JPS6125799B2 - - Google Patents

Info

Publication number
JPS6125799B2
JPS6125799B2 JP51052042A JP5204276A JPS6125799B2 JP S6125799 B2 JPS6125799 B2 JP S6125799B2 JP 51052042 A JP51052042 A JP 51052042A JP 5204276 A JP5204276 A JP 5204276A JP S6125799 B2 JPS6125799 B2 JP S6125799B2
Authority
JP
Japan
Prior art keywords
electrolytic solution
electrolytic
pressure
electrolyte
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51052042A
Other languages
Japanese (ja)
Other versions
JPS51149131A (en
Inventor
Tapio Korupi Teyuuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RARUSU EDOIN ANDERUSON
Original Assignee
RARUSU EDOIN ANDERUSON
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RARUSU EDOIN ANDERUSON filed Critical RARUSU EDOIN ANDERUSON
Publication of JPS51149131A publication Critical patent/JPS51149131A/en
Publication of JPS6125799B2 publication Critical patent/JPS6125799B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004Sealing devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/02Heating or cooling
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003Electroplating using gases, e.g. pressure influence

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Hybrid Cells (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Chemically Coating (AREA)

Description

【発明の詳細な説明】 本発明は低圧に保たれた処理室に於いて電解溶
液により被処理体の表面に金属を被覆処理する電
解処理方法とくに電気メツキ方法及びその方法を
実施するために用いる装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrolytic treatment method, particularly an electroplating method, in which a metal is coated on the surface of a workpiece using an electrolytic solution in a treatment chamber maintained at low pressure, and a method used to carry out the method. It is related to the device.

従来公知の電解処理には技術的にも環境上に
種々の欠点が生じている。上記の技術的欠点とし
ては、電着被膜厚さの不均等、被膜形成が遅いこ
と、然も被膜密度が低く且つ被膜密着性が悪いこ
と等が挙げられる。上記の欠点は最も顕著な欠点
の一部を列記したに過ぎなく、最大の問題点は被
膜が不規則に形成されることで、被膜が部分的に
厚くなる。
Conventionally known electrolytic treatments have various technical and environmental disadvantages. The above-mentioned technical drawbacks include non-uniform electrodeposited coating thickness, slow coating formation, low coating density and poor coating adhesion. The above drawbacks are just a list of some of the most prominent drawbacks, and the biggest problem is that the coating is irregularly formed and thick in some areas.

環境保安及び安全作業の見地から公知の処理方
法に於ける欠陥発生防止に関する最重要の問題点
は、ガス及び濃毒煙が猛烈に発生することに関連
している。然もこれらは人体に有毒性のもので
頗々職業病の原因になる。
The most important problem with respect to the prevention of defects in known treatment methods from the point of view of environmental security and safe operation is associated with the intense generation of gases and toxic fumes. However, these substances are toxic to the human body and often cause occupational diseases.

本発明の目的は公知の方法により生ずる欠点の
大部分を除き得る極めて効果的な処理方法を提供
しようとするものである。
The object of the present invention is to provide a highly effective treatment method which avoids most of the drawbacks caused by the known methods.

本発明による低圧下に於ける電解被覆加工を基
準とした処理方法を完壁に実験した結果、予期せ
ぬ多数の利点を伴うことが確証された。即ち電着
被覆の性質が極めて改善され、加工処理中に通常
発生する濃毒煙は、僅か0.85atmの低圧下で循環
する電解液中に既に混融凝固してしまう。濃毒煙
の発生量は使用する電解液及び電流密度の如何に
よつて決まるのである。尚作業中一層優れた安全
性を確保するため、0.8atm以下の圧力に保たれ
た低圧下で処理を行うことが好ましい。
Thorough testing of the process according to the invention, which is based on electrolytic coating under low pressure, has shown that it has a number of unexpected advantages. This means that the properties of the electrodeposited coating are greatly improved, and the toxic fumes normally generated during processing are already mixed and solidified in the circulating electrolyte at a low pressure of only 0.85 atm. The amount of toxic smoke generated depends on the electrolyte used and the current density. In order to ensure greater safety during the work, it is preferable to carry out the process under low pressure maintained at a pressure of 0.8 atm or less.

