewhat in the X and Y directions. Also The element 9c picked up by the needle 14 is tilted with respect to the apparent angular position. It's also possible.

In the next step, the element moving unit 11 is moved to the position shown by the dotted line in FIG. 1 on the workbench 2. The needle 14 is now moved down until the element 9C is inside the scanning section 15. Run Depending on the configuration of the scanning section 15, the movement of the needle 14 may be stopped or may continue; The actual position of the element 9C is determined when the element 9C enters the frame-shaped scanning section 15. Ru. The position of the element moving unit 15 is determined by the signal from the scanning unit 15 according to arrow A and/or The position of the workbench 2 is corrected in the direction B or the position of the workbench 2 is changed in the X direction and/or Y direction. or a combination of both. Thus needle 14 The element 9c that is attracted to the tip of the needle is located exactly above the work piece 3, and the needle 14 descends and places the element 9C on the surface of the workpiece 30 with extremely high precision.

As already mentioned, the position scanning unit 15 also detects the tilt deviation of the element 9C with respect to the apparent angular position. HP. The correction signal emitted from this is such that element 9C reaches the desired parallel position. It is used to rotate the needle 14 until the needle 14 is rotated. using the control means available today. Due to the The needle is suctioning the element 9C held inside the frame position scanning unit 15. It is not necessary to actually stop the movement of 14, or only to stop it for a very short time. good.

When the element 9C is placed on the surface of the work piece 3, the vacuum state inside the needle 14 is released, The needle 14 is retracted. The element moving section 11 returns to the original position shown in FIG. Move to a position above one of the magazines 6 as indicated by mark A. The needle 14 is in the desired position. Once reached, the needle descends and picks up another element 9a...9d.

All the elements placed on the workpiece 3 are thus separated from the magazine 6 and placed on the workpiece. The above steps are repeated until moving to .

In the following description, some embodiments of the invention, in particular the position scanning section 15, will be described. Several embodiments of this will be described with reference to FIGS. 6-11.

Elements 20 and 20d in FIGS. 9 and 11 are in a tilted position; - force cylinder 6. 7.8.10 Element 20 is angularly positioned correctly, but in the X and Y directions. It's off.

In the case of the positions shown in FIGS. 9 and 11, the position scanning unit 15 determines the rotation angle of the element 9 and 6.7° 8 and 10, the element 9 Rotate the needle 14 or the element pickup and holding member 13 until it reaches a position parallel to the make it move. Further, this position scanning section 15 detects the horizontal deviation of the element 9, for example, In FIG. 6, the deviation between the value x in the X direction and the value y in the Y direction is QKed. measurement value Depending on the original correction signal, the element moving section 11 is moved in the direction of arrows A and/or B. , or move the workbench 2 in the X and/or Y directions, or These combination correction operations are performed.

Another embodiment of the position scanning unit 15 is illustrated in FIGS. 6 to 11 and described below. do.

In FIG. 6 a mechanical solution of the position scanning unit 15 is shown, in which the element to be scanned is Child 20 is subjected to mechanical contact to determine its position. Scanning section 1 shown in FIG. 5 has a square frame member consisting of four frame-shaped side members 21a to 21d.

Each of these side members has needles 22a to 22(l) which extend longitudinally. The drive and measurement units 23a to 23d are movably connected to each other. are doing. The unit moves the needle 22 in the direction of arrows U-l to LJ-4, i.e. on four sides. It can be driven in a direction perpendicular to the direction in which the member 21 extends. For those skilled in the art, such The technology for designing drive and measuring units is known and therefore a description of their construction will be provided. There is no need to go into further detail. The important thing is that the longitudinal direction of the needle 22 can record the direction Th value and output a control signal sent to the central control unit of the device The drive and measurement unit 23 is located at this location.

Its functions are as follows: In the starting position, the needles 22a to 22d are in the most retracted position, so that the suction The element 20 held by the needle 14 is a frame-shaped element made up of four frame-shaped side members 21. It is possible to enter the middle part of the position scanning section 15. The center of the needle 14, i.e. the theoretical position axis The line is marked M. When the element 20 reaches a predetermined position inside the position scanning unit 15, the needle 218 to 21d are elements 20 under the influence of drive and measurement units 23a to 23d. is driven in the direction of , and its tip contacts the side surface of the element 2o.

The amount of movement of the needle 22 is measured by the drive and measurement unit 23.The measured value is A modified signal or modified signals are recorded. The value of this correction signal is It is directly related to the apparent position, that is, the deviation value of the center N of the element 20 from the axis M.

The correction signal causes the element moving section 11 and/or the workbench to be driven. of element 20 When the actual position is determined, the needles 22a to 22d move back and the element 20 is placed on the workbench 3. , where the element occupies the theoretical optimum position with great precision. become.

