JPH04229220A - Conductivity giving molding method of thermoplastic resin - Google Patents
Conductivity giving molding method of thermoplastic resinInfo
- Publication number
- JPH04229220A JPH04229220A JP41668790A JP41668790A JPH04229220A JP H04229220 A JPH04229220 A JP H04229220A JP 41668790 A JP41668790 A JP 41668790A JP 41668790 A JP41668790 A JP 41668790A JP H04229220 A JPH04229220 A JP H04229220A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- molding
- conductive filler
- exposed
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000000465 moulding Methods 0.000 title claims abstract description 33
- 229920005992 thermoplastic resin Polymers 0.000 title claims description 36
- 239000011231 conductive filler Substances 0.000 claims abstract description 49
- 238000002347 injection Methods 0.000 claims abstract description 23
- 239000007924 injection Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000001746 injection moulding Methods 0.000 claims description 10
- 238000000748 compression moulding Methods 0.000 claims description 9
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 15
- 239000011347 resin Substances 0.000 abstract description 15
- 238000007493 shaping process Methods 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 230000001815 facial effect Effects 0.000 abstract 3
- 239000000835 fiber Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、熱可塑性樹脂の導電性
付与成形法に係わり、部分的に高い導電性が要求される
樹脂成形品の製造に利用される。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for molding thermoplastic resins to impart electrical conductivity, and is used to manufacture resin molded articles that require high electrical conductivity in some areas.
【０００２】0002
【従来の技術及び発明が解決しようとする課題】従来、
熱可塑性樹脂に導電性を付与する樹脂成形法の一つとし
て、熱可塑性樹脂に導電性フィラー（導電性充填材）を
混練した成形材料を、賦形面が一様な材質で形成された
成形金型を使用して成形する方法がある。[Prior art and problems to be solved by the invention] Conventionally,
One of the resin molding methods that imparts conductivity to thermoplastic resin is a molding method in which a molding material made by kneading conductive filler (conductive filler) into thermoplastic resin is formed with a uniform material on the shaping surface. There is a method of molding using a mold.
【０００３】しかしながら、上記成形法による場合、表
面抵抗値が絶縁物のそれと略等しい帯電し易い成形品し
か得られないことが少なくなかった。However, when using the above-mentioned molding method, only molded products that are easily charged and whose surface resistance value is approximately equal to that of the insulating material are often obtained.
【０００４】すなわち、帯電防止性、ひいては静電気除
去性や電磁波シールド性などを樹脂成形品に付与するた
めの導電性付与成形法としては問題があった。[0004] That is, there have been problems with the conductivity-imparting molding method for imparting antistatic properties, as well as static electricity removal properties and electromagnetic shielding properties, to resin molded products.
【０００５】これは、従来の成形金型の賦形面は熱伝導
率のあまり大きくない部材又は熱容量のあまり小さくな
い部材で一様に形成されており、このため冷却時に成形
金型の賦形面に近接する熱可塑性樹脂が急冷されて成形
品の表面部に位置する導電性フィラーの大部分が表面層
に浮き出るものの、各導電性フィラーがプライマーを介
して非導電性の熱可塑性樹脂で被覆されてしまうことに
起因する。[0005] This is because the shaping surface of a conventional molding die is uniformly formed of a material that does not have a very high thermal conductivity or a material that does not have a very small heat capacity. Although the thermoplastic resin close to the surface is rapidly cooled and most of the conductive fillers located on the surface of the molded product emerge on the surface layer, each conductive filler is covered with a non-conductive thermoplastic resin via a primer. This is due to being exposed.
【０００６】もっとも、上記成形品は、その表面部の導
電性フィラーの大部分が非導電性の熱可塑性樹脂で被覆
されたために導電性を発現することができないものであ
るから、成形品の表面のうち導電性を付与すべき表面部
だけを２次加工により切除し、導電性フィラーが成形品
の表面に露出するようにすれば、導電性を発現させるこ
とができる。However, the above-mentioned molded product cannot exhibit conductivity because most of the conductive filler on its surface is coated with a non-conductive thermoplastic resin. If only the surface portion to which conductivity is to be imparted is removed by secondary processing so that the conductive filler is exposed on the surface of the molded article, conductivity can be developed.
