JPS614189B2 - - Google Patents

Info

Publication number
JPS614189B2
JPS614189B2 JP54073718A JP7371879A JPS614189B2 JP S614189 B2 JPS614189 B2 JP S614189B2 JP 54073718 A JP54073718 A JP 54073718A JP 7371879 A JP7371879 A JP 7371879A JP S614189 B2 JPS614189 B2 JP S614189B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54073718A
Other languages
Japanese (ja)
Other versions
JPS55165661A (en
Inventor
Norio Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7371879A priority Critical patent/JPS55165661A/ja
Publication of JPS55165661A publication Critical patent/JPS55165661A/ja
Publication of JPS614189B2 publication Critical patent/JPS614189B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68Shapes or dispositions thereof
    • H10W70/6875Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07541Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP7371879A 1979-06-12 1979-06-12 Semiconductor device Granted JPS55165661A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7371879A JPS55165661A (en) 1979-06-12 1979-06-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7371879A JPS55165661A (en) 1979-06-12 1979-06-12 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55165661A JPS55165661A (en) 1980-12-24
JPS614189B2 true JPS614189B2 (mo) 1986-02-07

Family

ID=13526275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7371879A Granted JPS55165661A (en) 1979-06-12 1979-06-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55165661A (mo)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59136963A (ja) * 1983-01-25 1984-08-06 Sanyo Electric Co Ltd 記憶装置の多層実装構造
JP2917575B2 (ja) * 1991-05-23 1999-07-12 株式会社日立製作所 樹脂封止型半導体装置
JP2901401B2 (ja) * 1991-12-03 1999-06-07 日本電気株式会社 マルチチップモジュール
KR100238197B1 (ko) * 1992-12-15 2000-01-15 윤종용 반도체장치
JPH06244231A (ja) * 1993-02-01 1994-09-02 Motorola Inc 気密半導体デバイスおよびその製造方法
KR100253325B1 (ko) * 1997-09-27 2000-04-15 김영환 랜드그리드어레이패키지및그제조방법

Also Published As

Publication number Publication date
JPS55165661A (en) 1980-12-24

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