JPS6130328A - Method and device for mirror surface like polishing stainless steel - Google Patents
Method and device for mirror surface like polishing stainless steelInfo
- Publication number
- JPS6130328A JPS6130328A JP15212784A JP15212784A JPS6130328A JP S6130328 A JPS6130328 A JP S6130328A JP 15212784 A JP15212784 A JP 15212784A JP 15212784 A JP15212784 A JP 15212784A JP S6130328 A JPS6130328 A JP S6130328A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- abrasive
- substrate material
- stainless steel
- electrolyte
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は、太陽電池基板等に使用されるステンレス鋼
を電解複合研摩によ)鏡面研摩する方法及びその装置に
関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method and apparatus for mirror polishing stainless steel used for solar cell substrates and the like (by electrolytic composite polishing).
(従来の技術)
ステンレス鋼は、耐久性、耐熱性、電気伝導性に優れ比
較的安価であることが広く知られてhる。このため近時
、太陽電池基板等の用途として注目され始めている。(Prior Art) Stainless steel is widely known to be excellent in durability, heat resistance, and electrical conductivity, and to be relatively inexpensive. For this reason, it has recently begun to attract attention as an application for solar cell substrates and the like.
しかしステンレス鋼は、表面にごく細かい突起などの表
面欠陥があシ、これをそのまま使用したのでは歩留シが
低下する。このためステンレス鋼を太陽電池基板等に使
用するには、予じめ表面を研摩してこの細かい突起物を
取り除き、表面を平滑忙する必要がある。However, stainless steel has surface defects such as minute protrusions, and if used as is, the yield will be reduced. Therefore, in order to use stainless steel for solar cell substrates and the like, it is necessary to polish the surface in advance to remove these fine protrusions and smooth the surface.
表面を平滑にする有力な研摩法として、電解複合研摩法
がある。この研摩法は、研摩砥粒を含有せしめた電解液
中で電極とステンレス鋼との間に電流を流し、電解研摩
と砥粒による研摩とを複合しておこなう方法である。Electrolytic composite polishing is an effective polishing method for smoothing surfaces. This polishing method is a method in which an electric current is passed between an electrode and stainless steel in an electrolytic solution containing abrasive grains to perform a combination of electrolytic polishing and polishing using abrasive grains.
(発明が解決しようとすゑ問題点)
しかるに従来の電解複合研摩は、その研摩性能を高める
ために、高い研摩圧力(例えば0、1〜0.3ゆ/、、
2 )及び高電流密度(1,0〜10 A/an2)で
行っている。このため研摩砥粒及び研摩材の消耗が大き
く、設備費が高くつき、この結果研摩費用が高くなる欠
点があった。(Problem that the invention is trying to solve) However, conventional electrolytic composite polishing requires high polishing pressure (for example, 0.1 to 0.3 Y/,...
2) and high current density (1.0 to 10 A/an2). For this reason, the polishing abrasive grains and abrasive material are consumed to a large extent, and the equipment costs are high, resulting in high polishing costs.
(問題点を解決するための手段)
本発明は、上述した欠点を解消すべくなされたもので、
その目的とするところは、研摩材として軟質多孔質合成
樹脂を用いることにより、低研摩圧力、低電流密度で電
解複合研摩することができ、もって基板製造コストを下
げることができるステンレス鋼の鏡面研摩方法及びその
装置を得んとするものである。(Means for Solving the Problems) The present invention has been made to solve the above-mentioned drawbacks.
The aim is to achieve mirror polishing of stainless steel by using a soft porous synthetic resin as the abrasive material, which enables electrolytic composite polishing at low polishing pressure and low current density, thereby reducing board manufacturing costs. The present invention aims to provide a method and an apparatus for the same.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
本発明方法は、ステンレス鋼製基板材を電解複合研摩す
るに際し、中性塩溶液に研摩砥粒を混入した研摩電解液
を用いて、この電解液を軟質多孔質合成樹脂からなる研
摩材に含浸せしめ々がら研1?8圧力0.02 kg/
cm2以下、電解電流密度0.5 A/cm”以下で電
解複合研摩することを特徴とする。The method of the present invention uses a polishing electrolyte in which polishing abrasive grains are mixed in a neutral salt solution when performing electrolytic composite polishing of a stainless steel substrate material, and impregnates an abrasive material made of a soft porous synthetic resin with this electrolyte. Seshimegaraken 1-8 pressure 0.02 kg/
cm2 or less, and electrolytic composite polishing is performed at an electrolytic current density of 0.5 A/cm" or less.
