JP2000346790A - Spray type heat treatment apparatus - Google Patents

Spray type heat treatment apparatus

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Publication number
JP2000346790A
JP2000346790A JP11158062A JP15806299A JP2000346790A JP 2000346790 A JP2000346790 A JP 2000346790A JP 11158062 A JP11158062 A JP 11158062A JP 15806299 A JP15806299 A JP 15806299A JP 2000346790 A JP2000346790 A JP 2000346790A
Authority
JP
Japan
Prior art keywords
liquid
processing
temperature
tank
spray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11158062A
Other languages
Japanese (ja)
Other versions
JP3425393B2 (en
Inventor
Shigehisa Hattori
榮久 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tabai Espec Co Ltd
Original Assignee
Tabai Espec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tabai Espec Co Ltd filed Critical Tabai Espec Co Ltd
Priority to JP15806299A priority Critical patent/JP3425393B2/en
Publication of JP2000346790A publication Critical patent/JP2000346790A/en
Application granted granted Critical
Publication of JP3425393B2 publication Critical patent/JP3425393B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a heat treatment apparatus easily treating an object to be treated by spraying heating and clooling treatment solns. thereon, made compact as a whole by miniaturizing a treatment soln. storage tank to be reduced in its installation space and capable of easily performing the changeover of the heating and cooling of the object to be treated and the alteration of treatment temp. conditions for a short time. SOLUTION: In a spray type heat treatment apparatus equipped with a treatment tank 2 enabling the taking in and out of an object (s) to be treated and having a spray nozzle 6 for spraying a treatment soln. on the object (s) to be treated and a treatment soln. storage tank 11 and spraying the treatment soln. (h) on the object (s) to be treated in the treatment tank 2 from the spray nozzle 6 to apply a heat shock to the object (s) to be treated, a circulating pump 12 sucking the treatment solns. (h) in both of the storage tank 11 and the treatment tank 2 at the same time or selectively to supply them to the storage tank 11 and the treatment tank 2 at the same time or selectively is provided to a piping 18 and a heat exchanger 13 is provided on the way of the piping 18.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、小型精密機器や
電子機器などの小型(熱容量の小さい)の部品類(以
下、被処理物という)などの熱処理、熱衝撃試験、洗浄
等に使用するための、噴霧式熱処理装置又は噴霧式熱試
験装置(以下、単に噴霧式熱処理装置という)に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for heat treatment, thermal shock test, cleaning, etc. of small (small heat capacity) parts (hereinafter referred to as "objects to be treated") such as small precision equipment and electronic equipment. The present invention relates to a spray heat treatment apparatus or a spray heat test apparatus (hereinafter, simply referred to as a spray heat treatment apparatus).

【0002】[0002]

【従来の技術】上記の部品類などを処理液を用いて加熱
したり冷却したりして熱衝撃を与えて試験する熱試験装
置70は、図7に示すように、熱交換エレメントとして
のヒーター73を備えた加熱用高温液hの貯留槽71
と、熱交換エレメントとしての冷却器74を備えた冷却
用低温液cの貯留槽72との2槽方式が一般的で、部品
類s等を籠状容器に入れて昇降機構80により選択的に
各貯留槽71/72内の液中に降下させて浸漬すること
により行われている。
2. Description of the Related Art As shown in FIG. 7, a thermal test apparatus 70 for heating and cooling the above components and the like by using a processing liquid and applying a thermal shock to test the components is a heater as a heat exchange element. Storage tank 71 for heating high-temperature liquid h provided with 73
And a storage tank 72 for a low-temperature liquid for cooling c provided with a cooler 74 as a heat exchange element. In general, parts s and the like are put in a basket-like container and selectively moved by a lifting mechanism 80. It is carried out by lowering and immersing in the liquid in each storage tank 71/72.

【0003】この種の装置に関する先行技術に、例えば
特公平3−71062号公報、および特開平4−225
137号公報に記載の発明があるが、基本的にはいずれ
も図7に示した上記の構造からなる。
[0003] Prior art relating to this type of apparatus is disclosed in, for example, Japanese Patent Publication No. 3-71062 and Japanese Patent Laid-Open No. 4-225.
Although there is an invention described in Japanese Patent Publication No. 137, all of them basically have the above structure shown in FIG.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上記公
報に記載の発明を含め従来の一般的な熱試験装置では、
次のような問題がある。すなわち、 大容量の液槽が2基必要なために、装置全体が大型
化し、広い設置スペースを要する。
However, in the conventional general thermal test apparatus including the invention described in the above publication,
There are the following problems. That is, since two large-capacity liquid tanks are required, the entire apparatus becomes large and a large installation space is required.

【0005】 液槽は熱容量が大きいために、液温の
安定性には優れているが、反面、処理液の温度条件を変
更する場合に、長時間を要する。
[0005] The liquid tank has a large heat capacity and thus is excellent in the stability of the liquid temperature, but on the other hand, it takes a long time to change the temperature condition of the processing liquid.

【0006】 部品等の被処理物を各処理液の貯留槽
へ移動し、処理液中に浸漬する必要があるため、処理操
作が複雑で時間がかかるうえに、移動の際に被処理物を
傷つけるおそれがある。
Since it is necessary to move an object to be processed such as a component to a storage tank for each processing liquid and immerse the processing object in the processing liquid, the processing operation is complicated and time-consuming. There is a risk of injury.

【0007】この発明は上述の点に鑑みなされたもの
で、被処理物に対し加熱用・冷却用の処理液を噴霧して
処理することにより、処理を容易にし、また処理液の貯
留槽を小型化して装置全体をコンパクトにし、設置スペ
ースの削減を図るとともに、被処理物の加熱・冷却など
の切換ならびに処理温度条件の変更が容易かつ短時間に
行える熱処理装置を提供することを目的としている。
SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and makes it easy to process by spraying a processing liquid for heating and cooling on an object to be processed. It is an object of the present invention to provide a heat treatment apparatus that can be reduced in size to make the entire apparatus compact, reduce installation space, and can easily and quickly change over heating / cooling of an object to be processed and change processing temperature conditions. .

【0008】[0008]

【課題を解決するための手段】上記の目的を達成するた
めに本発明に係る熱処理装置は、被処理物を出し入れ可
能で該被処理物に対し処理液を噴霧する噴霧ノズルを備
えた処理槽と、前記処理液を貯留する貯留タンク(貯留
槽)とを具備し、前記処理槽内の被処理物に対して前記
噴霧ノズルから処理液を噴霧させることにより被処理物
を所定温度に保持したり、被処理物に熱衝撃を与えたり
するための噴霧式熱処理装置であって、前記貯留タンク
内および前記処理槽内の処理液を両方同時にあるいは選
択的に吸引するとともに、吸引した処理液を前記貯留タ
ンクおよび前記処理槽へ両方同時にあるいは選択的に送
給できるように循環ポンプを介在させて配管し、該配管
の途中に熱交換器を介設したことを特徴としている。
In order to achieve the above object, a heat treatment apparatus according to the present invention is provided with a processing tank provided with a spray nozzle capable of taking in and out a processing object and spraying a processing liquid onto the processing object. And a storage tank (storage tank) for storing the processing liquid. The processing liquid is sprayed onto the processing object in the processing tank from the spray nozzle to maintain the processing object at a predetermined temperature. Or, a spray type heat treatment apparatus for giving a thermal shock to the object to be processed, and simultaneously or selectively aspirate the processing liquid in the storage tank and the processing tank simultaneously, and the sucked processing liquid A piping is provided via a circulation pump so that both can be fed to the storage tank and the processing tank simultaneously or selectively, and a heat exchanger is provided in the middle of the piping.