【０００７】しかしながら、上記切除には多大の労力及
び時間を要し、また製造コストも高くつく。[0007] However, the above-mentioned cutting requires a great deal of labor and time, and the manufacturing cost is also high.
【０００８】本発明は、以上の事情に鑑みなされたもの
であって、その目的とするところは、導電性を付与すべ
き表面部に位置する導電性フィラーが熱可塑性樹脂で殆
ど被覆されておらず、その結果該表面部が優れた導電性
を示す成形品を簡便且つ低廉に得ることができる成形法
を提供するにある。The present invention has been made in view of the above circumstances, and its purpose is to prevent the conductive filler located on the surface portion to be imparted with conductivity from being almost entirely covered with thermoplastic resin. First, it is an object of the present invention to provide a molding method that can easily and inexpensively obtain a molded article whose surface portion exhibits excellent conductivity.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
の請求項１記載の本発明に係る成形法は、溶融状態にあ
る導電性フィラー含有熱可塑性樹脂を射出成形金型のキ
ャビティに射出し、次いで前記射出成形金型を冷却して
成形品の表面部に前記導電性フィラーを多数露出させる
熱可塑性樹脂の導電性付与成形法であって、前記表面部
の一部に前記導電性フィラーを露出させるべく、成形中
、その導電性フィラーを露出させるべき表面部に臨む前
記射出成形金型の部分を他の部分に比べて高温状態に保
持する方法である。[Means for Solving the Problems] A molding method according to the present invention according to claim 1 for achieving the above object includes injecting a conductive filler-containing thermoplastic resin in a molten state into a cavity of an injection mold. A method for imparting conductivity to a thermoplastic resin, in which the injection molding mold is then cooled to expose a large number of the conductive fillers on the surface of the molded product, the method comprising applying the conductive filler to a part of the surface. In order to expose the conductive filler, this is a method in which during molding, the part of the injection mold facing the surface where the conductive filler is to be exposed is maintained at a higher temperature than other parts.
【００１０】また、請求項５記載の本発明に係る成形法
は、溶融状態にある導電性フィラー含有熱可塑性樹脂を
圧縮成形金型のキャビティに投入し、型締めして加圧し
た後、前記圧縮成形金型を冷却して成形品の表面部に前
記導電性フィラーを多数露出させる熱可塑性樹脂の導電
性付与成形法であって、前記表面部の一部に前記導電性
フィラーを露出させるべく、成形中、その導電性フィラ
ーを露出させるべき表面部に臨む前記圧縮成形金型の部
分を他の部分に比べて高温状態に保持する方法である。[0010] Furthermore, in the molding method according to the present invention as set forth in claim 5, the conductive filler-containing thermoplastic resin in a molten state is charged into the cavity of a compression mold, the mold is clamped and pressurized, and then the A method for imparting conductivity to a thermoplastic resin, in which a compression molding mold is cooled to expose a large number of the conductive fillers on the surface of a molded product, the method comprising: During molding, the part of the compression molding mold facing the surface where the conductive filler is to be exposed is kept at a higher temperature than other parts.
【００１１】上記請求項１又は５記載の両発明において
、導電性フィラーを露出させるべき表面部に臨む成形金
型の部分を他の部分に比べて高温状態に保持するための
方法としては、導電性フィラーを露出させるべき表面部
に臨む射出成形金型の部分を熱可塑性樹脂の融点を越え
ない温度に加熱手段にて加熱する方法が例示される。[0011] In both the above inventions as claimed in claim 1 or 5, the method for maintaining the portion of the mold facing the surface portion where the conductive filler is to be exposed at a higher temperature than other portions includes: An example is a method in which the part of the injection mold facing the surface part where the filler is to be exposed is heated by a heating means to a temperature that does not exceed the melting point of the thermoplastic resin.
