JPS6135150B2 - - Google Patents
Info
- Publication number
- JPS6135150B2 JPS6135150B2 JP54021995A JP2199579A JPS6135150B2 JP S6135150 B2 JPS6135150 B2 JP S6135150B2 JP 54021995 A JP54021995 A JP 54021995A JP 2199579 A JP2199579 A JP 2199579A JP S6135150 B2 JPS6135150 B2 JP S6135150B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molded body
- gas pressure
- molded
- cracks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Description
【発明の詳細な説明】
本発明は成形体から樹脂を除去する方法、特に
セラミツクス粉末若しくは金属粉末に樹脂を混合
してこれを所定の形状にして射出等の手段により
成形した後、得られた成形体から樹脂を除去する
方法に係るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for removing resin from a molded body, and in particular, a method for removing resin from a molded body, in particular, by mixing a ceramic powder or metal powder with a resin, shaping the mixture into a predetermined shape, and molding it by means such as injection. The present invention relates to a method for removing resin from a molded article.
近年、セラミツクスは一般工業材料から電子部
品に至る迄広く利用されるようになつてきた。こ
れに伴ない、これら製品は寸法精度や物性、形状
等につき、かなり厳しい要求がなされるようにな
つてきた。 In recent years, ceramics have become widely used in everything from general industrial materials to electronic components. Along with this, these products are now subject to considerably stricter requirements regarding dimensional accuracy, physical properties, shape, etc.
この様な要求に対処すべく、セラミツクス材料
に適当な樹脂を添加して熱可塑性を与え、これを
射出成形法により成形し、次いでこの成形体中に
含まれる樹脂を加熱分解除去後、本焼成を行な
い、所定のセラミツクス製品を得る方法がいくつ
か提案され、又実施されている。 In order to meet these demands, a suitable resin is added to the ceramic material to give it thermoplasticity, which is then molded by injection molding.Then, the resin contained in this molded body is removed by thermal decomposition, and then the main firing process is carried out. Several methods have been proposed and implemented to obtain desired ceramic products.
これら方法における重要点は、射出成形時に成
形体にクラツクが入らないことは勿論の事、得ら
れる成形体から樹脂を除去する際、いかにクラツ
クや膨れを起さずにそれを実施するかにある。 The important point in these methods is not only to ensure that the molded product does not crack during injection molding, but also to remove the resin from the resulting molded product without causing any cracks or blisters. .
従来、かかる樹脂の除去手段としては、空気中
において、単位時間当りの昇温速度を極く僅かづ
つにして数十乃至数百時間かけて徐々に樹脂を除
去することにより、クラツクや膨れが生じるのを
防いでいた。 Conventionally, the method for removing such resin has been to gradually remove the resin in air at a very small heating rate per unit time over several tens to hundreds of hours, which causes cracks and blisters. was preventing
しかしながら、かかる手段は長時間を要し、必
ずしも工業的に満足し得る手段と言い難いのみな
らず、この手段を用いても尚、クラツクや膨れを
十分防止し得なかつた。 However, such a method requires a long time and is not necessarily an industrially satisfactory method, and even if this method is used, cracks and blisters cannot be sufficiently prevented.
本発明者は、かかる点に鑑み、実質的にクラツ
クや膨れを生じることなく、又工業的にも満足し
得る樹脂の除去手段を見出すべく、種々研究、検
討した結果、成形体中から加熱によつて除去され
る樹脂のガス圧を抑制し得る大きさの密閉された
容器内において、成形体を加熱し、発生した樹脂
のガス圧によつて成形体表面のガス圧を上昇せし
めつつ成形体から樹脂を除去することにより、前
記目的を達成し得ることを見出した。 In view of the above, the present inventor has conducted various research and examinations in order to find a means for removing resin that does not substantially cause cracks or blisters and is also industrially satisfactory. The molded body is heated in a sealed container of a size that can suppress the gas pressure of the resin to be removed, and the gas pressure on the surface of the molded body is increased by the gas pressure of the generated resin. It has been found that the above object can be achieved by removing the resin from.
本発明において、用いられる密閉された容器の
大きさは、厳密には用いられる樹脂や成形体の形
状により多少異なるが、一般に350〜400℃におい
て成形体中に含まれた樹脂の約半量程度がガス化
して成形体から出て、容器内を満たしたとき、
1.5〜３気圧程度になる大きさが適当である。 In the present invention, the size of the sealed container used varies somewhat depending on the resin used and the shape of the molded product, but generally, at 350 to 400°C, about half of the resin contained in the molded product is When it gasifies and comes out of the molded body and fills the container,
A suitable size is about 1.5 to 3 atmospheres.