【0009】上記の構成を有する本発明の熱処理装置に
よれば、処理槽内に被処理物を収納した状態で、あらか
じめ設定温度に保持して貯留タンクに貯留されている処
理液を、処理槽内の噴霧ノズルから被処理物に向けて噴
霧し、加熱したり冷却したりできる。また、処理槽内に
噴霧された処理液は処理槽内に徐々に貯留されていくの
で、処理槽内に貯留される処理液の量に応じて、つまり
処理液の貯留量が少ない(低位の)場合には、貯留タン
ク内の処理液を噴霧ノズルに供給して被処理物に噴霧
し、逆に処理液の貯留量が多い(高位の)場合には、処
理槽内の処理液を熱交換器を経由して貯留タンクに循環
して噴霧ノズルから被処理物に噴霧し、また処理液の貯
留量が中程度(中位)の場合には、貯留タンク内の処理
液および処理槽内の処理液をそれぞれ循環ポンプにより
吸引し噴霧ノズルに供給して被処理物に噴霧するなど、
処理槽内に貯留されている処理液の量に応じて効果的に
設定温度に保持しながら被処理物に噴霧することができ
る。このように加熱用又は冷却用処理液を被処理物に噴
霧して処理するから、被処理物を設定温度で貯留した貯
留タンクの処理液に浸漬して処理する従来の装置に比べ
て、処理液の貯留タンクが小容量で済むので、小型化し
て装置全体をコンパクトにし、設置スペースの削減を図
れる。
According to the heat treatment apparatus of the present invention having the above-described structure, the processing solution stored in the storage tank while being maintained at the preset temperature in a state where the processing object is stored in the processing tank is processed. It can be heated and cooled by spraying from the spray nozzle in the inside toward the object to be processed. Further, since the processing liquid sprayed into the processing tank is gradually stored in the processing tank, the storage amount of the processing liquid is small according to the amount of the processing liquid stored in the processing tank, that is, the storage amount of the processing liquid is low (lower ), The processing liquid in the storage tank is supplied to the spray nozzle and sprayed on the object to be processed. Conversely, when the storage amount of the processing liquid is large (high order), the processing liquid in the processing tank is heated. Circulated to the storage tank via the exchanger and sprayed from the spray nozzle onto the object to be processed, and when the storage amount of the processing liquid is medium (medium), the processing liquid in the storage tank and the processing tank Each of the processing liquids is sucked by a circulation pump and supplied to the spray nozzle to spray on the workpiece.
It is possible to spray the processing object while effectively maintaining the set temperature according to the amount of the processing liquid stored in the processing tank. As described above, since the processing liquid for heating or cooling is sprayed onto the processing target, the processing is performed, so that the processing target is immersed in the processing liquid in the storage tank storing the processing target at the set temperature, and the processing is performed in comparison with the conventional apparatus. Since the liquid storage tank requires only a small capacity, it can be downsized to make the entire apparatus compact and reduce the installation space.

【0010】請求項2に記載のように、前記処理液を送
給するために加熱用高温液貯留タンクと高温液熱交換器
および冷却用低温液貯留タンクと低温液熱交換器との2
組の系統を設け、各貯留タンクおよび各熱交換器の外壁
に保温構造を施し、前記処理槽内の前記噴霧ノズルへ加
熱用高温液および冷却用低温液のいずれか一方を選択的
に供給するための開閉弁を、前記高温液循環系配管およ
び前記低温液循環系配管にそれぞれ介設することができ
る。
According to a second aspect of the present invention, a high-temperature liquid storage tank for heating and a high-temperature liquid heat exchanger and a low-temperature liquid storage tank for cooling and a low-temperature liquid heat exchanger are used to supply the processing liquid.
A set of systems is provided, a heat retaining structure is provided on the outer wall of each storage tank and each heat exchanger, and either the high-temperature heating liquid or the low-temperature cooling liquid is selectively supplied to the spray nozzle in the processing tank. Open / close valve can be interposed in the high-temperature liquid circulation system piping and the low-temperature liquid circulation system piping, respectively.

【0011】請求項2記載の熱処理装置によれば、貯留
タンクが保温構造を有することから、貯留される処理液
としての高温液と低温液とが温度変化しにくく、しかも
高温液と低温液をそれぞれ熱交換器を経由させて循環さ
せることにより、所定の設定温度に容易にかつ正確に保
持できる。とくに、冷熱衝撃試験等において被処理物に
対し例えば高温液を噴霧したのち低温液を噴霧して加熱
処理と冷却処理とを交互に行う場合にも、あらかじめ設
定温度に保持して貯留している貯留タンクから高温液あ
るいは低温液を吸引すると同時に処理槽底部より吸収す
る処理液を混合して噴霧処理するので、被処理物に対す
る加熱・冷却などの処理(試験)条件の切換ならびに処
理液の温度条件の変更を正確にして容易かつ短時間に行
うことができる。
According to the heat treatment apparatus of the present invention, since the storage tank has a heat retaining structure, the temperature of the high-temperature liquid and the low-temperature liquid as the processing liquid to be stored does not easily change, and the high-temperature liquid and the low-temperature liquid are separated. By circulating through the respective heat exchangers, it is possible to easily and accurately maintain a predetermined set temperature. In particular, in the case of performing a heating treatment and a cooling treatment alternately by spraying a high-temperature liquid on the object to be processed in a thermal shock test or the like, for example, and then spraying a low-temperature liquid, the object is held at a preset temperature and stored. The high-temperature liquid or low-temperature liquid is sucked from the storage tank, and at the same time, the processing liquid absorbed from the bottom of the processing tank is mixed and sprayed, so that the processing (test) conditions such as heating and cooling of the workpiece are switched, and the temperature of the processing liquid The condition can be changed accurately and easily and quickly.

【0012】請求項3に記載のように、前記処理槽に給
排気口を設けると、その給排気口を開閉可能に構成し、
給排気が必要なときにだけ開口することにより、冷熱衝
撃試験等において処理槽内雰囲気を常温にすることがで
きる(いわゆる、常温さらし)。また、強制的に通気す
る装置(必要に応じて温度調節可能な換気装置)を装備
しておき、噴霧ノズルから例えば蒸気や冷却ガスを被処
理物に対し噴霧させたときに、あるいは加熱時などに被
処理物からガスが発生したときに、強制的に換気して排
気口から排出させることができる。
According to a third aspect of the present invention, when the processing tank is provided with a supply / exhaust port, the supply / exhaust port is configured to be openable and closable,
By opening only when air supply and exhaust are required, the atmosphere in the processing tank can be brought to room temperature in a thermal shock test or the like (so-called room temperature exposure). In addition, a device for forced ventilation (ventilation device whose temperature can be adjusted as necessary) is provided, and when, for example, steam or cooling gas is sprayed from the spray nozzle onto the workpiece, or when heating is performed. When a gas is generated from the object to be processed, it can be forcibly ventilated and discharged from the exhaust port.

【0013】請求項4に記載のように、前記処理槽の底
部に排液口を備えた液溜まり部を形成し、該液溜まり部
内に、前記加熱用高温液貯留タンクへの循環ポンプおよ
び同循環ポンプ側開閉弁と、前記冷却用低温液貯留タン
クへの循環ポンプおよび同循環ポンプ側開閉弁等の運転
切換用レベルスイッチを配備することが好ましい。
According to a fourth aspect of the present invention, a liquid reservoir having a drain port is formed at the bottom of the processing tank, and a circulating pump for the heating high-temperature liquid storage tank and a liquid pump are provided in the liquid reservoir. It is preferable to provide a circulation pump side opening / closing valve, a circulation pump to the cooling low-temperature liquid storage tank, and an operation switching level switch such as the circulation pump side opening / closing valve.

【0014】請求項4記載の熱処理装置によれば、被処
理物に対する加熱処理と冷却処理等の異なる温度処理を
交互に行う際に、処理槽底部の液溜まり部に溜まった処
理液(例えば高温から低温に切り換わるときに高温液)
が循環ポンプによりほとんど残らず吸引され、空かほと
んど空になった状態で、この状態をレベルスイッチが検
知し、液溜まり部の処理液(高温液)側の循環ポンプお
よび同循環ポンプ側開閉弁と、他方の処理液(低温液)
側の循環ポンプおよび同循環ポンプ側開閉弁等の運転や
開閉状態が切り換わり、低温液が処理槽内に供給され冷
却処理が開始されることになる。このため、使用者は被
処理物を入れ換えるなどの簡単な作業をするだけで、後
はほとんど自動的に処理することができる。
According to the heat treatment apparatus of the present invention, when alternately performing different temperature treatments such as a heating treatment and a cooling treatment for the object to be treated, the treatment liquid (for example, high temperature High temperature liquid when switching from low to low)
Is almost completely sucked out by the circulating pump, and the level switch detects this state when it is empty or almost empty, and the circulating pump and the on-off valve on the circulating pump on the processing liquid (high-temperature liquid) side in the liquid pool. And the other processing liquid (low temperature liquid)
The operation and the open / close state of the circulating pump and the circulating pump side opening / closing valve are switched, and the low-temperature liquid is supplied into the processing tank to start the cooling process. For this reason, the user only needs to perform a simple operation such as replacing the object to be processed, and the processing can be almost automatically performed thereafter.

【0015】請求項5に記載のように、前記開閉弁を、
(出口側)二方へそれぞれ独立して流量調節可能な三方
切換弁にすると、配管系統の構成が簡略化され好まし
い。
According to a fifth aspect of the present invention, the on-off valve is
(Outlet side) It is preferable to use a three-way switching valve capable of adjusting the flow rate independently to the two directions since the configuration of the piping system is simplified.