The embodiment of the position scanning unit 15 shown in FIG. This is particularly advantageous if the shape is irregular or unknown. Difficulties with this implementation The point is at a point where the tilting movement of the element 20 about the axis M may not be perceivable.

Therefore, it is clear that element 20 is now in the correct angular position from the magazine and that axis M It is only shifted laterally in the X and Y directions with respect to the apparent position shown in the figure. This assumption is necessary.

A second embodiment of the position scanning section 15 is shown in FIG. In this case also four frames A square frame consisting of mold side members 21a to 21d is provided, and the elements are placed in this frame. A needle 14 holding 20 is introduced. The structure in Figure 7 consists of two laser diodes. The cards 24a to 24(l) are located at two opposite corners of the position scanning section 150 frame. and rotated by a suitable drive unit (not shown). This lane The laser diode 24 generates a sharply focused beam, which is connected to the four side members. It is reflected by the side surface of the element located inside the frame constituted by 21. Besides the two frames Receiving diodes 25a and 25b are arranged at two opposite corners of the , receives the beam projected by the two diodes 24 and reflected by the element 20. It is designed to be tolerated.

From FIG. 7, the laser diode 24b projects a beam during its rotation, which first The beam is reflected by the side surface 20a of the element 20, and the reflected beam is transmitted to the receiving diode 2. 5a, thereby recording that the beam was received. Re When the laser diode 24tl further rotates, the laser beam hits the side of the element 20. 20d and received by the receiving diode 25b. receiving die One of the ords 25 transmitted the Hg of the laser beam reflected from the side surface 20a. Sometimes the laser diode 24b is in an angular position and the receiver diode When 25 transmits the arrival of the laser beam reflected from the side surface 20d, it reaches another corner. degree position.

These two angular positions are recognized and recorded by the control unit of the device. laser - the positions associated with the diode 24a correspond: during its rotation an angular position; In this position, the projected beam is received by the receiving diode 25b. The reflected beam portion is then reflected from the side surface 20c at an angle of take the angular position reflected from side surface 20b at an angle such that it is received by 5a. .

These two angular positions are likewise recorded by the control unit.

Based on the values of these angles, the element 2 is moved from the theoretical apparent position according to mathematical laws. generating one or more correction signals that are directly related to the zero position offset value; be able to. As a result, the element 20 is angularly is assumed to be in the correct apparent position: this situation is shown by the solid line in Figure 7. Ru. However, it is possible that the element 20 is tilted at an angle with respect to the axis mm. Is Rukoto. Laser beam projection in such conditions and in such conditions The firing path is shown in dotted lines in Figure 7.

The rotation angle of the laser diodes 24a and 24b is such that the reflected beam is It will be understood that this is different from the aforementioned situation when received by 25a and 25b. cormorant. Therefore, by analyzing the rotation angle at the moment of reception of the reflected laser beam, Also, by continuously rotating the element 20 (in both directions if necessary), the position movement can be achieved. Determining the angular position of the element 20 that is exactly parallel to the frame side group members of the scanning section 15 be able to.

Another embodiment of the position scanning unit 15 is shown in FIGS. 8 and 9. these places In this case, the position of element 20 is determined without contact by mechanical means. one frame side county The member, in the embodiment of the drawing, the side member 21c includes a row of beam projection elements 26, For example, it has a laser diode. The beam generated by such a diode has an acute focal point and is projected parallel to the frame side group members 21b and 21d. frame side The frame-side grouping member 21a facing the grouping member 2IC has the receiving elements 27 in the corresponding row. , that is, a photosensitive semiconductor diode, etc., is connected to the light beam generated by each laser diode. A corresponding receiving diode 27 receives the beam.

In the state shown in FIG. Although it has shifted, the angular position is accurate. That is, its side surface is facing the frame side grouping member 21. are parallel. Therefore, a certain number of receiving diodes 27 located on the left and on the right A number of receiving diodes 27 located are projected from the laser diode 26. While being able to receive the laser beam, it is located at the center of the frame side grouping member 21a. A number of receiving diodes 27 receive the projection from the corresponding laser diode 26. It is not in a position to receive the laser beam. Because these are the shadows of element 2o Alcala is located in the same position. Therefore, the left receiver that receives the laser beam Ratio between the number of diodes 27 and the number of right receiving diodes that receive the laser beam is a coefficient directly proportional to the deviation of the element 20 in the X direction with respect to its apparent position. You could use it. The element 20 is precisely adjusted to determine the deflection in the Y direction. Rotate 90 degrees and measure this deviation as described above. two measurements is supplied to the control unit of the device and generates one or more correction signals, which The movement path of the element moving part 11 and/or the position of the work piece receiving and holding means 2 is The location will be corrected.