【００１２】また、他の方法としては、導電性フィラー
を露出させるべき表面部に臨む成形金型の部分の部材が
他の部分の部材に比べて熱伝導率の大きい部材で形成さ
れた成形金型を使用する方法が例示される。Another method is to use a molding die in which the part of the molding die facing the surface where the conductive filler is to be exposed is made of a material having a higher thermal conductivity than the other parts. An example is given of how to use types.
【００１３】後者の方法による場合の熱伝導率の大きい
部材としては、銅製部材、銅合金製部材、アルミニウム
合金製部材又はベリリウム−銅合金製部材が好適であり
、他の部分の部材としては、クロム−ステンレス鋼製部
材が好適である。なお、上記熱伝導率の大きい部材に代
えて、熱容量（ｃａｌ／度（摂氏）／グラム）の小さい
部材で形成された射出成形金型を使用することも可能で
あるが、熱伝導率が大きく、しかも熱容量が小さい部材
を使用することが最適である。In the case of the latter method, members having high thermal conductivity are preferably copper members, copper alloy members, aluminum alloy members or beryllium-copper alloy members, and other members include: Chrome-stainless steel parts are preferred. Note that it is possible to use an injection mold made of a member with a small heat capacity (cal/degree (Celsius)/gram) instead of the above-mentioned member with a high thermal conductivity. Moreover, it is optimal to use a member with a small heat capacity.
【００１４】本発明に係る成形法の成形対象となる熱可
塑性樹脂は、特に制限されないが、帯電し易いポリエチ
レン樹脂等の帯電防止などに特に好適に適用し得る。ま
た、本発明における導電性フィラーとしては、使用する
熱可塑性樹脂の物性を阻害しないものであれば特に制限
されず使用することができ、例えば金属微粒子、金属繊
維、金属フレークなど、従来既知の種々の導電性フィラ
ーを使用し得る。[0014] The thermoplastic resin to be molded by the molding method according to the present invention is not particularly limited, but it can be particularly suitably applied to antistatic materials such as polyethylene resins that are easily charged. Furthermore, the conductive filler in the present invention is not particularly limited and can be used as long as it does not inhibit the physical properties of the thermoplastic resin used. For example, various conventionally known conductive fillers such as metal fine particles, metal fibers, metal flakes, conductive fillers may be used.
【００１５】[0015]
【作用】本発明において、成形金型を冷却すると、導電
性フィラーを露出させるべき表面部に臨む成形金型の部
分は、他の部分に比べて高温状態に保持されているので
、急冷され難い。[Operation] In the present invention, when the mold is cooled, the part of the mold facing the surface where the conductive filler is to be exposed is kept at a higher temperature than other parts, so it is difficult to cool down quickly. .
【００１６】[0016]
【実施例】以下、本発明の実施例を図面を参照しつつ説
明するが、本発明は下記実施例に何ら限定されるもので
はなく、その要旨を変更しない範囲において適宜変更し
て実施することが可能なものである。[Examples] Examples of the present invention will be described below with reference to the drawings, but the present invention is not limited to the following examples in any way, and may be practiced with appropriate modifications within the scope of the gist thereof. is possible.
【００１７】第１図は、本発明の実施において使用され
る射出成形金型の一例を示す部分断面図である。FIG. 1 is a partial sectional view showing an example of an injection mold used in carrying out the present invention.
【００１８】同図に示す射出成形金型（１）は、溶融樹
脂の通路となる下流側に向けて拡径して形成されたスプ
ルー（２）を有するスプルーブッシュ（３）、ランナ（
４）、ゲート（５）、キャビティ（６）を形成するキャ
ビティブッシュ（７）及びコア（８）などからなる。The injection mold (1) shown in the figure includes a sprue bush (3) having a sprue (2) whose diameter is expanded toward the downstream side to serve as a passage for molten resin, and a runner (
4), a gate (5), a cavity bush (7) forming a cavity (6), a core (8), etc.