【0016】請求項5記載の熱処理装置によれば、例え
ば図4に示すように、弁体を中立状態(図4(a))から
特定方向(時計方向又は反時計方向)に略90°回転さ
せることにより処理液の流れ方向(供給方向)が、二方
向から一方向へ変更される。また、弁体を中立状態(図
4(a))から特定方向に数十度(例えば10〜20°)
回転させることにより、処理液の流れ方向は二方向のま
まで一方向への流量(供給量)だけを絞る(図4(b))
などの任意の流量調節が可能になる。したがって、とく
に上記の請求項1〜4に記載の各熱処理装置において貯
留タンクと処理槽からの処理液の流量(吸引量)、ある
いは貯留タンクと処理槽への処理液の流量(供給量)な
どを正確にかつ確実に調節することができ、処理槽の噴
霧ノズルより被処理物に対し噴霧させる処理液の温度を
所定温度に正確に保つことができる。
According to the heat treatment apparatus of the fifth aspect, for example, as shown in FIG. 4, the valve body is rotated by about 90 ° in a specific direction (clockwise or counterclockwise) from a neutral state (FIG. 4A). This changes the flow direction (supply direction) of the processing liquid from two directions to one direction. Further, the valve body is moved from the neutral state (FIG. 4A) to a specific direction by several tens of degrees (for example, 10 to 20 degrees).
By rotating, only the flow rate (supply amount) in one direction is reduced while the flow direction of the processing liquid remains in two directions (FIG. 4B).
Arbitrary flow rate adjustment such as is possible. Therefore, in each of the heat treatment apparatuses according to claims 1 to 4, the flow rate (aspiration amount) of the processing liquid from the storage tank and the processing tank, or the flow rate (supply amount) of the processing liquid to the storage tank and the processing tank, etc. Can be accurately and reliably adjusted, and the temperature of the processing liquid sprayed onto the workpiece from the spray nozzle of the processing tank can be accurately maintained at a predetermined temperature.

【0017】[0017]

【発明の実施の形態】以下に、この発明に係る噴霧式熱
処理装置の実施の形態を図面に基づいて説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a spray heat treatment apparatus according to the present invention will be described below with reference to the drawings.

【0018】図1は本発明を噴霧式冷熱衝撃試験装置に
適用した実施例を概略的に示す全体正面図であり、図2
は図1の噴霧式冷熱衝撃試験装置の別の配管系統の実施
例の一部を概略的に示す部分正面図、図3は図1の噴霧
式冷熱衝撃試験装置における処理槽の別の実施例の一部
を概略的に示す部分正面図である。
FIG. 1 is an overall front view schematically showing an embodiment in which the present invention is applied to a spray-type thermal shock test apparatus.
3 is a partial front view schematically showing a part of another embodiment of the piping system of the spray-type thermal shock test apparatus of FIG. 1, and FIG. 3 is another embodiment of the treatment tank in the spray-type thermal shock test apparatus of FIG. 3 is a partial front view schematically showing a part of FIG.

【0019】図1に示すように、本例の噴霧式冷熱衝撃
試験装置1は中央部に処理槽2を備えており、この処理
槽2を挟んで加熱用高温液hの循環系統Hと冷却用低温
液cの循環系統Cとをそれぞれ独立して左右に具備して
いる。処理槽2は頂面の一方に給気口2aを、他方に排
気口2bをそれぞれ開口している。処理槽2内の上下方
向の中間位置よりやや上方に、被処理物としての供試品
sを載置する支持台3が配設され、処理槽2の側壁の一
側方に供試品sを支持台3上に収納するための収納口4
が設けられ、開閉扉4aが装着されている。収納口4と
反対側に取出口5が設けられ、取出口5にも開閉扉5a
が装着されている。なお、供試品sは吊持具などで、処
理槽2内に吊り下げるようにしてもよい。
As shown in FIG. 1, the spray-type thermal shock test apparatus 1 of the present embodiment has a processing tank 2 in the center, and a circulating system H for cooling a high-temperature liquid h for heating and cooling. The circulating system C for the low-temperature liquid c for use is independently provided on the left and right sides. The processing tank 2 has an air supply port 2a on one of its top surfaces and an exhaust port 2b on the other. A support 3 on which a sample s to be processed is placed is disposed slightly above the intermediate position in the vertical direction in the processing tank 2, and the sample s is provided on one side of the side wall of the processing tank 2. Storage port 4 for storing on the support base 3
Is provided, and an opening / closing door 4a is mounted. An outlet 5 is provided on the side opposite to the storage opening 4, and the outlet 5 is also provided with an opening / closing door 5a.
Is installed. The sample s may be hung in the processing tank 2 with a hanging tool or the like.

【0020】処理槽2内の支持台3の上方には、噴霧ノ
ズル6が下向きに配設されている。また支持台3の下方
は、噴霧ノズル6から噴霧された処理液(本例では高温
液又は低温液)の貯留部2dに構成され、貯留部2dの
底面中央部に排出口2cが開口されている。排出口2c
には排出管7が接続され、この排出管7は下流端で分岐
され、一方の分岐管7aは循環系統Hの開閉弁としての
三方切換電磁弁14に、また他方の分岐管7bは循環系
統Cの開閉弁としての三方切換電磁弁24にそれぞれ接
続されている。排出管7には、排出口2c側からフロー
スイッチ付き電磁開閉弁9および温度センサ10がこの
順に介設されている。なお、フロースイッチ付き電磁開
閉弁9を設ける代わりに、フロースイッチだけで、三方
切換電磁弁14・24、後述の循環ポンプ12・22を
操作するようにしてもよい。また、噴霧ノズル6への処
理液の供給管8が噴霧ノズル6に接続され、供給管8は
上流端で分岐され、一方の分岐管8aは循環系統Hの開
閉弁としての三方切換電磁弁15に、また他方の分岐管
8bは循環系統Cの開閉弁としての三方切換電磁弁25
にそれぞれ接続されている。さらに.処理槽2内の貯留
部2dには、2個のレベルセンサ31・32が上下方向
に間隔をあけて配設されている。
Above the support 3 in the processing tank 2, a spray nozzle 6 is disposed downward. The lower part of the support base 3 is configured as a storage part 2d for the processing liquid (high-temperature liquid or low-temperature liquid in this example) sprayed from the spray nozzle 6, and an outlet 2c is opened at the center of the bottom of the storage part 2d. I have. Outlet 2c
Is connected to a discharge pipe 7. This discharge pipe 7 is branched at a downstream end. One branch pipe 7 a is connected to a three-way switching solenoid valve 14 as an on-off valve of the circulation system H, and the other branch pipe 7 b is connected to the circulation system. The three-way switching solenoid valve 24 as an open / close valve of C is connected to each. The discharge pipe 7 is provided with an electromagnetic on-off valve 9 with a flow switch and a temperature sensor 10 in this order from the discharge port 2c side. Instead of providing the electromagnetic on-off valve 9 with a flow switch, the three-way switching electromagnetic valves 14 and 24 and the circulating pumps 12 and 22 described later may be operated only by the flow switch. A supply pipe 8 for supplying the processing liquid to the spray nozzle 6 is connected to the spray nozzle 6, the supply pipe 8 is branched at the upstream end, and one branch pipe 8a is provided with a three-way switching electromagnetic valve 15 as an on-off valve for the circulation system H. And the other branch pipe 8b is provided with a three-way switching solenoid valve 25 as an on-off valve of the circulation system C.
Connected to each other. further. Two level sensors 31 and 32 are arranged in the storage part 2d in the processing tank 2 at intervals in the vertical direction.

【0021】処理槽2を挟んで左側の加熱用高温液の循
環系統Hは、高温液hを貯留するためのヘッドタンク
(貯留タンク)11と、循環ポンプ(吸引・供給ポン
プ)12と、熱交換器13と、2組の三方切換電磁弁1
4・15とを備えている。ヘッドタンク11は、タンク
本体11aの外側が保温材11bで被覆された保温構造
からなり、高温液hの流入口11cと流出口11dとを
備えている。また、ヘッドタンク11内にも、2個のレ
ベルセンサ33・34が上下に間隔をあけて配設されて
いる。さらに、ヘッドタンク11のレベルセンサ34の
すぐ下方に、温度センサ35が配設されている。流入口
11cと三方切換電磁弁15の間は供給管16で接続さ
れ、また流出口11dと三方切換電磁弁14との間は排
出管17で接続されており、排出管17には温度センサ
36が介設されている。これらの接続順は適宜変更して
もよいし、必要に応じて装備品を追加、又は省略しても
よい。供給側(吐出側)の三方切換電磁弁15と排出側
(吸入側)の三方切換電磁弁14との間が循環管18で
接続され、この循環管18に三方切換電磁弁14側から
三方切換電磁弁15にかけて循環ポンプ12、温度セン
サ37、熱交換器13、温度センサ38がこの順に介設
されている。
A heating high-temperature liquid circulation system H on the left side of the processing tank 2 includes a head tank (storage tank) 11 for storing the high-temperature liquid h, a circulation pump (suction / supply pump) 12, and a heat pump. Exchanger 13 and two sets of three-way switching solenoid valves 1
4.15. The head tank 11 has a heat retaining structure in which the outside of the tank main body 11a is covered with a heat retaining material 11b, and has an inlet 11c and an outlet 11d for the high-temperature liquid h. In the head tank 11, two level sensors 33 and 34 are arranged at an interval above and below. Further, a temperature sensor 35 is provided immediately below the level sensor 34 of the head tank 11. The supply port 16 is connected between the inflow port 11c and the three-way switching solenoid valve 15, and the discharge pipe 17 is connected between the outflow port 11d and the three-way switching solenoid valve 14, and a temperature sensor 36 is connected to the discharge pipe 17. Is interposed. These connection orders may be changed as appropriate, and equipment may be added or omitted as necessary. A three-way switching solenoid valve 15 on the supply side (discharge side) and a three-way switching solenoid valve 14 on the discharge side (suction side) are connected by a circulation pipe 18, and the three-way switching solenoid valve 14 is connected to the circulation pipe 18 from the three-way switching solenoid valve 14 side. A circulation pump 12, a temperature sensor 37, a heat exchanger 13, and a temperature sensor 38 are interposed in this order over the solenoid valve 15.