圧力が前記範囲に満たない様な、即ち大きな容
器ではクラツクや膨れが生じ、本発明の目的に沿
わず、逆に前記範囲より圧力が大となる容器では
成形体中から樹脂が除去するのに長時間を要すか
又は困難となる。 If the pressure is less than the above range, that is, if the container is large, cracks or bulges will occur, which does not meet the purpose of the present invention.On the other hand, if the pressure is greater than the above range, the resin may not be removed from the molded product. It may take a long time or be difficult.
本発明に用いられる密閉された容器の密閉と
は、それ程厳密なものでなく、多少圧力が漏れて
も前記した圧力がほぼ保てるものなら差し支えな
い。 The sealing of the sealed container used in the present invention is not so strict, and there is no problem as long as the above-mentioned pressure can be maintained even if some pressure leaks.
本発明が適用される成形体としては、通常セラ
ミツクス粉末若しくは金属粉末を原料とするもの
であり、セラミツクス粉末としては、例えば窒化
珪素、アルミナ、コージエライト、ジルコニア、
炭化珪素、窒化アルミニウム、タングステンカー
バイト等であり、又金属粉末としては、例えばシ
リコン、チタン、ジルコニウム等を挙げることが
出来る。 The molded body to which the present invention is applied is usually made from ceramic powder or metal powder, and examples of ceramic powder include silicon nitride, alumina, cordierite, zirconia,
Examples of the metal powder include silicon carbide, aluminum nitride, and tungsten carbide. Examples of the metal powder include silicon, titanium, and zirconium.
又、これら成形体の成形手段には特に制限はな
いが、射出成形、押出成形及びこれらに類する成
形法が挙げられる。 There are no particular limitations on the means for molding these molded bodies, but injection molding, extrusion molding, and similar molding methods may be mentioned.
本発明に用いられる樹脂としては、例えばポリ
プロピレン、ポリエチレン、ポリスチレン、アク
リロニトリルブタジエンスチレン共重合体等を適
宜用いることが出来、その他ジエチルフタレイ
ト、ジオクチルフタレート、ステアリン酸、ステ
アリン酸鉛等の滑剤や可塑剤等この種技術に用い
られる公知の樹脂や添加剤を適宜用いることが出
来る。 As the resin used in the present invention, for example, polypropylene, polyethylene, polystyrene, acrylonitrile butadiene styrene copolymer, etc. can be used as appropriate, and other lubricants and plasticizers such as diethyl phthalate, dioctyl phthalate, stearic acid, lead stearate, etc. Well-known resins and additives used in this type of technology can be used as appropriate.
又、用いられる密閉された容器の形状や材質に
特に制限はなく、例えばステンレス、アルミナ、
硼珪酸ガラス等高温において樹脂と反応しない様
な材料を適宜用いることが出来る。 Furthermore, there are no particular restrictions on the shape or material of the sealed container used; for example, stainless steel, alumina,
Materials that do not react with the resin at high temperatures, such as borosilicate glass, can be used as appropriate.
実際、本発明に従つて成形体から樹脂を除去す
るには、例えば成形体を容器中に入れ、外部から
適当な加熱手段によつて加熱する。 In fact, in order to remove the resin from a molded body according to the invention, the molded body is placed in a container and heated from the outside by suitable heating means.
そして、本発明方法を採用すると、通常の方法
である３〜４℃／時の昇温速度に対し、５〜６
℃／時の昇温速度が採用出来、即ち、従来法の約
半分の時間で樹脂を除去出来、しかも、クラツク
や膨れの発生が格段に少なくなる。 When the method of the present invention is adopted, the heating rate is 5 to 6 degrees Celsius, compared to the usual method of 3 to 4 degrees Celsius/hour.
A heating rate of °C/hour can be adopted, that is, the resin can be removed in about half the time of the conventional method, and the occurrence of cracks and blisters is significantly reduced.
次に本発明を実施例により説明する。 Next, the present invention will be explained by examples.
実施例
窒化珪素粉末77.6重量％、ポリスチレン10.6重
量％、ポリプロピレン5.9重量％、ポリエチレン
2.8重量％、ジエチルフタレート1.5重量％、ステ
アリン酸1.5重量％から成る混合物を加熱筒温度
250℃、射出圧力1t／cm2、金型温度50℃で射出成
形して60mm×100mm×７mmの成形体を得た。Examples Silicon nitride powder 77.6% by weight, polystyrene 10.6% by weight, polypropylene 5.9% by weight, polyethylene
A mixture consisting of 2.8% by weight, 1.5% by weight of diethyl phthalate, and 1.5% by weight of stearic acid was heated to the tube temperature.
