JPS6130293U - electronic circuit equipment - Google Patents

electronic circuit equipment

Info

Publication number
JPS6130293U
JPS6130293U JP11392984U JP11392984U JPS6130293U JP S6130293 U JPS6130293 U JP S6130293U JP 11392984 U JP11392984 U JP 11392984U JP 11392984 U JP11392984 U JP 11392984U JP S6130293 U JPS6130293 U JP S6130293U
Authority
JP
Japan
Prior art keywords
electronic circuit
circuit equipment
metal case
circuit device
block metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11392984U
Other languages
Japanese (ja)
Inventor
興 川目
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP11392984U priority Critical patent/JPS6130293U/en
Publication of JPS6130293U publication Critical patent/JPS6130293U/en
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,bは従来装置の斜視図及び回路基板の平面図
、第2図a, bは本考案の一実施例構造を示す斜視図
及び同a図A−A’断面図、第3図は従来装置及び本案
装置の温度上昇値と通電電流の関係を示す特性図である
。 因において1は回路基板、2はケース、2aは翼部、2
cは突起、3は封止樹脂である。
Figures 1a and b are a perspective view of a conventional device and a plan view of a circuit board; Figures 2a and b are a perspective view and a cross-sectional view taken along line A-A' of Figure 2a showing the structure of an embodiment of the present invention; The figure is a characteristic diagram showing the relationship between the temperature rise value and the current flowing in the conventional device and the device of the present invention. In the example, 1 is a circuit board, 2 is a case, 2a is a wing part, 2
c is a protrusion, and 3 is a sealing resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子回路部品を搭載した基板を塊状金属ケースに収容し
、これを樹脂封止してなる電子回路装置において、前記
塊状金属ケースの周表面に独立し−た複数個の突起を不
連統状に配設せしめたことを特徴とする電子回路装置。
In an electronic circuit device in which a board on which electronic circuit components are mounted is housed in a block metal case and this is sealed with resin, a plurality of independent protrusions are disposed on the circumferential surface of the block metal case in a discontinuous manner. An electronic circuit device characterized in that:
JP11392984U 1984-07-26 1984-07-26 electronic circuit equipment Pending JPS6130293U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11392984U JPS6130293U (en) 1984-07-26 1984-07-26 electronic circuit equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11392984U JPS6130293U (en) 1984-07-26 1984-07-26 electronic circuit equipment

Publications (1)

Publication Number Publication Date
JPS6130293U true JPS6130293U (en) 1986-02-24

Family

ID=30672955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11392984U Pending JPS6130293U (en) 1984-07-26 1984-07-26 electronic circuit equipment

Country Status (1)

Country Link
JP (1) JPS6130293U (en)

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