この方法で、研摩するステンレス鋼は、表面がなるべく
平滑なものが好ましく、例えば表面あらさが0.3μm
以下Rrr1.xと小さい光輝焼鈍及び調質圧延を行っ
たステンレス鋼を用いる。研摩電解液は、例えばNaN
O3あるいはNaN0□などの腐食性の少ない中性塩の
10%〜30チ程度の溶液である。この電解液に含まれ
る研摩砥粒は、材料がアルミナ酸化クロムなどで、粒径
が0.05〜1.0μm程度のものが好ましく、これを
通常10〜501/l混入する。In this method, it is preferable that the surface of the stainless steel to be polished be as smooth as possible, for example, the surface roughness is 0.3 μm.
Below Rrr1. Stainless steel that has been brightly annealed and temper rolled with a small x is used. The polishing electrolyte is, for example, NaN
It is a solution of about 10% to 30% of a less corrosive neutral salt such as O3 or NaN0□. The abrasive grains contained in this electrolytic solution are preferably made of alumina chromium oxide or the like and have a particle size of about 0.05 to 1.0 μm, and are usually mixed in 10 to 50 1/l.
軟質多孔質合成樹脂研摩材の材質は、発泡ポリウレタン
、発泡ポリエステル、発泡ポリエチレンなどで、孔が連
通気泡性のものを用いる。The material of the soft porous synthetic resin abrasive is foamed polyurethane, foamed polyester, foamed polyethylene, etc., and the pores are open-celled.
本発明は、上記ステンレス鋼基板材に研摩材を押しあて
て電解液を流し、研摩材に電解液を含浸させる。そして
電極と基板材との間を通電して電解研摩を行々う。これ
と同時に研摩材を基板材に対して相対的に摺動せしめて
、研摩砥粒による研摩を行なう。このような研摩におい
て、電解電流密度を0.5 A/crn2J″J、下、
研摩圧力を0、02 klil/cn12以下とする。In the present invention, an abrasive material is pressed against the stainless steel substrate material and an electrolytic solution is caused to flow therethrough, thereby impregnating the abrasive material with the electrolytic solution. Then, electricity is passed between the electrode and the substrate material to perform electrolytic polishing. At the same time, the abrasive material is slid relative to the substrate material to perform polishing with the abrasive grains. In such polishing, the electrolytic current density was lower than 0.5 A/crn2J''J,
The polishing pressure is 0.02 klil/cn12 or less.
その理由は、高研摩圧力及び高電流密度とすると、従来
方法の欠点で述べたように研摩材あるいは研摩砥粒の消
耗が大きくなるためである。そして本発明によれば、研
摩材に電解液が含浸され、電解液と基板材との接触が良
好に行なわれているので、その研摩性能が高く、低研摩
圧力及び低電流密度としても所望の研摩特性を得ること
ができる。なお砥粒の擦過速度は、砥粒研摩性能を高め
るためにin/sec以上が好ましい。The reason for this is that high polishing pressure and high current density result in increased consumption of the abrasive material or abrasive grains, as described in the disadvantages of the conventional method. According to the present invention, the abrasive material is impregnated with an electrolytic solution and good contact is made between the electrolytic solution and the substrate material, so the polishing performance is high and the desired low polishing pressure and current density are achieved. Abrasive properties can be obtained. Note that the abrasive grain rubbing speed is preferably in/sec or more in order to improve the abrasive grain polishing performance.
次に太陽電池基板を製造するための鏡面研摩装置につい
て、図示する実施例を参照して説明する。Next, a mirror polishing apparatus for manufacturing solar cell substrates will be described with reference to illustrated embodiments.
第1図及び第2図に示す装置は、電解研摩槽1内に基板
材支持台2を配置している。この支持台2の上方に円板
状の軟質多孔質合成樹脂研摩材3を配置している。この
研摩材3は、支持台2上のステンレス鋼基板上4を所定
圧力で押圧し、摺動回転するものである。この研摩材3
の上部に円板状の電極板(陰極)5が設けられ、この電
極板5け第2図に破線で示すように放射状の電解液供給
溝5&を穿設している。この電極板5と上記研摩材3と
は、保持体6で囲うように絶縁保持されている。この保
持体6は上部中央に回転軸7を固定している。この回転
軸7の内部には、上記電解液供給溝5aに連通する液路
7aが形成されている。この回転軸7は、駆動装置(図
示せず)で回転及び矢印方向への往復動がなされる。ま
た回転軸7には給電ブラシ8が電気的に接触しておシ、
この回転軸7に接している電極板5と基板材4との間に
給電するようになっている。更にこの装置には、電解研
摩槽1.電解液槽91回転軸2内の液路7n。In the apparatus shown in FIGS. 1 and 2, a substrate material support 2 is disposed within an electrolytic polishing tank 1. As shown in FIG. A disc-shaped soft porous synthetic resin abrasive material 3 is placed above the support base 2. This abrasive material 3 presses against the stainless steel substrate 4 on the support base 2 with a predetermined pressure, and slides and rotates. This abrasive material 3
A disc-shaped electrode plate (cathode) 5 is provided on the upper part of the electrode plate 5, and radial electrolyte supply grooves 5& are formed in the electrode plate 5 as shown by broken lines in FIG. This electrode plate 5 and the abrasive material 3 are held insulated so as to be surrounded by a holder 6. This holder 6 has a rotating shaft 7 fixed at the center of its upper part. A liquid path 7a is formed inside the rotating shaft 7 and communicates with the electrolyte supply groove 5a. This rotating shaft 7 is rotated and reciprocated in the direction of the arrow by a drive device (not shown). Further, a power supply brush 8 is in electrical contact with the rotating shaft 7.
