JPS6148858B2 - - Google Patents

Info

Publication number
JPS6148858B2
JPS6148858B2 JP55024871A JP2487180A JPS6148858B2 JP S6148858 B2 JPS6148858 B2 JP S6148858B2 JP 55024871 A JP55024871 A JP 55024871A JP 2487180 A JP2487180 A JP 2487180A JP S6148858 B2 JPS6148858 B2 JP S6148858B2
Authority
JP
Japan
Prior art keywords
moisture
powder
foundry sand
value
moisture content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55024871A
Other languages
Japanese (ja)
Other versions
JPS56120940A (en
Inventor
Masamichi Ozaki
Kazuo Oda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP2487180A priority Critical patent/JPS56120940A/en
Publication of JPS56120940A publication Critical patent/JPS56120940A/en
Publication of JPS6148858B2 publication Critical patent/JPS6148858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/043Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a granular material

Description

【発明の詳細な説明】 本発明は粉粒体、特に鋳物砂の水分調整方法に
関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for controlling the moisture content of granular materials, particularly foundry sand.

鋳造工場においては、鋳物砂の水分管理は極め
て大切なことである。この為には、混練前後の鋳
物砂の水分を正確に測定し、これに応じて混練時
の適切なる水分添加の調節が必要である。
In foundries, controlling the moisture content of foundry sand is extremely important. For this purpose, it is necessary to accurately measure the water content of the foundry sand before and after kneading, and to adjust the appropriate water addition during kneading accordingly.

従来に於けるこの種の水分測定は、鋳物砂に附
着した水分から電気抵抗値を測定する方式、秤量
によつて見掛け密度を測定する方式、輸送トラフ
に複数のスリツトを設け鋳物砂の造型性を利用し
て、個々のスリツトから流出した鋳物砂の層厚が
一定レベルに達したかどうかをセンサーで検出す
る方式等種々の方式がある。これ等のうち、第1
図に示すように電極を鋳物砂に接触させ、鋳物砂
の電気抵抗値を検出することによつて、水分を測
定する方式が実用化されていることは良く知られ
ている。
Conventional methods of measuring moisture content include measuring the electrical resistance value from the moisture attached to the foundry sand, measuring the apparent density by weighing, and measuring the moldability of the foundry sand by providing multiple slits in the transport trough. There are various methods, such as a method that uses a sensor to detect whether the layer thickness of molding sand flowing out from each slit has reached a certain level. Among these, the first
As shown in the figure, it is well known that a method of measuring moisture by bringing an electrode into contact with foundry sand and detecting the electrical resistance value of the foundry sand has been put into practical use.

第1図に於いて、コンベヤ1に依つて矢印Aの
如く搬送される鋳物砂2中に電極支持体3によつ
て支持された一対の電極4,5をある一定の深さ
Hに挿入して抵抗値を検出することによつて水分
測定を行なう。この場合、スクレーパ6を電極
4,5の手前に設けて鋳物砂2の表面を均してい
る。
In FIG. 1, a pair of electrodes 4 and 5 supported by an electrode support 3 are inserted to a certain depth H into molding sand 2 which is conveyed by a conveyor 1 as indicated by an arrow A. Moisture is measured by detecting the resistance value. In this case, a scraper 6 is provided in front of the electrodes 4 and 5 to level the surface of the molding sand 2.

しかし、上記従来の水分測定装置には次のよう
な欠点があつた。
However, the conventional moisture measuring device described above had the following drawbacks.

