JPS6142474A - Flux cleaning agent - Google Patents
Flux cleaning agentInfo
- Publication number
- JPS6142474A JPS6142474A JP16026684A JP16026684A JPS6142474A JP S6142474 A JPS6142474 A JP S6142474A JP 16026684 A JP16026684 A JP 16026684A JP 16026684 A JP16026684 A JP 16026684A JP S6142474 A JPS6142474 A JP S6142474A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- flux
- rubber
- cleaning agent
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、フラックス洗浄剤に関する。特に電気・電子
回路基板からハンダ付フラックスを洗浄除去するに適し
た洗浄剤に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a flux cleaning agent. In particular, the present invention relates to a cleaning agent suitable for cleaning and removing soldering flux from electrical and electronic circuit boards.
（従来の技術）
電気・電子工業において使用されるプリント回路基板は
、通常、紙・フェノール積層板やガラス・エポキシ積層
板等の上に接着された銅箔回路を有するものであり、こ
の回路に電気・電子部品がハンダ付によって固定される
。普通には、ハンダ付は回路基板全体にフラックスを塗
布した後、熔融ハンダ浴中に通すことＫよって行なわれ
るか、フラックスを含むクリーム状ハンダを塗布した後
、加熱することによって行なわれる。いずれの場合も、
残存するフラックスは電気回路に悪影響を及ばずことが
あるので、耐久性や厳密さ全要求される場合、フラック
スは洗浄等圧よって除去されなければならない。(Prior Art) Printed circuit boards used in the electrical and electronic industries usually have a copper foil circuit bonded onto a paper/phenol laminate, glass/epoxy laminate, etc. Electrical/electronic parts are fixed by soldering. Usually, soldering is carried out by applying flux to the entire circuit board and passing it through a molten solder bath, or by applying a creamy solder containing flux and then heating it. In either case,
Residual flux may not adversely affect the electrical circuitry, so if durability and rigor are required, the flux must be removed by isobaric cleaning.
この洗浄剤として、これまで多くの溶剤が提案されてき
たが、実用的な面から洗浄効果が高く、毒性や引火点が
なく、化学的にも変化しにくい安定で安全な洗浄剤が強
く要望されている。現状でａ、ｉＪ／ロロエチレン、テ
トラクロロエチレン、メチルクロロホルム等の塩素化炭
化水素系の溶剤や、１，１．２−トリクロロ−１，２，
２−トリフルオロエタン等の弗素系溶剤が広く用いられ
ている。Many solvents have been proposed as this cleaning agent, but from a practical standpoint, there is a strong demand for a stable and safe cleaning agent that has a high cleaning effect, has no toxicity or flash point, and is resistant to chemical changes. has been done. At present, chlorinated hydrocarbon solvents such as a, iJ/rolloethylene, tetrachloroethylene, methyl chloroform, 1,1,2-trichloro-1,2,
Fluorine solvents such as 2-trifluoroethane are widely used.
しかしながら、これらの溶剤には多くの欠点がある。た
とえば、トリクロルエチレンやテトラクロルエチレンは
、洗浄力はかなり大きいが、梅性が強く、また、回路基
板や電気・電子部品に使われる樹脂やゴム等を侵すこと
が多いので、使用が制限される。メチルクロロホルムは
洗浄力が十分でない。弗素系溶剤は毒性が低く、電気・
電子部°品への影響が少ないので使用範囲が広いが、肝
腎の洗浄力が低すぎる。そのため弗素系溶剤にメタノー
ル、エタノール、イソプロパツール等ｌｌして、フラッ
クス洗浄力を改善する方法が提案されている。However, these solvents have a number of drawbacks. For example, trichlorethylene and tetrachlorethylene have considerable cleaning power, but their use is restricted because they have a strong acidity and often corrode resins and rubbers used in circuit boards and electrical/electronic parts. . Methyl chloroform does not have sufficient cleaning power. Fluorinated solvents have low toxicity and are
It has a wide range of uses because it has little effect on electronic components, but its cleaning power for the liver and kidneys is too low. Therefore, a method has been proposed to improve flux cleaning power by adding methanol, ethanol, isopropanol, etc. to a fluorine-based solvent.