最も有利な処理方法としては、低圧に保たれて
いる適当な処理室を設け、電解溶液がこの処理室
内に循環通過するように構成することである。従
つて適当な冷却及び加熱機構を備えた循環機構が
利用できる。更に又、液体が循環しないで然も処
理室として役立つ電解液貯留室を設けた装置を使
用することができる。
The most advantageous treatment method is to provide a suitable treatment chamber which is maintained at low pressure and to arrange for the electrolyte solution to be circulated through the treatment chamber. A circulation system with suitable cooling and heating mechanisms can therefore be used. Furthermore, it is possible to use devices in which no liquid circulates, but which is provided with an electrolyte reservoir that serves as a processing chamber.

本発明による処理方法及びその方法を実施する
ために用いられる装置を一層簡単化するには、処
理室を形成して、一端が開放された容器を逆立ち
状態に配設し、開放口が電解液槽内の液面下に位
置するようにして、低圧源の連結すれば、低圧に
なつた逆立ち状態の電解液槽内には所望の液面ま
で電解液が充満するようになる。この方法によれ
ば、従来の処理装置の構造を僅か改変するだけ
で、容易に本発明による処理方法に利用すること
ができる。従来の電解液槽は電解液貯留室として
役立つことができる。
In order to further simplify the treatment method according to the invention and the equipment used to carry out the method, it is possible to form a treatment chamber by arranging a container open at one end in an inverted position, with the opening opening opening for the electrolyte solution. If a low pressure source is connected to the electrolyte tank so as to be located below the liquid level in the tank, the low pressure electrolyte tank in an upright position will be filled with electrolyte solution up to the desired liquid level. According to this method, the conventional processing apparatus can be easily used in the processing method of the present invention by only slightly modifying its structure. A conventional electrolyte reservoir can serve as an electrolyte reservoir.

前述のように処理室内自体を最大の低圧にする
必要はない。即ち電解液を処理室内の内圧を低く
して循環せしめることが肝要である。この作用に
より濃毒煙及び有害ガスの発生を阻止し得る最大
利点の一つが達成されるのである。電気化学的方
法による圧力低下の効果は、それ自体圧力低下の
程度が小さければそれだけ効果は劣ることになる
が、多くの場合、普通の材質ならば被覆処理作業
には充分有効である。
As mentioned above, it is not necessary to make the inside of the processing chamber itself the lowest pressure possible. That is, it is important to circulate the electrolytic solution while lowering the internal pressure within the processing chamber. This action achieves one of the greatest advantages in preventing the generation of toxic smoke and noxious gases. The effect of pressure reduction by electrochemical methods is itself less effective as the degree of pressure drop is smaller, but in most cases, ordinary materials are sufficiently effective for coating operations.

本発明による処理方法は又上記の作業にも適用
でき、更に本発明の環境的利点としては安価に極
めて簡易な設備を補足するだけで充分利用するこ
とができることである。
The treatment method according to the present invention can also be applied to the above-mentioned operations, and the environmental advantage of the present invention is that it can be used at low cost and with the addition of extremely simple equipment.

電解液槽の自由液面と低圧系内の最高位置との
差異がほぼ1.5mになるような圧力差にすると良
好な成果を収め得られるのである。低圧系統の最
高位置は処理室の外側に位置せしめてもよい。電
解液が処理室と該処理室に連通する低圧循環機構
とを通過して流動循環する場合には、処理室の上
端に空気ばねを配設すれば、電解液に接触しない
箇所に処理室ケーシングを経て所要電源供給用ケ
ーブルを引込むことができる。この操作はケーブ
ルを引込んだ時にパツキングを用いれば、簡単に
行うことができる。
Good results can be obtained by setting the pressure difference such that the difference between the free liquid level of the electrolyte tank and the highest position in the low pressure system is approximately 1.5 m. The highest point of the low pressure system may be located outside the processing chamber. When the electrolytic solution flows and circulates through the processing chamber and a low-pressure circulation mechanism communicating with the processing chamber, if an air spring is installed at the upper end of the processing chamber, the processing chamber casing can be placed in a place where it does not come into contact with the electrolytic solution. The required power supply cable can be drawn in through the This operation can be easily performed by using packing when pulling in the cable.

