JPS6129186A - Photoelectronic device with optical fiber and manufacture thereof - Google Patents

Abstract

PURPOSE:To enhance the reliability of coupling an optical fiber with the optical axis of a laser chip by passing the inner end of a fiber guide into the inserting hole of a stationary post, and securing to the post through a bonding material filled in the hole. CONSTITUTION:A cylindrical fiber guide 12 made of kovar is passed to the peripheral wall of a stem 2, and hermetically secured to the stem 2 by a brazing material 13. Part of an optical fiber cable 4 is inserted into the guide 12. The inner end of the guide 12 is inserted into the inserting hole 20 of a stationary post 19 made of kovar secured to the stem 2. A brazing material 12 is filled in the hole 20, and the guide 12 and a fiber body 18 are secured. Thus, the end of the body 18 is not varied at the position with respect to a laser chip 7, but always maintained in a preferably optical axis matched state.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an optoelectronic device with an optical fiber and a method for manufacturing the same.

[Background technology]

As one of the original communication light sources, for example, Hitachi Hyoron, published by Hitachi Hyoronsha, VO1, 65, /1610 (1983).

A communication laser module (semiconductor laser device) has been developed, as introduced in the document titled 7-Optical Semiconductor Laser for Communication by Hiraya et al. on pages 39 to 44. This semiconductor laser device is assembled in a so-called direct opposition method in which the tip of the original fiber opposes the resonator end face (light emitting surface) of the semiconductor laser element, and is provided as a flat module with a box-shaped pancage. This semiconductor laser device has a package structure in which the center of the main surface of a metal stem is sealed with a cap made of a metal plate.
Inside the package there is a semiconductor laser element (laser chip) and a light receiving element (for example, InGa
It has a built-in AsP PIN photodiode.

By the way, the communication laser module exhibits sufficient functions as a semiconductor laser device for communication, but like any other device, higher performance and improvement in manufacturing yield are required.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide an optical fiber-equipped optoelectronic device in which the optical axis of an optical fiber and a laser chip is coupled with high reliability.

Another object of the present invention is to provide an optical fiber-equipped optoelectronic device with excellent airtightness.

Another object of the present invention is to provide a method of manufacturing an optical fiber-attached electronic device that allows accurate and easy alignment of the optical fiber and laser chip.

Another object of the present invention is to provide a method for manufacturing an optoelectronic device with an optical fiber, which allows attachment of an optical fiber without applying high heat to the laser chip.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, in manufacturing the optoelectronic device with an optical fiber of the present invention, a fixing post having an insertion hole in advance on the main surface of the stem is fixed at a position facing the laser chip, and a fiber guide is inserted into the peripheral wall of the stem. When fixing, a cylindrical sleeve with a thin tip of the fiber guide is inserted into the insertion hole of the fixing post, and then the optical fiber with the jacket removed from the tip is inserted into the fiber guide. Then, the jacket part is temporarily caulked, and the tip protrudes from the inner end of the fiber guide to face the laser chip. Then,
The sleeve portion of the fiber guide is bent to align the original axes of the original fiber and the laser chip, and in this state, the insertion hole of the fixing post is filled with solder to fix the original fiber and the fiber guide. Since no equivalent external force is applied to the fixing post when fixing the fiber guide etc., no residual stress exists. Therefore, even if a heating test is performed during screening or the like, the fixed post will not be deformed due to residual stress, and the optical coupling efficiency will not change, making it possible to provide a highly reliable optoelectronic device with optical fiber. can.

〔Example〕

FIG. 1 is a sectional view showing the main parts of an optoelectronic device with an optical fiber according to an embodiment of the present invention, FIG. 2 is a perspective view showing the entire original optoelectronic device with an optical fiber, and FIG. FIG. 3 is a cross-sectional view showing a fixed state of the fiber.