（発明が解決しようとする問題点）
弗素系溶剤に前記のようにアルコール類を混合すると、
新九にプリント回路基板や電気・電子部品の金属部分、
特に亜鉛、亜鉛鍍金、アルミニウム等が発錆するという
問題が生じる。(Problems to be solved by the invention) When alcohols are mixed with a fluorinated solvent as described above,
Metal parts of printed circuit boards and electrical/electronic parts,
In particular, there is a problem in that zinc, zinc plating, aluminum, etc. rust.
（問題点を解決するための手段）
本発明者らは、上記問題点を解決する目的で種々検討し
た結果、フラックス洗浄力のすぐれた弗素系溶剤を見出
し、本発明圧到達した。(Means for Solving the Problems) As a result of various studies aimed at solving the above-mentioned problems, the present inventors discovered a fluorine-based solvent with excellent flux cleaning power and achieved the pressure of the present invention.
すなわち１本発明は、１，２−ジクロロ−１−フルオロ
エタン９４〜１００重量％とニトロメタン０〜６重量％
からなるフラックス洗浄剤である。That is, 1 the present invention contains 94 to 100% by weight of 1,2-dichloro-1-fluoroethane and 0 to 6% by weight of nitromethane.
It is a flux cleaning agent consisting of
本発明の溶剤は、引火点がなく 不燃性である。The solvent of the present invention has no flash point and is nonflammable.
さらに５電気・電子回路基板よりフラックスを除去する
能力が極めてすぐれている一方、回路基板や電気・電子
部品の金属や樹脂やゴムに対する悪影響が少ないという
利点を有する。特に銅、亜鉛、鉄に対する発錆や、アル
ミ電解コンデンサーのゴム部の膨潤が少ないことなどは
、本発明の使用範囲を一層拡大する。本発明の利点は、
ニトロメタンを少量含む時に一層顕著となるが、ニトロ
メタンが６重量％より多くなる時は、蒸発の際に燃焼性
となり、また、経済的にも得策でない。Furthermore, it has an extremely superior ability to remove flux compared to No. 5 electric/electronic circuit boards, and has the advantage of having less adverse effects on the metals, resins, and rubbers of circuit boards and electric/electronic parts. In particular, the fact that copper, zinc, and iron are less susceptible to rust and the rubber portion of aluminum electrolytic capacitors is less swollen further expands the scope of use of the present invention. The advantages of the invention are:
This becomes more noticeable when a small amount of nitromethane is included, but when nitromethane exceeds 6% by weight, it becomes flammable during evaporation and is not economically advisable.
本発明の洗浄剤には、通常行なわれる浸漬洗浄、蒸気洗
浄、超音波洗浄等が適用できる。また、さらに％別の目
的のために種々の添加剤、その他の安定剤、洗浄助剤等
を加えることは支障ない。The cleaning agent of the present invention can be applied to commonly used immersion cleaning, steam cleaning, ultrasonic cleaning, and the like. Furthermore, there is no problem in adding various additives, other stabilizers, cleaning aids, etc. for different purposes.
（実施例）
以下に本発明を実施例によって詳述するが、実施例中に
示される試験は次の方法にしたがってなされた。(Example) The present invention will be explained in detail below with reference to Examples, and the tests shown in the Examples were conducted according to the following method.
