JPS6139468A - Flexible through hole both-side heat sealing connector and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flexible through-hole double-sided heat seal connector and a method of manufacturing the same.

The present invention also provides terminal parts for, for example, liquid crystal display tubes (L(D), electrochromic display CEOD), electrodes of solar cells, and printed circuit boards (PCBs),
The present invention relates to a flexible through-hole double-sided heat-seal connector that is easy to manufacture and use, and that can ensure reliability, and a method for manufacturing the same.

Generally, conventional flexible heat seal connector members of this type are LC! D, EOD, solar cell electrode and P(
It is used as a connector between the iB terminal and the other PCB terminal, and is intended for use in electrical, 7
J, slave devices 2 Watches, cameras, etc. are used in a wide range of areas. The use of this flexible heat seal connector material is
Making equipment, devices, etc. lighter and thinner.

In addition to making it possible to downsize and reduce costs, the connector components themselves have been highly evaluated.

In recent years, in addition to demands for lower electrical resistance and increased adhesive strength for these flexible heat-sealable connectors, there has also been a demand for something that can handle complicated component mounting.

However, with the flexible heat seal connectors to date, so-called "circuit turning" is difficult.
This is why mounting electrical components and electronic elements becomes more complex.
There are some parts that cannot be fully addressed.

That is, conventional single-sided heat sealing is often inconvenient for connection. In other words, there is a strong demand for bridges and three-dimensional construction while maintaining flexibility, and on top of that,
There is a need for simplification of their manufacture and use.

゛The purpose of the present invention is to satisfy these requirements with reliability.It is possible to perform so-called "circuit turning" through the through-holes, and heat sealing can be performed on both sides, so that the conductive circuit pattern can be easily formed. can be designed for complex component mounting, so devices that are increasingly used,
@Quantity of equipment etc.

This makes it possible to reduce the thickness, size, and cost.

The present inventors have completed the present invention as a result of intensive research to achieve these objectives and requirements.

That is, as shown in the drawings, the flexible through-hole double-sided heat-seal connector of the present invention includes a flexible insulating film substrate 1, and is provided on both the front and back surfaces of the substrate 1, and has a desired width, mutual spacing, and number of wires. Vertical striped conductive strip layers 2.3 on each of the front and back sides to be electrically connected to desired electrical component terminal portions on the front and back sides, respectively, and both the front and back conductive i! A conductive layer 5 on the inner wall of the through hole 4 that connects the strip layers 2 and 8 to each other, and a conductive thermocompression bonding layer that is further overlaid on the front and back conductive strip layers 2 and 3 and formed to have approximately the same shape. 6, 7 and further,
Both the front and back insulating thermocompression bonding layers 10111 are respectively adhered to the remaining portions 8 and 9 on the front and back sides of the substrate l other than the conductive thermocompression bonding layers 6 and 7 so as to form substantially the same plane. It is characterized by comprising:

