JPS61276393A - Manufacture of printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION C) Industrial Field of Application This invention relates to a method for manufacturing a printed wiring board, and more specifically, to manufacturing a general-purpose printed circuit board on which printed wiring is performed to connect mutually adjacent through holes. The present invention relates to a method of manufacturing a desired printed wiring board by processing a general-purpose printed wiring board so that only the necessary parts of the printed wiring are brought into a conductive state.

(B) Conventional technology Conventionally, as shown in Fig. 7, the conventional method for manufacturing printed wiring boards involves cutting a copper-clad board into a size necessary to accommodate the intended electrical circuit, and then cutting the copper-clad board into a size necessary to accommodate the intended electrical circuit. A through hole is drilled to connect the electrical components of the circuit, the through hole is plated to form a through hole, and then masked and soldered or plated to form the printed wiring of the intended printed wiring board. After filling the holes, etching is performed, and the parts that will become connection terminals are plated, and then the cyst silk process and the external shape processing process are completed to manufacture the desired printed wiring board.

(C) Problems to be Solved by the Invention In general, the conventional method for manufacturing printed wiring boards starts with cutting a copper-clad board as shown in FIG. As shown in Figure 7, it has to be done by cutting the copper-clad board, and each printed wiring board required must be manufactured through the process shown in Figure 7, and since it is not possible to stock it, different printed wiring is required. It required a great deal of time and effort to quickly manufacture printed wiring boards, making it unsuitable. In particular, the process shown in FIG. 7 is required even for the quick production of a small amount of printed wiring boards, which requires a great deal of time and effort, making it unsuitable.

B) Means for Solving the Problems This invention is a process for manufacturing a general-purpose printed circuit board that has a plurality of through-holes in a lattice pattern and connects adjacent through-holes for printed wiring. It is characterized by the process of selecting through holes that will achieve the desired printed wiring connection state, and etching the parts that do not require conduction without masking, thereby making only the necessary parts conductive. It is an object of the present invention to solve the above-mentioned problems by providing a method for manufacturing a printed wiring board.

(E) Function In the present invention, first, a general-purpose printed circuit board is manufactured which has a plurality of through holes in a grid pattern and is printed with wiring so as to connect adjacent through holes. Next, the through-holes of this general-purpose printed circuit board are selected as necessary, and by etching without masking the parts that do not require conduction, the printed wiring is processed so that only the necessary parts of the printed wiring are in a conductive state, and the desired printed wiring is completed. Manufacture the substrate.

Therefore, even when manufacturing printed wiring boards with different printed wiring, the manufacturing time is short because it is processed from a general-purpose printed circuit board, and it can be manufactured easily. Similarly, printed wiring boards in small quantities can also be manufactured easily. can.

(g) Examples Below, Fig. 1 shows the general-purpose printed circuit board of the present invention, Fig. 2 shows the manufacturing process of the general-purpose printed circuit board, Fig. 3 (a) shows the surface pattern of the general-purpose printed board, FIG. 3(b) shows the back surface pattern; FIG. 4 shows the cutting part of the general-purpose printed circuit board; FIG. 5 shows the manufacturing process of the printed wiring board from the general-purpose printed circuit board; and FIG. 6 shows a part of the surface of the printed wiring board. The present invention will be described in detail with reference to FIG. 6(a) and FIG. 6(b) showing a partial back side of the printed wiring board.

(1) is a general-purpose printed circuit board, and (1) is a general-purpose printed circuit board (
1) is composed of a through hole (2), a pattern part (3), and a terminal part (not shown). In this embodiment, the through holes (2) are regularly bored in a grid pattern. The pattern portion (3) is provided so as to connect adjacent through holes (2) as shown in FIGS. 3(a) and 3(b). In this embodiment, the pattern portion (3) is formed on one surface of the general-purpose printed circuit board (1) with a pattern configuration that connects laterally adjacent through holes (2) in a grid pattern. A pattern connecting vertically adjacent through holes (2) is formed on the other surface of the general-purpose printed circuit board (1).