Optoelectronic device with optical fiber (semiconductor laser device) of the present invention
As shown in FIG. 2, the package 1 is a flat module, and the package 1 includes a box-shaped metal stem 2 (made of evacovar) in which each component is assembled into a recess on its main surface, and a stem 2 that is made of box-shaped metal (ebarcovar). It is formed by a metal camp 3 that closes the hollow part. This package 1 includes one optical fiber cable 4 and a total of four pairs of cables.
The structure has a prominent dot 5. Note that mounting holes 6 are provided at the four corners of the stem 1.

A laser chip 7 is fixed to the center of the hollow bottom of the stem 2. This laser chip 7 is fixed to the stem 2 via a conductive support piece 8.

On this supporting piece 8, in addition to the laser chip 7, a pedestal 9 is fixed. This pedestal 9 is a small piece on which a wire is stretched during a characteristic test performed before attaching the laser chip 7 to the stem 2, and is made of an insulator with a conductive layer on its surface. Therefore, this supporting piece 8
becomes unnecessary once it is fixed to the stem 2. Further, as shown in FIG. 1, the supporting piece 8 is fixed to the stem 2 by a solder material 10, and the laser chip 7 is fixed onto this supporting piece 8 by a solder material 11.

Further, a cylindrical fiber guide 12 made of Kovar passes through the peripheral wall of the stem 2 and is fixed to the stem 2 in an airtight manner with a brazing material 13. This fiber guide 12 has a long sleeve 14 inserted into the stem 2. A large diameter stopper 15 that comes into contact with the side surface of the stem 2. Stopper 15
16. Note that the sleeve 14 has an outer diameter of, for example, 0.
4111° inner diameter is 0.2 II. and,
A part of the optical fiber cable 4 is inserted into this fiber guide 12, as shown in FIG. This insertion part includes a part with a jacket 17 attached, and an original fiber part (hereinafter referred to as the fiber body 18) consisting of a core and a cladding from which the jacket 17 is removed from the tip.
It consists of. Although not shown, the tip of the fiber body 18 is formed into a conical shape, and the core of the tip faces the end surface (light emitting surface) of one of the resonators of the laser chip 7, so that light is emitted from the laser chip 7 (not shown). It is a trap to capture laser light into the core.

On the other hand, the inner end portion of the fiber guide 12 has an insertion hole 2 of a fixed boss 19 made of Kovar fixed to the stem 2.
It is inserted into 0. The inner end of the fiber guide 12 enters approximately to the center of the insertion hole 20, and the fiber main body 18 extending inside the fiber guide 12 protrudes from the fiber guide 12 and the insertion hole 20. The insertion hole 20 is filled with a solder material 21 such as solder, and the fiber guide 12 and the fiber main body 18 are fixed thereto. As a result, the fiber body 1
The position of the tip 8 does not change with respect to the laser chip 7, and a good optical axis alignment state is always maintained. Further, the fiber guide 12 is hermetically fixed to the stem 2 via a solder material 13 on the outside, and the inside is secured to the stem 2 through a solder material 13.
1, the fiber guide 12 is hermetically sealed.

On the other hand, the fiber guide 2 located on the opposite side of the fiber guide 12
A block 22 made of ceramic is attached to the inner end of the book glue portion 5. The lead 5 is connected to the block 22
conductor layer 23,24 extending from the main surface to the side surface thereof;
A solder material 25 such as solder is used to connect a portion of the wire. A light-receiving element 26 is fixed to one of the conductor layers 23, and the other end of a wire 27, one end of which is connected to the electrode of the light-receiving element 26, is connected to the other conductor layer 24. Therefore, these pair of leads 5 serve as output terminals of the light receiving element 26. Incidentally, these pair of glueds 5 are fixed to the stem 2 via an insulator 28.

Also, one lead 5 for the laser chip 7 is fixed to the stem 2 through an insulator 28 in the same manner as the lead 5, and is fixed to the surface electrode of the laser chip 70 via a wire 29. Also, some other glue for laser chip 7 5
is directly fixed to the stem 2. This lead 5 is
Stem 2. It is electrically connected to the lower electrode of the laser chip 7 via the support piece 8 . Therefore, when a predetermined voltage is applied between the pair of leads 5, laser light is emitted from the light emitting surfaces at both ends of the laser chip 70.

