JPS61255788A - Laser beam processing head - Google Patents

Abstract

PURPOSE:To make possible the efficient and stable processing of a work having high reflectivity by radiating an absorbent which accelerates the absorption of a laser beam to be irradiated on the work to the processing part of the work. CONSTITUTION:A container 6 for the absorbent 7 is mounted to a processing head body 3a and the absorbent 7 is radiated from the container 6 and is successively coated along the processing shape of the work 11 as the body 3a moves. The absorbent 7 prevents the reflection of the laser beam 1 on the surface of the work 1 and since the energy of the beam 1 is easily absorbed to the work 11, the device is effective particularly for the laser beam processing of the work 11 having high reflectivity.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a modification of a laser processing head device for laser processing workpieces with high reflectivity such as gold, silver, and phosphor bronze. .

[Conventional technology]

There is a conventional laser processing RAD device shown in Fig. 2. In the figure, (1) is the laser beam output from a laser oscillator (not shown), and (2) is the laser beam (1) that is focused to an energy density that matches the purpose of processing. Condensing lens for irradiation, (3
)t! The main body of the processing head covers the laser beam (1) and the condenser lens (2), and (4) is the assist gas supply port.

(5) is an assist gas nozzle provided at the bottom of the processing head body (3) coaxially with the laser beam (1).

Normally, in laser processing, a laser beam (1) output from one oscillator is focused by a condensing lens (2).

At this time, the laser beam (1) and the assist gas supply port (4)
The workpiece Ql) is processed by simultaneously irradiating and injecting the assist gas supplied from the assist gas nozzle /L/ (5) onto the workpiece qη. However, 1 e.g. gold, silver, phosphor bronze.

For workpieces (6) such as brass and 1 μm.

As shown in Figure 3, the reflectance is 1%i (, laser beam (
1) It has the property of being difficult to absorb. Therefore, when processing these highly reflective workpieces (6).

Since the laser beam (1) is not absorbed by the workpiece (b) but is reflected by the surface of the workpiece (b), processing is extremely difficult.

[Problem that the invention seeks to solve]

Since the conventional laser processing head device has a groove bottom as described above, when processing a flat workpiece α with a reflectance of 1, the laser beam (1) is difficult to be absorbed by the workpiece (6). Therefore, processing efficiency is poor, stable processing cannot be performed, and the laser beam (2) reflected from the surface of the workpiece (2) is
1) has the problem of destroying the assist gas nozzle /I/ (5) or the condenser lens (2).

This invention was made to solve the above-mentioned problems, even when the workpiece has a high reflectance.

The objective is to obtain a laser processing head device that can perform efficient and stable processing.

[Means for Solving the Problems] The laser processing head device t according to the present invention includes a laser beam outputted from one oscillator and a condensing lens that condenses the laser beam and irradiates it onto the workpiece. The main body of the processing head is provided with means for emitting an absorbent that promotes absorption of the laser beam irradiated onto the workpiece onto the processed portion of the workpiece.

[For production]

In this invention, by means of emitting an absorbent,
During machining, the absorbent is applied radiation along the shape of the workpiece while machining progresses.

(Embodiment of the invention) Hereinafter, a further embodiment of the invention will be explained with reference to the drawings.
In the figure, (1), (2), (4),
(5) , α1) are the same as the conventional ones, (6) is a container that contains the laser beam absorber (7), and (8) is a container that controls the emission, stop, amount of radiation, etc. of the absorber (7). The switch (9) is a support for the container (6), and αG is a fixture that has one side engaged with the support (9) and the other located on the processing head main body (8a). The support tool (9) and the fixture (10 are for holding the container (6) and the anvil).

The bottom of the container (6) is grooved so that the angle of the container (6) can be freely adjusted.

Next, the operation will be explained. Processing head body (8a)
After loading the absorbent (7) into the container (6), processing is carried out by normal means, and as the processing head main body (3a) moves during processing, the absorbent (6) is removed from the container (6).
7) is emitted and applied along the machining shape of the workpiece (b). The radiation of the absorber (7) at this time.

Control such as stopping and radiation amount is performed, for example, by operating a switch (8) provided on the container (6) in accordance with an instruction from a separately provided operation panel.

As described above, the absorbent (7) is applied to the processed part of the workpiece αυ by the laser beam (
By preventing reflection on the surface of the workpiece (6) in 1), the energy of the laser beam (1) is easily absorbed by the workpiece (b), so the laser beam is applied to the workpiece αη, which has a particularly high reflectance. Effective for processing.

In addition, in the above-mentioned example, processing was carried out while applying the absorbent (7) by radiation, but this was done before processing.

Apply it to the part of the workpiece to be processed in advance.

After sowing, the laser beam (1) is irradiated to perform processing i, producing the same effect as t4.

〔Effect of the invention〕

As described above, according to the present invention, the laser processing head device is provided with a means for emitting a laser beam absorbent.
For example, when processing workpieces with high reflectivity such as gold, silver, or phosphor bronze using a laser, the processing can be performed efficiently and stably, and the absorption agent prevents the reflection of the laser beam from the surface of the workpiece. Since this can be prevented, it is possible to obtain a V-za processing head apparatus that can prevent destruction of the assist gas nozzle and the condensing lens.

[Brief explanation of the drawing]

Fig. 1 is an assembled diagram of a laser processing head device showing a complete embodiment of this invention, and Fig. 2 is a diagram of a conventional laser processing head device.
Figure 8 is a diagram showing the reflectance of various materials. In the figure, (1) is the laser beam, (2) is the condenser lens, (3a) is the processing head body, (6) is the container, (
7) is an absorbent, and (6) is a workpiece. Note that the same reference numerals in Figure 1 indicate the same parts.

Claims (1)

[Claims] An outputted laser beam, a condenser lens that condenses the laser beam and irradiates it onto the workpiece, a processing head body that covers the laser beam and the condenser lens, and a laser that irradiates the workpiece. 1. A laser processing head device comprising: means for emitting an absorbent that promotes absorption of a beam onto a processing portion of a workpiece.