【0022】一方、処理槽2を挟んで右側の冷却用低温
液の循環系統Cは、低温液cを貯留するためのヘッドタ
ンク(貯留タンク)21と、循環ポンプ(吸引・供給ポ
ンプ)22と、熱交換器23と、2組の三方切換電磁弁
24・25とを備えている。ヘッドタンク21は、タン
ク本体21aの外側が保温材21bで被覆された保温構
造からなり、高温液hの流入口21cと流出口21dと
を備えている。また、ヘッドタンク21内にも、2個の
レベルセンサ43・44が上下に間隔をあけて配設され
ている。さらに、ヘッドタンク11のレベルセンサ44
のすぐ下方に、温度センサ45が配設されている。流入
口21cと三方切換電磁弁25の間は供給管26で接続
され、また流出口21dと三方切換電磁弁24との間は
排出管27で接続されており、排出管27には温度セン
サ46が介設されている。これらの接続順も適宜変更し
てもよい。
On the other hand, a circulating system C for cooling low-temperature liquid on the right side of the processing tank 2 includes a head tank (storage tank) 21 for storing the low-temperature liquid c, a circulation pump (suction / supply pump) 22, , A heat exchanger 23 and two sets of three-way switching solenoid valves 24 and 25. The head tank 21 has a heat retaining structure in which the outside of the tank main body 21a is covered with a heat retaining material 21b, and includes an inlet 21c and an outlet 21d for the high-temperature liquid h. Also, two level sensors 43 and 44 are arranged in the head tank 21 with a vertical interval. Furthermore, the level sensor 44 of the head tank 11
A temperature sensor 45 is provided immediately below the temperature sensor 45. The inflow port 21c and the three-way switching solenoid valve 25 are connected by a supply pipe 26, and the outflow port 21d and the three-way switching solenoid valve 24 are connected by a discharge pipe 27. Is interposed. These connection orders may be changed as appropriate.

【0023】供給側(吐出側)の三方切換電磁弁25と
排出側(吸入側)の三方切換電磁弁24との間が循環管
28で接続され、この循環管28に三方切換電磁弁24
側から三方切換電磁弁25にかけて循環ポンプ22、温
度センサ47、熱交換器23、温度センサ48がこの順
に介設されている。
A three-way switching solenoid valve 25 on the supply side (discharge side) and a three-way switching solenoid valve 24 on the discharge side (suction side) are connected by a circulation pipe 28.
A circulation pump 22, a temperature sensor 47, a heat exchanger 23, and a temperature sensor 48 are arranged in this order from the side to the three-way switching solenoid valve 25.

【0024】そして、フロースイッチ付き電磁開閉弁
9、温度センサ10、レベルセンサ31・32、循環ポ
ンプ12・22、三方切換電磁弁14・15・24・2
5、レベルセンサ33・34・43・44、温度センサ
35〜38・45〜48は、制御器としてのコントロー
ラ30にそれぞれパイロットラインによって接続されて
いる。
The solenoid on-off valve 9 with a flow switch, the temperature sensor 10, the level sensors 31 and 32, the circulating pumps 12 and 22, the three-way switching solenoid valves 14, 15, 24 and 2
5. The level sensors 33, 34, 43, 44 and the temperature sensors 35 to 38, 45 to 48 are connected to the controller 30 as a controller by a pilot line.

【0025】上記のようにして本実施例に係る噴霧式冷
熱衝撃試験装置1が構成されるが、この冷熱衝撃試験装
置1の使用態様については図1に基づいて説明する。
The spray-type thermal shock test apparatus 1 according to the present embodiment is constructed as described above. The mode of use of the thermal shock test apparatus 1 will be described with reference to FIG.

【0026】1) 供試品(被処理物)としての部品s
を、開閉扉4aを開放して収納口4より、処理槽2内の
支持台3上に載置し、開閉扉4aを閉じる。
1) Parts as test samples (workpieces)
Is placed on the support 3 in the processing tank 2 from the storage opening 4 by opening the opening / closing door 4a, and the opening / closing door 4a is closed.

【0027】2) 本例では、加熱用循環系統Hにおいて
は、熱交換器13を循環させながらあらかじめ設定温度
(加熱温度+α℃)に保持しているヘッドタンク11内
の高温液hを、三方切換電磁弁14、循環ポンプ12、
熱交換器13を経由させたのち、三方切換電磁弁15を
経由させて処理槽2へ供給して噴霧ノズル6から供試品
sに噴霧する。ヘッドタンク11内の高温液hは規定温
度に保たれているから、供試品sの影響を受けて高温液
hの温度が下がっても噴霧する高温液hの温度には影響
しない。この状態を継続して貯留部2dにある程度高温
液hが溜まった時点で、循環ポンプ12により吸引し始
めて排出口2cから排出管7、分岐管7a、三方切換電
磁弁14を経由してヘッドタンク11から吸引した高温
液hと混合したものを熱交換器13によって所定温度ま
で加熱しつつ(最初のうちは、供試品sに噴霧されて温
度低下するので、貯留部2d内の高温液hは設定温度よ
り下がっている)、三方切換電磁弁15、分岐管8a、
供給管8を経由して処理槽2へ供給し噴霧ノズル6から
供試品sに噴霧する。この状態では、貯留部2d内の高
温液hの温度はかなり低くなっている可能性があるが、
ヘッドタンク11内の高温液hと混合させることによっ
て、熱交換器13による加熱量は少なくて済む。
2) In the present embodiment, in the heating circulation system H, the high-temperature liquid h in the head tank 11, which is maintained in advance at the set temperature (heating temperature + α ° C.) while circulating the heat exchanger 13, is supplied in three directions. Switching solenoid valve 14, circulation pump 12,
After passing through the heat exchanger 13, it is supplied to the processing tank 2 via the three-way switching electromagnetic valve 15 and sprayed from the spray nozzle 6 onto the sample s. Since the high-temperature liquid h in the head tank 11 is maintained at the specified temperature, the temperature of the high-temperature liquid h sprayed does not affect even if the temperature of the high-temperature liquid h decreases due to the influence of the sample s. When this state is continued and the high-temperature liquid h accumulates in the storage part 2d to some extent, the suction is started by the circulation pump 12 and the head tank is discharged from the discharge port 2c through the discharge pipe 7, the branch pipe 7a, and the three-way switching solenoid valve 14. While the mixture mixed with the high temperature liquid h sucked from 11 is heated to a predetermined temperature by the heat exchanger 13 (initially, the temperature is lowered by being sprayed on the specimen s, so that the high temperature liquid h in the storage unit 2d is reduced). Is lower than the set temperature), the three-way switching solenoid valve 15, the branch pipe 8a,
It is supplied to the processing tank 2 via the supply pipe 8 and sprayed from the spray nozzle 6 onto the sample s. In this state, there is a possibility that the temperature of the high temperature liquid h in the storage section 2d is considerably low,
By mixing with the high-temperature liquid h in the head tank 11, the amount of heating by the heat exchanger 13 can be reduced.

【0028】そして、ヘッドタンク11内の高温液hが
低位になったときには、高温液hは処理槽2内の貯留部
2dへ移行していることになり、その時点では貯留部2
d中の高温液hの温度はかなり上昇しているから、循環
ポンプ12で全量を吸引して循環管18を経由させ処理
槽2へ供給しても、循環管18に介設された熱交換器1
3によって設定温度まで十分に加熱し得る。したがっ
て、以降は循環ポンプ12で全量を吸引して循環管18
を経由させ、熱交換器13で加熱しながら処理槽2内へ
循環させて噴霧ノズル6から噴霧する。
When the high temperature liquid h in the head tank 11 becomes lower, the high temperature liquid h has been transferred to the storage section 2d in the processing tank 2. At that time, the high temperature liquid h is stored in the storage section 2d.
Since the temperature of the high-temperature liquid h in d is considerably increased, even if the entire amount is sucked by the circulation pump 12 and supplied to the treatment tank 2 through the circulation pipe 18, the heat exchange provided in the circulation pipe 18 Vessel 1
3 allows sufficient heating to the set temperature. Therefore, thereafter, the entire amount is sucked by the circulation pump 12 and
And is circulated into the processing tank 2 while being heated by the heat exchanger 13 and sprayed from the spray nozzle 6.