本発明による処理方法を実施する装置は、電解
液槽、低圧室及び電解液槽から処理室内に流入す
る電解液が再び該電解液槽内に戻るように循環流
動させる堰止め機構とにより構成されてある。上
記の堰止め機構は例えば搾乳機に使用する所謂レ
リーザ(releaser)と同じ原理により作用する公
知の型式のものである。電解液槽から電解液は低
圧室内の低圧力の作用で低圧室まで直接吸い出さ
れるように流入するが、吸引ポンプを使用するこ
ともできる。
The apparatus for implementing the treatment method according to the present invention includes an electrolytic solution tank, a low-pressure chamber, and a dam mechanism that circulates and flows the electrolytic solution flowing into the processing chamber from the electrolytic solution tank so that it returns to the electrolytic solution tank. There is. The above-mentioned damming mechanism is of the known type, operating on the same principle as the so-called releaser used, for example, in milking machines. From the electrolyte tank, the electrolyte flows directly into the low-pressure chamber under the influence of the low pressure in the low-pressure chamber, but a suction pump can also be used.

電解処理法では電解液は加熱されるので、通常
冷却処理する必要がある。本発明による処理方法
では、例えば、処理室と堰止め機構との間に熱交
換器を配設して冷却処理を行うようにしてある
が、該熱交換器は電解液循環機構及び冷却機構に
それぞれ連結されてある。最終的には冷却処理は
電解液槽内でも行う必要があり、或る場合には加
熱することも必要になる。所望の温度を保持させ
るために電解液槽には適当な温度調整器が設けて
ある。上記の温度調整器は電解液循環機構内の熱
交換器として使用される電解液冷却機構に連結さ
れてあれば極めて便宜である。
In the electrolytic treatment method, the electrolyte is heated, so it usually needs to be cooled. In the treatment method according to the present invention, for example, a heat exchanger is disposed between the treatment chamber and the damming mechanism to perform cooling treatment, and the heat exchanger is connected to the electrolyte circulation mechanism and the cooling mechanism. Each is connected. Ultimately, the cooling process must also be performed within the electrolyte bath, and in some cases, heating may also be required. A suitable temperature regulator is provided in the electrolyte bath to maintain the desired temperature. It is very convenient if the temperature regulator described above is connected to an electrolyte cooling mechanism used as a heat exchanger within the electrolyte circulation mechanism.

本発明による処理装置には、各種寸法の被処理
体を電気メツキするため容積の異なる複数の低圧
室を設けたことが処理上極めて有利である。循環
機構は各種の低圧室を同時に又は選択的に使用で
きるように構成されてある。
It is very advantageous in terms of processing that the processing apparatus according to the present invention is provided with a plurality of low pressure chambers having different volumes for electroplating workpieces of various sizes. The circulation mechanism is configured so that various low pressure chambers can be used simultaneously or selectively.

本発明の処理方法に用いる装置の詳細を図示の
実施例について説明する。
The details of the apparatus used in the processing method of the present invention will be explained with reference to the illustrated embodiment.