1 鋳物砂の特質として水分を含むと細かい塊毎
に遊離して、その塊と塊の間に空隙を形成し鋳
物砂の電極への接触状態は電極の或る部分では
密になり、或る部分では疎になつて一様になら
なくなる。また、鋳物砂は、水分が高くなる程
表面状況が段々悪くなり、スクレーパで均して
も、例えば水分が4.5%程度にもなると表面が
非常に荒された状態になつて一様に搬送できな
くなる。
1 A characteristic of foundry sand is that when it contains moisture, it separates into small lumps, forming voids between the lumps, and the contact state of the molding sand to the electrode becomes dense in some parts of the electrode, and It becomes sparse in some parts and becomes uneven. Furthermore, the higher the moisture content of molding sand, the worse the surface condition becomes. Even if you smooth it with a scraper, for example, if the moisture content reaches about 4.5%, the surface will be extremely rough and cannot be conveyed uniformly. It disappears.

2 コンベヤ1上の鋳物砂2の搬送量を常に一定
に保つことは困難である。このため、鋳物砂の
層厚(表面レベル)が変化するので、鋳物砂の
電極への接触状態の疎密が一様にならなくなり
正確な水分測定ができない。
2. It is difficult to always keep the amount of molding sand 2 conveyed on the conveyor 1 constant. For this reason, the layer thickness (surface level) of the foundry sand changes, and the contact state of the foundry sand to the electrode becomes uneven, making accurate moisture measurement impossible.

従来の電気抵抗式の水分測定装置は、上記の理
由により、鋳物砂の実際の水分値が3.5%位まで
は正確に測定することができるが、実際の水分値
が3.5%以上になると、測定器の目盛は水分の真
の変動に係わりなく大きくバラツキを生じ、整然
たる相関性を維持することが出来ないという欠点
があつた。
For the reasons mentioned above, conventional electrical resistance moisture measuring devices can accurately measure the actual moisture value of foundry sand up to about 3.5%, but if the actual moisture value exceeds 3.5%, the measurement will fail. The scale of the vessel varied widely regardless of the true fluctuations in moisture content, and had the drawback of not being able to maintain an orderly correlation.

従つて、鋳物砂の混練前の水分値を電気抵抗式
の水分測定装置で測定し、この測定値に基いて、
目標水分値に調整するようにした水分調整装置
は、その調整精度が低下する欠点があつた。
Therefore, the moisture value of the foundry sand before kneading was measured using an electrical resistance type moisture measuring device, and based on this measurement value,
Moisture adjusting devices that adjust to a target moisture value have a drawback in that the accuracy of the adjustment decreases.

本発明は、前記従来の欠点を改良した電気抵抗
式の粉粒体の水分測定及び調整方法を提供するこ
とにある。
An object of the present invention is to provide an electrical resistance method for measuring and adjusting the moisture content of powder or granular material, which improves the above-mentioned conventional drawbacks.

本発明は、粉粒体の水分値を一定にして、その
層厚と電極間を流れる電流値との関係について実
験したところ、粉粒体の層厚が一定以上になると
電流値が一定になることに着目してなされたもの
である。
In the present invention, when the moisture value of the granular material was kept constant, an experiment was conducted on the relationship between the layer thickness and the current value flowing between the electrodes, and it was found that when the layer thickness of the granular material exceeds a certain level, the current value becomes constant. This was done with this in mind.

