JPS61261013A - Manufacture of electromagnetically shielded cabinet - Google Patents
Manufacture of electromagnetically shielded cabinetInfo
- Publication number
- JPS61261013A JPS61261013A JP10127185A JP10127185A JPS61261013A JP S61261013 A JPS61261013 A JP S61261013A JP 10127185 A JP10127185 A JP 10127185A JP 10127185 A JP10127185 A JP 10127185A JP S61261013 A JPS61261013 A JP S61261013A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- thermoplastic resin
- cabinet
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は電子機器用電磁シールドキャビネツ゛ トの
製造方法に係り、特に平滑な表面を得るのに好適なかか
る電磁シールドキャビネットの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method of manufacturing an electromagnetic shielding cabinet for electronic equipment, and particularly to a method of manufacturing such an electromagnetic shielding cabinet suitable for obtaining a smooth surface.
従来、電子機器用の電磁シールドキャビネットについて
は、雑誌「工業材料」の第２９巻、第１２号の「導電性
プラスチックによ−る電磁シールド」と題する文献にお
いて論じられている。Conventionally, electromagnetic shielding cabinets for electronic equipment have been discussed in a document titled "Electromagnetic Shielding Made of Conductive Plastic" in Volume 29, No. 12 of the magazine "Kogyo Zaizai".
以下、金属繊維を混練した導電性の熱可塑性樹脂による
電子機器用電磁シールドキャビネットの従来技術につい
て説明する。Hereinafter, a conventional technology of an electromagnetic shielding cabinet for electronic equipment made of a conductive thermoplastic resin kneaded with metal fibers will be described.
第３図はかかる電磁シールドキャビネットの断面図であ
る。同図に示すように、キャビネットは、ブラウン管８
および電子部品７など構成部品の取付や安全および電磁
波障害対策、外観意匠の向上のために構成部品を囲うフ
ロントキャビネット５とリヤーキャビネット６を配置、
構成したもので、その材料は第２図に示すように、ポリ
スチレンやＡＢＳ樹脂などの熱可塑性樹脂１と電磁波障
害を防止する黄銅やステンレスの短い金属繊維２で構成
し、その成形品の表面３の金属繊維２の回りには空Ｆｌ
ｆｉ４ｂが配置されているものである。FIG. 3 is a sectional view of such an electromagnetic shielding cabinet. As shown in the figure, the cabinet consists of 8 cathode ray tubes.
In addition, a front cabinet 5 and a rear cabinet 6 are arranged to surround the components such as electronic components 7, for safety and electromagnetic interference countermeasures, and to improve the appearance design.
As shown in Figure 2, the material is a thermoplastic resin 1 such as polystyrene or ABS resin, and short metal fibers 2 made of brass or stainless steel to prevent electromagnetic interference. There is an empty Fl around the metal fiber 2 of
fi4b is arranged.
なお第２図は、従来の成形方法により製造されたキャビ
ネットの一表面付近の拡大断面図である。Note that FIG. 2 is an enlarged sectional view of the vicinity of one surface of a cabinet manufactured by a conventional molding method.
このように、従来の成形方法により製造されたキャビネ
ットは、その表面に比較的大きな空Ｒ４ｂが発生してい
るため、手ざわりが悪く、美観上も宜しくないという欠
点があった。As described above, the cabinet manufactured by the conventional molding method has a relatively large void R4b on its surface, which has the disadvantage that it has a poor texture and is not aesthetically pleasing.
本発明の目的は、金属繊維を混練した熱可塑性樹脂によ
る平滑な表面の電子機器用電磁シールドキャビネットを
製造することのできる製造方法を提供することにある。An object of the present invention is to provide a manufacturing method capable of manufacturing an electromagnetic shielding cabinet for electronic equipment with a smooth surface made of thermoplastic resin kneaded with metal fibers.
