JPS6141546A - Manufacture of multilayer printed substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] 5 (Industrial application field).

The present invention relates to a method for manufacturing a multilayer printed circuit board by laminating and press-bonding a plurality of printed circuit boards.

(Prior Art) A multilayer circuit board, for example a multilayer circuit board, has conventionally been manufactured in the following manner. This will be explained with reference to FIG. 1. First, the lower press plate 3 is placed on the upper surface of the carrier plate 1 with a sheet (for example, made of paper) 2 interposed therebetween. At the peripheral edge of the lower press plate 3, for example at the four corners, through holes 4 are provided, into which the lower ends of the alignment pins 5 are respectively inserted. Then, a predetermined number of printed circuit boards 6 each having a conductive layer for printed circuits on one or both sides are laminated with an adhesive layer 7 interposed therebetween. In this case, the printed circuit board 6 and the adhesive layer 7 are also provided with alignment holes that correctly match the holes 4 of the lower press plate 3, and the alignment pins 5 are inserted through the holes. Stack the layers while doing so. After a predetermined number of printed circuit boards 6 have been laminated in this manner, the upper press plate 9, which has a through hole 8 formed at the same position as the lower press plate 3, is inserted through the through hole 8 into the positioning pin 5. insert it into the

Next, this laminated printed circuit board 6 is sandwiched between the lower press plate 3 and the upper press plate 9 and transferred to a press (not shown), for example, at a temperature of 175° C. and a pressure of 50° C.
Press at 0 psl to create a multilayer printed circuit board.

However, in this case, the length of the alignment pin must be short enough to prevent it from protruding from the upper press plate 9 or the lower press plate 3 during pressing. If the upper or lower part of the alignment pin 5 protrudes during pressing, not only will the press device or the press plates 3 and 9 themselves be damaged, but the multilayer printed circuit board will not be sufficiently pressurized.

In this way, the length of the alignment pin 5 is appropriately short (the upper part,
However, in the printed circuit/board stacking process as shown in FIG. It must protrude to a sufficient height above the lower press plate 3 to enable mating. Therefore, as shown in FIG. 1, it is necessary to maintain the lower end of the alignment pin 5 in a floating state by leaving a space above the carrier plate 1.

However, it is difficult to set the alignment pin 5 in such a floating state, and especially when the alignment pin 5 becomes old, it tends to sink, and in that case, the upper position of the alignment pin 5 tends to sink. It becomes impossible to align the printed circuit board 6 and the upper press plate 9, and the pins do not function as alignment pins. Therefore, as a means to prevent the alignment pin 5 from sinking downward, a height adjustment pin 10 made of iron with a sufficiently small outer diameter is aligned with the through hole 4 of the lower press plate 3 as shown in FIG. The pin 5 is interposed between the lower end of the pin 5 and the upper surface of the carrier plate 1. By using such a height adjustment pin 10 made of iron, the positioning pin 5
It is possible to reliably maintain the height position of the
When the printed circuit boards 6 are stacked and transferred to the pressing process while being sandwiched between the upper and lower press plates 3 and 9, the iron height adjustment pin 10 does not remain on the carrier plate 1 and the lower end of the alignment pin 5 Frequently, the material was transferred to the press equipment while remaining attached to the material. In this way, the height adjustment pin 10 is attached to the lower end of the alignment pin 5.
If pressed, the alignment pin 5 or the height adjustment pin 10 will not protrude from the upper or lower press plate 3.9 during pressing, as will be the case if the alignment pin 5 is too long. Problems may arise, such as damage to the device or insufficient pressure on the multilayer printed circuit board.

(Object of the Invention) The present invention has been made in view of the above circumstances, and it is possible to reliably maintain the correct height position of the alignment pins in the process of stacking printed circuit boards on the lower press board, and to It is an object of the present invention to provide a method for manufacturing a multilayer printed circuit board that can completely prevent damage to the device, upper and lower press plates, or insufficient pressure applied to the multilayer printed circuit board.