以下、本発明を実施例に基いて説明する。第2
図は本発明を実施するための電気抵抗式水分測定
装置の一例を示すものである。図において、7は
ベルトコンベヤ8などによつて矢印A方向へ搬送
される鋳物砂である。そして、コンベヤ8上に
は、鋳物砂7の表面から鋳物砂7を押圧する如く
電極支持体9を設ける。電極支持体9には、鋳物
砂7の進行方向Aに対向して、流線型部9aを設
けると共に、その底面は平面状9bとし、鋳物砂
7と接するように電極10,11を設ける。電極
支持体9には、支持板12を立設する。そして、
支持板12と、図示しない枠体等に固定された支
持板13とは、ピン14,15,16,17を介
して、リンク部材18,19により連結されてい
る。従つて、電極支持体9は、その自重等により
鋳物砂7の表面を押圧すると共に、コンベヤ8を
搬送されてくる鋳物砂7の層厚(表面レベル)の
変化に応じて、上下方向に自由に移動できるよう
になつている。20は支持体12に設けたドツグ
で、このドツグ20の上下方向のレベルが予め設
定した基準レベルに達すると、ドツグ20は支持
体21に設置したリミツトスイツチ22に当接す
るようになつている。
The present invention will be explained below based on examples. Second
The figure shows an example of an electrical resistance type moisture measuring device for carrying out the present invention. In the figure, 7 is foundry sand conveyed in the direction of arrow A by a belt conveyor 8 or the like. An electrode support 9 is provided on the conveyor 8 so as to press the molding sand 7 from the surface thereof. The electrode support 9 is provided with a streamlined portion 9a facing the traveling direction A of the molding sand 7, and has a flat bottom surface 9b, and electrodes 10 and 11 are provided so as to be in contact with the molding sand 7. A support plate 12 is provided upright on the electrode support 9 . and,
The support plate 12 and the support plate 13 fixed to a frame (not shown) or the like are connected by link members 18, 19 via pins 14, 15, 16, 17. Therefore, the electrode support 9 presses the surface of the molding sand 7 by its own weight, and also moves freely in the vertical direction according to changes in the layer thickness (surface level) of the molding sand 7 conveyed on the conveyor 8. It is now possible to move to Reference numeral 20 denotes a dog provided on the support 12, and when the vertical level of this dog 20 reaches a preset reference level, the dog 20 comes into contact with a limit switch 22 installed on the support 21.

23は、図示しない電源に接続されているヒー
ターである。ヒーター23は、電極支持体9が鋳
物砂7と接する底面などを適度に加熱して、鋳物
砂の付着を防止するためのものである。24は鋳
物砂7の表面を均一に掻きならすためのスクレー
パーである。なお、前記ドツグ20、リミツトス
イツチ22による検出手段の他に、その他のセン
サーを用いた検出手段を採用することも可能であ
る。
23 is a heater connected to a power source (not shown). The heater 23 is used to appropriately heat the bottom surface of the electrode support 9 where it contacts the molding sand 7, thereby preventing molding sand from adhering to the electrode support 9. 24 is a scraper for scraping the surface of the foundry sand 7 uniformly. In addition to the detection means using the dog 20 and limit switch 22, it is also possible to employ detection means using other sensors.

次に、本発明の作用を第3図に基いて説明す
る。第3図は、本発明を用いた鋳物砂等の粉粒体
の水分調整システムの一例を示すものである。第
3図において、25は水分調整前の鋳物砂を混練
装置26例えば、連続サンドミル、マルチマルミ
キサー等に投入するためのコンベヤ装置、27は
混練装置26内の鋳物砂に水を添加するための水
槽、28は配管29に設置した電磁弁などの自動
操作弁である。30はベルトコンベヤで、混練装
置26で、その水分を目標水分値に調整された鋳
物砂を、次工程(例えば鋳型造型機の砂ホツパ
ー)に搬送するためのものである。31a,31
bは、第2図に示す水分測定装置で、各々コンベ
ヤ25,30を流れる水分調整前および調整後の
鋳物砂の水分値を測定する装置である。水分測定
装置31bは必要に応じて設けてもよい。31
a,31bは、同じく水分調整前および調整後の
鋳物砂の温度を測定する温度計、例えば、熱電対
式の温度計である。33はマイクロコンピユータ
ーなどの演算、記憶および制御を行なう装置であ
る。マイクロコンピユーター33は、自動弁2
8、水分測定装置31a,31b、温度計32
a,32bと電気的に接続されて信号の入出力が
できるようになつている。
Next, the operation of the present invention will be explained based on FIG. FIG. 3 shows an example of a moisture adjustment system for powder and granular materials such as foundry sand using the present invention. In FIG. 3, 25 is a conveyor device for feeding the foundry sand before moisture adjustment into a kneading device 26, for example, a continuous sand mill, a multi-mixer, etc., and 27 is a conveyor device for adding water to the foundry sand in the kneading device 26. The water tank 28 is an automatically operated valve such as a solenoid valve installed in the piping 29. 30 is a belt conveyor for conveying the foundry sand whose moisture content has been adjusted to a target moisture value by the kneading device 26 to the next process (for example, a sand hopper of a mold making machine). 31a, 31
b is a moisture measuring device shown in FIG. 2, which measures the moisture value of the foundry sand flowing through the conveyors 25 and 30 before and after moisture adjustment, respectively. The moisture measuring device 31b may be provided as necessary. 31
Numerals a and 31b are thermometers, for example, thermocouple thermometers, which measure the temperature of the foundry sand before and after moisture adjustment. 33 is a device such as a microcomputer that performs calculation, storage, and control. The microcomputer 33 controls the automatic valve 2
8. Moisture measuring device 31a, 31b, thermometer 32
It is electrically connected to the terminals a and 32b so that signals can be input and output.