（１１ハンダ付フラツクス洗浄試験
銅被覆フ工ノール樹脂積層板からモデル的に作製された
プリント電気回路板Ｋ、各種の市販ハンダ付フラックス
を塗布し、ｔｏｏＣで２分間乾燥させた。次いで、２５
０ｃで１０分間焼付けを行ない、ハンダ付の実用条件に
近づけた。これを洗浄用試験片として、洗浄液の中に常
温で浸漬し、超音波をかけながら３０秒間洗浄試験した
。洗浄後の試験片は、イソプロパツールと水の７５／２
５容量チの混液の一定量に浸漬し、超音波をかけながら
５分間洗浄した。一方、空試験として、洗浄試験を省略
した試験片について、同様にイソプロパツールと水の混
液で洗浄した。この両者のインプロパツール／水混液の
比抵抗を測定し、空試験に対する比抵抗の上昇率をもっ
て、洗浄試験におけるフラックスの除去率とし、−で表
示した。(11 Soldering flux cleaning test A printed electric circuit board K made as a model from a copper-coated phenolic resin laminate was coated with various commercially available soldering fluxes and dried for 2 minutes at tooC.
Baking was performed at 0c for 10 minutes to approximate the practical conditions for soldering. This was used as a cleaning test piece, immersed in a cleaning solution at room temperature, and subjected to a cleaning test for 30 seconds while applying ultrasonic waves. After cleaning, the test piece was mixed with isopropanol and water at 75/2.
It was immersed in a fixed amount of a 5 volume mixture and washed for 5 minutes while applying ultrasonic waves. On the other hand, as a blank test, a test piece for which the cleaning test was omitted was similarly cleaned with a mixture of isopropanol and water. The specific resistance of both Improper Tool/Water mixtures was measured, and the rate of increase in specific resistance with respect to the blank test was defined as the flux removal rate in the cleaning test, and was expressed as -.
（２）金属腐蝕試験
溶剤中に鉄、亜鉛、銅の試験片の各々を別々に浸漬し、
６０Ｃで３日間処理した後、試験片の発錆、変色の状態
を観察した。(2) Immerse each of the iron, zinc, and copper test pieces separately in a metal corrosion test solvent,
After being treated at 60C for 3 days, the state of rusting and discoloration of the test piece was observed.
（３）合成樹脂・ゴム膨潤試験
合成樹脂、ゴムの試験片を溶剤中に浸漬し、常温で２０
時間放置した。放置後、試験片を取り出し、表面の溶剤
を拭き取り、その重量増加１■、増加率をチで表わした
。(3) Synthetic resin/rubber swelling test A synthetic resin/rubber test piece was immersed in a solvent for 20 minutes at room temperature.
I left it for a while. After standing, the test piece was taken out, the solvent on the surface was wiped off, and the weight increase was expressed as 1 cm, and the rate of increase was expressed as x.
実施例１
１．２−ジクロロ−１−フルオロエタンＣ以下、Ｆ−１
４１と略す）およびニトロメタン全容々０．５ 、１，
０ 、 Ｓ、０ 、６．０重量％含むｌｉ’−１４１、
さらに比較例として、１，１．２−トリクロロ−１，２
，２−トリフルオロエタン（以下、Ｆ−１１′５と略す
）およびエタノール３．６重量−とニトロメタン１．１
重量％ヲ含むＦ−１１５およびインプロノくノール３５
重量Ｓｔ含むｐ’−１１５、メチルクロロホルムについ
て、フラックス洗浄試験１行なった。Example 1 1.2-dichloro-1-fluoroethane C below, F-1
41) and nitromethane total volume 0.5, 1,
0, S, 0, li'-141 containing 6.0% by weight,
Furthermore, as a comparative example, 1,1,2-trichloro-1,2
, 2-trifluoroethane (hereinafter abbreviated as F-11'5) and ethanol 3.6% by weight and nitromethane 1.1%
F-115 and Impronoknol 35 containing wt%
One flux cleaning test was conducted on p'-115 containing weight St and methyl chloroform.
なお、洗浄試験には次のハンダ付フラックスを用い友。In addition, the following soldering flux was used for the cleaning test.