【0029】なお、噴霧ノズル6から噴霧する流量とヘ
ッドタンク11へ戻す流量は、三方切換電磁弁14・1
5に、例えば後述する流量調整可能な構造の三方切換電
磁弁(図4)を使用することにより、簡単かつ正確に調
整できる。
The flow rate of spray from the spray nozzle 6 and the flow rate returned to the head tank 11 are determined by the three-way switching solenoid valves 14.1
For example, by using a three-way switching solenoid valve (FIG. 4) having a structure capable of adjusting a flow rate, which will be described later, the adjustment can be performed simply and accurately.

【0030】3) 一方、冷却用循環系統Cの循環ポンプ
22も同時に運転し、冷却用循環系統C内において低温
液cを循環させながら、温度センサ47・48で測温し
てコントローラ30を介して度熱交換器23により冷却
してヘッドタンク21内の低温液cを設定温度(冷却温
度−β℃)に保持する。
3) On the other hand, the circulation pump 22 of the cooling circulation system C is operated at the same time, and the temperature is measured by the temperature sensors 47 and 48 while circulating the low-temperature liquid c in the cooling circulation system C. The temperature of the low-temperature liquid c in the head tank 21 is maintained at a set temperature (cooling temperature−β ° C.) by cooling with the heat exchanger 23.

【0031】4) 部品sに対し高温液hを噴霧して加熱
試験が終了したのちは、三方切換電磁弁14・15と三
方切換電磁弁24・25の開閉状態を逆に切換して低温
液cを部品sに噴霧して冷却試験する。
4) After the heating test is completed by spraying the high-temperature liquid h on the part s, the open / close states of the three-way switching solenoid valves 14 and 15 and the three-way switching solenoid valves 24 and 25 are reversed to switch the low-temperature liquid. The cooling test is conducted by spraying c on the part s.

【0032】加熱から冷却へ、すなわち噴霧ノズル6か
ら噴霧する処理液を高温液hから低温液cに切り換ると
きは、貯留部2d内の高温液hを可及的に残らず循環ポ
ンプ12により吸引して抜き取る。つまり、噴霧を中止
した後もフロースイッチ9が作動するまで、循環ポンプ
12で吸引する。このようにしなければ、次に冷却試験
を行う際に、高温液hが相当に残っていることになっ
て、冷却試験の妨げになるからである。なお、高温液h
はヘッドタンク11に移行される。
When the processing liquid sprayed from the spray nozzle 6 is switched from the high-temperature liquid h to the low-temperature liquid c from the heating to the cooling, that is, the high-temperature liquid h in the storage section 2d remains as small as possible. Aspirate and remove. That is, even after the spraying is stopped, the suction is performed by the circulation pump 12 until the flow switch 9 operates. Otherwise, the next time the cooling test is performed, a considerable amount of the high-temperature liquid h will remain, hindering the cooling test. The high-temperature liquid h
Is transferred to the head tank 11.

【0033】5) 低温液cの噴霧手順は、前述の高温液
hの噴霧手順に準じて行う。これは要するに、処理槽2
内の貯留部2d内に貯留される処理液(高温液h又は低
温液c)の液面が高位に達した場合には、処理槽2内の
処理液を全て循環ポンプ12/22で吸引する必要があ
るが、処理槽2内の処理液の液面が高位に達するまで
は、処理槽2内の処理液を少量ずつ循環ポンプ12/2
2で吸引することとし、ヘッドタンク11/21内の設
定温度に常時保持されている処理液を多量に処理槽2へ
供給して供試品sに噴霧することができるから、加熱/
冷却の変更を要する冷熱衝撃試験を行うときにでも、容
量の小さい(つまり小型の)熱交換器であっても設定温
度の処理液を発生させられる。また、加熱用あるいは冷
却用の、処理槽2内の処理液の温度が処理温度に近くな
った場合には、噴霧する処理液全量を処理槽2から循環
ポンプ12/22により吸引しても熱交換器13/23
を経由させるだけで、設定温度に制御できるようにな
る。
5) The spraying procedure of the low-temperature liquid c is performed according to the above-described spraying procedure of the high-temperature liquid h. This is basically the treatment tank 2
When the liquid level of the processing liquid (the high-temperature liquid h or the low-temperature liquid c) stored in the storage section 2d of the inside reaches a high level, the processing liquid in the processing tank 2 is entirely sucked by the circulation pump 12/22. It is necessary, but until the liquid level of the processing liquid in the processing tank 2 reaches a high level, the processing liquid in the processing tank 2 is gradually reduced by a circulating pump 12/2.
2 and a large amount of the processing liquid constantly maintained at the set temperature in the head tank 11/21 can be supplied to the processing tank 2 and sprayed on the specimen s.
Even when performing a thermal shock test requiring a change in cooling, even a small-capacity (ie, small) heat exchanger can generate a processing liquid at a set temperature. Further, when the temperature of the processing liquid in the processing tank 2 for heating or cooling approaches the processing temperature, the entire amount of the processing liquid to be sprayed is sucked from the processing tank 2 by the circulation pump 12/22. Exchanger 13/23
The temperature can be controlled to the set temperature simply by passing through.

【0034】以上のようにして、衝撃試験が全て終了し
たときには、処理槽2内の処理液をほぼ完全に抜き取
り、ヘッドタンク11/21へ戻したのち、各循環系統
H/C内で熱交換器13/23を経由させて循環し、設
定温度に保持されるように制御する。
As described above, when all the impact tests are completed, the processing liquid in the processing tank 2 is almost completely drained, returned to the head tank 11/21, and then heat-exchanged in each circulation system H / C. It is circulated through the vessel 13/23 and controlled so as to be maintained at the set temperature.

【0035】図5および図6は上記実施例の試験装置1
における処理液(ここでは加熱用高温液h)の噴霧開始
時とその噴霧停止時のフローの一例をチャートで示すも
のである。噴霧開始時には、図5において、始動スイ
ッチ等のONにより、開始信号がコントローラ30に発
信されると、循環ポンプ12(/22)が運転状態か
否かが検知され、運転状態でない(NO)と循環ポンプ
12(/22)が起動される。運転状態である(YE
S)と、吐出側三方電磁切換弁15の流れ方向をヘッ
ドタンク11側の循環状態から処理槽2側への噴霧状態
に切り換る。処理槽2内の高温液hの液面位置がレベル
センサ32(図1)によって検知され、低位が検知され
るまでは現状のままであるが、レベルセンサ32によ
る低位(YES)検知で、吸入側三方切換電磁弁14
においてヘッドタンク11側が全開で処理槽2側が全閉
であったのを、処理槽2側を微開とする。処理槽2内
の高温液hの液面位置がレベルセンサ31(図1)によ
って検知され、高位(YES)検知で、吸入側三方切
換電磁弁14の処理槽2からの開口(流入口)が全開状
態まで開放され、ヘッドタンク11側は全閉となる。以
降、定常状態になる。なお、の処理槽2内の高温液h
の液面が検知される工程の前に、高温液hの温度を検知
し設定温度に制御する工程があるが、図5のフローチャ
ートでは省略している。
FIGS. 5 and 6 show the test apparatus 1 of the above embodiment.
Is a chart showing an example of a flow at the start of spraying of the processing liquid (here, the high temperature liquid for heating h) and at the time of stopping the spraying. At the start of spraying, in FIG. 5, when a start signal is transmitted to the controller 30 by turning on a start switch or the like, it is detected whether or not the circulation pump 12 (/ 22) is in the operating state, and it is determined that the circulating pump 12 (/ 22) is not in the operating state (NO). The circulation pump 12 (/ 22) is started. Operating state (YE
S), the flow direction of the discharge side three-way electromagnetic switching valve 15 is switched from the circulation state on the head tank 11 side to the spray state on the processing tank 2 side. The liquid surface position of the high-temperature liquid h in the processing tank 2 is detected by the level sensor 32 (FIG. 1) and remains as it is until the low level is detected. Side three-way switching solenoid valve 14
, The head tank 11 side is fully opened and the processing tank 2 side is fully closed, but the processing tank 2 side is slightly opened. The liquid surface position of the high-temperature liquid h in the processing tank 2 is detected by the level sensor 31 (FIG. 1), and when the high level (YES) is detected, the opening (inlet) of the suction side three-way switching electromagnetic valve 14 from the processing tank 2 is opened. The head tank 11 is fully opened and the head tank 11 side is fully closed. Thereafter, a steady state is set. The high-temperature liquid h in the processing tank 2
Prior to the step of detecting the liquid level, there is a step of detecting the temperature of the high-temperature liquid h and controlling the temperature to the set temperature, but is omitted in the flowchart of FIG.