第1図に於いて、符号1は電解液槽、2は小型
処理室、3は大型処理室をそれぞれ示す。上記電
解液槽1は連結管4を介して小型処理室2に連通
し、電解液が該連結管4を経て電解液槽1から小
型処理室2内に吸引作用で流入し、更に導管5及
び三方弁6を経て熱交換器7に流入し、該熱交換
器7により循環電解液は必要に応じて冷却され
る。電解液は熱交換器7より更に堰止め機構8の
上段室9内に流入する。真空ポンプ10が該堰止
め機構8の上段室9に連絡しているので、該電解
液は尚低圧状態に保たれてある。循環電解液は前
記の上段室9より逆送り弁(back stroke
valve)11及び導管12を経て堰止め機構8の
下段室13が低圧状態に保たれていればこの下段
室13内に逆流する。上記下段室13内に一定の
液面に達するまで電解液が充満した後、堰止め機
構8は自動的に下段室13と真空ポンプ10との
連絡を遮断し、該下段室を大気に連通させる作用
が行われる。従つて電解液は自重で導管1を経て
電解液槽1内に流入するようになつている。
In FIG. 1, reference numeral 1 indicates an electrolytic solution tank, 2 indicates a small processing chamber, and 3 indicates a large processing chamber. The electrolytic solution tank 1 communicates with the small processing chamber 2 via the connecting pipe 4, and the electrolytic solution flows through the connecting pipe 4 from the electrolytic solution tank 1 into the small processing chamber 2 by suction, and further through the conduit 5 and the small processing chamber 2. The circulating electrolyte flows into a heat exchanger 7 via a three-way valve 6, and is cooled by the heat exchanger 7 as required. The electrolytic solution further flows from the heat exchanger 7 into the upper chamber 9 of the dam mechanism 8 . Since the vacuum pump 10 is connected to the upper chamber 9 of the damming mechanism 8, the electrolyte is still maintained at a low pressure. The circulating electrolyte is passed through a back stroke valve from the upper chamber 9.
If the pressure in the lower chamber 13 of the damming mechanism 8 is maintained at a low pressure, the water flows back through the lower chamber 13 of the damming mechanism 8 through the valve) 11 and the conduit 12. After the lower chamber 13 is filled with the electrolyte until it reaches a certain level, the damming mechanism 8 automatically cuts off the communication between the lower chamber 13 and the vacuum pump 10, and communicates the lower chamber with the atmosphere. action takes place. Therefore, the electrolyte flows into the electrolyte tank 1 through the conduit 1 under its own weight.

電解液は又連結管16を経て大型処理室3に吸
引作用で流入し、更に導管17と三方弁6を経て
熱交換器7と堰止め機構8内に流入する。電解液
を所望の循環流動させるには三方弁6を調整する
ことにより達成できる。この三方弁6は小型及び
大型処理室を経て同時に循環せるように構成され
てある。
The electrolyte also flows by suction into the large processing chamber 3 via the connecting pipe 16, and further into the heat exchanger 7 and the dam mechanism 8 via the conduit 17 and the three-way valve 6. The desired circulation flow of the electrolyte can be achieved by adjusting the three-way valve 6. This three-way valve 6 is configured to allow circulation through the small and large processing chambers at the same time.

第1図に示した装置は液体冷却用閉鎖回路18
を設け、該回路18は膨脹室19、扇風機20の
作動により冷却器21、循環ポンプ22及び所要
の設備即ち例えば閉鎖弁23及び逆送り弁24を
それぞれ備えている。冷却用水は熱交換器7を経
て循環し、又必要に応じて電解液槽の周囲又は内
部を流動する。例えば時々被覆処理の初期段階に
於いて、電解液の温度が低く過ぎる場合には加熱
処理が必要である。電解液を加熱するために電解
液槽は電熱装置25を設けてある。
The device shown in FIG. 1 is a closed circuit 18 for liquid cooling.
The circuit 18 is equipped with an expansion chamber 19, a cooler 21 operated by an electric fan 20, a circulation pump 22 and the necessary equipment, such as a closing valve 23 and a reversing valve 24, respectively. The cooling water circulates through the heat exchanger 7 and flows around or inside the electrolyte bath as required. For example, sometimes in the early stages of the coating process a heat treatment is necessary if the temperature of the electrolyte is too low. The electrolyte bath is equipped with an electric heating device 25 to heat the electrolyte.

実際的に被覆処理は電力を普通外部から供給す
るとにより処理室2又は3内で行われ、電熱装置
活性化用電力ケーブル26及び27を経て供給さ
れる。この被覆処理方法は大体に於いて公知の電
気メツキ方法に準じて行われている。
In practice, the coating process is carried out in the process chamber 2 or 3 by supplying power, usually from outside, via power cables 26 and 27 for activating the electric heating device. This coating treatment method is generally carried out in accordance with a known electroplating method.