Ｂ−１１１Ｒ（タムラ製作所製ニブリフラックス）Ｃ−
１３１１（タムラ裏作所製ニブリフラックス）ＭＨ−３
２０Ｖ（タムラ製作所製二つや消用タイプ。B-111R (Nibli flux manufactured by Tamura Seisakusho) C-
1311 (Nibli flux manufactured by Tamura Urasakusho) MH-3
20V (Futiya consumption type manufactured by Tamura Seisakusho.
標準品）
ＣＦ−２１０Ｖ（タムラ製作所製二つや消プリント配線
板用）
Ｌ−５５（タムラ裂作所製：精密電子機器・ＩＣ電極用
）ＧＸ−８８（アツヒ化研製：つや消タイプ）Ｐ−２５
０（アサヒ化研製：光沢タイプ・速乾性）ＷＡ−７１（
タムラ辺作所製：水溶性・自動ハンダ付用）洗浄試鋏の
結果を表１に示す。Standard products) CF-210V (made by Tamura Seisakusho, for Futsuya print wiring boards) L-55 (made by Tamura Seisakusho, for precision electronic equipment and IC electrodes) GX-88 (made by Atsuhi Kaken: matte type) P- 25
0 (manufactured by Asahi Kaken: glossy type, quick drying) WA-71 (
Table 1 shows the results of cleaning test scissors manufactured by Tamura Hensakusho (water-soluble, automatic soldering).
実施例２
実施例１で用いた溶剤について金属に対する影響度をみ
るために、金属腐蝕試験を行なった。結果を表２に示す
。Example 2 A metal corrosion test was conducted to examine the effect of the solvent used in Example 1 on metals. The results are shown in Table 2.
表 ２ 金属腐蝕試験
実施例５
実施例１で用いた溶剤について、合成樹脂、ゴムに対す
る影響をみるためＫ、合成樹脂・ゴム膨潤試験を行なつ
几。プリント回路板に使ゎれるエポキシ樹脂、フェノー
ル樹脂、ポリイミド樹脂に対しては、いずれの溶剤も不
活性であったが、アルミ電解コンデンサーのシール部に
一般的に使われている天然ゴム、イノブレン−イソブチ
レンゴムに対する結果は表３に示す。Table 2 Metal Corrosion Test Example 5 A synthetic resin/rubber swelling test was conducted to see the effect of the solvent used in Example 1 on synthetic resin and rubber. All solvents were inert to the epoxy resins, phenolic resins, and polyimide resins used in printed circuit boards; The results for isobutylene rubber are shown in Table 3.
表 ３ ゴム膨潤試験
（発明の効果）
実施例１．２．３から明らかなように、本発明の洗浄剤
は、フラックスに対する洗浄力が強いが、亜鉛、銅、鉄
等の金属や電気・電子回路基板上の合成樹脂やゴムに対
する影響が少なく、その実用的価値は高い。Table 3 Rubber swelling test (effect of the invention) As is clear from Example 1.2.3, the cleaning agent of the present invention has a strong cleaning power against flux, but it also has a strong cleaning power against metals such as zinc, copper, iron, and electric/electronic. It has little effect on the synthetic resins and rubber on circuit boards, and its practical value is high.
Claims (1)
量％とニトロメタン０〜６重量％からなるフラックス洗
浄剤。A flux cleaning agent consisting of 94 to 100% by weight of 1,2-dichloro-1-fluoroethane and 0 to 6% by weight of nitromethane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16026684A JPS6142474A (en) | 1984-08-01 | 1984-08-01 | Flux cleaning agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16026684A JPS6142474A (en) | 1984-08-01 | 1984-08-01 | Flux cleaning agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6142474A true JPS6142474A (en) | 1986-02-28 |
Family
ID=15711281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16026684A Pending JPS6142474A (en) | 1984-08-01 | 1984-08-01 | Flux cleaning agent |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6142474A (en) |
-
1984
- 1984-08-01 JP JP16026684A patent/JPS6142474A/en active Pending
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