(4) is the cutting part, which is left when producing the intended printed circuit board from the general-purpose printed circuit board (1), when making the adjacent through holes (2) conductive with each other, and by etching when making them insulated. disconnect. In this embodiment, as shown in FIG. 4, by creating a pattern in which eight cut portions (4) are provided around one arbitrary through hole (2), more connections can be made. Further, the number of cut portions (4) around one through hole (2) may be changed by changing the configuration of the pattern of the pattern portion (3).

Next, a method for manufacturing the general-purpose printed circuit board (1) will be explained with reference to FIG.

Cut the copper-clad board to the desired size. By making this size match the size of the intended printed wiring board, it becomes possible to efficiently manufacture the general-purpose printed wiring board (1).

Next, a plurality of through holes in a grid pattern are bored on the cut copper-clad substrate. Next, a through hole (2 holes) is formed by applying solder plating or the like to the through hole, and the structure is plated so that copper is not etched.
As shown in Figure (b), the copper plating portions other than the pattern portions (3) where adjacent through holes (2) are connected are masked and then etched. Next, the terminal part (not shown) is plated, the cut part (4) is left, the other pattern part (3) is mask-resisted, the outer shape is processed, and a general-purpose printed circuit board (
1) Manufacture.

The process of manufacturing the intended printed wiring board (5) from the general-purpose printed board (1) manufactured as described above will be explained based on FIG. 5.

Select an arbitrary through hole (2) that will form the desired circuit pattern from the through holes (2) on the general-purpose printed circuit board (1) manufactured by the process shown in Fig. 2, and cut the cut portion (
By masking only the portions where 4) are conductive and then etching, it becomes possible to connect arbitrarily selected through holes 2 to the desired circuit pattern, as shown in Figure 6(a). ), a printed wiring board (5) with the intended circuit pattern as shown in FIG.
) is manufactured.

Therefore, for printed wiring boards of any circuit pattern, by manufacturing a large number of general-purpose printed circuit boards (1) in advance, masking the conductive parts of the cut portions (4) as shown in FIG. It can then be manufactured by etching.

(G) Effects of the Invention Accordingly, in the present invention, by manufacturing a general-purpose printed circuit board in advance, any printed wiring board can be etched using a small process of masking and etching as shown in Fig. 5, based on a general-purpose printed circuit board. Since it can be manufactured, manufacturing time can be shortened. Furthermore, small quantities of printed wiring boards can be manufactured easily and in a short time.

[Brief explanation of drawings]

FIG. 1 is a surface view of a general-purpose printed circuit board according to an embodiment of the present invention, and FIG. 2 shows the manufacturing process of the general-purpose printed circuit board. Third
FIG. 3(a) shows the front surface pattern of the general-purpose printed circuit board of this embodiment, and FIG. 3(b) similarly shows the back surface pattern of the general-purpose printed circuit board. FIG. 4 shows a cutting section of the general-purpose printed circuit board, and FIG. 5 shows the manufacturing process of a printed wiring board from the general-purpose printed circuit board of this embodiment. FIG. 6(a) shows a part of the front surface of the printed wiring board of this embodiment, and FIG. 6(b) shows a part of the back surface of the printed wiring board. FIG. 7 is a process diagram of a conventional printed wiring board manufacturing method. l... General purpose printed circuit board 2... Through hole 3... Pattern section 4... Cutting section 5... Printed wiring board patent applicant
Naiko Electronics Co., Ltd. Representative Patent Attorney Masaru Yasuhara 2nd Masayoshi Yasuhara 7th
figure

Claims (1)

[Claims] The process of manufacturing a general-purpose printed circuit board that has a plurality of through-holes in a grid pattern and connects adjacent through-holes to print wiring; A method for manufacturing a printed wiring board, comprising the steps of selecting through holes and etching without masking areas that do not require conduction, thereby making only necessary areas conductive.