【００１９】キャビティブッシュ（７）は、比較的熱伝
導率の小さい材料で形成されており、またコア（８）は
、比較的熱伝導率の大きい材料で形成されている。The cavity bush (7) is made of a material with relatively low thermal conductivity, and the core (8) is made of a material with relatively high thermal conductivity.
【００２０】かかる射出成形金型（１）において、加熱
シリンダ（図示せず）にて加熱流動化された樹脂がノズ
ル（１１）から射出されると、射出された樹脂はスプル
ー（２）、ランナ（４）、ゲート（５）を順次経て、キ
ャビティ（６）内に導かれ、そこで冷却固化して成形品
となる。[0020] In such an injection molding mold (1), when resin heated and fluidized by a heating cylinder (not shown) is injected from a nozzle (11), the injected resin is transferred to a sprue (2) and a runner. (4) and the gate (5), and are guided into the cavity (6), where they are cooled and solidified to become a molded product.
【００２１】ここにおいて、コア（８）は、比較的熱伝
導率の大きい材料で形成されているので、コア（８）の
賦形面に接した成形品の表面部（９）は、冷却固化の際
に急冷され難く、このため樹脂が導電性フィラーの表面
を被覆することが少ない。Here, since the core (8) is made of a material with relatively high thermal conductivity, the surface portion (9) of the molded product in contact with the shaping surface of the core (8) is cooled and solidified. It is difficult to rapidly cool the conductive filler during the process, and therefore the resin rarely covers the surface of the conductive filler.
【００２２】一方、キャビティブッシュ（７）は、コア
（８）に比べて熱伝導率の小さい材料で形成されている
ので、キャビティブッシュ（７）の賦形面に接した成形
品の表面部（１０）は、冷却固化の際に急冷され易く、
このため樹脂が導電性フィラーの表面を被覆し易くなる
。On the other hand, since the cavity bushing (7) is made of a material with lower thermal conductivity than the core (8), the surface portion of the molded product in contact with the shaping surface of the cavity bushing (7) ( 10) is likely to be rapidly cooled during cooling and solidification,
This makes it easier for the resin to cover the surface of the conductive filler.
【００２３】上記実施例では、導電性フィラーを露出さ
せるべき部分に臨むコア（８）自体が比較的熱伝導率の
大きい材料で形成された射出成形金型（１）を使用する
場合について説明したが、本発明はかかる場合に限定さ
れるものではなく、表面又は内部に加熱手段を設けたコ
アを備える射出成形金型を使用して導電性フィラーを露
出させるべき表面部を融点を越えない温度に加熱するよ
うにしてもよい。この場合、融点を越えない温度までの
加熱に制限されるのは、熱可塑性樹脂を融点を越えて加
熱すると成形性が低下するからである。[0023] In the above embodiment, the case is explained in which the injection mold (1) is used, in which the core (8) itself facing the part where the conductive filler is to be exposed is made of a material with relatively high thermal conductivity. However, the present invention is not limited to such a case, and the surface portion where the conductive filler is to be exposed is heated to a temperature not exceeding the melting point using an injection molding mold having a core provided with a heating means on the surface or inside. It may be heated to In this case, heating is limited to a temperature that does not exceed the melting point, because if the thermoplastic resin is heated above the melting point, the moldability will decrease.