【0036】次に、加熱衝撃試験が終了して噴霧を停止
したときには、図6において、始動スイッチ等のOF
Fにより、停止信号がコントローラ30に発信される
と、噴霧ノズル6へ高温液hを供給する吐出側三方切
換電磁弁15の、処理槽2への開口(流出口)が全閉状
態になると同時に、ヘッドタンク11側への開口(流出
口)が全開状態に開放される。処理槽2の排出口から
の高温液hの排出がゼロか又は貯留部2d内の高温液h
がレベルセンサ32によって低位か否かが検知され、ゼ
ロか低位かのどちらかである(YES)と,吸入側三
方切換電磁弁14の、処理槽2からの開口(流入口)が
全閉状態になると同時に、ヘッドタンク11側からの開
口(流入口)が全開状態に開放される。この結果、高温
液hは循環状態になる。なお、循環状態になったのち
に、高温液hの温度を検知し設定温度に制御する工程が
あるが、図6のフローチャートでは省略している。
Next, when the spraying is stopped after the heat shock test is completed, in FIG.
When the stop signal is transmitted to the controller 30 by F, the opening (outflow port) to the processing tank 2 of the discharge-side three-way switching solenoid valve 15 that supplies the high-temperature liquid h to the spray nozzle 6 becomes fully closed, and The opening (outflow port) to the head tank 11 side is fully opened. The discharge of the high-temperature liquid h from the discharge port of the processing tank 2 is zero or the high-temperature liquid h in the storage unit 2d
Is low or low by the level sensor 32, and if it is either zero or low (YES), the opening (inlet) of the suction side three-way switching solenoid valve 14 from the processing tank 2 is fully closed. At the same time, the opening (inlet) from the head tank 11 side is opened to the fully opened state. As a result, the high temperature liquid h enters a circulating state. It should be noted that after the circulation state, there is a step of detecting the temperature of the high-temperature liquid h and controlling the temperature to the set temperature, but is omitted in the flowchart of FIG.

【0037】図2は別の実施例を示す熱交換器周りの配
管図で、図1の配管系統では、ヘッドタンク11/21
側と処理槽2側の処理液が混合して熱交換器13/23
に導入されるが、本例では、図2に示すようにヘッドタ
ンク11側と処理槽側からの処理液がそれぞれ別々の熱
交換器13/23/51/54によって加熱あるいは冷
却されることになる。したがって、本来、ヘッドタンク
11/21側の熱交換器13/23の役割は温度調整だ
けであるから、熱交換器13/23が小容量で済み小型
化が図られ、また処理槽2側は処理液の温度差を大きく
とれるので、これまた小型となるうえに、処理液の温度
制御も容易になる。なお、本配管系統では図2に示すよ
うに、図1において循環管18/28の途中に介設して
いた加熱用熱交換器13/冷却用熱交換器23および温
度センサ37・38/47・48を、それぞれ排出管1
7/27に介設するとともに、別個に加熱用熱交換器5
1/冷却用熱交換器54および温度センサ52・53/
55・56を分岐管7a/分岐管7bに三方切換電磁弁
14/24を挟んでそれぞれ介設したところが相違して
いる。本実施例の試験装置1’の他の構成については、
上記第1の実施例の試験装置1と共通する。
FIG. 2 is a piping diagram showing another embodiment of the heat exchanger. In the piping system shown in FIG.
The processing liquid on the side of the processing tank 2 and the processing liquid on the side of the processing tank 2 are mixed to form a heat exchanger 13/23.
In this example, the processing liquid from the head tank 11 side and the processing liquid from the processing tank side are heated or cooled by separate heat exchangers 13/23/51/54, respectively, as shown in FIG. Become. Therefore, the heat exchanger 13/23 on the head tank 11/21 side only plays a role of adjusting the temperature, so that the heat exchanger 13/23 requires a small capacity and can be miniaturized. Since the temperature difference between the processing liquids can be increased, the size of the processing liquid can be reduced, and the temperature of the processing liquid can be easily controlled. In this piping system, as shown in FIG. 2, the heating heat exchanger 13 / cooling heat exchanger 23 and the temperature sensors 37, 38/47, which are provided in the middle of the circulation pipe 18/28 in FIG.・ 48 are connected to the discharge pipe 1
7/27 and a separate heating heat exchanger 5
1 / cooling heat exchanger 54 and temperature sensors 52/53 /
The difference is that 55 and 56 are interposed between the branch pipe 7a / branch pipe 7b with the three-way switching solenoid valve 14/24 interposed therebetween. Regarding another configuration of the test apparatus 1 ′ of the present embodiment,
This is common to the test apparatus 1 of the first embodiment.

【0038】図3は処理槽の別の実施例の一部を概略的
に示す部分正面図で、本例では、処理槽2’の底部に液
溜まり部2eを形成し、この液溜まり部2eの底端付近
にレベルスイッチ41を配備し、コントローラ30を介
して電磁開閉弁9の開閉操作と同時に、循環ポンプ12
/22の運転・停止操作を行うようにしたところが、上
記実施例の装置1および1’と相違している。その他の
構成および作用については、上記第1実施例の試験装置
1と共通するので、詳しい説明を省略する。
FIG. 3 is a partial front view schematically showing a part of another embodiment of the processing tank. In this embodiment, a liquid pool 2e is formed at the bottom of the processing tank 2 ', and the liquid pool 2e is formed. A level switch 41 is provided in the vicinity of the bottom end of the circulating pump 12.
The point that the start / stop operation of / 22 is performed is different from the apparatuses 1 and 1 'of the above embodiment. Other configurations and operations are the same as those of the test apparatus 1 of the first embodiment, and thus detailed description is omitted.

【0039】次に、図4(a)(b)は請求項5による
三方切換弁の他の実施例を示すもので、本例の三方切換
弁15’(25’)は、弁体81aを備えた従来の一般
的な切換弁81(図8(a)(b))に欠けている流量
調整機能を備えた構造にしている。すなわち、図4に示
すように、三方切換弁15’は弁体15aの循環管18
からの流入口15bの開口面積を、流出口15c・15
dに比べて大きくし、ヘッドタンク11および処理槽2
への流量を同一にした状態(図4(a))から、ヘッドタ
ンク11側の流量に比べて処理槽2側への流量を絞った
状態(図4(b))にしたり、図示は省略するが処理槽2
側の流量に比べてヘッドタンク11側の流量への流量を
絞った状態にも任意に調整できるようにしている。つま
り、切換弁81とは弁体81aの構造を異ならせてい
る。
FIGS. 4 (a) and 4 (b) show another embodiment of the three-way switching valve according to claim 5, in which the three-way switching valve 15 '(25') has a valve body 81a. It has a structure provided with a flow rate adjusting function lacking in the conventional general switching valve 81 provided (FIGS. 8A and 8B). That is, as shown in FIG. 4, the three-way switching valve 15 'is connected to the circulation pipe 18 of the valve body 15a.
The opening area of the inlet 15b from the outlet 15c
d, the head tank 11 and the processing tank 2
From the state in which the flow rate to the processing tank 2 is the same (FIG. 4A), the state in which the flow rate to the processing tank 2 side is reduced compared to the flow rate in the head tank 11 side (FIG. 4B), or not shown. Yes, but processing tank 2
It can be arbitrarily adjusted even when the flow rate on the head tank 11 side is narrowed compared to the flow rate on the side. That is, the structure of the valve body 81a is different from that of the switching valve 81.

【0040】また、構成的には複雑になるが、図4(c)
に示すように、循環管18と供給管16と分岐管8aと
を一体的に接続し、供給管16および分岐管8aに流量
調整・開閉弁61・62をそれぞれ介設しても同様に循
環管18からヘッドタンク11および処理槽2への流量
を任意に調整することができる。
Although the configuration is complicated, FIG.
As shown in the figure, the circulation pipe 18, the supply pipe 16 and the branch pipe 8 a are integrally connected and the supply pipe 16 and the branch pipe 8 a are provided with flow rate adjusting / opening / closing valves 61 and 62, respectively. The flow rate from the pipe 18 to the head tank 11 and the processing tank 2 can be arbitrarily adjusted.

【0041】上記に本発明の噴霧式熱処理試験装置の一
実施例としての冷熱衝撃試験装置を示したが、本発明は
下記のように実施することができる。
Although the thermal shock test apparatus as an embodiment of the spray heat treatment test apparatus of the present invention has been described above, the present invention can be implemented as follows.

【0042】a)加熱および冷却のどちらか一方の処理
を被処理物に対し施す場合には、処理槽2と加熱用高温
液の循環系統Hか冷却用低温液の循環系統Cのどちらか
一方だけを組み合わせればよい。
A) When one of the heating and cooling treatments is performed on the object to be treated, either the treatment tank 2 and the circulation system H for the high-temperature liquid for heating or the circulation system C for the low-temperature liquid for cooling are used. You only need to combine

【0043】b)処理液として高温液および冷温液など
の特殊な溶液を通常は使用するが、高低温域が狭いとき
には、水を使用してもよい。
B) A special solution such as a high-temperature liquid or a cold-temperature liquid is usually used as the processing liquid. However, when the high-low temperature range is narrow, water may be used.