The present invention also provides that the vertically striped conductive strip layers 2°3 on both the front and back sides and the inner wall conductive layer 5 of the through hole 4 have (a) a particle size of 0.1 to
A conductive fine powder of 20 to 80 μm consisting of 14 or more types of graphite powder of 60μ, silver powder, copper powder, nickel powder, palladium powder, tin powder, and carbon black powder with a particle size of 0.1μ or less, b) 5 to 80% by weight of a rubber and thermoplastic resin binder consisting of x8 of chloroprene rubber, chlorosulfonated rubber, polyurethane resin, polyester resin, and vinyl chloride resin, or two or more of them;
) Organic solvent 15 consisting of one or more of dimethylformamide, diacetone alcohol, isophorone, diethyl carbitol, butylarbitol, and turpentine oil.
~80% by weight was mixed (a+b+c) and uniformly dispersed, with an apparent specific gravity of 0.9 to 2.8 and a viscosity of 150 to δ0.
The double conductive thermocompression bonding layers 6 and 7 are formed by adhering and drying a conductive suspension paint of 00 poise, and are provided on the front and back vertically striped conductive strip layers 2 and 8, respectively. ,
(i) Graphite powder, silver powder, copper powder, nickel powder, palladium powder, tin powder with a particle size of 0.1 to 60μ and a particle size of 0.1 to 60μ.
10 to 650 to 65% by weight of conductive fine powder consisting of one or more types of carbon black powder of 1 μ or less) 1 of chloroprene rubber, polyester resin, ethylene-acetate-vinyl copolymer resin, and polymethyl methacrylate resin
A rubber-based and thermoplastic resin binder consisting of a heel or two or more heels, consisting of 10 to 5 QM, and (is) 1 fiX or 28 or more of isophorone, diacetone alcohol, methyl isobutyltetone, xylene, toluene, and diethyl carbitol. Mix 15 to 80% by weight of an organic solvent and 0.1 to 20% by weight of a tackifier consisting of one or two of terpene resins and aliphatic hydrocarbon resins. ) Dissolved and uniformly dispersed apparent specific gravity 0.9-2
．． 0.0 and a viscosity of 500 to 10,000 poise. Japanese alumina and floidal silicon li
or 2 to 80% by weight of a powder consisting of two or more types, and (E) chloroprene rubber, polyester resin, ethylene-vinyl acetate copolymer resin, and polymethyl methacrylate) 41
20 to 60% of a rubber-based and thermoplastic resin-based binder consisting of one or more types of 11 fats, (earth) isophorone,
One or two of diacetone alcohol, methyl isobutyl ketone, xylene, toluene and diethyl carbitol
Mix 10 to 70% by weight of an organic solvent consisting of at least 10% of organic solvents, and 1% by weight of a tackifier of 0.1 to 20% of one or both of (1) terpene resin and aliphatic hydrocarbon resin. i 10 note + soil + ci) Appearance ratio i0, dissolved and uniformly dispersed
8 to 1.4 and a viscosity of 150 to 5,000 poise.

In addition, the method for manufacturing a flexible through-hole double-sided heat-seal connector of the present invention includes drilling through-holes 4 in advance at positions where through-holes are required on a desired printed circuit of the flexible insulating film substrate 1. The desired width, mutual spacing, and number of holes covering at least the diameter of the through hole 4 obtained in the step (A) of forming the through hole and the step (i) of forming the through hole, and the desired electrical component terminal portion and the front and back sides, respectively. The vertical striped conductive layers 2, 8 and the inner wall conductive layer 5 of the through-hole 4 on the front and back sides to be air-connected are (a) particle size 0.1 to 60μ;
Conductive fine powder consisting of one or more types of graphite powder, silver powder, copper powder, nickel powder, palladium powder, powder powder, and carbon black powder with a particle size of 0.1 μ or less 20 ~
80% by weight, () 5 to aO% by weight of a rubber-based and thermoplastic resin binder consisting of one or more of chloroprene rubber, chlorosulfonated rubber, polyurethane resin, polyester resin, and vinyl chloride resin; C) Mixed with 15 to 80% by weight of an organic solvent consisting of one or more of dimethylformamide, diacetone alcohol, isophorone, diethyl carbitol, diethyl carbitol, butyl carbitol, turpentine oil, etc. (a + b + c)
Dissolved and uniformly dispersed apparent ratio fi O, 9-2.
3. Process CB of coating or screen printing using a conductive suspension paint with a viscosity of 150 to 3000 poise, allowing it to drip into the inner wall surface of the through hole 4, and heating and drying it.
) and (i) graphite powder, silver powder with a particle size of 0.1 to 60μ,
10 to 65% conductive powder consisting of one or more of copper powder, nickel powder, palladium powder, tin powder, and carbon black powder with a particle size of 0.1μ or less, (filter) chloroprene rubber, polyester resin, ethylene- 10 to 50 ftft% of a rubber-based and thermoplastic resin-based binder consisting of one or more of vinyl acetate copolymer resin and polymethyl methacrylate resin, and isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, organic solvent consisting of one or more of toluene and diethyl carbitol (15-805-80% by weight)
1 or 2 of terpene resin and aliphatic hydrocarbon resin
A tackifier consisting of seeds with an apparent specific gravity of 0 is mixed with 0.1 to 20% by weight (10% by weight) and uniformly dispersed.
．． Using a conductive thermocompression bonding suspension paint having a viscosity of 9 to 2.0 poise and a viscosity of 500 to 100 poise, the conductive strip layers 2 and 8 on both the front and back sides are overlaid and coated by screen printing, and dried. and a conductive thermocompression bonding layer6. The process of forming a foam (
C), and (i) 2 to 30% by weight of a powder consisting of one or more of titanium oxide, talc, hydrated alumina, and colloidal silica, and (ji) chloroprene rubber, polyester resin, ethylene-acetic acid. 20 to 60 ff of rubber-based and thermoplastic resin-based binder consisting of one or more of vinyl copolymer resin and polymethyl methacrylate resin
(ffi) 10 to 70% by weight of an organic solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, and diethyl carpito, and (jy) a terpene resin. and 0.1 to 20% by weight of a tackifier consisting of one or two aliphatic hydrocarbon resins (i15+soil+iv)
Dissolved and uniformly dispersed apparent specific gravity 0.8 to 1.4,
Using an insulating thermocompression bonding agent @ suspension paint having a viscosity of 150 to 5000 poise, the remaining portions 8 and 9 on the front and back sides of the substrate 1 other than the conductive thermocompression N layers 6 and 7 are approximately flush with each other. Step (D) of applying each layer by screen printing and drying it by heating to form both the front and back insulating thermocompression bonding layers 10 and 11.
It is characterized by consisting of.