第2図に於いて、下端が開放されてある処理室
2は電解液槽1内に沈設されてる。該処理室2が
真空ポンプ10に連結されているので、電解液槽
1内の電解液34は処理室1内で所望の液面まで
上昇する。電解液は処理室2から導管5を経て堰
止め機構8に流入し、更に戻し導管15を経て電
解液槽1に逆流し循環流動する。2図は更に電力
ケーブル26,27、及びそれらの引込パツキン
グ40、電極41をそれぞれ示してある。空気ば
ね43は上記引込ケーブル用パツキング40の下
方に形成され、処理室2の該パツキング40が電
解液に直接接触しないように防止する役目を果す
ようになつている。
In FIG. 2, a processing chamber 2 whose lower end is open is submerged within an electrolyte tank 1. Since the processing chamber 2 is connected to the vacuum pump 10, the electrolytic solution 34 in the electrolytic solution tank 1 rises to a desired level within the processing chamber 1. The electrolytic solution flows from the processing chamber 2 through the conduit 5 into the damming mechanism 8, and further flows back into the electrolytic solution tank 1 through the return conduit 15 for circulation. FIG. 2 further shows power cables 26, 27, their lead-in packings 40, and electrodes 41, respectively. The air spring 43 is formed below the lead-in cable packing 40 and serves to prevent the packing 40 of the processing chamber 2 from coming into direct contact with the electrolyte.

第3図に示した処理装置は第1図の処理装置に
相当するものである。水洗流体用容器45を備
え、該容器45は三方弁46及び47により電解
液槽1の代りに電解液循環機構に連結されてあ
る。電解液槽1が循環機構から遮断され、水洗流
体用容器45の循環機構に連絡すれば、水洗流体
は該容器45から導管48及び三方弁46を経て
処理室2に流入し、該処理室2内で被処理体を水
洗処理するようになつている。水洗流体は更に導
管5、堰止め機構8、戻し導管15及び三方弁4
7と導管49を経て、前記と同じように水洗流体
用容器45内に再び流入する。本発明によるこの
実施例によれば水洗処理のため被処理体を移動さ
せる必要がなく、実際的な被覆処理中と同じよう
に低圧循環機構を利用して処理室内で水洗作業を
行うことができることは極めて有利である。この
ような方法により迅速に且つ分秒の無駄なく水洗
処理を引続い行うことができる。
The processing device shown in FIG. 3 corresponds to the processing device shown in FIG. A washing fluid container 45 is provided, and the container 45 is connected to the electrolyte circulation mechanism in place of the electrolyte tank 1 by three-way valves 46 and 47. When the electrolyte tank 1 is cut off from the circulation mechanism and connected to the circulation mechanism of the washing fluid container 45, the washing fluid flows from the container 45 through the conduit 48 and the three-way valve 46 into the processing chamber 2, The object to be treated is washed with water inside the chamber. The flushing fluid is further supplied to a conduit 5, a dam mechanism 8, a return conduit 15 and a three-way valve 4.
7 and conduit 49, it flows again into the flushing fluid container 45 in the same way as before. According to this embodiment of the present invention, there is no need to move the object to be treated for washing, and the washing can be carried out in the processing chamber using a low-pressure circulation mechanism in the same way as during actual coating processing. is extremely advantageous. With this method, the water washing process can be carried out rapidly and without wasting any time.

本発明による処理方法を用いて、上記の条件に
基いて硬質クロムメツキ処理を行い、極めて良好
な結果を収め得た一例を示す。
An example in which hard chrome plating was performed using the treatment method according to the present invention under the above conditions and achieved very good results will be shown.

電解液は所謂自動調節電解液(SRHS)で、温
度は電解液製造業者の勧告に従つて調節した。処
理室内の圧力は0.85atmで、電流密度は100A/
dm2の値まで上昇させることができたが、上記の
条件にも拘らず、極めて堅牢で均一した被覆処理
を行うことができた。
The electrolyte was a so-called self-regulating electrolyte (SRHS) and the temperature was adjusted according to the recommendations of the electrolyte manufacturer. The pressure inside the processing chamber is 0.85atm, and the current density is 100A/
dm 2 and, despite the above conditions, a very robust and uniform coating process could be achieved.