Electric power is supplied between the electrode plate 5 and the substrate material 4 which are in contact with the rotating shaft 7. Furthermore, this apparatus includes an electrolytic polishing tank 1. Liquid path 7n in electrolyte tank 91 rotating shaft 2.
電極材5の電解液供給溝5a及び研摩材3をIンゾ10
で循環せしめる研摩電解液供給装置が配置されている。The electrolyte supply groove 5a of the electrode material 5 and the abrasive material 3 are
A polishing electrolyte supply device for circulating the polishing electrolyte is provided.
この装置では、ポンプ10によシ、研摩砥粒を混入した
電解液を例えば0.51/min〜5//minで液路
2aから、電解液供給溝5aを通し、研摩材3中で一定
時間保持した後、研摩材3と基板材4との間から電解研
摩槽1内に排出する。これと同時に研摩材3を基板材4
に押し付けながら摺動回転及び摺動往復動せしめ、電解
液中の研摩砥粒によ多材料を擦過研摩する。In this device, an electrolytic solution mixed with abrasive grains is fed by a pump 10 from a liquid path 2a at a rate of, for example, 0.51/min to 5/min, through an electrolytic solution supply groove 5a, and is kept constant in the abrasive material 3. After holding the polishing material for a certain period of time, it is discharged into the electrolytic polishing tank 1 from between the abrasive material 3 and the substrate material 4. At the same time, apply the abrasive material 3 to the substrate material 4.
The material is slid and rotated and reciprocated while being pressed against the surface, and the abrasive grains in the electrolyte abrade the material.
更に同時に電極板5と基板材4との間に、基板材4を陽
極として電流を流して電解研摩を行なう。この研摩時間
は、基板材40表面状態により変わるが、通常1 dm
”当り数十秒〜数分である。またこの装置を数段重ねる
ことによシ研摩速度を向上するようにしてもよい。Furthermore, at the same time, an electric current is applied between the electrode plate 5 and the substrate material 4, with the substrate material 4 used as an anode, to perform electrolytic polishing. This polishing time varies depending on the surface condition of the substrate material 40, but is usually 1 dm.
The polishing speed is several tens of seconds to several minutes per polishing process.Also, the polishing speed may be increased by stacking several stages of this apparatus.
第3図及び第4図は別の装置を示す。この装置は、電解
研摩槽11内に研摩砥粒を含む研摩電解液を入れており
、この液中に基板材支持台12を配置している。この支
持台12は、上面に断面円弧状凹部12mを形成してお
り、ことに帯状のステンレス鋼基板材14の一部が載せ
られるようになっている。この支持台12の上方には円
筒状の回転電極15が配置され、この電極15の外周面
に軟質多孔質合成樹脂研摩材13が被覆されている。こ
の研摩材13d、そp下部が研摩電解液中にあり、上記
支持台の四部12aと同じ曲率半径であり、上記支持台
12の凹部12*に対向している。一方電極15には駆
動体(図示せず)が連結され、電極15及びこれを被覆
する研摩材13を基板材14に対して摺動回転及び摺動
往復動せしめるようになっている。また電極15には給
電ブラシ18が電気的に接触し、電極15と基板材14
との間に給電する給電装置の一部を構成している。なお
図中16は絶縁保持体11mは円筒カバーである。Figures 3 and 4 show another device. In this apparatus, a polishing electrolyte containing polishing abrasive grains is placed in an electrolytic polishing tank 11, and a substrate material support stand 12 is placed in this liquid. The support base 12 has a recess 12m having an arcuate cross section on its upper surface, on which a part of the belt-shaped stainless steel substrate material 14 is placed. A cylindrical rotating electrode 15 is arranged above the support base 12, and the outer peripheral surface of the electrode 15 is coated with a soft porous synthetic resin abrasive material 13. The lower part of this abrasive material 13d is in the polishing electrolyte, has the same radius of curvature as the four parts 12a of the support base, and faces the recess 12* of the support base 12. On the other hand, a driving body (not shown) is connected to the electrode 15 so that the electrode 15 and the abrasive material 13 covering it are slidably rotated and reciprocated relative to the substrate material 14. Further, a power supply brush 18 is in electrical contact with the electrode 15, and the electrode 15 and the substrate material 14 are connected to each other.
It forms part of the power supply device that supplies power between the Note that the insulating holder 11m denoted by 16 in the figure is a cylindrical cover.