【００２４】また、以上では、導電性フィラーを露出さ
せるべき表面部がコア（８）の賦形面により賦形される
場合について説明したが、導電性を露出させるべき表面
部がキャビティブッシュ（７）の賦形面により賦形され
る場合には、キャビティブッシュ（７）が上記比較的熱
伝導率の大きい材料で形成された射出成形金型を使用す
るか、或いは、キャビティブッシュ（７）の表面又は内
部に加熱手段を設けた射出成形金型を使用するようにす
ればよい。[0024] Also, in the above, the case where the surface portion to which the conductive filler is to be exposed is shaped by the shaping surface of the core (8) has been described, but the surface portion to which the conductivity is to be exposed is formed by the cavity bushing (7). ), use an injection molding mold in which the cavity bush (7) is made of the above-mentioned material with relatively high thermal conductivity, or An injection mold provided with heating means on the surface or inside may be used.
【００２５】さらに、導電性フィラーを露出させるべき
表面部がキャビティブッシュ（７）及び／又はコア（８
）の賦形面が接する面の一部に存在する場合は、その当
該一部に接するキャビティブッシュ（７）又はコア（８
）の部分だけが比較的熱伝導率の大きい材料で形成され
た射出成形金型を使用するか、或いは、その部分に加熱
手段を設けた射出成形金型を使用するようにすればよい
。Furthermore, the surface portion where the conductive filler is to be exposed is the cavity bushing (7) and/or the core (8).
) is present in a part of the surface in contact with the shaped surface of the cavity bush (7) or core (8
) may be made of a material with relatively high thermal conductivity, or an injection mold may be used in which a heating means is provided for that portion.
【００２６】さらにまた、本発明は熱可塑性樹脂に導電
性フィラーを混練した複合材料の導電性付与成形法全般
に係るものであり、ここにおける成形法は必ずしも射出
成形法に限定されず、圧縮成形法による場合にも同様に
実施し得るものである。Furthermore, the present invention relates to a general method for molding a composite material made of a thermoplastic resin and a conductive filler to impart conductivity, and the molding method here is not necessarily limited to injection molding, but may include compression molding. The same can be implemented by law.
【００２７】〔具体的実施例〕鉛芯等の筆記芯を収容及
び芯出しするための略円筒状の筆記芯ストッカーを、コ
アピン及びキャビティブッシュが、それぞれベリリウム
−銅合金（ＢｅＡ２５：熱伝導率（ＣＧＳ）０．２６）
、１２クロム−ステンレス鋼（熱伝導率（ＣＧＳ）０．
０６）で形成された射出成形金型を使用して射出成形し
、成形品１０個を得た。[Specific Example] A substantially cylindrical writing lead stocker for accommodating and centering writing leads such as lead leads, the core pin and the cavity bushing are each made of beryllium-copper alloy (BeA25: thermal conductivity ( CGS)0.26)
, 12 chromium-stainless steel (thermal conductivity (CGS) 0.
Injection molding was performed using the injection mold formed in 06) to obtain 10 molded products.
【００２８】使用した射出成形機、成形材料及び成形条
件は、下記のとおりである。
（射出成形機）
オープンループコントロール油圧射出成形機（アキュー
ムレータ付、型締力２０トン）
（成形材料）
熱可塑性樹脂：大塚化学社製ポリアセタール樹脂（商品
名「ウィスタット」）０．５グラム
プライマー処理済導電性フィラー：繊維長１０〜２０μ
ｍ、繊維直径０．２〜０．５μｍの導電性ウィスカー０
．１グラム
（成形条件）
■シリンダー内ヒーター設定温度（摂氏）ノズル部：２
００度
金型部： ８０度
■ 最大射出圧力（キログラム／平方センチメートル
）：６００
■ 射出速度（ミリメートル／秒）：３０■ 保圧
（キログラム／平方センチメートル）：６００■ 背
圧（キログラム／平方センチメートル）： ８０■
スクリュー回転数（ｒｐｍ）： ８０■ 計量値
（グラム／ショット）： １８The injection molding machine, molding material and molding conditions used are as follows. (Injection molding machine) Open loop control hydraulic injection molding machine (with accumulator, mold clamping force 20 tons) (Molding material) Thermoplastic resin: Otsuka Chemical Co., Ltd. polyacetal resin (product name "Wistat") 0.5 g Primer treated Conductive filler: fiber length 10-20μ