本発明においては、金属繊維を混練した熱可塑性樹脂に
よる平滑な表面の電子機器の電磁シールドキャビネット
を実現するために、熱可塑性樹脂に短い金属繊維を混練
し射出成形する過程で、樹脂を成形型へ注入する直前に
成形型の表面を樹脂の成形温度近くまで加熱して成形す
ることにより、成形型と接触した成形品の表面の樹脂温
度の低下を防ぎ、成形品の表面付近の樹脂の流動性を良
くして、成形型の表面と金属繊維の接触部分にできる樹
脂の表面張力による空隙を小さくすることで従来の問題
点を解決した０
〔発明の実施例〕
第４図は本発明の実施のために用いる成形型の断面図で
ある。In the present invention, in order to realize an electromagnetic shielding cabinet for electronic equipment with a smooth surface made of thermoplastic resin mixed with metal fibers, the resin is mixed into a mold in the process of kneading short metal fibers with thermoplastic resin and injection molding. By heating the surface of the mold to near the molding temperature of the resin immediately before injection into the mold, the temperature of the resin on the surface of the molded product in contact with the mold is prevented from decreasing, and the flow of resin near the surface of the molded product is prevented. The conventional problems were solved by improving the properties and reducing the voids created by the surface tension of the resin at the contact area between the surface of the mold and the metal fibers. It is a sectional view of the mold used for implementation.
同図に見られるように、成形型９は、キャビネット５，
６の外観表面を成形する金型表面１２を有するキャビテ
ィ側１０とファー側１１およびキャビティ側１０の金型
表面１２を加熱する電磁コイル１３を配置、構成したも
のであり、熱可塑性樹脂１に短い金属繊維２を混練し射
出成形する直前に通常４０℃から５０℃のキャビティ側
１０の金型表面１２の温度を熱可塑性樹脂１の成形温度
２２０℃から２３０℃の近くの２００℃程度まで電磁コ
イル１３を利用して加熱し成形することにより、成形品
の表面３の熱可塑性樹脂１の流動性を向上し、金型表面
１２と金属繊維２の接触部分にできる熱可塑性樹脂１の
表面張力による空隙を金型表面１２を加熱しない場合に
できる大きな空隙４ｂ（第２図参照）から小さな空１！
１ｊ ４＆（第１図参照）にできるため、従来より平滑
な表面の電磁シールドキャビネットにできる効果がある
。As seen in the figure, the mold 9 has a cabinet 5,
The electromagnetic coil 13 is arranged and configured to heat the mold surface 12 on the cavity side 10 and the far side 11 and the mold surface 12 on the cavity side 10, which has a mold surface 12 for molding the external surface of the thermoplastic resin 1. Immediately before kneading and injection molding the metal fibers 2, the temperature of the mold surface 12 on the cavity side 10, which is normally 40°C to 50°C, is raised to about 200°C, close to the molding temperature of the thermoplastic resin 1, 220°C to 230°C, using an electromagnetic coil. By heating and molding using 13, the fluidity of the thermoplastic resin 1 on the surface 3 of the molded product is improved, and due to the surface tension of the thermoplastic resin 1 formed at the contact area between the mold surface 12 and the metal fiber 2. The gap is changed from the large gap 4b (see Figure 2) that is created when the mold surface 12 is not heated to the small gap 1!
1j 4& (see Figure 1), it has the effect of creating an electromagnetic shielding cabinet with a smoother surface than conventional cabinets.
なお第１図は、本発明による製造方法によって製造した
キャビネットの表面付近の拡大断面図である。Note that FIG. 1 is an enlarged sectional view of the vicinity of the surface of a cabinet manufactured by the manufacturing method according to the present invention.
本発明によれば、キャビネットを成形するときに成形型
の表面と金属繊維の接触部分にできる樹脂の表面張力に
よる空隙を小さくできるので、金属繊維を混練した熱可
塑性樹脂による平滑な表面の電子機器の電磁シールドキ
ャビネットを提供できる効果がある。According to the present invention, it is possible to reduce the voids created by the surface tension of the resin at the contact area between the surface of the mold and the metal fibers when molding the cabinet, so electronic devices with smooth surfaces made of thermoplastic resin kneaded with metal fibers can be reduced. This has the effect of providing an electromagnetic shielding cabinet.