この装置では、研摩砥粒を混入した電解液中において、
電解液を保持した基板材14に研摩材13を押し付け々
から回転及び往復動させ、同時に電極15と基板材14
との間に電極15を陽極として電流を流し、電解複合研
摩を行なうO
この装置では、基板材14が円弧形状に彎曲しているの
で、研摩面積を広げることができる。In this device, in an electrolytic solution mixed with abrasive grains,
The abrasive material 13 is pressed against the substrate material 14 holding the electrolytic solution, and the electrode 15 and the substrate material 14 are simultaneously rotated and reciprocated.
Electrolytic composite polishing is performed by passing a current between the electrode 15 and the electrode 15 as an anode. In this apparatus, since the substrate material 14 is curved in an arc shape, the polishing area can be expanded.
第5図及び第6図は、本発明の更に異なる装置を示す。Figures 5 and 6 show further different devices of the invention.
この装置は、電解研摩槽21内に基板材支持台22を配
置し、この支持台22上に帯状のステンレス鋼製基板材
24を載せるように々っている。支持台22の上方には
1対の円筒状回転電極25□ 、25.が配置され、そ
の外周面に軟質多孔質合成樹脂研摩材23.。In this apparatus, a substrate material support 22 is arranged in an electrolytic polishing tank 21, and a belt-shaped stainless steel substrate material 24 is placed on the support 22. Above the support stand 22 are a pair of cylindrical rotating electrodes 25□, 25. is arranged, and a soft porous synthetic resin abrasive material 23. is disposed on its outer peripheral surface. .
232が被覆されている。各研摩材231 。232 is coated. Each abrasive material 231.
23、は、それぞれその下部を上記支持台22上に対向
しており、支持台22上の基板材24を抑圧できるよう
になっている。また各研摩材23、.232は、対向す
る側部をそれぞれ互いに接触せしめている。上記電極2
5□、252は、それぞれルス動体(図示せず)により
、第6図に示す矢印方向に回転しまた第7図に示す矢印
方向に往復移動するようになっており、これら電極25
1.25.の回転及び往復動により研摩材23..2.
’4.が基板材24上を摺動しながら回転及び往復動す
るようになっている。23 and 23 have their lower portions facing above the support stand 22, so that the substrate material 24 on the support stand 22 can be suppressed. In addition, each abrasive material 23, . 232 has opposing sides in contact with each other. Above electrode 2
5□, 252 are rotated in the direction of the arrow shown in FIG. 6 and reciprocated in the direction of the arrow shown in FIG. 7 by a Lus moving body (not shown).
1.25. The rotation and reciprocation of the abrasive material 23. .. 2.
'4. rotates and reciprocates while sliding on the substrate material 24.
上記基板材24の上方には、1対のノズル30th1.
3θhが設けられている。これらノズルso&1.so
t、は、基板材24と研摩材’?J1+231との間に
研摩砥粒を含む研摩電解液を噴出するもので、研摩電解
液はポンプ30により研摩電解槽21.電解液槽29及
び上記ノズル、?Oa、、、9(7a、を循環流通する
ようになっている。また電極251,25tには給電ブ
ラシ28が電気的に接触し、この給電ブラシ28け電極
25..25.と基板材24とに給電する給電装置の一
部を構成している。なお図中26は絶縁保持体、211
Lは円筒カバーである。Above the substrate material 24, a pair of nozzles 30th1.
3θh is provided. These nozzles so&1. so
t, is the substrate material 24 and the abrasive material'? A polishing electrolyte containing polishing abrasive grains is spouted between the polishing electrolyte tank 21.J1+231 and the polishing electrolyte tank 21. Electrolyte tank 29 and the above nozzle? Oa, . It constitutes a part of a power supply device that supplies power to the
L is a cylindrical cover.
この装置では、研摩砥粒を混入した電解液をノズル30
m1,30a2から各研摩材231 。In this device, an electrolytic solution mixed with abrasive grains is passed through a nozzle 30.
Each abrasive material 231 from m1, 30a2.
23、に吹き付け、電解液を含浸した研摩材23、.2
:9□で基板材24を押し例けながら摺動回転及び摺動
往復動せしめ、同時に電極25、.25.と基板材24
との間に基板材24を陽極として電流を流して電解複合
研摩する。23, and the abrasive material 23, . 2
: While pushing the substrate material 24 with 9□, it slides and rotates and slides back and forth, and at the same time the electrodes 25, . 25. and substrate material 24
Electrolytic composite polishing is performed by passing a current between the substrate material 24 and the substrate material 24 as an anode.
この装置によれば、1対の研摩材231 。According to this device, a pair of abrasive materials 231.
23□を用いているので、基板材24の研摩面積を高め
かつ研摩液を有効的に使用でき、研摩効率を高めること
ができる。Since 23□ is used, the polishing area of the substrate material 24 can be increased, the polishing liquid can be used effectively, and the polishing efficiency can be increased.