When the situation shown in FIG. 9 occurs, that is, when the element 20 is tilted with respect to the axis M, In this case, a small number of the left and right receiving diodes 27 are emitted from the laser diode 26. It can receive the emitted beam. Therefore, element 2o emits the laser beam It is rotated about the axis M until the number of diodes 27 received is maximum. write so that the element 20 is in the desired position, that is, in a position where its side surface is parallel to the frame side grouping member 21. It is confirmed that

Another embodiment of the position scanning unit 15 which can also operate without contacting the element is the first one. 0 and 11.

This embodiment substantially combines the embodiment of FIG. 7 with the embodiment of FIGS. 8 and 9. It was made by Also in this case, a frame consisting of four frame side members 21a to 21d A mold scanning section is installed. One frame side member similar to the embodiment of FIGS. 8 and 9. , ie 21a has a row of receiving diodes 31. Opposing the frame side group member 218 The frame side grouping member 21G has a fixed optical property 30 which is a concave laser diode on two sides. , whose two halves 30a and 30b direct a beam with an acute focus into two diametrical directions. Project to both sides of the target. These beams are substantially flat with respect to the frame side group members 210. It is a row. The two end regions of the frame side group member 21c are rotatable on rotating shafts 29a and 29b. Two reflective elements 28a and 29b in the form of mirrors, which can be supported, are provided.

Beam a4 projected from two halves 30a and 30b of laser diode 3o is reflected by Efi 28a and 28b and scans the position scanning section where the element 20 is located. Head inward of 15.

An inclination with respect to the axis M as shown in FIG. 11 or an X direction as shown in FIG. The position of the element 20 allows the receiving die to be The ode 31 is more or less projected from the laser diode halves 30a and 30b. and receives beams reflected by rotating mirrors 28a and 28b. Position of element 20 A possible procedure for measuring and determining is as follows: until the element 20, which is assumed to be QW, has reached its correct angular position. Rotates around axis M. After this, the laser diode halves 30a and 30 Two laser beams projected from b and reflected by GM 28a and 28b The displacement in the X direction is based on the number of receiving diodes 31 on the left and right sides that receive the is determined. A correction signal representing the deviation in the X direction is generated based on this measurement value. It will be done. The element 20 is then rotated exactly 90 degrees in a corresponding manner to correct the deviation in the Y direction. A positive signal is obtained. These two correction signals are used by the control unit of the device as already mentioned. The moving path of the element moving section 11 and/or the position of the workbench 2 are corrected. Ru.

The device described above can be applied in various embodiments without departing from the scope of the invention. It should be understood that Of course, the same applies to the method according to the present invention. It's true.

In particular, the method and apparatus according to the invention do not involve placing electronic components on a circuit board. , for example in the field of watchmaking, etc., to automatically attach all kinds of elements onto workpieces, etc. It is also desirable to use it in assembly processes that require accurate placement. .

Return Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 international search report

Claims (24)