m, conductive whisker 0 with fiber diameter 0.2-0.5 μm
．． 1 gram (molding conditions) ■ Cylinder heater setting temperature (Celsius) Nozzle part: 2
00 degree mold section: 80 degrees■ Maximum injection pressure (kilograms/cm²): 600 ■ Injection speed (mm/sec): 30■ Holding pressure (kg/cm²): 600■ Back pressure (kilograms/cm²): 80■
Screw rotation speed (rpm): 80■ Weight value (grams/shot): 18
【００２９】得られた
成形品について、熱伝導率の大きいコアピンにより賦形
された成形品の内周面を走査型電子顕微鏡写真（ＳＥＭ
）で観察したところ、導電性フィラーの輪郭が比較的鮮
明であることから、導電性フィラーの多くは樹脂に被覆
されず表面に露出していることが分かった。因みに、１
０個の成形品について前記内周面の表面抵抗値を測定し
たところ、１０２ 〜１０６ オームと小さく、優れた
導電性を有していることが分かった。A scanning electron micrograph (SEM) of the inner circumferential surface of the molded product formed by the core pin with high thermal conductivity was taken.
), it was found that the outline of the conductive filler was relatively clear, indicating that most of the conductive filler was not covered with resin and was exposed on the surface. By the way, 1
When the surface resistance value of the inner circumferential surface of 0 molded products was measured, it was found to be as small as 102 to 106 ohms, and to have excellent electrical conductivity.
【００３０】また、熱伝導率の小さいキャビティブッシ
ュにより賦形された成形品の外周面を走査型電子顕微鏡
写真で観察したところ、冷却固化の際に樹脂が収縮する
ため導電性フィラーは成形品の外周面に浮き出ているも
のの、導電性フィラーの輪郭が不鮮明であることから、
該導電性フィラーの多くは樹脂で被覆されてしまってい
ることが分かった。因みに、外周面の表面抵抗値は、１
０個の成形品の全てについて１０８ オーム以上であっ
た。[0030] Furthermore, when observing the outer peripheral surface of a molded product formed by a cavity bushing with low thermal conductivity using a scanning electron microscope, it was found that the conductive filler is not present in the molded product because the resin contracts during cooling and solidification. Although it stands out on the outer circumferential surface, the outline of the conductive filler is unclear, so
It was found that most of the conductive filler was covered with resin. Incidentally, the surface resistance value of the outer peripheral surface is 1
The resistance was 108 ohms or more for all of the 0 molded products.
【００３１】上記筆記芯ストッカーを組み込んだシャー
プペンは、導電性が要求される筆記芯ストッカーの内周
面が帯電し難いため、芯出しが容易であった。[0031] The mechanical pencil incorporating the above-mentioned writing lead stocker was easy to center because the inner peripheral surface of the writing lead stocker, which is required to be electrically conductive, was not easily charged.
【００３２】[0032]
【発明の効果】本発明によれば、成形品表面部の導電性
を付与すべき部分に有効に導電性フィラーを露出させる
ことができるなど、本発明は優れた特有の効果を奏する
。According to the present invention, a conductive filler can be effectively exposed in a portion of the surface of a molded product to which conductivity is to be imparted, and the present invention has excellent and unique effects.
【図１】本発明において使用する射出成形金型の部分断
面図である。FIG. 1 is a partial sectional view of an injection mold used in the present invention.