第7図乃至第9図は、別の装置、を示す。この装置は、
電解研摩槽31内に基板材支持台32を配置し、この上
にステンレス製基板月34を載せるようになっている。7 to 9 show another device. This device is
A substrate material support stand 32 is disposed within the electrolytic polishing tank 31, and a stainless steel substrate plate 34 is placed thereon.
この支持台32の上方には、軟質多孔質合成樹脂研摩材
33が対向して配置され、基板材34を押圧するように
なっている。研摩材33の上部には電極板35(陰極)
が設けられ、この電極板35d電解液流通孔35a・・
・を研摩材33に連通して形成している。電極板35の
上部には、平形研摩板41が設けられ、この研摩板41
は、電解液流通孔41a・・・を上記電解液流通孔40
h・・・に連通して形成している。これら研摩材33.
電極板35及び研摩板41は、絶縁保持体36によシ一
体的に絶縁保持され、この絶縁保持体26により漏れ電
流を防止しかつ研摩液を研摩材中に保持するようにして
いる。上記研摩板40の上部にはスライドベアリング4
2・・・が取付けられ、このスライドベアリング42・
・・にガイドシャフト43.43が挿入している。そし
て駆動体(図示せず)によシ研摩板40をガイドシャツ
) 4 、? 、 43に沿って往復移動せしめるよう
になっている。またこの装置には電解液供給装置が組込
まれ、電解液をポンプ40によシミ解研摩槽3ノ、電解
液槽39.研摩板41の電解液流通孔41a、電極35
の電解液流通孔35m及び研摩材33中を循環させるよ
うになっている。更に給電装置が組込まれ、電極35と
基板材34との間に電流を流すようになっていa0この
装置では、研摩砥粒を混入した電解複合研摩液を電解液
流通孔41 a 、 、? 5 mから研摩材33中に
入れ、所定時間保持し7た後、電解研摩槽31内に排出
する。この時、電解液を保持した研摩材33を基板材3
4に押し付けながら往復動させ、同時に電椋板35と基
板材34との間に基板材34を陽極として電流を流して
電解複合研摩を行なう。A soft porous synthetic resin abrasive material 33 is placed above the support base 32 to face the support base 32 and presses the substrate material 34 . An electrode plate 35 (cathode) is placed above the abrasive material 33.
are provided, and this electrode plate 35d electrolyte flow hole 35a...
* is formed in communication with the abrasive material 33. A flat polishing plate 41 is provided on the top of the electrode plate 35, and this polishing plate 41
The electrolyte flow holes 41a... are connected to the electrolyte flow holes 40.
It is formed in communication with h... These abrasive materials33.
The electrode plate 35 and the polishing plate 41 are integrally insulated and held by an insulating holder 36, and the insulating holder 26 prevents leakage current and retains the polishing liquid in the abrasive material. A slide bearing 4 is mounted on the top of the polishing plate 40.
2... is installed, and this slide bearing 42.
The guide shafts 43 and 43 are inserted into... Then, the abrasive plate 40 is guided by a driving body (not shown). , 43 to move back and forth. Further, an electrolytic solution supply device is incorporated in this device, and the electrolytic solution is pumped into the stain removal polishing tank 3, the electrolytic solution tank 39. Electrolyte flow hole 41a of polishing plate 41, electrode 35
The electrolyte solution is circulated through the abrasive material 33 and the electrolyte flow hole 35m. Furthermore, a power supply device is incorporated to pass a current between the electrode 35 and the substrate material 34. In this device, an electrolytic composite polishing solution mixed with abrasive grains is passed through the electrolyte distribution holes 41a, , ? It is put into the abrasive material 33 from a distance of 5 m, held for a predetermined period of time, and then discharged into the electrolytic polishing tank 31. At this time, the abrasive material 33 holding the electrolyte is transferred to the substrate material 3.
4, and at the same time, a current is applied between the plate 35 and the substrate material 34, with the substrate material 34 used as an anode, to perform electrolytic composite polishing.
(実施例) 次に本発明の実施例につき説明する。(Example) Next, examples of the present invention will be described.
第1図及び第2図に示す装置を用い、下記条件で電解複
合研摩を行った。Electrolytic composite polishing was performed using the apparatus shown in FIGS. 1 and 2 under the following conditions.
電解複合研摩条件
基板材 幅300咽 、厚さ0.3m表面あらさR,
0,26μm
材質 光輝焼鈍及び調質圧延をしたステンレス鋼研摩材
軟質多孔質合成樹脂(発泡ポリウレタン)研摩圧
力0.0051ψ/Crn2
電解液 組成 硝酸す) IJつ1,20011/
i研摩砥粒 材質 酸化クロム 粒径 0.58m
混入割合 20 El/l!
