JPS61296974A - セラミツク粒子分散金属複合層の形成方法 - Google Patents
セラミツク粒子分散金属複合層の形成方法Info
- Publication number
- JPS61296974A JPS61296974A JP60137489A JP13748985A JPS61296974A JP S61296974 A JPS61296974 A JP S61296974A JP 60137489 A JP60137489 A JP 60137489A JP 13748985 A JP13748985 A JP 13748985A JP S61296974 A JPS61296974 A JP S61296974A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- dispersed
- composite layer
- metal material
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Laser Beam Processing (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60137489A JPS61296974A (ja) | 1985-06-24 | 1985-06-24 | セラミツク粒子分散金属複合層の形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60137489A JPS61296974A (ja) | 1985-06-24 | 1985-06-24 | セラミツク粒子分散金属複合層の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61296974A true JPS61296974A (ja) | 1986-12-27 |
JPH0585272B2 JPH0585272B2 (de) | 1993-12-06 |
Family
ID=15199840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60137489A Granted JPS61296974A (ja) | 1985-06-24 | 1985-06-24 | セラミツク粒子分散金属複合層の形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61296974A (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH035085A (ja) * | 1989-06-01 | 1991-01-10 | Smc Corp | 電子ビーム溶接面の表面処理方法 |
JP2018015878A (ja) * | 2016-07-29 | 2018-02-01 | 三菱マテリアル株式会社 | 複合部材およびこれからなる切削工具 |
-
1985
- 1985-06-24 JP JP60137489A patent/JPS61296974A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH035085A (ja) * | 1989-06-01 | 1991-01-10 | Smc Corp | 電子ビーム溶接面の表面処理方法 |
JP2018015878A (ja) * | 2016-07-29 | 2018-02-01 | 三菱マテリアル株式会社 | 複合部材およびこれからなる切削工具 |
Also Published As
Publication number | Publication date |
---|---|
JPH0585272B2 (de) | 1993-12-06 |
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