JPS6137363A - Detergent of flux - Google Patents
Detergent of fluxInfo
- Publication number
- JPS6137363A JPS6137363A JP15715784A JP15715784A JPS6137363A JP S6137363 A JPS6137363 A JP S6137363A JP 15715784 A JP15715784 A JP 15715784A JP 15715784 A JP15715784 A JP 15715784A JP S6137363 A JPS6137363 A JP S6137363A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- detergent
- cleaning
- dichloro
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Detergent Compositions (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分ｆｆ）
本発明は、フラックス洗浄剤に関する。特に電気・電子
回路基板からノ・ンダ付フラックスを洗浄除去するに適
した洗浄剤に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Applications ff) The present invention relates to a flux cleaning agent. In particular, the present invention relates to a cleaning agent suitable for cleaning and removing soldering flux from electrical and electronic circuit boards.
（従来の技術）
電気・電子工業において使用されるプリント回路基板は
、通常、紙・フェノール積層板やガラス・エポキシ積層
板等の上に接着された銅箔回路を有するものであり、こ
の回路に電気・電子部品がハンダ付によって固定される
。普通には、ハンダ付は回路基板全体にフラックスを塗
布した後、熔融ハンダ浴中に通すことによって行なわれ
るか、フラックスを含むクリーム状ハンダを塗布した後
、加熱することによって行なわれる。いずれの場合も、
残存するフラン〉スは電気回路に悪影響を及ぼすことが
あるので、耐久性や厳密さを要求される場合、フラック
スは洗浄等によって除去されなければならない。(Prior Art) Printed circuit boards used in the electrical and electronic industries usually have a copper foil circuit bonded onto a paper/phenol laminate, glass/epoxy laminate, etc. Electrical/electronic parts are fixed by soldering. Typically, soldering is accomplished by applying flux to the entire circuit board and passing it through a molten solder bath, or by applying a creamy solder containing flux and then heating. In either case,
The remaining flux may have an adverse effect on the electrical circuit, so if durability and precision are required, the flux must be removed by cleaning or the like.
この洗浄剤として、これまで多くの溶剤が提案されてき
たが、実用的な面から洗浄効果が高く、毒性や引火点が
なく、化学的にも変化しにくい安定で安全な洗浄剤が強
く要望されている。現状でハ、トリクロロエチレン、テ
トラクロロエチレン、メチルクロロホルム等の塩素化炭
化水素系の溶剤やｉ、１．２−トリクロロ−１，２，２
−）リフルオロエタン等の弗素系溶剤が広く用いられて
いる。Many solvents have been proposed as this cleaning agent, but from a practical standpoint, there is a strong demand for a stable and safe cleaning agent that has a high cleaning effect, has no toxicity or flash point, and is resistant to chemical changes. has been done. At present, chlorinated hydrocarbon solvents such as trichlorethylene, tetrachloroethylene, methyl chloroform, and i, 1,2-trichloro-1,2,2
-) Fluorinated solvents such as refluoroethane are widely used.
しかしながら、これらの溶剤には多くの欠点がある。た
とえば、トリクロルエチレンやテトラクロルエチレンは
洗浄力はかなり大きいが、毒性が強く、また、回路基板
や電気・電子部品に使われる樹脂やゴム等を侵すことが
多いので、使用が制限される。メチルクロロホルムは洗
浄力が十分でない。弗素系溶剤１ｄ毒性が低く、電気・
電子部品への影響が少ないので使用範囲が広いが、肝腎
の洗浄力が低すぎる。そのため弗素系溶剤にメタノール
、エタノール、イソプロパツール等を混合して、フラッ
クス洗浄力全改善する方法が提案されている。However, these solvents have a number of drawbacks. For example, trichlorethylene and tetrachlorethylene have considerable cleaning power, but their use is limited because they are highly toxic and often corrode resins, rubbers, etc. used in circuit boards and electrical/electronic parts. Methyl chloroform does not have sufficient cleaning power. Fluorinated solvent 1d has low toxicity and is suitable for electricity and
It has a wide range of uses because it has little effect on electronic components, but its cleaning power for the liver and kidneys is too low. Therefore, a method has been proposed in which methanol, ethanol, isopropanol, etc. are mixed with a fluorine-based solvent to completely improve the flux cleaning power.
