JPS61268100A - Heat radiating frame structural body - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] 11 Retired Emperor ■And Min! The present invention relates to a heat radiation frame structure in a circuit device such as a ballast for a discharge lamp.

Conventionally, a leaky transformer has been used as a ballast for a discharge lamp, and this transformer is installed together with the discharge lamp at a location such as an iron pole where the discharge lamp is installed. However, the above-mentioned leaky transformer is quite heavy and often difficult to install, so in recent years efforts have been made to make the ballast smaller and lighter by making it an electronic device using semiconductors. .

By the way, when converting a ballast for a discharge lamp into an electronic device, it is necessary to add a heat dissipation part because the semiconductor becomes a heat source due to its thermal loss. Therefore, the heat dissipation section is generally a heat dissipation plate made of a good heat conductive material such as aluminum attached to the semiconductor as a heat generating element, and the larger the heat dissipation plate, the greater the heat dissipation effect. Similarly, when a semiconductor is attached to an insulating substrate and a heat sink is attached, if the heat sink is large, the device will be large, and if the heat sink is small, sufficient heat dissipation effect may not be obtained, or during use. Is there a sufficient distance between the high voltage terminals of the ballast to prevent discharge between the terminals? There is a need. At this time,
Increasing this distance also increases the size of the device, so the distance must be kept to the minimum necessary when designing the device.

According to the present invention, two chassis parts made of a good heat conductive material are brought into contact with each other to form a closed frame, and an electronic component that generates heat is attached across each of the chassis parts in the abutting parts. This is a heat dissipation base frame structure in which other parts are assembled inside a frame body formed by integrating chassis parts. This structure is a heat dissipating base frame structure characterized by having a heat dissipating assembly structure that is housed in close contact with an outer case that accommodates the structure as needed, and an outer case that fits the assembly.

A semiconductor as a heating element is directly attached to a frame-shaped chassis made of two parts made of a high heat conductive material in a closed loop, and heat is radiated through the frame.

An embodiment of the present invention will be described below with reference to FIGS. 1 to 4 regarding a lighting circuit device for a neon lamp. first,
In FIGS. 1 and 2, (la) and (lb) are materials with good thermal conductivity, such as aluminum.

Two frame-shaped chassis parts made of RAM, (2) is a semiconductor that becomes a heating element, (3) is a high-voltage terminal board for relay, (4)
is a transformer, (5) is a capacitor, (6) is a variable resistor for adjustment, and (7) is a printed circuit board on which electronic components such as the transformer (4), capacitor (5), and variable resistor (6) are assembled. , (8) has two chassis parts (
(9) is a fuse holder, (10) is a bushing for pulling out the cord (11), and (12) is a prismatic external case.

The two chassis parts (la) and (lb) are frame bodies having the same shape and having a rectangular cross section.
a) (lb) are vertically symmetrical. Therefore, two chassis parts (la') can be made using the same mold.
(lb) and can reduce costs. Then, as shown in Figure 3, each chassis component (
When la) (lb) are butted together to form a closed frame, an integrated chassis (1) is formed. Here, the semiconductor (2) and the fuse holder (9) are mounted across the chassis parts (la) and (lb) at the abutting parts, that is, the joint parts, of the chassis parts (la) and (lb), and the printed circuit board (7 ) to each chassis part (la) (lb
) by installing it across the chassis (
1) (see Figure 3), that is, the semiconductor (2), which becomes a heat generating body due to thermal loss, is directly attached to the chassis (1) made of a good heat conductive material, so the integrated chassis ( 1) serves as a heat dissipation plate, and since the chassis (1) is sufficiently large compared to the semiconductor (2), the heat dissipation effect is also high.

The relay high voltage terminal board (3) is a terminal board that relays the lead (13) (see Figure 1) pulled out from the top of the transformer (4) and the cord (11). A lead (not shown) and a cord (11) drawn out from the board are relayed on a printed circuit board (7). At this time, each relay terminal (not shown) of the upper and lower leads of the transformer (4)
The solder is exposed and there is no insulating coating, and the voltage between each relay terminal is high. Therefore, the upper relay terminal, which has a high potential with respect to the lower relay terminal, is placed at a distance sufficient to prevent discharge from occurring on the printed circuit board ( The width and mounting position of the high-voltage terminal plate (3) are determined to maintain the same distance from the side chassis parts (la) and (lb), and Attach the high voltage terminal board (3) to 1).

That is, according to the above embodiment, parts other than electronic parts to be assembled on the printed circuit board (7), such as the transformer (4), capacitor (5), variable resistor (6), etc., namely, the semiconductor (2), and the relay high voltage The terminal board (3), fuse holder (9), bushing (10), mounting bracket (8), etc., and the ground terminal (not shown) are attached to the frame-shaped chassis (1), which also serves as a heat sink, so they can be miniaturized. enable.

Then, as shown in FIG. 3, if the integrated chassis (1) of the frame body in which the above-mentioned parts are assembled is fitted and attached to the external case (12) as shown in FIG.
). At this time, the integrated chassis (1) has screw holes (LC) (1
2a), it is attached tightly to the external case (12) with screws or the like, and heat is radiated from the uniform chassis (1) of the frame body to the external case (12).

According to the present invention, when configuring an electronic circuit for a ballast for a discharge lamp such as a neon lamp, a semiconductor serving as a heating element is directly attached to a frame-shaped chassis that also serves as a heat dissipation plate, and the voltage is high. Since the distance between the terminals is reduced, the heat dissipation effect is not compromised (the device can be made smaller and lighter).

[Brief explanation of the drawing]

FIG. 1 shows a ballast for a discharge lamp with a heat dissipating frame structure according to the present invention.
FIG. 2 is an exploded perspective view of a frame-shaped chassis according to an embodiment; FIG. 2 is a perspective view of an external case that houses a neon lamp ballast circuit device according to the present invention; FIG. 3 is an assembled perspective view of the frame-shaped chassis of FIG. 1. FIG. 4 is a perspective view showing an embodiment of a discharge lamp ballast in which a heat dissipation frame structure according to the present invention is housed in an external case. (1) --- Frame body (integrated chassis), (1a) (l
b) ---Chassis parts, (2)--Electronic components that generate heat, (3) (4) (5) (6) (9) (10)--Specified circuit components, (12)--External case .

Claims (1)

[Claims] (1) Two chassis parts made of a good heat conductive material are brought into contact with each other to form a closed frame, and an electronic component that generates heat is attached across the abutting parts to integrate each chassis part, and the frame is closed. A heat dissipation frame structure characterized by incorporating predetermined circuit components inside the body.