【0044】c)衝撃試験に限らず、部品等の加熱処理
を行ったり、洗浄液により洗浄処理を行ったり、常温で
大気中に放置して常温での耐久試験を行ったり、各種用
途に広範囲に利用できる。
C) Not only the impact test but also a heat treatment of parts, a cleaning treatment with a cleaning liquid, a durability test at room temperature by being left in the air at a room temperature, a wide range of various uses. Available.

【0045】[0045]

【発明の効果】以上説明したことから明らかなように、
本発明に係る噴霧式熱処理装置には、次のような優れた
効果がある。
As is apparent from the above description,
The spray heat treatment apparatus according to the present invention has the following excellent effects.

【0046】(1) 請求項1記載の発明では、加熱用又は
冷却用処理液などを被処理物に噴霧して処理するから、
被処理物を設定温度で貯留した貯留タンクの処理液に浸
漬して処理する従来の装置に比べて、処理液の貯留タン
クが小容量で済むので、小型化して装置全体をコンパク
トにし、設置スペースの削減を図れる。また、噴霧して
処理するから処理が容易になるとともに、被処理物の加
熱・冷却などの切換ならびに処理温度条件の変更が容易
かつ短時間に行える。
(1) According to the first aspect of the present invention, since a treatment liquid for heating or cooling is sprayed on the object to be treated,
Compared to the conventional equipment that immerses the processing object in the processing liquid in the storage tank that stores the processing liquid at a set temperature, the processing liquid storage tank requires a smaller capacity than the conventional equipment. Can be reduced. Further, since the processing is performed by spraying, the processing becomes easy, and switching of heating / cooling of the processing target and the change of the processing temperature condition can be performed easily and in a short time.

【0047】(2) 請求項2記載の発明では、適温に保持
された貯留タンクと熱交換器を併用するので、その両方
が小型となるばかりでなく、処理温度も適切かつ容易に
保持できる。貯留タンクは保温構造を有するので、貯留
される処理液としての高温液と低温液とが温度変化しに
くく、しかも高温液と低温液をそれぞれ熱交換器を経由
させて循環させることにより、所定の設定温度に容易に
かつ正確に保持できる。とくに被処理物に対し例えば高
温液と低温液を交互に噴霧して加熱処理と冷却処理とを
交互に行う場合にも、あらかじめ設定温度に保持して貯
留している貯留タンクから高温液あるいは低温液を噴霧
して処理するので、被処理物に対する加熱・冷却などの
処理条件の切換ならびに処理液の温度条件の変更を容易
かつ短時間に行うことができる。
(2) According to the second aspect of the present invention, since the storage tank and the heat exchanger maintained at an appropriate temperature are used in combination, not only both of them can be reduced in size but also the processing temperature can be appropriately and easily maintained. Since the storage tank has a heat retaining structure, the temperature of the high-temperature liquid and the low-temperature liquid as the processing liquid to be stored does not easily change, and the high-temperature liquid and the low-temperature liquid are circulated through the heat exchanger, respectively. It can be easily and accurately maintained at the set temperature. Especially when the heating and cooling are alternately sprayed, for example, by alternately spraying a high-temperature liquid and a low-temperature liquid on the object to be processed, the high-temperature liquid or the low-temperature liquid is stored in a storage tank that is stored at a preset temperature. Since the processing is performed by spraying the liquid, it is possible to easily and quickly change the processing conditions such as heating and cooling of the object to be processed and change the temperature conditions of the processing liquid.

【0048】(3) 請求項3記載の発明では、前記処理槽
に給排気口を設け、給排気口を開閉可能に構成すれば、
冷熱衝撃試験等において処理槽内雰囲気を常温にするこ
と(いわゆる常温さらし)ができ、給排気が必要なとき
にだけ開口することができるから、さらに噴霧ノズルか
ら例えば蒸気や冷却ガスを被処理物に対し噴霧させたと
きに、あるいは加熱時などに被処理物からガスが発生し
たときに、強制的に換気して排気口から排出させること
ができる。
(3) According to the third aspect of the present invention, if the processing tank is provided with a supply / exhaust port and the supply / exhaust port can be opened and closed,
In a thermal shock test, etc., the atmosphere in the processing tank can be brought to room temperature (so-called room temperature exposure) and can be opened only when air supply and exhaust are required. When a gas is generated from the object to be processed during spraying or during heating, the air can be forcibly ventilated and discharged from the exhaust port.

【0049】(4) 請求項4記載の発明では、加熱処理か
ら冷却処理あるいは冷却処理から加熱処理への切換時に
処理槽底部の液溜まり部に溜まった処理液を循環ポンプ
によりほとんど残らず吸引できるので、前処理時に用い
た処理液によって次処理の処理液の温度制御に悪影響を
及ぼすことがなく、あらかじめ設定した温度で正確にか
つ確実に処理を行える。また、処理槽底部の液溜まり部
に溜まった処理液が空かほとんど空になった状態で、こ
の状態をレベルスイッチが検知し、液溜まり部の処理液
側の循環ポンプおよび同循環ポンプ側三方切換弁と、温
度の異なる処理液側の循環ポンプおよび同循環ポンプ側
三方切換弁との運転が自動的に切り換わり、低温液が処
理槽内に供給され冷却処理が開始されることになるか
ら、使用者は被処理物を入れ換えるなどの簡単な作業を
するだけで、ほとんど自動的に処理され、作業者の負担
が減り、作業能率も向上する。
(4) According to the fourth aspect of the present invention, when the process is switched from the heating process to the cooling process or from the cooling process to the heating process, almost no residual processing liquid accumulated in the liquid pool at the bottom of the processing tank can be sucked by the circulation pump. Therefore, the processing liquid used in the pre-processing does not adversely affect the temperature control of the processing liquid in the next processing, and the processing can be performed accurately and reliably at a preset temperature. When the processing liquid accumulated in the liquid pool at the bottom of the processing tank is empty or almost empty, the level switch detects this state, and the circulation pump on the processing liquid side of the liquid pool and the three-way pump on the circulation pump side Since the operation of the switching valve and the operation of the circulation pump on the processing liquid side having a different temperature and the three-way switching valve on the circulation pump side are automatically switched, the low-temperature liquid is supplied into the processing tank and the cooling process is started. By simply performing simple work such as replacing the object to be processed, the processing is almost automatically performed, the burden on the operator is reduced, and the work efficiency is improved.

【0050】(5) 請求項5記載の発明では、とくに上記
の請求項1〜4に記載の各熱処理装置において貯留タン
クと処理槽からの処理液の流量(吸引量)、あるいは貯
留タンクと処理槽への処理液の流量(供給量)などを正
確にかつ確実に調節することができ、処理槽の噴霧ノズ
ルより被処理物に対し噴霧させる処理液の温度を所定温
度に正確に保つことができる。
(5) In the invention according to claim 5, the flow rate (suction amount) of the processing liquid from the storage tank and the processing tank, or the storage tank and the processing in each of the heat treatment apparatuses according to the first to fourth aspects. The flow rate (supply amount) of the processing liquid to the tank can be adjusted accurately and reliably, and the temperature of the processing liquid sprayed onto the workpiece from the spray nozzle of the processing tank can be accurately maintained at a predetermined temperature. it can.

【0051】(6) 上記した各効果は被処理物の熱容量が
小さいときに、とくに有効に発揮される。
(6) Each of the above effects is particularly effective when the heat capacity of the object is small.

【0052】(7) 処理液を噴霧させることにより、被処
理物が空気に触れているので、腐食試験等では浸漬試験
よりも、より短期間で効果を得ることができる。
(7) Since the object to be processed is exposed to air by spraying the processing liquid, the effect can be obtained in a shorter time in a corrosion test or the like than in an immersion test.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明を噴霧式冷熱衝撃試験装置に適用した実
施例を概略的に示す全体正面図である。
FIG. 1 is an overall front view schematically showing an embodiment in which the present invention is applied to a spray-type thermal shock test apparatus.

【図2】図1の噴霧式冷熱衝撃試験装置の別の実施例の
一部を概略的に示す部分正面図である。
FIG. 2 is a partial front view schematically showing a part of another embodiment of the spray-type thermal shock test apparatus of FIG.

【図3】図1の噴霧式冷熱衝撃試験装置における処理槽
の別の実施例の一部を概略的に示す部分正面図である。
FIG. 3 is a partial front view schematically showing a part of another embodiment of the treatment tank in the spray-type thermal shock test apparatus of FIG. 1;

【図4】図4(a)(b)は三方切換電磁弁14・15
(24・25)の他の実施例を示す断面図で、図4
(a)は中立状態を表し、図4(b)は一方の流出量を
絞った状態を表す。図4(c)は三方切換電磁弁を用い
ずにに方向への流量を吊設する構造を示す部分概要正面
図である。
FIGS. 4A and 4B show three-way switching solenoid valves 14 and 15;
FIG. 4 is a sectional view showing another embodiment (24/25) of FIG.
4A illustrates a neutral state, and FIG. 4B illustrates a state in which one outflow amount is reduced. FIG. 4C is a partial schematic front view showing a structure for suspending a flow rate in a direction without using a three-way switching electromagnetic valve.