（発明が解決しようとする問題点）
弗素系溶剤に前記のようにアルコール類を混合すると、
新らたにプリント回路基板や電気・電子部品の金属部分
、特に亜鉛、亜鉛鍍金、アルミニウム等が発錆するとい
う問題が生じる。(Problems to be solved by the invention) When alcohols are mixed with a fluorinated solvent as described above,
A new problem arises in that metal parts of printed circuit boards and electrical/electronic parts, especially zinc, zinc plating, aluminum, etc., develop rust.
（問題点を解決するための手段）
本発明者らは、上記問題点を解決する目的で種々検討し
た結果、フラックス洗浄力のすぐれた弗素系溶剤を見出
し、本発明に到達した。(Means for Solving the Problems) As a result of various studies aimed at solving the above-mentioned problems, the present inventors discovered a fluorine-based solvent with excellent flux cleaning power and arrived at the present invention.
すなわち、本発明は、１，２−ジクロロ−１，１−ジフ
ルオロエタン９４〜１００重量％とニトロソタフ０〜６
重量係からなるフラックス洗浄剤である。That is, the present invention comprises 94 to 100% by weight of 1,2-dichloro-1,1-difluoroethane and 0 to 6% by weight of nitrosotaph.
It is a flux cleaning agent consisting of a weight agent.
本発明の溶剤は、引火点がなく、不燃性である。The solvent of the present invention has no flash point and is nonflammable.
さらに、電気・電子回路基板よりフラックスを除去する
能力が極めてすぐれている一方、回路基板や電気・電子
部品の金属や樹脂やゴムに対する悪影響が少ないという
利点を有する。特に銅、亜鉛、鉄に対する発錆や、アル
ミ電解コンデンサーのゴム部の膨潤が少ないことなどは
、本発明の使用範囲を一層拡大する。本発明の利点は、
ニトロメタンを少量含む時に一層顕著となるが、ニトロ
メタンが６重量１日多くなる時は、蒸発の際に燃焼性と
なり、また、経済的に本得策でない。Furthermore, while it has an extremely superior ability to remove flux than electrical/electronic circuit boards, it also has the advantage of having less adverse effects on the metals, resins, and rubbers of circuit boards and electrical/electronic parts. In particular, the fact that copper, zinc, and iron are less susceptible to rust and the rubber portion of aluminum electrolytic capacitors is less swollen further expands the scope of use of the present invention. The advantages of the invention are:
This becomes more noticeable when a small amount of nitromethane is included, but if the amount of nitromethane increases by 6 weight per day, it becomes flammable during evaporation and is not economically advantageous.
本発明の洗浄剤には１通常行なわれる浸漬洗浄、蒸気洗
浄、超音波洗浄等が適用できる。また、さらに特別の目
的のために種々の添加剤、その他の安定剤、洗浄助剤等
を加えることは支障ない。The cleaning agent of the present invention can be applied to commonly used immersion cleaning, steam cleaning, ultrasonic cleaning, etc. Moreover, there is no problem in adding various additives, other stabilizers, cleaning aids, etc. for further special purposes.
（実施例）
以下に本発明の特徴を実施例によって詳述するが、実施
例中に示される試験は、次の方法にしたがってなされた
。(Example) The features of the present invention will be explained in detail below using Examples, and the tests shown in the Examples were conducted according to the following method.