電解液 SRHS110 処理温度 60℃ 電流密度 80A/dm2 被処理体 円筒状鋳鉄管 本発明は上述の実施例に限定するものでなく、
特許請求の範囲を逸脱することなく種々に変形さ
せることができる。
Electrolyte SRHS110 Processing temperature 60°C Current density 80A/dm 2Object to be processed Cylindrical cast iron pipe The present invention is not limited to the above-mentioned embodiments,
Various modifications can be made without departing from the scope of the claims.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の処理方法に用いる装置の第1
実施例に於ける構成を示した側面図、第2図は上
記装置の第2実施例に於ける要部を示し側面図、
第3図は上記装置の3実施例を示した側面図であ
る。 図中の符号、1…電解液槽、2…小型処理室、
3…大型処理室、4,16…連結管、5,12,
15,17,48及び49…導管、6…三方弁、
7…熱交換器、8…堰止め機構、9…上段室、1
0…真空ポンプ、11,24…逆送り弁、13…
下段室、18…液体冷却用閉鎖回路、20…扇風
器、21…冷却器、22…循環ポンプ、23…閉
鎖弁、26,27…ケーブル、25…電熱装置、
34…電解液、40…引込ケーブル用パツキン
グ、41…電極、42…被処理体、43…空気ば
ね、45…水洗流体用容器、46,47…三方
弁。
Figure 1 shows the first part of the apparatus used in the treatment method of the present invention.
FIG. 2 is a side view showing the configuration of the embodiment; FIG. 2 is a side view showing the main parts of the second embodiment of the device;
FIG. 3 is a side view showing three embodiments of the above device. Symbols in the diagram: 1... Electrolyte tank, 2... Small processing chamber,
3...Large processing chamber, 4,16...Connecting pipe, 5,12,
15, 17, 48 and 49... conduit, 6... three-way valve,
7... Heat exchanger, 8... Weir mechanism, 9... Upper chamber, 1
0... Vacuum pump, 11, 24... Reverse feed valve, 13...
Lower chamber, 18... closed circuit for liquid cooling, 20... electric fan, 21... cooler, 22... circulation pump, 23... closing valve, 26, 27... cable, 25... electric heating device,
34... Electrolytic solution, 40... Packing for lead-in cable, 41... Electrode, 42... Treated object, 43... Air spring, 45... Washing fluid container, 46, 47... Three-way valve.

Claims (1)