[Claims] 1. A method of positioning an element relative to a work piece, the method comprising: a magazine or a magazine; removing an element from a particular magazine selected from the group and scanning the position of said element; The element is moved to the area of the work piece by the element moving means, and the element is moved to the surface of the work piece. In a method of placing an element in a predetermined position: removing an element from said magazine; After that, the element is moved to a predetermined position relative to the work piece by the element moving means. in which the selectable positioning axis of the element moving means is aligned with the element on the workpiece. coincident with the predetermined position; then move the element towards the workpiece During the measurement, the actual position of the element with respect to the positioning axis is measured and the predetermined record the deviations that would occur with respect to the given apparent position; and finally, if the element The predetermined apparent position and the actual position before being placed on the work piece. Depending on the scanned and recorded deviation between the An elementary method for a workpiece characterized in that the movement path of the workpiece and the element moving means is corrected. How to position the child. 2. Scanning the position of the element is performed not before the element is placed, but when the element is held with the element moving means. 2. The method according to claim 1, wherein the method is carried out while the patient is in a hospital. 3. The positioning axis extends vertically, and the position of the element with respect to the positioning axis is Claims characterized in that the displacement is measured and recorded in at least one horizontal direction. The method described in Item 1 or 2 of the scope. 4. The displacement of the element relative to the positioning axis is determined by at least two mutually perpendicular deviations. 4. A method according to claim 3, characterized in that the measurements and records are made in the horizontal direction. 5. Measure and record the deviation of the position of the element relative to the positioning axis with respect to the rotation of the element 4. The method according to claim 2 or 3, characterized in that: 6. A correction signal is generated based on the result of measuring the displacement of the element, thereby Any of the preceding claims characterized in that it controls and modifies the travel path of the child moving means. The method described in Section 1. 7. A correction signal is generated based on the measurement result of the positional deviation of the element, and this is used to Any one of claims 1 to 5, characterized in that the position of the work piece is controlled and corrected. or the method described in Section 1 or Section 6. 8. An apparatus for carrying out the method according to any one of the preceding claims, comprising: at least one element magazine or group of element magazines and for receiving elements; at least one element moving section having a pick-up means; at least one workpiece holding means for receiving a workpiece; said element The moving part can move between an element magazine or a group of element magazines; In an apparatus having a position scanning unit for scanning the instantaneous position of a moving element, hand: The position scanning section 15 is operated by the start-up means 13 and 14 of the element moving sections 10 and 11. The pick-up means is disposed within the movement path of the elements 9, 20 held by the pick-up means. Relative position of elements 9, 20 with respect to a predetermined position with respect to the positioning axis and is connected to the position scanning section 15 and at least It has a control means connected to a drive unit of the element moving section, and the control means is connected to the drive unit of the element moving section, and the control means controlling the drive unit based on the relative positional deviation value measured by the scanning section; A device characterized in that it becomes controlled in a manner that it controls. 9. The position scanning unit 15 is disposed on the upper part of the work piece holding unit (1, 2, 4) coaxially therewith, The device according to claim 8, characterized in that the device is arranged at a certain distance. Place. 10. The position scanning unit 15 is arranged in the element moving unit 11, and the position scanning unit 15 is arranged in the element moving unit 11, and Claim 8, characterized in that the device is located at the lower part of the top means 13, 14. equipment. 11. The position scanning unit 15 has frame members 21a to 21d, and the element 2 of the element moving unit Pick-up means 13 and 14 for holding 0 pass through the inside of the frame member. The device according to any one of claims 8 to 10, characterized in that: 12. The frame members 21a to 21d are quadrilateral or square, and most of the frame members are along one side 21a or 21b or 21c or 21d) Scanning unit members 22a-22d; 23a-23d or 24a, b, 25a, b or 26; 27 or 30; 31). The device according to any one of items 8 to 11. 13. At least some of the frame members 21a-21d are position scanning needles 22a-22. d, which is arranged at the center of the frame side member, extends at right angles thereto, and moves in the longitudinal direction. Each position scanning needle is connected to a drive and measuring unit provided on the frame side member. Moved to the center of the frame member by knits 23a-23d and measured the amount of movement. Apparatus according to any one of claims 8 to 11, characterized in that: 14. The drive and measurement units 23a to 23d include a driving means and an operating unit for the element moving section. 14. A device according to claim 13, characterized in that the device is connected to the 15. Projection elements 24a and 24b are arranged at respective areas of two opposing angles of the frame member. 20, the projection element emits a beam that can be reflected by an element 20 located inside the frame member. and rotate at least 90 degrees, and the receiving elements 25a, 25b is arranged at each of the remaining two opposing angles of the frame member, and the projection element to receive the beam projected from the frame member and reflected by the element inside the frame member. Apparatus according to any one of claims 8 to 12, characterized in that: 16. The beam projection elements 24a and 24b are characterized in that they rotate 360 degrees. 16. The apparatus according to claim 15. 17. Beam projecting elements 24a, 24b and beam receiving elements 25a, 25b are located at the front. Claim 15, characterized in that the device is connected to a drive unit of the element moving section. Or the device described in item 16. 18. The beam projection elements 24a, 24b are laser diodes, and the beam receiving elements 24a, 24b are laser diodes. Claim 15, wherein the elements 25a and 25b are photosensitive semiconductor elements. 18. The device according to any one of items 17 to 17. 19. At least one row of beam projection elements 26 is arranged closely along the frame side portion 21c. A row of beam receiving elements 2 is arranged along the frame side 21a on the side opposite to this frame side. 7 are arranged in close proximity to each other. The device according to item 1. 20. The beam projecting element 26 is a laser diode, and the beam receiving element 27 is a laser diode. A sensing semiconductor device, which includes a light sensing and receiving device with which each laser diode is associated. 20. Device according to claim 19, characterized in that it corresponds. 21. At least one row of photo-sensing elements 31 is arranged closely along the frame side part 21a. , a two-plane projection element 30 that projects two beams in diametrically opposite directions connects the light sensing and receiving element. It is provided at the center of the frame side portion 21c opposite to the frame side portion comprising the Reflective elements 28a and 28b are rotatably driven at both ends of the frame side portion 21c having elements. Claims 8 to 12, characterized in that: equipment. 22. The two-plane projection element 30 is composed of a semiconductor laser diode having two surfaces, and is a mirror. The reflective elements 28a and 28b are substantially parallel to the frame side portion 21c. Claim 21, characterized in that two laser beams are projected. Apparatus described in section. 23. Claim No. 3, characterized in that the light sensing/receiving element 31 is made of a semiconductor element. The device according to item 21 or 22. 24. Beam projection element (24a, b or 26 or 30 and beam receiving element) The child (25a, b or 27 or 31) is a control unit of the element moving means. Any one of claims 15-23, characterized in that the device is operably connected to The device according to item 1.