（１）ハンダ付フラックス洗浄試験
銅被覆フェノール樹脂積層板からモデル的に炸裂された
プリント電気回路板に、各種の市販ノｈンダ付フラック
スを塗布し、１ｏｏＣで２分間乾燥させた。次いで、２
５０Ｃで１０分間焼付けを行ない、ハンダ付の実用条件
に近づけた。これを洗浄用試験片として、洗浄液の中に
常温で浸漬し超音ｖをかけながら３０秒間洗浄試験した
。洗浄後の試験片１・ま、イソプロパツールと水の７５
／２５谷量チの混液の一定量に浸漬し、超音波をかけな
がら５分間洗浄した。一方、全試験として洗浄試験を省
略した試験片について、同様にイソプロノくノールと水
の混液で洗浄した。この両者のインプロパツール／水混
液の比抵抗全測定し、仝試験に対する比抵抗の上昇率を
もって、洗浄試験における７ラツクスの除去率とし、係
で表示した。(1) Soldering flux cleaning test Various commercially available soldering fluxes were applied to a printed electric circuit board modeled from a copper-coated phenolic resin laminate and dried at 1ooC for 2 minutes. Then 2
Baking was carried out at 50C for 10 minutes to approximate the practical conditions for soldering. This was used as a cleaning test piece, and was immersed in a cleaning solution at room temperature and subjected to a cleaning test for 30 seconds while applying ultrasonic V. Test piece 1 after cleaning, isopropanol and water 75
The sample was immersed in a certain amount of a mixed solution of /25% and washed for 5 minutes while applying ultrasonic waves. On the other hand, the test pieces for which the cleaning test was omitted from all tests were similarly washed with a mixture of isopronochlorinol and water. The specific resistances of both Improper Tool/Water mixtures were completely measured, and the rate of increase in specific resistance with respect to the test was determined as the removal rate of 7 lux in the cleaning test, and was expressed in the table below.
（２）金属腐蝕試験
溶剤中に鉄、亜鉛、銅の試験片の各々を別々に浸漬し、
６０Ｃで３Ｂ、間処理した後、試験片の発錆、変色の状
態を観察した。(2) Immerse each of the iron, zinc, and copper test pieces separately in a metal corrosion test solvent,
After being treated at 60C for 3B, the state of rusting and discoloration of the test piece was observed.
（３）合成樹脂・ゴムＷ潤試験
合成樹脂、ゴムの試験片全溶剤中に浸漬し、常温で２０
時間放置した。放置後、試験片を取り出し、表面の溶剤
を拭き取り、その重量増加を秤り、増加率をチで表わし
た。(3) Synthetic resin/rubber W moisture test A synthetic resin/rubber test piece was immersed in a total solvent for 20 minutes at room temperature.
I left it for a while. After standing, the test piece was taken out, the solvent on the surface was wiped off, the increase in weight was measured, and the increase rate was expressed in chi.
実施例１
１．２−ジクロロ−１，ｔ−ジフルオロエタン（以下、
Ｆ−１３２ｂと略す）およびニトロメタンを各々０．５
、１．０ 、３，０ 、６．０重量％含むｐ’−１４
１、さらに比較例として１，１．２−トリクロロ−１，
２゜２−トリフルオロエタン（以下、ｌｉ’−１１３と
略す）およびエタノール３．６重量％とニトロメタン１
．１重量係ヲ含むＦ−１１３、インプロパノール３５重
量％を含むＦ−１１３，メチルクロロホルムについて、
フラックス洗浄剤験を行なった。Example 1 1,2-dichloro-1,t-difluoroethane (hereinafter referred to as
(abbreviated as F-132b) and nitromethane (0.5 each)
, 1.0, 3,0, 6.0% by weight p'-14
1. Furthermore, as a comparative example, 1,1.2-trichloro-1,
2゜2-trifluoroethane (hereinafter abbreviated as li'-113) and ethanol 3.6% by weight and nitromethane 1
．． Regarding F-113 containing 1% by weight, F-113 containing 35% by weight of impropanol, and methyl chloroform,
A flux cleaning agent experiment was conducted.
ナオ、洗浄試験には次のハンダ付フラックスを用いた。The following soldering flux was used for the cleaning test.