第１図は本発明の製造方法により製造したキャビネット
の拡大した表面付近の断面図、第２図は従来の成形方法
により製造したキャビネットの拡大した表面付近の断面
図、第３図は電子機器の断面図、第４図は本発明の実施
に用いる成形型の断面図である。
１・・・熱可塑性樹脂、
２・・・金属繊維、
３・・・成形品の表面、
４ａ・・・空隙、
４ｂ・・・空隙、
５・・・フロントキャビネット、
６・・・リヤーキャビネット、
７・・・電子部品、
８・・・ブラウン管、
９・・・成形型、
１０・・・キャビティ側、
１１・・・ファー側、
１２・・・金型表面、
色・・・電磁コイル。
代理人弁理士 小 川 勝 男
第１【 躬。。
第４［！１
手続補正書（方式）
事件の表示
昭和 ６０年特許願第 １０１２７１、発明の名称
電子機器用電磁シールドキャビネットの製造方法
補正をする者
譜との関係 特許出願人
名 称 ｒｓｈｏｔ株式会社 口 立 製
作所代 理 人
補正の対象 図面Figure 1 is an enlarged cross-sectional view of the cabinet manufactured by the manufacturing method of the present invention near the surface, Figure 2 is an enlarged cross-sectional view of the cabinet manufactured by the conventional molding method, and Figure 3 is an enlarged cross-sectional view of the cabinet manufactured by the conventional molding method. 4 is a cross-sectional view of a mold used in carrying out the present invention. DESCRIPTION OF SYMBOLS 1...Thermoplastic resin, 2...Metal fiber, 3...Surface of molded product, 4a...Gap, 4b...Gap, 5...Front cabinet, 6...Rear cabinet, 7...Electronic component, 8...Cathode ray tube, 9...Molding mold, 10...Cavity side, 11...Fur side, 12...Mold surface, Color...Electromagnetic coil. Representative Patent Attorney Katsutoshi Ogawa 1st. . 4th [! 1 Procedural amendment (formality) Indication of the case 1985 Patent Application No. 101271, Title of the invention
Relationship with the person who corrects the manufacturing method of electromagnetic shielding cabinets for electronic equipment Patent applicant name Rshot Co., Ltd. Tate Kuchi Manufacturing agent Target of person correction Drawing
Claims (1)
電子機器用電磁シールドキャビネットを製造する方法に
おいて、樹脂を成形型へ注入するに先立ち、該成形型の
表面を樹脂の成形温度近くまで加熱する段階を含むこと
を特徴とする電子機器用電磁シールドキャビネットの製
造方法。1) In the method of manufacturing electromagnetic shield cabinets for electronic devices by kneading short metal fibers into thermoplastic resin and injection molding, before injecting the resin into the mold, the surface of the mold is heated to near the molding temperature of the resin. A method of manufacturing an electromagnetic shielding cabinet for electronic equipment, the method comprising the step of heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10127185A JPS61261013A (en) | 1985-05-15 | 1985-05-15 | Manufacture of electromagnetically shielded cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10127185A JPS61261013A (en) | 1985-05-15 | 1985-05-15 | Manufacture of electromagnetically shielded cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61261013A true JPS61261013A (en) | 1986-11-19 |
Family
ID=14296219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10127185A Pending JPS61261013A (en) | 1985-05-15 | 1985-05-15 | Manufacture of electromagnetically shielded cabinet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61261013A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1988004986A1 (en) * | 1986-12-24 | 1988-07-14 | Nippon Steel Corporation | Process for molding resin composition containing metallic fibers |
| JPH04229220A (en) * | 1990-12-27 | 1992-08-18 | Tigers Polymer Corp | Conductivity giving molding method of thermoplastic resin |
| EP0671117A1 (en) * | 1992-11-25 | 1995-09-13 | Amesbury Group, Inc. | Emi-shielding gasket |
-
1985
- 1985-05-15 JP JP10127185A patent/JPS61261013A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1988004986A1 (en) * | 1986-12-24 | 1988-07-14 | Nippon Steel Corporation | Process for molding resin composition containing metallic fibers |
| JPH04229220A (en) * | 1990-12-27 | 1992-08-18 | Tigers Polymer Corp | Conductivity giving molding method of thermoplastic resin |
| EP0671117A1 (en) * | 1992-11-25 | 1995-09-13 | Amesbury Group, Inc. | Emi-shielding gasket |
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