(Means for Solving the Problems) That is, the present invention provides through holes at a plurality of appropriate locations in the lower press plate, and inserts first the height adjustment pin of the positioning pin into the through holes, and then inserts the positioning pin into the through holes. Next, insert a plurality of printed circuit boards through the alignment holes provided in each one through the alignment pins, and stack them on the lower press plate from the front side.Finally, insert the upper press plate, which also has all the through holes, into the alignment pins. In the method of manufacturing a multilayer printed circuit board by fitting the printed circuit boards through the through holes and then heating and pressing the laminated printed circuit boards through the upper and lower press plates, the height adjustment pin of the alignment pin The present invention provides a method characterized in that a material made of thermoplastic synthetic resin that easily melts in the heating and pressurizing step is used.

(Example) The present invention will be described below with reference to FIGS. 1 and 2. As shown in FIG. 1, the method of the present invention involves placing a lower press plate 3 on a carrier plate 1 with a sheet 2 interposed therebetween as necessary, and inserting transparent As shown in FIG. 2, a height adjustment pin 10' made of a thermoplastic plastic such as polyvinyl chloride or polyolefin, which easily melts under the conditions of the subsequent hot press process, is first inserted into the hole 4, and then aligned. Insert the lower end of pin 5 in the same way. This height adjustment pin 10
The dimension ' is set in advance so as to maintain the height position of the alignment pin 5 at a desired appropriate level. Then, for example, a predetermined number of printed circuit boards 6 are stacked, with adhesive layer sheets 7 interposed between the tiles of each layer, if necessary. In addition,
This adhesive layer may be formed integrally with the printed circuit board 6 in advance.

Finally, after placing the upper press plate 9 with the through holes 8 drilled in the same position as the lower press plate 3 in alignment with the alignment pins 5, the upper and lower press plates with the printed circuit board 6 sandwiched therebetween are placed. 3.9 is transferred to a press device (not shown) and pressed at a temperature of, for example, 175° C. and a pressure of 500 pal to produce a multilayer printed circuit board. When transferring the upper and lower press plates 3, 9 holding the printed circuit board 6 from the carrier plate 1 to the press machine, normally,
The height adjustment pin 10' will remain on the carrier plate 1, but even if the height adjustment pin 10' is attached to the bottom of the alignment pin 5 and transferred to the press machine and pressed as is. Since this height adjustment pin 10' easily melts under the temperature and pressure during pressing, there is no risk of damaging the press device, upper and lower press plates 3, 9, and it is suitable for multilayer printed circuit boards. Sufficient pressure can be applied even if the

(Effects) As detailed above, according to the method of the present invention, the height position of the alignment pin is adjusted using a pin made of thermoplastic synthetic resin that easily melts under the temperature and pressure conditions during pressing. By doing this, it is possible to ensure that the height position of the alignment pin is maintained properly, and also to prevent the height position adjustment pin from being applied to the press machine with the lower end of the alignment pin attached. Even if there is a press device,
There is no risk of damaging the upper and lower press plates or causing defects in the multilayer printed circuit board.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of an apparatus used for manufacturing a multilayer printed circuit board, and FIG. 2 is a cross-sectional view showing essential parts of the apparatus shown in FIG. In the figure, 1...carrier plate, 2...sheet, 3
... lower press plate, 4 ... through hole, 5 ... alignment plate, 6 ... printed circuit board, 7 ... adhesive layer, 8 ...
... Upper press plate, 9... Height adjustment pin, 10,
J O'...Height position adjustment bit of alignment pin. Figure 1 Figure 2 U (10')

Claims (1)

[Claims] Through-holes are provided at multiple appropriate locations on the lower press plate, first the height adjustment pin of the positioning pin is inserted into the through-holes, then the positioning pin is inserted into the through-holes, and then multiple printed circuit boards are placed in each of the holes for positioning. The alignment pins are inserted into the holes and stacked on the lower press plate, and finally the upper press plate, which also has through holes, is fitted into the alignment pins through the holes, and then these upper and In a method for manufacturing a multilayer printed circuit board by heating and pressing the above laminated printed circuit boards through a lower press plate, a thermoplastic compound that is easily melted in the heating and pressing process is used as a height adjustment pin of the alignment pin. A method for manufacturing a multilayer printed circuit board, characterized by using a board made of resin.