【特許請求の範囲】 1 電解処理室内の電解液に金属被覆すべき物品
の表面を浸漬して上記物品と電解液との間に電流
を流し、上記物品の表面に金属被膜を施す電気メ
ツキ方法にいて、上記電解処理室を含む空間内に
外気が浸入しないように同空間をシールして同電
解処理室内に電解液を循環せしめ、上記空間内の
電解液に作用する圧を0.85気圧以下に保つことを
特徴とする電気メツキ方法。 2 電解液を循環中適度に冷却又は加熱する特許
請求の範囲第1項に記載の方法。 3 上記空間内の電解液に作用する低圧によつて
上記空間外との電解液を循環を行う特許請求の範
囲第1項に記載の方法。 4 前記電解処理室は下端が電解液槽内の液面下
に開口した容器で構成され、その内部に生ずる低
圧により所望の液面まで電解液を充満させる特許
請求の範囲第1項に記載の方法。 5 電解液槽内の自由液面と電解処理室内の液面
の差異を約1.5m又はそれ以上にしてある特許請
求の範囲第4項に記載の処理方法。 6 前記低圧電解処理室の内部上端に空気ばねを
形成する特許請求の範囲第4項に記載の処理方
法。 7 電解液槽と、大気圧より低い低圧に保つこと
のできる低圧電解処理室と、該電解液槽より低圧
電解処理室内に流入する電解溶液を再び電解液槽
内に逆戻りするように循環させる堰止め循環機構
とを設けたことを特徴とする電解処理装置。 8 上記電解液槽には温度調整機構が設けてある
特許請求の範囲第4項に記載の処理装置。 9 前記低圧電解処理室は下端が電解液槽内の液
面下に開口した容器で構成され、且つ減圧装置に
連結されている特許請求の範囲第7項に記載の装
置。 10 電解液槽と、大気圧より低い低圧に保つこ
とのできる低圧電解処理室と、該電解液槽より低
圧電解処理室内に流入する電解溶液を再び電解液
槽内に逆戻りするように循環させる堰止め循環機
構とを設けた処理装置において、該堰止め循環機
構に連結して、一個或いは数個の水洗流体用容器
を設け、これによつて電解液槽と上記堰止め循環
機構とは連通を断ち、該電解液槽の代りに一個又
は数個の水洗流体用容器と該循環機構とを連絡さ
せて水洗流体が該機構内を流動循環するように構
成されている処理装置。
[Scope of Claims] 1. An electroplating method in which the surface of an article to be metal coated is immersed in an electrolytic solution in an electrolytic treatment chamber and a current is passed between the article and the electrolyte to form a metal coating on the surface of the article. The space containing the electrolytic treatment chamber is sealed to prevent outside air from entering the space, and the electrolytic solution is circulated within the electrolytic processing chamber, and the pressure acting on the electrolytic solution in the space is reduced to 0.85 atmospheres or less. An electroplating method characterized by: 2. The method according to claim 1, wherein the electrolytic solution is appropriately cooled or heated during circulation. 3. The method according to claim 1, wherein the electrolyte is circulated to and from the outside of the space by low pressure acting on the electrolyte in the space. 4. The electrolytic treatment chamber is constituted by a container whose lower end is opened below the liquid level in the electrolytic solution tank, and the electrolytic treatment chamber is filled with the electrolytic solution to a desired liquid level by the low pressure generated inside the container. Method. 5. The treatment method according to claim 4, wherein the difference between the free liquid level in the electrolytic solution tank and the liquid level in the electrolytic treatment chamber is about 1.5 m or more. 6. The processing method according to claim 4, wherein an air spring is formed at the upper end of the interior of the low-pressure electrolytic processing chamber. 7 An electrolytic solution tank, a low-pressure electrolytic treatment chamber that can maintain a low pressure lower than atmospheric pressure, and a weir that circulates the electrolytic solution flowing from the electrolytic solution tank into the low-pressure electrolytic treatment chamber so that it returns back into the electrolytic solution tank. An electrolytic treatment device characterized by being provided with a stop circulation mechanism. 8. The processing apparatus according to claim 4, wherein the electrolytic solution tank is provided with a temperature adjustment mechanism. 9. The apparatus according to claim 7, wherein the low-pressure electrolytic treatment chamber is constituted by a container whose lower end opens below the liquid level in the electrolytic solution tank, and is connected to a pressure reducing device. 10 An electrolytic solution tank, a low-pressure electrolytic treatment chamber that can maintain a low pressure lower than atmospheric pressure, and a weir that circulates the electrolytic solution flowing from the electrolytic solution tank into the low-pressure electrolytic treatment chamber so that it returns back into the electrolytic solution tank. In a processing device equipped with a stop circulation mechanism, one or several containers for washing fluid are provided connected to the stop circulation mechanism, whereby the electrolyte tank and the stop circulation mechanism are communicated with each other. A processing device configured to connect one or more washing fluid containers to the circulation mechanism instead of the electrolyte tank so that the washing fluid flows and circulates within the mechanism.
JP51052042A 1975-05-07 1976-05-07 Chemical or electrochemical treatment method and apparatus therefor Granted JPS51149131A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI751337A FI53841C (en) 1975-05-07 1975-05-07 ELEKTROLYTISK YTBELAEGGNINGSANORDNING

Publications (2)

Publication Number Publication Date
JPS51149131A JPS51149131A (en) 1976-12-21
JPS6125799B2 true JPS6125799B2 (en) 1986-06-17

Family

ID=8509187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51052042A Granted JPS51149131A (en) 1975-05-07 1976-05-07 Chemical or electrochemical treatment method and apparatus therefor

Country Status (14)