Here, a method for fixing the fiber guide 12 and the original fiber cable 4 will be explained. Before fixing the optical fiber cable 4, as shown in FIG.
The inserted portion with the stem 2 is hermetically fixed with a solder material 13. At this time, the tip of the sleeve 14 is inserted to approximately the middle of the insertion hole 20 of the fixed boss 19. In this state, the sleeve 14 is not in contact with the inner peripheral surface of the insertion hole 2o.

Next, a support piece 8 to which a laser chip 7 is fixed is fixed to the stem 2.

After that, the optical fiber cable 4 is inserted from the outside of the package 1.
is inserted into the fiber guide 12.

At this time, in the optical fiber cable 4, the crimped portion 1
The jacket 17 is removed from the tip end portion deeper than 6, and the fiber body 18 is exposed. Then, the tip of the fiber body 18 passes through the sleeve 14 and protrudes to a position several tens of micrometers from the light emitting surface of the laser chip 70. Further, a metallized layer is provided on the exposed surface of the fiber main body 180. This is the fixed boss 19 which will be described later.
This is to promote the bonding between the fiber body 18 and the fiber body 18 by the solder material 21.

Next, the caulked portion 16 of the fiber guide 12 is caulked, the jacket 17 portion of the original fiber cable 4 is crushed, and the original fiber cable 4 is temporarily fixed to the fiber guide 12.

In addition, the sleeve 14 protruding inside the stem 2 is moved vertically and horizontally so that the optical axis of the tip of the fiber body 18 and the optical axis of the laser beam emitted from the resonator of the laser chip 7 coincide. Be manipulated.

Since the sleeve 14 has a thin cylindrical shape, it can be easily deformed. At this time, since no equivalent external force is applied to the fixed boss 19, the fixed boss 19 does not deform during the deformation operation of the sleeve 14, and no residual stress is generated.

Next, apply a solder material 2 such as solder to the insertion hole 20 of the fixed boss 19.
1 to form the fiber guide 12 and the fiber body 1.
8 securely.

Such an optoelectronic device with an optical fiber (semiconductor laser device) emits laser light from the end face of the resonator of the laser chip 7 by applying a predetermined voltage between the pair of leads 5. Optical information by laser light is transmitted to a desired location using the original fiber cable 4 as a transmission medium. Further, the optical output of the laser beam is constantly monitored by the light receiving element 26 and controlled so that the optical output is constant.

〔effect〕

1. According to the present invention, once the optical axis of the laser beam emitted from the laser chip 7 and the optical axis of the optical fiber are set with high precision, the tip of the optical fiber is firmly fixed by the fixing post 19. Therefore, there is no reduction in optical coupling efficiency, and the effect of increasing reliability can be obtained.

In other words, since no external force is applied to the fixed post 19 that holds the tip of the original fiber during manufacturing, even if heat or the like is applied after the original fiber and the fixed post 19 are joined, the residual stress ( The position of the optical fiber tip no longer fluctuates, and the optical coupling efficiency can always be maintained at a high level.

2. According to the present invention, the outer side of the cylindrical fiber guide 12 is airtightly fixed to the stem 2 by the solder material 13, and the inner side is the solder material 21 loaded into the insertion hole 20 of the fixed boss 19. It is fixed to the fiber body 18 in an airtight manner by. Therefore, infiltration of moisture transmitted through the original fiber cable 4 can be reliably prevented. In addition, since the mounting parts of package 1 are sealed with insulators such as brazing material and glass, the airtightness inside package 1 is high, and chips such as laser chip 7 and light receiving element 26 are sealed. The reliability of corrosion resistance and the like is high, and the effect is that the reliability of optoelectronic devices with optical fibers can be improved.

3. In manufacturing the optoelectronic device with an optical fiber of the present invention, the optical axis alignment between the laser chip 7 and the fiber main body 18 can be performed by simply deforming the sleeve 14 in the fiber guide 12, making the process easy. , it is possible to achieve the effects of improving work efficiency and manufacturing yield.