The present invention provides that the flexible insulating film substrate l is a polyester film, a polyethylene terephthalate film,
It is a polyamide film, polyimide film, polycarbonate film, polyethylene film, polypropylene film, or a heat-treated product thereof, and its thickness is usually 10 to 500μ, and the above-mentioned sulfo-A/(transparent film) is perforated therein. The diameter of the hole is 0.1~
Approximately 2 readings.

Next, an example of how to use the flexible through-hole double-sided heat seal connector according to the present invention will be briefly explained with reference to FIGS. 3 to 6.

The thermo-pressure sensitive layer 6 of the conductive circuit pattern on one end of one side of the connector of the present invention is brought into contact with the terminal portion of the liquid crystal display tube, electrochromic display, solar cell electrode, printed circuit board, etc. Bringing the thermocompression bonding layer 7 into contact with the other printed circuit terminal portion, etc.,
Both ends are heated at a temperature of 70 to 230°C and a pressure of 1 to 5.
0 ky/c++! Heat and press them together to integrate the three parts.

That is, they are integrated as shown in FIGS. 8 and 4,
Electrical and mechanical connections can be made very easily and compactly.

This eliminates the need to bend the connector itself as in the conventional products shown in FIGS. 5 and 6, or to use circuit protection tape or insulating printing as in EC No. 61'U). It is extremely thin and can be connected compactly with minimal volume. Light, thin, short and easy to use.

Next, the reasons for each quantity limitation in the present invention will be briefly described as follows.

Regarding the conductive suspension paint (a+b+c), (a) 20 to 800 to 80% by weight of conductive fine powder; below the lower limit, the limited electric resistance value becomes high and is not suitable for the present invention. If the upper limit is exceeded, the stability and printability of the suspension, so-called "consistency" and "glue" will deteriorate and cannot be used.

(b) Rubber-based and thermoplastic resin-based binders 5 to 80% by weight, below the lower limit, the stability and printability of the am liquid, so-called "consistency" and "adhesiveness" deteriorate and cannot be used. If the upper limit is exceeded, the resulting electrical resistance value will be high, making it unsuitable for the present invention.

Note that the apparent specific gravity and viscosity of the suspension paint itself are also extremely important, and outside the limited range, they mainly affect the printability of the ink, the fluidity of dripping and penetrating into the inner wall surface of the through hole 7.8, the resistance to This is not possible because the properties such as adhesion and permeability will be compromised.

Said conductive thermocompression bonding) cloudy 'D, paint (I+RO+ is 10)
Regarding (i) 10 to 65% by weight of the tetraelectric fine powder, if it is less than the lower limit, the resulting electrical resistance value will be too high and is not suitable for the present invention. If the upper limit is exceeded, the adhesive strength after thermocompression bonding will be significantly reduced, which is unacceptable.