Injection molding was performed at 250°C, injection pressure of 1 t/cm 2 , and mold temperature of 50°C to obtain a molded article of 60 mm x 100 mm x 7 mm.
この成形体をねじ込み式の蓋を有する内容積
150c.c.のステンレス製容器に入れ、熱風循環式電
気炉を熱源として室温から200℃迄を昇温速度30
℃／時とし、次いで200℃から350℃迄の昇温速度
を５℃／時として350℃にて10時間保持後、成形
体をとり出した処、クラツクや膨れは全くなかつ
た。これを窒素雰囲気中において室温から1750℃
迄を昇温速度200℃／時で焼成し、1750℃におい
て１時間保持した。得られた焼結体はクラツクや
膨れは認められなかつた。 This molded body has an internal volume with a screw-on lid.
Place it in a 150 c.c. stainless steel container and use a hot air circulation electric furnace as the heat source to raise the temperature from room temperature to 200°C at a rate of 30°C.
℃/hour, then the heating rate from 200℃ to 350℃ was set at 5℃/hour, and after holding at 350℃ for 10 hours, the molded product was taken out and there were no cracks or blisters at all. This is heated from room temperature to 1750°C in a nitrogen atmosphere.
The mixture was fired at a temperature increase rate of 200°C/hour and held at 1750°C for 1 hour. No cracks or blisters were observed in the obtained sintered body.
Claims (1)
混合し、これを成形した成形体から樹脂を除去す
るに当り、成形体中から加熱によつて除去される
樹脂のガス圧を制御し得る大きさの密閉された容
器内において、成形体を加熱し、発生した樹脂の
ガス圧によつて成形体表面のガス圧を上昇せしめ
つつ成形体から樹脂を除去する方法。 ２ 成形体表面のガス圧の上昇は、350〜400℃に
おいて1.5〜３気圧である特許請求の範囲１の方
法。[Scope of Claims] 1. When removing the resin from a molded article made by mixing a resin with ceramic powder or metal powder, the gas pressure of the resin removed from the molded article by heating is controlled. A method for removing resin from a molded body by heating the molded body in a sealed container of a size that allows the molded body to be heated, and increasing the gas pressure on the surface of the molded body by the gas pressure of the generated resin. 2. The method according to claim 1, wherein the increase in gas pressure on the surface of the compact is 1.5 to 3 atm at 350 to 400°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2199579A JPS55114523A (en) | 1979-02-28 | 1979-02-28 | Method of removing resin from molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2199579A JPS55114523A (en) | 1979-02-28 | 1979-02-28 | Method of removing resin from molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55114523A JPS55114523A (en) | 1980-09-03 |
| JPS6135150B2 true JPS6135150B2 (en) | 1986-08-11 |
Family
ID=12070596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2199579A Granted JPS55114523A (en) | 1979-02-28 | 1979-02-28 | Method of removing resin from molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55114523A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717468A (en) * | 1980-06-30 | 1982-01-29 | Toyota Motor Co Ltd | Manufacture of ceramic sintered body |
| JPS57205378A (en) * | 1981-06-09 | 1982-12-16 | Toyota Motor Co Ltd | Manufacture of ceramics sintered body |
| JPS5898210A (en) * | 1981-12-09 | 1983-06-11 | 株式会社東芝 | Manufacture of ceramic sintered body |
| JPS6060984A (en) * | 1983-09-13 | 1985-04-08 | 日立化成工業株式会社 | Manufacture of ceramic sintered body |
| JPS60195062A (en) * | 1984-03-16 | 1985-10-03 | 日本碍子株式会社 | Method of dewaxing ceramic molded body |
| JPS60245703A (en) * | 1984-05-21 | 1985-12-05 | Honda Motor Co Ltd | Production of metallic laminated body |
| JPS60264369A (en) * | 1984-06-11 | 1985-12-27 | 株式会社日本製鋼所 | Device for dewaxing ceramic formed body |
| JPH0647684B2 (en) * | 1989-01-20 | 1994-06-22 | 川崎製鉄株式会社 | Degreasing method for injection molded products |
| ZA200801157B (en) * | 2005-08-23 | 2009-08-26 | Dow Global Technologies Inc | Improved method for debindering ceramic honeycombs |
-
1979
- 1979-02-28 JP JP2199579A patent/JPS55114523A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55114523A (en) | 1980-09-03 |
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