4. In the production of the optoelectronic device with optical fiber of the present invention, the connection work of the fiber body 18 to the fixed post 19 is a so-called local work in which the insertion hole 20 of the fixed post 19 is filled with the solder material 21, so a laser that is sensitive to high heat is used. High heat does not act on the chip 7, resulting in the effect that the reliability of the original fiber optoelectronic device can be improved.

5. From 1 and 4 above, according to the present invention, a synergistic effect can be obtained in that an optoelectronic device with an optical fiber having high original coupling efficiency and low manufacturing cost can be provided at a low price.

Although the invention made by the present inventor has been specifically explained based on the examples above, the present invention is not limited to the above examples, and it is possible to make various changes without departing from the gist of the invention. Not even. For example, as shown in FIG. 4, the sleeve 14 and the fiber body 18 are connected to the fixed post 19 by melting the solder 30 in the insertion hole 20 of the fixed post 19 while vibrating it with an ultrasonic vibrator 31. By loading the solder 30 into the fibers, bonding can be performed without using flux, so the process of rinsing off the flux after connecting the original fibers, which was conventionally required, can be eliminated, and manufacturing costs can be reduced. Note that in this case as well, similar to the embodiments described above, high heat is not applied to the laser chip 7, so that it is possible to prevent the characteristics of the laser chip 7 from deteriorating.

[Application field]

In the above explanation, the invention made by the present inventor was mainly applied to optical communication technology using semiconductor lasers, which is the background field of application, but the present invention is not limited to this. The present invention can be applied to optical communication technology using type light emitting diodes, optical integrated circuits (OEICs), etc., or measurement technology using light.

The present invention is applicable at least to light emitting electronic device technology incorporating optical fibers for light transmission.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing the main parts of an optoelectronic device with an optical fiber according to an embodiment of the present invention, FIG. 2 is a perspective view of the entire optoelectronic device with an optical fiber, and FIG. 3 is a diagram showing the original fiber guide and FIG. 4 is a sectional view showing a fixed state of the original fiber and a fiber guide according to another embodiment of the present invention. 1... Package, 2... Stem, 3... Cap, 4... Optical fiber cable, End... Lead, 6...
...Mounting hole, 7...Laser chip, 8...Support piece, 9...Pedestal, 10...Brazing material, 11...Brazing material, 12...Fiber guide, 13... Brazing material, 14
... Sleeve, 15... Stopper, 16... Caulking part, 17... Jacket, 18... Fiber body, 19... Fixed post, 2o... Insertion hole, 21...
... Brazing material, 22... Block, 23, 24... Conductor layer, 25... Soldering material, 26... Light receiving element, 27...
・Wire, 28... Insulator, 29... Wire, 30
... Solder, 31... Vibrator. Figure 1 Figure 2

Claims (1)

[Scope of Claims] 1. A package, a laser chip disposed within the package, a fiber guide attached to the peripheral wall of the package in a penetrating state, and an inner end inserted into the fiber guide with the laser chip disposed within the package. an optical fiber facing the light emitting surface of the optical fiber guide, the inner end portion of the fiber guide passing through an insertion hole of a fixed post fixed in the package, An optoelectronic device with an optical fiber, characterized in that it is fixed to a fixed post via a filled bonding material. 2. The optoelectronic device with optical fiber according to claim 1, wherein the package has an airtight structure. 3. Insert the sleeve portion of the fiber guide into one side wall of the package body provided with a fixing post having an insertion hole, insert the sleeve tip into the insertion hole, and securely fix the fiber guide to the package body. a step of inserting an optical fiber into the fiber guide and temporarily fixing the optical fiber to the fiber guide;
It is characterized by comprising the steps of bending the sleeve portion of the fiber guide to align the optical axes of the optical fiber and the laser chip, and loading a bonding material into the insertion hole to fix the optical fiber to the fixed post. A method for manufacturing an optoelectronic device with an optical fiber. 4. The optoelectronic device with an optical fiber according to claim 3, wherein the fixing post and the fiber guide are fixed by temporarily melting solder supplied to the fixing part by ultrasonic vibration. manufacturing method.