(B) If the rubber-based or thermoplastic resin-based binder is less than the lower limit of 10 to 50% by weight, the adhesive strength after thermocompression bonding will be significantly reduced, and the "consistency" and "glue" of the suspension will deteriorate, making it impossible to use. be. Exceeding the upper limit is not acceptable because it will actually worsen the stability and printability of the suspension.

(2) If the upper limit of 0.1 to 20% by weight of the tackifier resin is exceeded, the consistency will be too high, the solubility of the resin will be poor, and the printability will be poor, making it impossible. If the lower limit is exceeded, no tackifying effect will be produced and it is not possible.

Note that the apparent specific gravity and viscosity of the suspension paint itself are also important, and if it is outside the limited range, the printability and conductivity of the ink cannot be obtained.

Regarding the above-mentioned insulating thermocompression suspension paint (i150 earth 1 jy), if the upper and lower limits of the insulating inorganic powder 2 to 8 oz (by weight) are exceeded, the suspension used as printing ink may become unstable. Both the so-called "glue" and "consistency" of adhesiveness and printability are not good, and in particular, when the upper limit is exceeded, sufficient adhesion cannot be obtained and it is unacceptable.

(ii) Rubber and thermoplastic resin binders below the lower limit of 20 to 60 wt. If the upper limit is exceeded, the consistency will be too high, the solubility will be poor, and the printability will be poor, making it impossible.

(iv) Tackifier If the upper limit of 0.1 to 20% by weight is exceeded, the consistency will be too high and the solubility will be poor; if it is less than the lower limit, no tackifying effect will be produced and it is not acceptable.

Note that the apparent specific gravity and viscosity of the suspension paint itself are also important, and if it is outside the limited range, the printability and adhesion resistance of the ink will not be obtained and it will not be possible.

Also, the graphite, silver, copper, nickel, palladium.

In the case of the tin powder particle size, if it exceeds 60 μm, the stability of the suspension, so-called "glue" and adhesion of printing cannot be obtained sufficiently. Further, the lower limit is set to 0.1 μ because it is usually commercially available and is suitable in view of the viscosity, consistency, printability, etc. of the suspension. Further, in the case of the carbon black, the particle size is set to 0.1 μm or less because it is difficult to obtain a particle size exceeding 0.1 μm industrially. or,
In the case of carbon black, the reason why the particle size is 0.1 μm or less is that, unlike in the case of graphite, silver, etc., the particles are bonded together like a bar, so even if the particles are fine, printability is suitable.

The manufacturers and product names of the materials used are listed below.

Generic name Manufacturer (company name) Product name
Roprene Rubber Showa Neoprene Co., Ltd. Neoprene WR
T, WD chlorosulfonation DuPont Hypalon A30.40 rubber l urethane resin Nippon Polyurethane Co., Ltd. Paraprene 22S, 253 polyester resin Toa Paint Co., Ltd. xp-aa.

Rip Roblev Synthesis Showa Kobunshi Co., Ltd. Vinyroll 210.2700 Rubber Polyester Resin Hitachi Chemical Co., Ltd. Nispel 1
811 Toyobo Co., Ltd. Pioy & 2oO, 30
゜Titanium oxide Titanium Kogyo Co., Ltd. Anatar Shogada Titanium Talc Nippon Talc Co., Ltd.
Talc powder A hydrated alumina Showa Denko K.K. Hisilite H-32 colloidal silica
As mentioned above, the bonding strength of the thermocompression bonding, that is, the heat-sealed part of the connector according to the present invention is flexible even when the central part of the connector is bent upward or downward, so the printed circuit board will not warp. It is also fully guaranteed against collisions. On top of that,
The manufacturing process is very simple, and a conductive thermocompression layer is provided on the required surface, ensuring sufficient conductivity on the inner wall of the through-hole, resulting in a perfect electrical connection, easy installation, and a low defect rate. Becomes cheaper.

Because of the insulating thermocompression bonding layer, the adhesive strength is maintained as a whole, and there is no need to use release paper.

The present invention will be further described below with reference to Examples.

Examples of the present invention will be described below with reference to the drawings.Example 1 Step (A) Q, 3m through hole, film substrate Width 40mm, length 55mm Process (g)) Same process side as process 03) Thermocompression bonding temperature 120°C 1 pressure 10 kv/c
++fLiquid crystal display tube (LOD) and printed circuit board (PC
B) can be used extremely easily and compactly, and good results have been obtained in practice. The conductivity of the through-holes, the flexibility, and the thermocompression bondability of the terminal layer were all sufficient.