次に、第3図に示す水分調整システムの作用に
ついて説明する。まず、ベルトコンベヤ25を駆
動させて、水分調整前の鋳物砂(戻り砂)を連続
して、混練装置26に投入する。このとき、混練
装置26も駆動させる。混練装置26は、所定量
の鋳物砂を混練しつつ、水分を調整された一定量
をコンベヤ30に払い出すようになつている。そ
して、混練装置26に一定量の鋳物砂が投入され
てから一定時間経過後に、ベルトコンベヤ25を
流れる水分調整前の鋳物砂の水分値と温度、さら
に、混練装置26から排出された鋳物砂の水分値
と温度とを、水分測定装置31a,31b、温度
計32a,32bで測定してマイクロコンピユー
ター33にインプツトする。これらの水分値、温
度の測定は、予め設定した時間間隔で測定(例え
ば0.1秒間隔)する。マイクロコンピユーター3
3は、水分測定装置31a,31b、温度計32
a,32bからの入力信号を数値(水分%、℃)
に変換する。
Next, the operation of the moisture adjustment system shown in FIG. 3 will be explained. First, the belt conveyor 25 is driven to continuously feed foundry sand (returned sand) before moisture adjustment into the kneading device 26 . At this time, the kneading device 26 is also driven. The kneading device 26 is configured to knead a predetermined amount of foundry sand and deliver a predetermined amount with controlled moisture to the conveyor 30. After a certain period of time has elapsed since a certain amount of foundry sand was put into the kneading device 26, the moisture value and temperature of the foundry sand flowing through the belt conveyor 25 before moisture adjustment are determined, and furthermore, the moisture value and temperature of the foundry sand discharged from the kneading device 26 are determined. The moisture value and temperature are measured by moisture measuring devices 31a, 31b and thermometers 32a, 32b and input into the microcomputer 33. The moisture value and temperature are measured at preset time intervals (for example, at 0.1 second intervals). microcomputer 3
3, moisture measuring devices 31a, 31b, thermometer 32
Input signals from a and 32b as numerical values (moisture %, °C)
Convert to

続いて、マイクロコンピユーター33は、上記
の測定値、混練装置26の砂処理量などから、目
標水分値に調整するための不足水分量を所定の計
算式により求める。そして、マイクロコンピユー
ター33は、自動弁28を制御して不足水分量を
混練装置26へ添加し、鋳物砂の水分値を目標値
に均一に調整するのである。
Next, the microcomputer 33 uses a predetermined calculation formula to determine the amount of insufficient moisture to adjust to the target moisture value from the above-mentioned measured values, the amount of sand processed by the kneading device 26, and the like. The microcomputer 33 then controls the automatic valve 28 to add the insufficient amount of moisture to the kneading device 26, thereby uniformly adjusting the moisture value of the foundry sand to the target value.

