JPS6132491A - Hybrid integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a hybrid integrated circuit (C), and more particularly to a ROM (read-only memory) mounted on the hybrid integrated circuit.

[Prior art]

ROM is a type of memory IC, and can be briefly explained as follows.

Memory has the function of storing and retaining various information and retrieving it as needed.In data processing machines such as electronic computers, memory is a memory that temporarily stores data and allows information to be retrieved at high speed. There are semi-permanent memories for storing instructions, etc., and memories used as buffers for input/output devices and data processing devices, and the performance required varies depending on the purpose of use. Memory IC is semiconductor memory, especially MOS
As memory has become more integrated, an increase in the degree of integration has led to a decrease in price, and it has come to be used in large quantities incomparably with logic ICs, and is now used in applications other than large and medium-sized electronic computers. They are also widely used in personal computers, applied office automation equipment, and home appliances. Semiconductor memories can be categorized according to their operating state, and are broadly divided into address access memory, in which data is written/read based on addresses, and associative memory, in which data is accessed based on stored contents.Address access memory is further divided into arbitrary When calling up a memory location, the call time is the memory location called immediately before [2 unrelated RAM (random access me)].
(mory) and an iS that can only call up information sequentially.
AM (5equential access memory)
y). The RAM also has RWM (reacl/wri) that can read and write data.
There are ROMs that can be written, but the number of times they can be rewritten are limited, or extreme (-the writing time is slow, and the king is read-only.
only me-mory). This ROM
+2 is a completely fixed ROM in which information is written during manufacturing.
(mask ROM) and PROM that can be written by the user
(programmable ROM). Both ROMs are non-volatile memories that do not lose stored information even when the power is turned off. Conventionally, when mounting this ROM on a wired insulating board, a semiconductor TETSU was mounted inside a chip carrier.・The chip carrier was mounted by soldering after being bonded and fixed. However, this method requires a different specific ROM code for each of the nine subscribers when used as a subscriber calling code, for example in a pager.

Moreover, since it is fixedly mounted by soldering, if the subscriber changes, another product with a different ROM code (
OBJECTS OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to provide a hybrid integrated circuit in which a ROM can be attached or removed.

〔composition〕

In order to achieve the above object, the present invention provides a chip carrier comprising a frame fixed on a wired substrate and having a protrusion on the outer side surface, and a chip carrier having a read-only memory mounted inside the frame. A conductive intervening member is interposed on the substrate side, and the protrusion is fitted into the gap having a recess into which the protrusion fits.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded view of an embodiment of the present invention, and FIG. 2 is a sectional view after assembly. In FIG. 1, an insulating substrate 1 is placed on an insulating substrate 1, which is made of a non-conductive material, and has protrusions 2 on its sides.
An outer frame 6 is fixedly provided. A chip carrier 5 carrying a ROM 4 is fitted into this outer frame 6 by a cap 8 having a groove 7 that fits into the protrusion 2, with a conductive rubber 6 interposed on an insulating substrate 1g8. Here, the conductive rubber 6 is not entirely conductive, but is designed so that each terminal of the ROM 4 and a predetermined wired portion on the insulating substrate 1 are electrically connected. Only a predetermined portion of the conductive rubber 6 has conductivity.

As is clear from the drawing, the ROM 4 (chip carrier 5) is brought into contact with the substrate 1 by a snap connection between the cap 8 and the outer frame 3 through the conductive rubber 6 that acts as a buffer material, so that the ROM is Replacement can be done quickly and easily, and connection failures due to vibrations and the like can also be prevented.

In addition, in this example, the protrusion 2 is provided in two directions, but it is provided in four directions,
In other words, protrusions may be provided on all sides of the outer frame B.

〔Effect of the invention〕

As described above, in the present invention, since the ROM is removable, it can be replaced easily and quickly, and versatility can be achieved. Further, reliable electrical connection can be made to the swinging rally 1 and the like.

[Brief explanation of the drawing]

FIG. 1 is an exploded view of an embodiment of the present invention, and FIG. 2 is a sectional view after assembly. 1... Insulating substrate, 2... Protrusion. 3... Outer frame, 4... ROM. 5... Chip carrier, 6... Conductive comb. 7...Groove, 8...Cap.

Claims (1)

[Claims] A chip carrier is provided with a frame fixed on a wired substrate and has a protrusion on an outer side surface, and a chip carrier having a read-only memory mounted inside the frame has a conductive intervening member interposed on the substrate side, A hybrid integrated circuit characterized in that the hybrid integrated circuit is fitted with a cap having a recess that fits into the protrusion.