JPS61290743A - 半導体デバイスの冷却装置 - Google Patents

半導体デバイスの冷却装置

Info

Publication number
JPS61290743A
JPS61290743A JP60131717A JP13171785A JPS61290743A JP S61290743 A JPS61290743 A JP S61290743A JP 60131717 A JP60131717 A JP 60131717A JP 13171785 A JP13171785 A JP 13171785A JP S61290743 A JPS61290743 A JP S61290743A
Authority
JP
Japan
Prior art keywords
semiconductor chip
holes
semiconductor
thermally conductive
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60131717A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0573061B2 (enExample
Inventor
Keizo Kawamura
圭三 川村
Takahiro Oguro
崇弘 大黒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60131717A priority Critical patent/JPS61290743A/ja
Publication of JPS61290743A publication Critical patent/JPS61290743A/ja
Publication of JPH0573061B2 publication Critical patent/JPH0573061B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/774—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60131717A 1985-06-19 1985-06-19 半導体デバイスの冷却装置 Granted JPS61290743A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60131717A JPS61290743A (ja) 1985-06-19 1985-06-19 半導体デバイスの冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60131717A JPS61290743A (ja) 1985-06-19 1985-06-19 半導体デバイスの冷却装置

Publications (2)

Publication Number Publication Date
JPS61290743A true JPS61290743A (ja) 1986-12-20
JPH0573061B2 JPH0573061B2 (enExample) 1993-10-13

Family

ID=15064552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60131717A Granted JPS61290743A (ja) 1985-06-19 1985-06-19 半導体デバイスの冷却装置

Country Status (1)

Country Link
JP (1) JPS61290743A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010142333A1 (en) * 2009-06-10 2010-12-16 Robert Bosch Gmbh Cooling arrangement and method for assembling the cooling arrangement
WO2012123367A1 (de) * 2011-03-17 2012-09-20 Robert Bosch Gmbh Wärmeleitfolie für die entwärmung und fixierung elektronischer bauelemente
EP2428990A3 (en) * 2010-09-10 2013-11-27 Honeywell International Inc. Electrical component assembly for thermal transfer
JP2024059110A (ja) * 2022-10-05 2024-05-01 レノボ・シンガポール・プライベート・リミテッド 放熱構造、電子機器、および伝熱構造体

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010142333A1 (en) * 2009-06-10 2010-12-16 Robert Bosch Gmbh Cooling arrangement and method for assembling the cooling arrangement
EP2428990A3 (en) * 2010-09-10 2013-11-27 Honeywell International Inc. Electrical component assembly for thermal transfer
US8957316B2 (en) 2010-09-10 2015-02-17 Honeywell International Inc. Electrical component assembly for thermal transfer
WO2012123367A1 (de) * 2011-03-17 2012-09-20 Robert Bosch Gmbh Wärmeleitfolie für die entwärmung und fixierung elektronischer bauelemente
JP2024059110A (ja) * 2022-10-05 2024-05-01 レノボ・シンガポール・プライベート・リミテッド 放熱構造、電子機器、および伝熱構造体
US12557249B2 (en) 2022-10-05 2026-02-17 Lenovo (Singapore) Pte. Ltd. Heat radiation structure, electronic device, and heat transfer structure

Also Published As

Publication number Publication date
JPH0573061B2 (enExample) 1993-10-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term