電解電流密度 0.2A、7cm”
砥粒擦過速度 2m/see
研摩時間 60秒/ldm”
上述した研摩条件で研摩した後、基板材表面の表面あら
さを測定した結果R,0,06μmと著しく平滑と々っ
ていた。Electrolytic composite polishing conditions Substrate material Width 300mm, thickness 0.3m Surface roughness R,
0.26μm Material Bright annealed and temper rolled stainless steel abrasive Soft porous synthetic resin (foamed polyurethane) Polishing pressure 0.0051ψ/Crn2 Electrolyte Composition Nitric acid) IJ 1,20011/
i Polishing abrasive grain Material Chromium oxide Particle size 0.58m
Mixing ratio 20 El/l! Electrolytic current density 0.2A, 7cm" Abrasive grain rubbing speed 2m/see Polishing time 60 seconds/ldm" After polishing under the above-mentioned polishing conditions, the surface roughness of the substrate material surface was measured and was extremely smooth with R of 0.06μm. It was amazing.
同様に第3図及び第4図に示す装置、第5図及び第6図
に示す装置及び第7図乃至第9図に示す装置を用いて、
同じ研摩条件で電解複合研摩を行った。その結果、前述
の実施例と同様基−板材表面が著しく平滑なものとなっ
た。Similarly, using the devices shown in FIGS. 3 and 4, the devices shown in FIGS. 5 and 6, and the devices shown in FIGS. 7 to 9,
Electrolytic composite polishing was performed under the same polishing conditions. As a result, the surface of the substrate material became extremely smooth, similar to the previous example.
(発明の効果)
以上詳述したように本発明によれば、軟質多孔質合成樹
脂の研摩材に電解液を含浸させた状態で電解複合研摩す
るので、低研摩圧力、低電流密度として研摩てき、研摩
材及び研摩砥粒の消耗を防ぎ、研摩コストを下げること
ができる。(Effects of the Invention) As described in detail above, according to the present invention, electrolytic composite polishing is performed in a state where the soft porous synthetic resin abrasive is impregnated with an electrolytic solution. , it is possible to prevent consumption of abrasive materials and abrasive grains, and reduce polishing costs.
第1図は本発明装置の一例を示す断面図、第2図は第1
図の■−■線に沿って見た図、第3図は本発明装置の他
の例を示す断面図、第4図は第3図の■−IV線に沿う
断面図、第5図は本発明装置の更に異なる装置の一例を
示す断面図第6図は第5図の■−■線に沿う断9面図、
第7図は本発明装置の別の例を示す断面図、第8図は同
装置の研摩板、電極及び研摩材の断面図、第9図は同装
置の平面図である。
1.11,21,31・・・電解研摩槽、11a。
21 a ・・−円筒カバー、2 、12 、22 、
32−・・基板材支持台、12a・・・断面円弧状凹部
、3゜13.23□ 、23□、33・・・軟質多孔質
合成樹脂研摩材、4,14,24,34・・・ステンレ
ス鋼基板材、5,35・・・電極板、15,251゜2
5、・・・回転電極、5a・・・電解液供給溝、35a
・・・電解液流通孔、6 、16 、261.? 6・
・・絶縁保持体、7・・・回転軸、7a・・・液路、I
I、18゜28・・・給電ブラシ、9,29.39・・
・電解液槽、10 、 、? 0 、40 、、、ポン
プ、30a1,301L2・・・ノズル、41・・・研
摩板、41a・・・常、f@液流通孔、42・・・スラ
イPベアリング、43・・・ガイドシャフト。FIG. 1 is a sectional view showing an example of the device of the present invention, and FIG.
FIG. 3 is a cross-sectional view showing another example of the device of the present invention, FIG. 4 is a cross-sectional view taken along line ■-IV in FIG. 3, and FIG. A cross-sectional view showing an example of a further different device of the present invention; FIG. 6 is a cross-sectional view taken along line ■-■ in FIG.
FIG. 7 is a sectional view showing another example of the apparatus of the present invention, FIG. 8 is a sectional view of the abrasive plate, electrode, and abrasive material of the same apparatus, and FIG. 9 is a plan view of the same apparatus. 1.11, 21, 31... Electrolytic polishing tank, 11a. 21a...-cylindrical cover, 2, 12, 22,
32-... Substrate material support stand, 12a... Arc-shaped recess in cross section, 3°13.23□, 23□, 33... Soft porous synthetic resin abrasive material, 4, 14, 24, 34... Stainless steel substrate material, 5,35...electrode plate, 15,251°2
5. Rotating electrode, 5a... Electrolyte supply groove, 35a
... Electrolyte flow hole, 6, 16, 261. ? 6.
...Insulation holder, 7...Rotating shaft, 7a...Liquid path, I
I, 18°28... Power supply brush, 9,29.39...
・Electrolyte tank, 10, ,? 0 , 40 , , Pump, 30a1, 301L2... Nozzle, 41... Grinding plate, 41a... Constant, f @ liquid flow hole, 42... Sly P bearing, 43... Guide shaft.