しかしながら、前記の通り、ベルトコンベヤ2
5,30を流れる鋳物砂の層厚(表面レベル)は
均一ではなく、その層厚が一定レベル以下になる
と、電気抵抗式水分測定装置31aの測定精度は
低下する欠点があつた。本発明では、第2図に示
すように、鋳物砂の層厚が一定レベル以下になる
とリミツトスイツチ22が作動するようになつて
いる。リミツトスイツチ22が作動しているとき
には、電極10,11を流れる電流値をマイクロ
コンピユーター33への入力として採用しないよ
うにし、その代りに、時系列的にみて、前回測定
した測定値(リミツトスイツチが作動していない
ときに測定した電流値)で不足水分量を求めるよ
うにする。
However, as mentioned above, the belt conveyor 2
The layer thickness (surface level) of the foundry sand flowing through the molding sands 5 and 30 is not uniform, and when the layer thickness falls below a certain level, the measurement accuracy of the electrical resistance moisture measuring device 31a decreases. In the present invention, as shown in FIG. 2, a limit switch 22 is activated when the thickness of the foundry sand layer falls below a certain level. When the limit switch 22 is activated, the current value flowing through the electrodes 10, 11 is not used as an input to the microcomputer 33, and instead, the previously measured value (when the limit switch is activated) is used as an input to the microcomputer 33. Determine the amount of water shortage using the current value measured when the water is not in use.

なお、前記の不足水分量をマイクロコンピユー
ター33で求める方法として、時系列的に予め設
定した複数個の水分値および温度の測定値につい
て平均値を求め、これらの平均値から不足水分量
を求め、この不足水分量を混練装置に添加する
と、水分値の調整精度がより向上する。
In addition, as a method for determining the water shortage amount using the microcomputer 33, the average value of a plurality of moisture values and temperature measurements set in advance in time series is determined, and the water shortage amount is determined from these average values. Adding this insufficient amount of moisture to the kneading device further improves the accuracy of adjusting the moisture value.

以上に説明した本発明は、鋳物砂等の水分調整
装置に用いると次の効果を有する。
The present invention described above has the following effects when used in a moisture regulating device for foundry sand and the like.

すなわち、鋳物砂の表面レベルが一定レベルよ
り低下した場合には、その時の水分測定値をマイ
クロコンピユーターに入力せず、前回測定した値
を入力するので、鋳物砂の目標水分値への調整精
度がより向上する。特に、水分値および温度の測
定時間間隔を小さくすると、その効果が大であ
る。この理由は、ベルトコンベヤ25,30を流
れる鋳物砂の水分値は、短時間で極端に変動する
可能性は少ないからである。
In other words, when the surface level of the foundry sand falls below a certain level, the moisture measurement value at that time is not input into the microcomputer, but the previously measured value is input, which improves the accuracy of adjustment to the target moisture value of the foundry sand. Improve more. In particular, the effect is great if the time intervals for measuring moisture values and temperatures are shortened. The reason for this is that the moisture value of the foundry sand flowing through the belt conveyors 25, 30 is unlikely to change significantly in a short period of time.

また、本発明において、鋳物砂の表面レベルが
低下してリミツトスイツチ22が作動した場合に
は警報装置(警報ベル、ランプ等)を作動させる
ようにするとよい。
Further, in the present invention, when the surface level of the molding sand decreases and the limit switch 22 is activated, it is preferable to activate an alarm device (alarm bell, lamp, etc.).