Ｂ−１１１Ｒ（タムラ裂作所製ニブリフラックス）Ｃ−
１３１Ｒ（タムラ製作所製：ブリフラツクメ）ＭＨ−３
２０Ｖ（タムラ製作所木：つや油剤タイプ。B-111R (Nibli flux manufactured by Tamura Rakusakusho) C-
131R (Manufactured by Tamura Seisakusho: Brifuratsukume) MH-3
20V (Tamura Manufacturing Wood: Glossy oil type.
標準品）
ＣＦ−２１０Ｖ（タムラ製作所製二つや消プリント配線
板用）
Ｌ−３５（タムラ製作所製：精密電子機器・ＩＣ電極用
）ＧＸ−８８（アサヒ化研與二つや消タイプ）Ｐ−５５
０−５（アサヒ化研製：光沢タイプ）ＷＡ−７１（タム
ラ製作所裂：水溶性・自動ハンダ付用）洗浄試験の結果
を表１に示す。Standard products) CF-210V (made by Tamura Seisakusho, for printed wiring boards) L-35 (made by Tamura Seisakusho, for precision electronic equipment and IC electrodes) GX-88 (Asahi Kaken Futsuyaya type) P-55
Table 1 shows the results of the cleaning test.
実施例２
実施例１で用いた溶剤について、金属に対する影響度を
みるために金属腐蝕試験を行なった。結果を表２に示す
。Example 2 A metal corrosion test was conducted on the solvent used in Example 1 to see the degree of influence on metals. The results are shown in Table 2.
表 ２ 金属腐蝕試験
実施例３
実施例１で用いた溶剤について、合成樹脂、ゴムに対す
る影響をみるために、合成樹脂、ゴム膨潤試験を行なっ
た。プリント回路板に使われるエポキシ樹脂、フエ）−
ル樹脂、ポリイミド樹脂に対しては、いずれの溶剤も不
活性であった〃；、アルミ電解コンデンサーのシール部
に一般的に使われている天然ゴム、イソプレン−イソブ
チレンゴムに対する結果は表３に示す。Table 2 Metal Corrosion Test Example 3 In order to examine the effect of the solvent used in Example 1 on synthetic resin and rubber, a synthetic resin and rubber swelling test was conducted. Epoxy resin used in printed circuit boards, FUE)
All solvents were inert to polyurethane resin and polyimide resin; Table 3 shows the results for natural rubber and isoprene-isobutylene rubber, which are commonly used in the seals of aluminum electrolytic capacitors. .
表 ３ ゴム膨潤試験
（発明の効果）
実施例１，２．５から明らかなように、本発明の洗浄剤
はフラックスに対する洗浄力が強いが、亜鉛、銅、鉄等
の金属や電気・電子回路基板上の合成樹脂やゴムに対す
る影響が少なく、その実用的価値は高い。Table 3 Rubber swelling test (effect of the invention) As is clear from Examples 1 and 2.5, the cleaning agent of the present invention has strong cleaning power against flux, but it also has a strong cleaning power against metals such as zinc, copper, iron, and electric/electronic circuits. It has little effect on the synthetic resin and rubber on the substrate, and its practical value is high.
Claims (1)
００重量％とニトロメタン０〜６重量％からなるフラッ
クス洗浄剤。1,2-dichloro-1,1-difluoroethane 94-1
00% by weight and 0 to 6% by weight of nitromethane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15715784A JPS6137363A (en) | 1984-07-30 | 1984-07-30 | Detergent of flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15715784A JPS6137363A (en) | 1984-07-30 | 1984-07-30 | Detergent of flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6137363A true JPS6137363A (en) | 1986-02-22 |
Family
ID=15643428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15715784A Pending JPS6137363A (en) | 1984-07-30 | 1984-07-30 | Detergent of flux |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6137363A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5695545A (en) * | 1996-05-10 | 1997-12-09 | Hoechst Celanese Corporation | Degassing liquids: apparatus and method |
-
1984
- 1984-07-30 JP JP15715784A patent/JPS6137363A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5695545A (en) * | 1996-05-10 | 1997-12-09 | Hoechst Celanese Corporation | Degassing liquids: apparatus and method |
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