Claims (5)
、中性塩溶液に研摩砥粒を混入した研摩電解液を、軟質
多孔質合成樹脂からなる研摩材に含浸せしめながら、研
摩圧力0.02kg/cm^2以下、電解電流密度0.
5A/cm^2以下で電解複合研摩することを特徴とす
るステンレス鋼の鏡面研摩方法。(1) When electrolytically composite polishing a stainless steel substrate material, an abrasive material made of soft porous synthetic resin is impregnated with a polishing electrolyte containing abrasive grains mixed in a neutral salt solution, and a polishing pressure of 0.02 kg is applied. /cm^2 or less, electrolytic current density 0.
A method for mirror polishing stainless steel, characterized by electrolytic composite polishing at 5 A/cm^2 or less.
板材支持台と、この支持台の上方に対向して配置された
軟質多孔質合成樹脂研摩材と、この研摩材の上部に設け
られ電解液供給溝を形成した電極板と、この電極板及び
研摩材を絶縁保持する保持体と、この保持体を回転駆動
して上記研摩材が上記支持台に載せたステンレス鋼製基
板材に対して摺動しながら回転するようにした駆動体と
、上記電極板の電解液供給溝から研摩材を通って上記基
板材に研摩砥粒を含む研摩電解液を供給する供給装置と
、上記電極板と上記基板材との間に給電する給電装置と
を具備してなるステンレス鋼の鏡面研摩装置。(2) An electrolytic polishing tank, a substrate material support placed in the electrolytic polishing tank, a soft porous synthetic resin abrasive placed oppositely above the support, and an upper part of the abrasive. An electrode plate provided with an electrolyte supply groove, a holder for insulating and holding the electrode plate and the abrasive material, and a stainless steel substrate material on which the abrasive material is placed on the support base by rotationally driving the holder. a driving body configured to rotate while sliding against the electrode plate; a supply device that supplies a polishing electrolyte containing abrasive grains to the substrate material from the electrolyte supply groove of the electrode plate through the abrasive material; A stainless steel mirror polishing device comprising a power supply device that supplies power between an electrode plate and the substrate material.
、この電解研摩槽内に配置され上面に断面円弧状凹部を
形成した基板材支持台と、この支持台の上方に配置され
た円筒状回転電極と、この電極の外周面に被覆されその
下部が上記支持台の凹部に対向する軟質多孔質合成樹脂
研摩材と、上記回転電極を回転駆動して上記研摩材が上
記支持台上にあるステンレス鋼製基板材に対して摺動し
ながら回転するようにした駆動体と、上記電極と基板材
との間に給電する給電装置とを具備してなるステンレス
鋼の鏡面研摩装置。(3) An electrolytic polishing tank containing a polishing electrolyte containing polishing abrasive grains, a substrate material support placed within the electrolytic polishing tank and having a concave portion with an arcuate cross section on its upper surface, and an electrolytic polishing tank placed above the support. a cylindrical rotating electrode; a soft porous synthetic resin abrasive material coated on the outer circumferential surface of the electrode and whose lower part faces the recess of the support base; A mirror polishing apparatus for stainless steel, comprising: a driving body that rotates while sliding against an upper stainless steel substrate; and a power supply device that supplies power between the electrode and the substrate.
板材支持台と、この支持台の上方に配置された1対の円
筒状回転電極と、これら電極の外周面に被覆されその下
部が上記支持台に対向する軟質多孔質合成樹脂研摩材と
、上記回転電極を回転駆動して上記研摩材が上記支持台
上にあるステンレス鋼製基板材に対して摺動しながら回
転するようにした駆動体と、上記研摩材と基板材との間
に研摩砥粒を含む研摩電解液を噴出するノズルと、上記
回転電極と基板材との間に給電する給電装置と、を具備
してなるステンレス鋼の鏡面研摩装置。(4) An electrolytic polishing tank, a substrate material support placed in the electrolytic polishing tank, a pair of cylindrical rotating electrodes placed above the support, and A soft porous synthetic resin abrasive material whose lower part faces the support base, and the rotary electrode are rotationally driven so that the abrasive material rotates while sliding against the stainless steel substrate material located on the support base. a drive body made of a metal powder, a nozzle that spouts a polishing electrolyte containing abrasive grains between the abrasive material and the substrate material, and a power supply device that supplies power between the rotating electrode and the substrate material. Stainless steel mirror polishing equipment.