（１）射出成形金型 （２）スプルー （３）スプルーブッシュ （４）ランナ （５）ゲート （６）キャビティ （７）キャビティブッシュ （８）コア (1) Injection mold (2) Sprue (3) Sprue bushing (4) Runner (5) Gate (6) Cavity (7) Cavity bush (8) Core
Claims (8)
性樹脂を射出成形金型のキャビティに射出し、次いで前
記射出成形金型を冷却して成形品の表面部に前記導電性
フィラーを多数露出させる熱可塑性樹脂の導電性付与成
形法であって、前記表面部の一部に前記導電性フィラー
を露出させるべく、成形中、その導電性フィラーを露出
させるべき表面部に臨む前記射出成形金型の部分を他の
部分に比べて高温状態に保持することを特徴とする熱可
塑性樹脂の導電性付与成形法。[Claim 1] A conductive filler-containing thermoplastic resin in a molten state is injected into a cavity of an injection mold, and then the injection mold is cooled to expose a large number of the conductive fillers on the surface of the molded product. A method for molding a thermoplastic resin to impart electrical conductivity, the injection molding die facing the surface part to which the conductive filler is to be exposed during molding, in order to expose the conductive filler to a part of the surface part. A method for molding thermoplastic resin to impart conductivity, the method comprising: maintaining a portion of the thermoplastic resin at a higher temperature than other portions.
部に臨む射出成形金型の部分を他の部分に比べて高温状
態に保持すべく、前記表面部に臨む射出成形金型の部分
を前記熱可塑性樹脂の融点を越えない温度に加熱手段に
て加熱することを特徴とする請求項１記載の熱可塑性樹
脂の導電性付与成形法。2. In order to maintain the part of the injection mold facing the surface part where the conductive filler is to be exposed at a higher temperature than other parts, the part of the injection mold facing the surface part is 2. The method of molding a thermoplastic resin to impart electrical conductivity according to claim 1, wherein the thermoplastic resin is heated to a temperature not exceeding the melting point of the thermoplastic resin using a heating means.
部に臨む射出成形金型の部分を他の部分に比べて高温状
態に保持すべく、前記表面部に臨む射出成形金型の部分
の部材が他の部分の部材に比べて熱伝導率の大きい部材
で形成された射出成形金型を使用する請求項１記載の熱
可塑性樹脂の導電性付与成形法。3. In order to maintain the part of the injection mold facing the surface part where the conductive filler is to be exposed at a higher temperature than other parts, a member of the part of the injection mold facing the surface part is used. 2. The method of molding a thermoplastic resin to impart electrical conductivity according to claim 1, wherein an injection mold is used which is made of a material having a higher thermal conductivity than other members.
銅合金製部材、アルミニウム合金製部材又はベリリウム
−銅合金製部材であり、前記他の部分の部材が、クロム
−ステンレス鋼製部材である請求項３記載の熱可塑性樹
脂の導電性付与成形法。4. The member having high thermal conductivity is a copper member,
4. The method of molding a thermoplastic resin to impart electrical conductivity according to claim 3, wherein the member is a copper alloy member, an aluminum alloy member, or a beryllium-copper alloy member, and the member of the other portion is a chromium-stainless steel member.
性樹脂を圧縮成形金型のキャビティに投入し、型締めし
て加圧した後、前記圧縮成形金型を冷却して成形品の表
面部に前記導電性フィラーを多数露出させる熱可塑性樹
脂の導電性付与成形法であって、前記表面部の一部に前
記導電性フィラーを露出させるべく、成形中、その導電
性フィラーを露出させるべき表面部に臨む前記圧縮成形
金型の部分を他の部分に比べて高温状態に保持すること
を特徴とする熱可塑性樹脂の導電性付与成形法。5. A conductive filler-containing thermoplastic resin in a molten state is put into a cavity of a compression mold, the mold is clamped and pressurized, and then the compression mold is cooled to form a surface portion of a molded product. A molding method for imparting conductivity to a thermoplastic resin in which a large number of the conductive filler is exposed on the surface of the thermoplastic resin, wherein the conductive filler is exposed on a part of the surface portion during molding. 1. A method for molding thermoplastic resin to impart electrical conductivity, characterized in that a portion of the compression molding die facing the section is maintained at a higher temperature than other portions.