以上本発明の実施例の説明においては、鋳物砂
の水分調整方法について説明したが、本発明は、
一般の粉粒体の水分測定装置にも適用できること
は勿論である。
In the above description of the embodiments of the present invention, the method for controlling the moisture content of foundry sand has been described, but the present invention
Of course, the present invention can also be applied to a general moisture measuring device for powder or granular materials.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の装置の一例を示す側面図、第2
図は本発明の一実施例を示す側面図、第3図は本
発明の装置を用いた粉粒体の水分調整システムの
一例を示す図である。 7:鋳物砂、8:ベルトコンベヤ、9:電極支
持体、10,11:電極、20:ドツグ、22:
リミツトスイツチ。
Figure 1 is a side view showing an example of a conventional device; Figure 2 is a side view showing an example of a conventional device;
The figure is a side view showing an embodiment of the present invention, and FIG. 3 is a diagram showing an example of a moisture adjustment system for powder or granular material using the apparatus of the present invention. 7: Foundry sand, 8: Belt conveyor, 9: Electrode support, 10, 11: Electrode, 20: Dog, 22:
Limit switch.

Claims (1)

【特許請求の範囲】[Claims] 1 ベルトコンベヤ等により搬送される粉粒体に
電極を押圧してその電流値を求めの時間間隔で制
御装置に入力して粉粒体の水分値を求め、前記制
御装置は目標水分値に対する不足水分量を算出
し、前記不足水分量を粉粒体の混練装置に添加制
御する粉粒体の水分調整方法において、電極を埋
設し粉粒体を押圧する如く上下に移動可能にした
電極支持体にその上下方向の下限レベルを検出す
る検出手段を設け、前記検出手段が作動している
ときは、前記制御装置は前記検出手段が作動して
いないときの最新の電流値で前記不足水分量を算
出することを特徴とする粉粒体の水分調整方法。
1 Press an electrode against the powder or granule material conveyed by a belt conveyor, etc., input the current value to a control device at specified time intervals to obtain the moisture value of the powder or granule material, and the control device determines the moisture content of the powder or granule material. An electrode support in which an electrode is embedded and is movable up and down as if pressing the powder, in a method for adjusting the moisture content of a powder or granule, in which the moisture content is calculated and the insufficient moisture is added to a powder or granule kneading device. is provided with a detection means for detecting the lower limit level in the vertical direction, and when the detection means is in operation, the control device detects the insufficient water amount using the latest current value when the detection means is not in operation. A method for adjusting the moisture content of a powder or granular material, characterized by calculating the moisture content of a powder or granular material.
JP2487180A 1980-02-29 1980-02-29 Measuring device for moisture of pulverized body Granted JPS56120940A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2487180A JPS56120940A (en) 1980-02-29 1980-02-29 Measuring device for moisture of pulverized body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2487180A JPS56120940A (en) 1980-02-29 1980-02-29 Measuring device for moisture of pulverized body

Publications (2)

Publication Number Publication Date
JPS56120940A JPS56120940A (en) 1981-09-22
JPS6148858B2 true JPS6148858B2 (en) 1986-10-27

Family

ID=12150262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2487180A Granted JPS56120940A (en) 1980-02-29 1980-02-29 Measuring device for moisture of pulverized body

Country Status (1)

Country Link
JP (1) JPS56120940A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115015492B (en) * 2022-08-08 2022-11-04 合肥江淮铸造有限责任公司 Molding sand moisture on-line measuring device and molding sand humidification system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3646437A (en) * 1970-09-21 1972-02-29 Orville C Nutter Sand moisture detector including a plow nose housing and roller electrode
JPS52154699A (en) * 1976-06-18 1977-12-22 Asahi Chemical Ind Liquid detector
JPS54115193A (en) * 1978-02-28 1979-09-07 Omron Tateisi Electronics Co Seaweed humidity detector

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3646437A (en) * 1970-09-21 1972-02-29 Orville C Nutter Sand moisture detector including a plow nose housing and roller electrode
JPS52154699A (en) * 1976-06-18 1977-12-22 Asahi Chemical Ind Liquid detector
JPS54115193A (en) * 1978-02-28 1979-09-07 Omron Tateisi Electronics Co Seaweed humidity detector

Also Published As

Publication number Publication date
JPS56120940A (en) 1981-09-22

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