Country Link
JP (1) JPS51149131A (en)
BE (1) BE841590A (en)
CA (1) CA1093012A (en)
CH (1) CH620247A5 (en)
DD (1) DD125995A5 (en)
DE (1) DE2619987A1 (en)
DK (1) DK151906C (en)
FI (1) FI53841C (en)
FR (1) FR2310425A1 (en)
GB (1) GB1551340A (en)
HK (1) HK97184A (en)
IT (1) IT1061259B (en)
NO (1) NO148193C (en)
SE (2) SE7512925L (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2104918B (en) * 1981-08-19 1984-12-19 Inoue Japax Res Electrodepositing a metal on a conductive surface
JPH03505348A (en) * 1988-11-24 1991-11-21 グラム,ゲルハルト Equipment for depositing and/or removing coatings on workpieces
JPH0772357B2 (en) * 1989-03-07 1995-08-02 日本電気株式会社 Electroplating method
GB2324805A (en) * 1997-04-30 1998-11-04 Platt Electromeck Limited Electroplating
WO2000010200A1 (en) * 1998-08-11 2000-02-24 Ebara Corporation Wafer plating method and apparatus
US20060091020A1 (en) * 2004-10-29 2006-05-04 Medtronic, Inc. Processes and systems for formation of high voltage, anodic oxide on a valve metal anode
PL2180088T5 (en) * 2008-10-22 2020-11-16 Macdermid Enthone Inc. Method for electroplating hard chrome layers
EP3530776B1 (en) 2018-02-26 2020-07-08 Cockerill Maintenance & Ingenierie S.A. Localised surface treatment installation and method for industrial parts

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR661883A (en) * 1928-01-31 1929-07-31 Improvements to electrolysers
FR976098A (en) * 1942-04-09 1951-03-13 Condensateurs S A Soc Ind Des Electrolysis tank
US2465747A (en) * 1945-04-30 1949-03-29 Rca Corp Apparatus for electroplating metal
BE563570A (en) * 1956-12-28
DE2106164A1 (en) * 1971-02-10 1972-08-24 Forstmann E Electro deposition cell - subdivided by permeable partition

Also Published As

Publication number Publication date
FI53841B (en) 1978-05-02
GB1551340A (en) 1979-08-30
DE2619987A1 (en) 1976-11-25
CA1093012A (en) 1981-01-06
NO148193C (en) 1983-08-24
DD125995A5 (en) 1977-06-08
FI53841C (en) 1978-08-10
BE841590A (en) 1976-09-01
DK151906B (en) 1988-01-11
NO761570L (en) 1976-11-09
HK97184A (en) 1984-12-21
DK205176A (en) 1976-11-08
SE7512925L (en) 1976-11-08
CH620247A5 (en) 1980-11-14
SE8506146D0 (en) 1985-12-27
NO148193B (en) 1983-05-16
JPS51149131A (en) 1976-12-21
DK151906C (en) 1988-08-08
FR2310425B1 (en) 1980-08-29
SE8506146L (en) 1985-12-27
FI751337A (en) 1976-11-08
IT1061259B (en) 1983-02-28
FR2310425A1 (en) 1976-12-03

Similar Documents

Publication Publication Date Title
JPS6125799B2 (en)
US4066515A (en) Apparatus and method for the electrodepositing of aluminum
US3002907A (en) Electrolytic hole sinking
CN1769526B (en) Method and device for internal wall ceramic treatment of steel and iron pipe casting
US5534126A (en) Apparatus and method for selective coating of metal parts
US4163705A (en) Apparatus for chemical and electrochemical treatment
US3633895A (en) Vacuum water dump quench
CN211256147U (en) Water bath circulation heating system of plating bath
US5411652A (en) Optimum conversion chamber
CN110923798B (en) Liquid supply device for electrochemical polishing
US2549099A (en) Process for stripping color from dyed wool
JPS6239240B2 (en)
CN117568907B (en) Electroplating process of nickel-palladium-gold lead frame
JPS6034667A (en) Low bath ratio beam dyeing and other cloth treating method
CN218585936U (en) Automatic temperature control water replenishing tank convenient for cleaning silicon wafers
JP5167983B2 (en) Plating pretreatment method and surface treatment apparatus
JPH09291385A (en) Water circulating device of water electrolyzer
JP2000346790A (en) Spray type heat treatment apparatus
KR20050115646A (en) Electroless plating process & electroless plating process and apparatus for the cooling line of metal mold
JPH09272902A (en) Device for impregnating porous member
JP2530029Y2 (en) Painting pretreatment equipment
GB905278A (en) Improvements in or relating to apparatus for the treatment of steel strip
JPH04310319A (en) Electric discharge machining device
SU1371986A1 (en) Unit for chemical nickel-plating
JPS5697860A (en) Apparatus for cataphoresis