部に臨む圧縮成形金型の部分を他の部分に比べて高温状
態に保持するために、前記表面部に臨む圧縮成形金型の
部分を前記熱可塑性樹脂の融点を越えない温度に加熱手
段にて加熱することを特徴とする請求項５記載の熱可塑
性樹脂の導電性付与成形法。6. In order to maintain the portion of the compression molding mold facing the surface portion where the conductive filler is to be exposed at a higher temperature than other portions, the portion of the compression molding mold facing the surface portion is 6. The method of molding a thermoplastic resin to impart conductivity according to claim 5, wherein the thermoplastic resin is heated to a temperature not exceeding the melting point of the thermoplastic resin using a heating means.
部に臨む圧縮成形金型の部分を他の部分に比べて高温状
態に保持するために、前記表面部に臨む圧縮成形金型の
部分の部材が他の部分の部材に比べて熱伝導率の大きい
部材で形成された圧縮成形金型を使用する請求項５記載
の熱可塑性樹脂の導電性付与成形法。7. In order to maintain the portion of the compression molding mold facing the surface portion where the conductive filler is to be exposed at a higher temperature than other portions, the portion of the compression molding mold facing the surface portion is 6. The method for molding a thermoplastic resin to impart electrical conductivity according to claim 5, wherein a compression molding mold is used in which the member is formed of a member having higher thermal conductivity than other members.
銅合金製部材、アルミニウム合金製部材又はベリリウム
−銅合金製部材であり、前記他の部分の部材が、クロム
−ステンレス鋼製部材である請求項７記載の熱可塑性樹
脂の導電性付与成形法。8. The member having high thermal conductivity is a copper member,
8. The method of molding a thermoplastic resin for imparting electrical conductivity according to claim 7, wherein the member is a copper alloy member, an aluminum alloy member, or a beryllium-copper alloy member, and the member of the other portion is a chromium-stainless steel member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41668790A JPH04229220A (en) | 1990-12-27 | 1990-12-27 | Conductivity giving molding method of thermoplastic resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41668790A JPH04229220A (en) | 1990-12-27 | 1990-12-27 | Conductivity giving molding method of thermoplastic resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04229220A true JPH04229220A (en) | 1992-08-18 |
Family
ID=18524890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP41668790A Pending JPH04229220A (en) | 1990-12-27 | 1990-12-27 | Conductivity giving molding method of thermoplastic resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04229220A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59124824A (en) * | 1983-01-05 | 1984-07-19 | Toshiba Chem Corp | Manufacture of electromagnetic wave-shielding synthetic resin injection molding |
| JPS60186097A (en) * | 1984-03-05 | 1985-09-21 | 株式会社東芝 | Method for molding electromagnetic wave shielding mold and injection mold |
| JPS61261013A (en) * | 1985-05-15 | 1986-11-19 | Hitachi Ltd | Manufacture of electromagnetically shielded cabinet |
| JPS6257501A (en) * | 1985-09-06 | 1987-03-13 | 株式会社 双進 | Rubber shoes and production thereof |
| JPS62198423A (en) * | 1986-02-26 | 1987-09-02 | Hitachi Ltd | Method of molding resin |
-
1990
- 1990-12-27 JP JP41668790A patent/JPH04229220A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59124824A (en) * | 1983-01-05 | 1984-07-19 | Toshiba Chem Corp | Manufacture of electromagnetic wave-shielding synthetic resin injection molding |
| JPS60186097A (en) * | 1984-03-05 | 1985-09-21 | 株式会社東芝 | Method for molding electromagnetic wave shielding mold and injection mold |
| JPS61261013A (en) * | 1985-05-15 | 1986-11-19 | Hitachi Ltd | Manufacture of electromagnetically shielded cabinet |
| JPS6257501A (en) * | 1985-09-06 | 1987-03-13 | 株式会社 双進 | Rubber shoes and production thereof |
| JPS62198423A (en) * | 1986-02-26 | 1987-09-02 | Hitachi Ltd | Method of molding resin |
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