Example 2 Step (4)l, Qss through hole, film substrate width 4Qts
, length 105 vinyl roll 2700 Process (E) Same process as process (B) (Takumi Thermocompression bonding temperature 200℃, pressure cuff kg / cn
It can be easily and concisely used to connect one printed circuit board (PAN) to another printed circuit board (PC3B), and good results have been obtained in practice. In other respects, the same satisfactory results as in Example 1 were obtained.0 Example 3 Process (A) 0. '7 through holes, film substrate width 5
Qtrm, length 15mm process Q3) (a) Particle size 0.
5~aoμ Graphite powder 25 weight - 0.1μ or less Carbon black 5% by weight (b) Chloroprene rubber Showa Neobrene Co., Ltd. 15% by weight Neoprene WRT Process) (i) Titanium oxide Titanium Kogyo Co., Ltd.
5% by weight anatase type titanium oxide process■) Same process as process (B) (g)Thermocompression bonding temperature 160°C2 pressure 8 kg/c
+j It could be easily and compactly used for connecting an electrochromic display (EOD) and a printed circuit board (PCB), and good results were obtained in practical use.

Example meeting process ■ 0. SM through hole, film substrate 20 times wide, long process (B) (a) Silver powder with particle size of 5 to 15μ
70% by weight) Polyurethane resin Nippon Polyurethane Co., Ltd. 10% by weight Product name Paraprene 228 Process (Cn Example 2 Q/M) + (Ro) + Gma) + Same process as (D) Example 2 (υ+(2
) + (same process as (b) + (e) (E) process 03)
Same process ke) Heat compression temperature 200°C1 pressure zokg/c++
1 Electrode terminal part of solar cell and printed circuit board (paB)
It can be easily and compactly used for connection with other systems, and good results have been obtained in practical use. Through-hole conductivity, flexibility,
The strength was also sufficiently maintained by thermocompression bonding.

Example 5 Step (G) 3.5 is through hole, film substrate Width 85 mm, length 10 mm Step (B) Example 4 Step) (
Same process as a) + (b) + (C) (C) (i/N)
Particle size 5-15μ silver powder 50% by weight (ha)
Isophorone 10% by weight Toluene 8% by weight Viscosity: B
ooo Poise Specific gravity: 1.9 Process (6) Example 2 Process) ←) + (i) + Medium υ + (B) Same process (G)) Process (, B) Same process Transfer) Thermocompression bonding temperature 190 °C9 Pressure15
/c++1 It was easy and compact to use for connecting POB and PCB, and good results were obtained in practical use. Unlike conventional products, there was no need to tuck it up or down, and its flexibility, adhesiveness, and conductivity were all sufficient.

[Brief explanation of the drawing]

FIG. 1 is an enlarged perspective schematic view showing one embodiment of the present invention, and FIG. 2 is a view along the center of the through hole 4 in FIG.
FIG. 8 and FIG. 4 are explanatory diagrams showing an example of use of an embodiment of the present invention, and FIG. 5 and FIG. FIG. 3 is an explanatory diagram showing an example of how the product is used. l... Flexible insulating film substrate 2, 3... Vertical striped conductive strip layer 4... Through hole (
Through hole) 5... Conductive layer 6.7 on the inner wall of the through hole 4... Conductive thermocompression bonding layer 8.9... Both remaining portions 10 on the front and back sides of the substrate 1 other than the conductive thermocompression bonding layers 6 and 7 .11... Insulating thermocompression bonding layer A... PCB substrate, FPO substrate, solar cell electrode, etc. B
...PCB substrates, FPO substrates, solar cell electrodes, etc.0.
0/...Flexible through-hole double-sided heat-seal connector according to an embodiment of the present invention D...Conventional product (flexible single-sided heat-seal connector) E
...Circuit protection tape or insulation printing. Figure 1 Figure 2 Figure 3 Figure 4 Name: Flexible through-hole double-sided heat-seal connector and its manufacturing method 3; Relationship with the amended case Patent applicant: Nippon Graphite Industries Co., Ltd. Telephone: (581) Number 2241 (representative) and 1 other person 5°, 1. Deleted “Process■ Same as step (5)” on page 25 of the specification, line 16, and corrected “Process (3)” on line 17 of the same page to “Conditions of use (see Figures 8 and 4)” do. 2. Delete "Process (6) Process (same as uniform") on the 6th line of page 27, and change "Process (technical)" from the 6th line of the same page to "Conditions of use (see Figure 8 and Figure 1)" 3. Delete "Process (Odor) Same as process (B>)" on page 28, line 13, and change "Process ■" on line 14 of the same page to [Conditions of use (Fig. 8 and la
(See Figure 4). 4. On page 29, line 8, "Process (G) Same as process c issue" was deleted, and on line 9 of the same page, "Process (G)" was replaced with "Conditions of use (see Figures 8 and 4)" Correct. 5. Delete "Process (smell) Same as process CB" on the 4th line of page 30 and correct "Process (g)" on the 5th line of the same page to "Conditions of use (see Figures 3 and 4)" do.

