JPS6139944U - Thin IC tray mounting device - Google Patents
Thin IC tray mounting deviceInfo
- Publication number
- JPS6139944U JPS6139944U JP12368784U JP12368784U JPS6139944U JP S6139944 U JPS6139944 U JP S6139944U JP 12368784 U JP12368784 U JP 12368784U JP 12368784 U JP12368784 U JP 12368784U JP S6139944 U JPS6139944 U JP S6139944U
- Authority
- JP
- Japan
- Prior art keywords
- thin
- tray
- mounting device
- ics
- tray mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Specific Conveyance Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の搭載装置の１実施例を示し、第２図の
Ｉ−Ｉ断面図である。
第２図は上記実施例の■−■断面図である。
第３図は薄形ＩＣの斜視図。
第４図（ま薄形ＩＣ用トレーの斜視図、第５図は同平面
図である。
第６図は位置決めピンを備えた薄形ＩＣ用トレーの斜視
図、第７図は同平面図である。
１．１’−・・薄形ＩＣ． ２． ２’−｝−レー、
２ａ・・・枠状突条、２ｂ・・・透孔、２ｃ・・・位置
決めピン、２ｄ・・・位置決め用の透孔、３・・・レー
ル、４・・・位置決めピン、５・・・吸着マグネット、
６・・・アライメント部材、７・・・ガイド部材、７ａ
・・・テーパ面を有する透孔、８・・・シリンダ、９・
・・揺動力ム、１０・・・カムフオロワローラ、１１・
・・仕切板。FIG. 1 shows one embodiment of the mounting device of the present invention, and is a sectional view taken along the line II in FIG. FIG. 2 is a sectional view taken along the line 1--2 of the above embodiment. FIG. 3 is a perspective view of the thin IC. Fig. 4 is a perspective view of a thin IC tray, and Fig. 5 is a plan view of the same. Fig. 6 is a perspective view of a thin IC tray equipped with positioning pins, and Fig. 7 is a plan view of the same. Yes. 1. 1'--thin IC. 2. 2'-}-ray,
2a...Frame-shaped protrusion, 2b...Through hole, 2c...Positioning pin, 2d...Through hole for positioning, 3...Rail, 4...Positioning pin, 5... adsorption magnet,
6... Alignment member, 7... Guide member, 7a
...Through hole having a tapered surface, 8...Cylinder, 9...
... Rocking force ram, 10... Cam follower roller, 11.
...Partition board.
Claims (1)
め手段を設けるとともに薄形ＩＣ搭載位置それぞれに透
孔を設けたトレーの上に、被搬送物である薄形ＩＣを搭
載する装置において、薄形ＩＣを保持してトレー上の所
定の位置の真上に搬送して保持を解除する機能を備えた
搬送手段と、上記の搬送手段によって所定位置の真上ま
で搬送きれた薄形ＩＣを支承して真直下方に下降もしめ
るアライメント手段と、上記のアライメント手段によっ
て下降せしめられる薄形ＩＣをトレー上の所定位置に案
内するテーパ面を備えたガイド部材とを設けたことを特
徴とする、薄形ＩＣのトレー搭載装置。A device for mounting thin ICs, which are objects to be transported, on a tray that is provided with positioning means for thin ICs so that the thin ICs are arranged and mounted, and that has through holes at each of the thin IC mounting positions. , a conveying means has a function of holding a thin IC, conveying it to just above a predetermined position on the tray, and releasing the holding; The present invention is characterized by being provided with an alignment means that supports the IC and also moves it downward straight down, and a guide member having a tapered surface that guides the thin IC lowered by the alignment means to a predetermined position on the tray. A thin IC tray mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12368784U JPS6139944U (en) | 1984-08-14 | 1984-08-14 | Thin IC tray mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12368784U JPS6139944U (en) | 1984-08-14 | 1984-08-14 | Thin IC tray mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6139944U true JPS6139944U (en) | 1986-03-13 |
Family
ID=30682434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12368784U Pending JPS6139944U (en) | 1984-08-14 | 1984-08-14 | Thin IC tray mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6139944U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006080483A (en) * | 2004-08-10 | 2006-03-23 | Ueno Seiki Kk | Electronic component process handling equipment, process handling method and process handling program |
| JP2019163103A (en) * | 2018-03-19 | 2019-09-26 | 日本電気株式会社 | Component alignment device, component alignment system, and component alignment method |
-
1984
- 1984-08-14 JP JP12368784U patent/JPS6139944U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006080483A (en) * | 2004-08-10 | 2006-03-23 | Ueno Seiki Kk | Electronic component process handling equipment, process handling method and process handling program |
| JP4683415B2 (en) * | 2004-08-10 | 2011-05-18 | 上野精機株式会社 | Electronic component process processing apparatus, process processing method, and process processing program |
| JP2019163103A (en) * | 2018-03-19 | 2019-09-26 | 日本電気株式会社 | Component alignment device, component alignment system, and component alignment method |
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