板材支持台と、この支持台の上方に対向して配置された
軟質多孔質合成樹脂研摩材と、この研摩材の上部に設け
られ電解液流通孔を形成した電極板と、この電極板の上
部に設けられ電解液流通孔を形成した研摩板と、上記研
摩材、電極板及び研摩板を絶縁保持する保持体と、上記
研摩板を往復駆動して上記研摩材が上記支持台に載せた
ステンレス鋼製基板材に対して摺動しながら往復動する
ようにした駆動体と、研摩砥粒を含む研摩電解液を研摩
板の電解液流通孔及び電極板の電解液流通孔及び研摩材
を通って上記基板材に供給する供給装置と、上記電極板
と上記基板材との間に給電する給電装置とを具備してな
るステンレス鋼の鏡面研摩装置。(5) An electrolytic polishing tank, a substrate material support placed in the electrolytic polishing tank, a soft porous synthetic resin abrasive placed oppositely above the support, and an upper part of the abrasive. an electrode plate provided with an electrolyte flow hole formed therein; an abrasive plate provided on the upper part of the electrode plate and formed with an electrolyte flow hole; a holder for insulating and holding the abrasive material, the electrode plate, and the abrasive plate; A driving body that reciprocates the abrasive plate so that the abrasive material slides and reciprocates against the stainless steel substrate material placed on the support base; a supply device that supplies the substrate material through the electrolyte distribution hole of the electrode plate, the electrolyte distribution hole of the electrode plate, and the abrasive material, and a power supply device that supplies power between the electrode plate and the substrate material. Stainless steel mirror polishing equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15212784A JPS6130328A (en) | 1984-07-24 | 1984-07-24 | Method and device for mirror surface like polishing stainless steel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15212784A JPS6130328A (en) | 1984-07-24 | 1984-07-24 | Method and device for mirror surface like polishing stainless steel |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6130328A true JPS6130328A (en) | 1986-02-12 |
Family
ID=15533648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15212784A Pending JPS6130328A (en) | 1984-07-24 | 1984-07-24 | Method and device for mirror surface like polishing stainless steel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6130328A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07241728A (en) * | 1994-03-04 | 1995-09-19 | Agency Of Ind Science & Technol | Electrolytic abrasive grain polishing method for stainless steel |
WO2003090964A1 (en) * | 2002-04-23 | 2003-11-06 | Sony Corporation | Polishing system and polishing method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5819409A (en) * | 1981-07-25 | 1983-02-04 | Sumitomo Electric Ind Ltd | Manufacture of isotropic mn-al-c magnet |
-
1984
- 1984-07-24 JP JP15212784A patent/JPS6130328A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5819409A (en) * | 1981-07-25 | 1983-02-04 | Sumitomo Electric Ind Ltd | Manufacture of isotropic mn-al-c magnet |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07241728A (en) * | 1994-03-04 | 1995-09-19 | Agency Of Ind Science & Technol | Electrolytic abrasive grain polishing method for stainless steel |
WO2003090964A1 (en) * | 2002-04-23 | 2003-11-06 | Sony Corporation | Polishing system and polishing method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4140598A (en) | Mirror finishing | |
US7655565B2 (en) | Electroprocessing profile control | |
US7566385B2 (en) | Apparatus adapted for membrane-mediated electropolishing | |
US20040266327A1 (en) | Conductive polishing article for electrochemical mechanical polishing | |
EP1381491B1 (en) | Conductive polishing article for electrochemical mechanical polishing | |
US20030213703A1 (en) | Method and apparatus for substrate polishing | |
KR101192157B1 (en) | Polishing roller apparatus for display panel, semiconductor substrate, etc. | |
US7311592B2 (en) | Conductive polishing article for electrochemical mechanical polishing | |
JPH05277914A (en) | Flat plate polishing method and its device | |
US6284114B1 (en) | Method of fabricating a porous polymeric material by electrophoretic deposition | |
WO2009150885A1 (en) | Stainless steel and surface treatment method for stainless steel | |
JPS6130328A (en) | Method and device for mirror surface like polishing stainless steel | |
US20070099552A1 (en) | Conductive pad with ion exchange membrane for electrochemical mechanical polishing | |
JP4878159B2 (en) | Rotational surface reduction head, electrolytic surface reduction device, and electrolytic surface reduction method | |
KR20010089212A (en) | Removable electrode | |
JP2000158328A (en) | System and method for electro-chemical and mechanical polishing for magnetic board | |
JP2008062324A (en) | Polishing pad and plating pad | |
JP2950064B2 (en) | Electrolytic dressing type grinding machine | |
JPS5914111Y2 (en) | Electrolytic buffing compound polishing device | |
JPH11144240A (en) | Electrolytic texturing method and electrolytic slurry liquid | |
US20030006146A1 (en) | Method for machining micro grooves of dynamic pressure pneumatic bearing | |
US20070215488A1 (en) | Methods and apparatus for electroprocessing with recessed bias contact | |
KR100445462B1 (en) | Electropolishing Apparatus for Corrugated Membrane | |
JPH04111776A (en) | Porous multilayer electrodeposition grindstone and manufacture thereof | |
CN111958478A (en) | Bearing roller ELID grinding device based on active control of oxide film state |