Claims (1)

[Scope of Claims] 1. A flexible insulating film substrate 1, provided on both the front and back sides of the substrate 1, having a desired width, mutual spacing, and number of wires, and having electrical connections with desired electrical component terminals on each of the front and back sides. Vertical striped conductive strip layer 2 on each of the front and back sides,
3, a conductive layer 5 on the inner wall of the through-hole 4 that connects the front and back conductive strip layers 2 and 3 to each other, and a conductive layer 5 formed on the front and back conductive strip layers 2 and 3 in substantially the same shape. The conductive thermocompression bonding layers 6 and 7 and the remaining portions 8 and 9 on the front and back sides of the substrate 1 other than the conductive thermocompression bonding layers 6 and 7 are respectively adhered so as to form substantially the same plane. Both the front and back insulating thermocompression bonding layers 1 formed
1. A flexible through-hole double-sided heat-seal connector characterized by comprising: 0 and 11. 2. The vertically striped conductive strip layers 2 and 3 on the front and back sides and the inner wall conductive layer 5 of the through hole 4 are made of (a) graphite powder, silver powder, copper powder, nickel powder, palladium powder with a particle size of 0.1 to 60μ; Conductive fine powder 20-8 consisting of one or more types of silver powder and carbon black powder with a particle size of 0.1μ or less
(b) 5 to 30% by weight of a rubber-based and thermoplastic resin binder consisting of one or more of chloroprene rubber, chlorosulfonated rubber, polyurethane resin, polyester resin, and vinyl chloride resin; (c) 15 to 80% by weight of an organic solvent consisting of one or more of dimethylformamide, diacetone alcohol, isophorone, diethyl carbitol, butyl carbitol, and turpentine oil.
(a+b+c) and is uniformly dispersed by applying and drying a conductive suspension paint having an apparent specific gravity of 0.9 to 2.3 and a viscosity of 150 to 3000 poise, Both conductive thermocompression bonding layers 6 and 7 are provided on the vertically striped conductive strip layers 2 and 3, respectively.
(i) Graphite powder, powder, silver powder with a particle size of 0.1 to 60μ,
10 to 65% by weight of conductive fine powder consisting of one or more of copper powder, nickel powder, palladium powder, tin powder, and carbon black powder with a particle size of 0.1 μ or less;
10 to 50% by weight of a rubber and thermoplastic resin binder consisting of one or more of chloroprene rubber, polyester resin, ethylene-vinyl acetate copolymer resin, and polymethyl methacrylate resin; Acetone alcohol, methyl isobutyl ketone, xylene,
15 to 80% by weight of an organic solvent consisting of one or more of toluene and diethyl carbitol, and (to) 0.1 tackifier consisting of one or two of a terpene resin and an aliphatic hydrocarbon resin. An apparent specific gravity of 0.9 to 2 that was mixed with ~20% by weight (I+RO+HA+) and uniformly dispersed.
．． 0.0 and a viscosity of 500 to 10,000 poise.
i) 2 to 30% by weight of powder consisting of one or more of titanium oxide, talc, hydrated alumina, and colloidal silica.
(ii) 20 to 60% by weight of a rubber-based and thermoplastic resin binder consisting of one or more of chloroprene rubber, polyester resin, ethylene-vinyl acetate copolymer resin, and polymethyl methacrylate resin; iii) 10 to 70% by weight of an organic solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, and diethyl carbitol; and (iv) a terpene resin and an aliphatic hydrocarbon resin. An apparent specific gravity of 0.8 to 1.4 and a viscosity of 160 to 500 obtained by dissolving (i + ii + iii + iv) 0.1 to 20% by weight of a tackifier consisting of one or two of the following and uniformly dispersing it.