【図5】本発明の実施例の試験装置1における処理液
(ここでは加熱用高温液h)の噴霧開始時のフローチャ
ートを示す。
FIG. 5 is a flow chart at the start of spraying a processing liquid (here, a high-temperature liquid for heating h) in the test apparatus 1 according to the embodiment of the present invention.

【図6】本発明の実施例の試験装置1における処理液
(ここでは加熱用高温液h)の噴霧停止時のフローチャ
ートを示す。
FIG. 6 is a flowchart of the test apparatus 1 according to an embodiment of the present invention when spraying of a processing liquid (here, a high-temperature liquid for heating h) is stopped.

【図7】従来の一般的な熱衝撃試験装置70を概略的に
示す正面図である。
FIG. 7 is a front view schematically showing a conventional general thermal shock test apparatus 70.

【図8】図8(a)(b)は従来の一般的な切換弁81
を示す断面図で、図8(a)は中立状態を表し、図8
(b)は流出路を一方へ切り換えた状態を表している。
8 (a) and 8 (b) show a conventional general switching valve 81.
FIG. 8A shows a neutral state, and FIG.
(B) shows a state in which the outflow path is switched to one side.

【符号の説明】[Explanation of symbols]

1・1' 噴霧式冷熱衝撃試験装置 2・2' 処理槽 3 支持台 4 収納口 5 取出口 6 噴霧ノズル 7 排出管 8 供給管 9 電磁開閉弁 11・21 ヘッドタンク(貯留タンク・貯留槽) 12・22 循環ポンプ(吸引・供給ポンプ) 13・23 熱交換器 14・15・24・25 三方切換電磁弁(開閉弁) 18・28 循環管 30 制御器 31〜34 レベルセンサ 10・36〜38 温度センサ s 供試品(被処理物) h 高温液(処理液) c 低温液(処理液) H 加熱用高温液循環系統 C 冷却用低温液循環系統 1 ・ 1 ′ Spray-type thermal shock test device 2.2 ・ 2 Treatment tank 3 Support 4 Storage port 5 Outlet 6 Spray nozzle 7 Discharge pipe 8 Supply pipe 9 Electromagnetic open / close valve 11 ・ 21 Head tank (storage tank / storage tank) 12.22 circulation pump (suction / supply pump) 13.23 heat exchanger 14.15.24.25 three-way switching solenoid valve (open / close valve) 18.28 circulation pipe 30 controller 31-34 level sensor 10.36-38 Temperature sensor s Sample (object to be processed) h High temperature liquid (processing liquid) c Low temperature liquid (processing liquid) H High temperature liquid circulation system for heating C Low temperature liquid circulation system for cooling

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 被処理物を出し入れ可能で該被処理物に
対し処理液を噴霧する噴霧ノズルを備えた処理槽と、前
記処理液を貯留する貯留タンクとを具備し、前記処理槽
内の被処理物に対して前記噴霧ノズルから処理液を噴霧
させることにより被処理物を所定温度に保持したり、被
処理物に熱衝撃を与えたりするための噴霧式熱処理装置
であって、 前記貯留タンク内および前記処理槽内の処理液を両方同
時にあるいは選択的に吸引するとともに、吸引した処理
液を前記貯留タンクおよび前記処理槽へ両方同時にある
いは選択的に送給できるように循環ポンプを介在させて
配管し、該配管の途中に熱交換器を介設したことを特徴
とする噴霧式熱処理装置。
1. A processing tank provided with a spray nozzle capable of taking in and out an object to be processed and spraying a processing liquid onto the object to be processed, and a storage tank storing the processing liquid. A spray-type heat treatment apparatus for holding a processing object at a predetermined temperature by spraying a processing liquid onto the processing object from the spray nozzle or applying a thermal shock to the processing object, While simultaneously or selectively sucking the processing liquid in the tank and in the processing tank, a circulation pump is interposed so that the sucked processing liquid can be simultaneously or selectively supplied to both the storage tank and the processing tank. And a heat exchanger interposed in the middle of the pipe.
【請求項2】 前記処理液を送給するために加熱用高温
液貯留タンクと高温液熱交換器および冷却用低温液貯留
タンクと低温液熱交換器との2組の系統を設け、各貯留
タンクおよび各熱交換器の外壁に保温構造を施し、前記
処理槽内の前記噴霧ノズルへ加熱用高温液および冷却用
低温液のいずれか一方を選択的に供給するための開閉弁
を、前記高温液循環系配管および前記低温液循環系配管
にそれぞれ介設した請求項1記載の噴霧式熱処理装置。
2. A system for supplying the treatment liquid is provided with two sets of a high-temperature liquid storage tank for heating and a high-temperature liquid heat exchanger, and a low-temperature liquid storage tank for cooling and a low-temperature liquid heat exchanger. An on-off valve for selectively supplying either a high-temperature heating liquid or a low-temperature cooling liquid to the spray nozzle in the processing tank is provided on the outer wall of the tank and each heat exchanger. The spray heat treatment apparatus according to claim 1, wherein the spray-type heat treatment apparatus is provided in the liquid circulation system pipe and the low-temperature liquid circulation system pipe, respectively.
【請求項3】 前記処理槽に、給排気口を設けた請求項
1又は2記載の噴霧式熱処理装置。
3. The spray heat treatment apparatus according to claim 1, wherein a supply / exhaust port is provided in the treatment tank.
【請求項4】 前記処理槽の底部に排液口を備えた液溜
まり部を形成し、該液溜まり部内に、前記加熱用高温液
貯留タンクへの循環ポンプおよび同循環ポンプ側開閉弁
と、前記冷却用低温液貯留タンクへの循環ポンプおよび
同循環ポンプ側開閉弁等の運転切換用レベルスイッチを
配備した請求項2又は3記載の噴霧式熱処理装置。
4. A liquid reservoir having a drainage port formed at the bottom of the processing tank, and a circulation pump to the heating high-temperature liquid storage tank and a circulation pump-side opening / closing valve in the liquid reservoir. The spray type heat treatment apparatus according to claim 2 or 3, further comprising an operation switching level switch such as a circulation pump to the low-temperature liquid storage tank for cooling and an on-off valve on the circulation pump side.
【請求項5】 前記開閉弁を、二方へそれぞれ独立して
流量調節可能な三方切換弁にした請求項1〜4のいずれ
かに記載の噴霧式熱処理装置。
5. The spray heat treatment apparatus according to claim 1, wherein the on-off valve is a three-way switching valve capable of adjusting a flow rate independently to two directions.
JP15806299A 1999-06-04 1999-06-04 Spray heat treatment equipment Expired - Lifetime JP3425393B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15806299A JP3425393B2 (en) 1999-06-04 1999-06-04 Spray heat treatment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15806299A JP3425393B2 (en) 1999-06-04 1999-06-04 Spray heat treatment equipment

Publications (2)

Publication Number Publication Date
JP2000346790A true JP2000346790A (en) 2000-12-15
JP3425393B2 JP3425393B2 (en) 2003-07-14

Family

ID=15663476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15806299A Expired - Lifetime JP3425393B2 (en) 1999-06-04 1999-06-04 Spray heat treatment equipment

Country Status (1)

Country Link
JP (1) JP3425393B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007212320A (en) * 2006-02-10 2007-08-23 Espec Corp Accelerated surface deterioration test method and device
JP2007218639A (en) * 2006-02-14 2007-08-30 National Institute For Materials Science Sea salt particle generator of high-speed high-precision
JP2011169691A (en) * 2010-02-17 2011-09-01 Espec Corp Environment testing device
KR101101072B1 (en) * 2009-10-21 2011-12-30 주식회사 케피코 thermal shock test chamber
CN104122079A (en) * 2013-04-25 2014-10-29 深圳市海洋王照明工程有限公司 Key cap test method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007212320A (en) * 2006-02-10 2007-08-23 Espec Corp Accelerated surface deterioration test method and device
JP4727439B2 (en) * 2006-02-10 2011-07-20 エスペック株式会社 Surface state deterioration promotion test method and surface state deterioration promotion test apparatus
JP2007218639A (en) * 2006-02-14 2007-08-30 National Institute For Materials Science Sea salt particle generator of high-speed high-precision
JP4714832B2 (en) * 2006-02-14 2011-06-29 独立行政法人物質・材料研究機構 High-speed and high-precision sea salt particle generator
KR101101072B1 (en) * 2009-10-21 2011-12-30 주식회사 케피코 thermal shock test chamber
JP2011169691A (en) * 2010-02-17 2011-09-01 Espec Corp Environment testing device
CN104122079A (en) * 2013-04-25 2014-10-29 深圳市海洋王照明工程有限公司 Key cap test method

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