2. The flexible through-hole double-sided heat-seal connector according to claim 1, wherein the flexible through-hole double-sided heat-seal connector is formed by applying and drying an insulating thermocompression suspension paint having a zero poise. 3. A step (A) of drilling a through hole 4 in advance at a position where a through hole is required on a desired printed circuit of the flexible insulating film substrate 1; The longitudinally striped conductive strip layers 2 and 3 on the front and back sides, which are to be electrically connected to the desired electric component terminal portion on the front and back sides, and have the desired width, mutual spacing, and number covering at least the diameter of the through-hole 4 obtained by The conductive layer 5 on the inner wall of the through hole 4 is made of (a) grain size 0.1
~60μ graphite powder, silver powder, copper powder, nickel powder,
20 to 80% by weight of conductive fine powder consisting of one or more of palladium powder, silver powder, and carbon black powder with a particle size of 0.1μ or less, and (b) chloroprene rubber, chlorosulfonated rubber, polyurethane resin, polyester 5 to 30% by weight of a rubber and thermoplastic resin binder consisting of one or more of resins and vinyl chloride resins, and (c) dimethylformamide, diacetone alcohol, isophorone, diethyl carbitol, butyl carbitol, and Mixed with 15 to 80% by weight of one or more organic solvents such as turpentine (a+b+
c) Dissolved and uniformly dispersed apparent specific gravity of 0.9 to 2.
3. Using a conductive suspension paint with a viscosity of 150 to 3000 poise, coating or screen printing, and further dripping into the inner wall surface of the through hole 4 and heating and drying to form it (B
), and (b) graphite powder, silver powder, copper powder, nickel powder, palladium powder, tin powder with a particle size of 0.1 to 60μ and a particle size of 0.
10 to 65% by weight of conductive powder consisting of one or more types of carbon black powder of 1μ or less, and (filter) one type of chloroprene rubber, polyester resin, ethylene-vinyl acetate copolymer resin, and polymethyl or methacrylate resin. or 10 to 50% by weight of a rubber-based and thermoplastic resin binder consisting of two or more types, and one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, and diethyl carbitol. A mixture of 15 to 80% by weight of an organic solvent consisting of 0.1 to 20% of a tackifier consisting of one or two of terpene resins and aliphatic hydrocarbon resins (I+RO+HA) Using a conductive thermocompression suspension paint having an apparent specific gravity of 0.9 to 2.0 and a viscosity of 500 to 10,000 poise, which was dissolved and uniformly dispersed in , 3 by screen printing and drying to form conductive thermocompression bonding layers 6 and 7, and (i) titanium oxide, talc, hydrated alumina and colloidal. 2 to 30% by weight of powder consisting of one or more types of silica, and (ii) rubber consisting of one or more of chloroprene rubber, polyester resin, ethylene-vinyl acetate copolymer resin, and polymethyl methacrylate resin. and thermoplastic resin binders 20-6
(iii) 10 to 70% by weight of an organic solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, and diethyl carbitol; (iv) terpene resin and Mixed with 0.1 to 20% by weight of a tackifier consisting of one or two aliphatic hydrocarbon resins (i+ii+iii+iv
) Dissolved and uniformly dispersed apparent specific gravity 0.8 to 1.4
, using an insulating thermocompression suspension paint with a viscosity of 150 to 5000 poise, the remaining portions 8 and 9 on the front and back sides of the substrate 1 other than the conductive thermocompression layers 6 and 7 are approximately flush with each other. Step (D
) A method for manufacturing a flexible through-hole double-sided heat-seal connector, characterized by comprising: