JP2684414B2 - Laser processing method - Google Patents
Laser processing methodInfo
- Publication number
- JP2684414B2 JP2684414B2 JP1123052A JP12305289A JP2684414B2 JP 2684414 B2 JP2684414 B2 JP 2684414B2 JP 1123052 A JP1123052 A JP 1123052A JP 12305289 A JP12305289 A JP 12305289A JP 2684414 B2 JP2684414 B2 JP 2684414B2
- Authority
- JP
- Japan
- Prior art keywords
- laser light
- processed
- processing
- laser
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明はレーザによる加工方法、特に照射されたレー
ザ光の吸収率を高めて加工部材を加工するレーザによる
加工方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing method, and more particularly, to a laser processing method for processing a processing member by increasing the absorption rate of irradiated laser light.
（従来の技術） 反射率の高い、すなわち吸収率の低い難加工材をレー
ザ光線により加工する手段として、従来、例えば、特開
昭60−152390号公報に記載の技術が周知である。この従
来技術によれば、加工物の表面に予め黒鉛粉末等の吸光
剤を塗布し、加工物のレーザ光吸収率を高めて加工する
というものである。(Prior Art) As a means for processing a difficult-to-machine material having a high reflectance, that is, a low absorptance with a laser beam, a technology described in, for example, JP-A-60-152390 is conventionally well known. According to this conventional technique, a light absorber such as graphite powder is applied to the surface of the workpiece in advance to increase the laser light absorption rate of the workpiece for processing.
（発明が解決しようとする課題） しかしながら、前述した従来のレーザ加工手段による
と、以下に述べるような種々の課題があった。(Problems to be Solved by the Invention) However, the above-described conventional laser processing means has various problems as described below.
加工物の個々に吸光剤を予め塗布しなければならな
いため、手間がかかりコストアップとなる。Since it is necessary to apply the light absorbing agent to each of the workpieces in advance, it is time-consuming and costly.
吸光剤を塗布する際に、任意の形状に塗布したり微
小部分に塗布するのが難しい。When applying the light absorber, it is difficult to apply it in an arbitrary shape or a minute portion.
加工物が塗布剤により汚れ易く、この汚れを落とす
のに加工後の洗浄に手間がかかる。The processed material is easily soiled by the coating agent, and it takes a lot of time to clean after processing to remove this soiled material.
この発明は係る課題を解決するためになされたもの
で、その目的とするところは、照射されたレーザ光の吸
収率を高めることにより、加工部材や加工箇所の大きさ
に拘らず、また加工部材を汚すことなく、更に難加工材
に対しても容易に所望の加工物を施すことのできるレー
ザによる加工方法を提供することにある。The present invention has been made to solve the above problems, and an object of the present invention is to increase the absorption rate of irradiated laser light, regardless of the size of the processed member or the processed portion, and the processed member. Another object of the present invention is to provide a laser processing method that can easily apply a desired processed material to a difficult-to-process material without soiling the surface.
（課題を解決するための手段） 前記目的を達成するために、本発明方法は、片面にレ
ーザ光吸収層を形成してなる透光体の前記片面に加工部
材を複数突合せて接触して配置させ、又は前記片面に加
工部材を複数重ね合せて接触して配置させ、前記透光体
の他面からレーザ光を前記加工部材に照射して、レーザ
光の吸収率を高め、これら加工部材を接合してなること
を特徴としている。(Means for Solving the Problems) In order to achieve the above-mentioned object, the method of the present invention is arranged such that a plurality of processing members are abutted against and in contact with one surface of a light-transmitting body having a laser light absorption layer formed on one surface. Or a plurality of processing members are placed in contact with each other on one surface, and the processing member is irradiated with laser light from the other surface of the translucent body to increase the absorption rate of the laser light. It is characterized by being joined.
また、片面に蒸着あるいはスパッタリング等の薄膜形
成手段によりレーザ光吸収層を形成してなる透光体の前
記片面に加工部材を接触して配置させ、前記透光体の他
面からレーザ光を前記加工部材に照射して、レーザ光の
吸収率を高め、加工部材を切断することを特徴としてい
る。Further, a processing member is placed in contact with the one surface of the light-transmitting body having a laser light absorption layer formed on one surface by a thin film forming means such as vapor deposition or sputtering, and the laser light is emitted from the other surface of the light-transmitting body. It is characterized by irradiating the processed member to increase the absorption rate of the laser light and cutting the processed member.
（作用） 前記構成により請求項１記載の発明方法においては、
透光体の片面に形成したレーザ光吸収層により、照射さ
れたレーザ光の吸収率を高めてそのレーザエネルギーを
効果的に活用し、このエネルギーが直接加工部材に供給
される構成を有しているので、いわゆる反射率の高い難
加工材に対しても、容易に接合が可能となる。(Operation) With the above-mentioned configuration, in the method of the present invention according to claim 1,
With the laser light absorption layer formed on one side of the translucent body, the absorption rate of the irradiated laser light is increased to effectively utilize the laser energy, and this energy is directly supplied to the processed member. Therefore, even a difficult-to-process material having a high reflectance can be easily joined.
さらに、請求項２記載の発明方法においては、蒸着あ
るいはスパッタリング等の薄膜形成手段により透光体の
片面に形成したレーザ光吸収層が前記請求項１のレーザ
光吸収層と同様の作用を発揮し、いわゆる反射率の高い
難加工材に対しても、容易に切断が可能となる。Further, in the method of the present invention as defined in claim 2, the laser light absorbing layer formed on one surface of the light transmitting body by means of thin film forming means such as vapor deposition or sputtering exhibits the same function as the laser light absorbing layer in claim 1. Thus, even a so-called difficult-to-process material having a high reflectance can be easily cut.
また、前記透光体に形成されたレーザ光吸収層のパタ
ーンを変更することによって、簡単に所望の形状に加工
することが可能であり、更に、加工部材には従来例のよ
うに直接吸光剤等が塗布されることがないので、加工後
の洗浄が容易であり、作業工数が大幅に削減されるとい
う利点を有する。Further, by changing the pattern of the laser light absorption layer formed on the translucent body, it is possible to easily process it into a desired shape. Since it is not applied, it has an advantage that cleaning after processing is easy and the number of working steps is significantly reduced.
（実施例） 以下、図面に基づき本発明の好ましい実施例を説明す
る。Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
本発明方法においては、片面にレーザ光吸収層を形成
してなる透光体の前記片面に加工部材を複数突合せて接
触して配置させ、又は前記片面に加工部材を複数重ね合
せて接触して配置させ、前記透光体の他面からレーザ光
を前記加工部材に照射して、レーザ光の吸収率を高め、
これら加工部材を接合してなることを特徴とする。In the method of the present invention, a plurality of processed members are placed in contact with each other on one side of the light-transmitting body formed with a laser light absorption layer on one side, or a plurality of processed members are placed on one side and brought into contact with each other. Arranged, irradiating the processing member with laser light from the other surface of the translucent body to increase the absorption rate of laser light,
It is characterized in that these processed members are joined together.
また、本発明方法においては、片面にレーザ光吸収層
を形成してなる透光体の前記片面に加工部材を接触して
配置させ、前記透光体の他面からレーザ光を前記加工部
材に照射して、レーザ光の吸収率を高め、加工部材を切
断することを特徴とする。Further, in the method of the present invention, a processing member is placed in contact with the one surface of the translucent body having a laser light absorption layer formed on one surface, and laser light is applied to the processed member from the other surface of the translucent body. Irradiation is performed to increase the absorption rate of laser light, and the processed member is cut.
本実施例において、第１図には、透光体１の片面に加
工部材３を接触配置し、他面からレーザ光を照射して加
工（接合又は切断）を行う場合の概念図が示されてお
り、第２図には、前記透光体１の概略構成が示されてい
る。In the present embodiment, FIG. 1 shows a conceptual diagram in the case where a processing member 3 is arranged in contact with one surface of a light-transmitting body 1 and laser light is irradiated from the other surface to perform processing (bonding or cutting). FIG. 2 shows a schematic structure of the translucent body 1.
前記透光体１は、透光部材1aの片面にレーザ光吸収層
２が形成されたものであり、透光部材1aとしては、例え
ばYAGによる加工（接合又は切断）を行う場合には石英
ガラスが用いられる。The translucent body 1 has a laser light absorption layer 2 formed on one surface of a translucent member 1a. As the translucent member 1a, for example, quartz glass is used when processing (joining or cutting) by YAG. Is used.
前記レーザ光吸収層２としてはカーボンやニッケル等
の吸収率の高い材料が用いられ、照射されたレーザ光の
吸収率を高めてそのレーザエネルギーを加工部材３に供
給する役目をなす。このレーザ光吸収層２は前記透光部
材1aの表面に蒸着あるいはスパッタリングの薄膜形成手
段の手段によって形成される。A material having a high absorptivity such as carbon or nickel is used for the laser light absorption layer 2 and serves to increase the absorptivity of the irradiated laser light and supply the laser energy to the processed member 3. The laser light absorption layer 2 is formed on the surface of the transparent member 1a by means of thin film forming means such as vapor deposition or sputtering.
第３図には、本発明方法により加工部材を溶接する場
合の実施例が示されている。FIG. 3 shows an embodiment in which the processed members are welded by the method of the present invention.
すなわち、第３図（ａ）（ｂ）は突合わせ溶接を行う
場合の例であり、この突合わせ溶接を行うには、同図の
ように、先ず、加工部材３−１、３−２の端面同志を互
いに突合わせ、該突合せ面の上部に透光体１をそのレー
ザ光吸収層２が接触するように配置する。このとき、突
合せ面に沿ってレーザ光吸収層２が位置するようにする
ことがポイントである。That is, FIGS. 3 (a) and 3 (b) are examples in the case of performing butt welding. To perform this butt welding, first, as shown in FIG. The end faces are abutted against each other, and the light transmitting body 1 is arranged on the abutting face so that the laser light absorbing layer 2 thereof is in contact with the light transmitting body 1. At this time, the point is that the laser light absorption layer 2 is positioned along the abutting surface.
次に、上方からレーザ光を照射するわけであるが、そ
の照射位置を突合せ面に沿って移動させると、レーザ光
吸収層２によってレーザエネルギー効果的に活用され、
これにより加工部材３の突合せ面が順次溶融して溶接さ
せることになる。Next, laser light is irradiated from above. When the irradiation position is moved along the abutting surface, the laser energy is effectively utilized by the laser light absorption layer 2,
As a result, the butt surfaces of the processed members 3 are sequentially melted and welded.
また、第３図（ｃ）（ｄ）は重ね合せ溶接を行う場合
の例であり、この場合は、加工部材３−１、３−２を上
下に重ね合せ、その上部に透光体１を前記と同様に接触
させて配置する。このとき、溶接を行いたい箇所にレー
ザ光吸収層２を位置させることは前記と同様である。次
に、透光体１の上方からレーザ光を照射すると、その照
射位置はレーザ光吸収層２を介して溶解し、第３図
（ｄ）のように、その溶融部分は下側の加工部材３−２
にまで達し、これによって良好な重ね合わせ溶接が行わ
れる。Further, FIGS. 3 (c) and (d) show an example of the case where lap welding is performed. In this case, the processed members 3-1 and 3-2 are vertically stacked, and the translucent body 1 is placed on top of them. As in the above, they are placed in contact with each other. At this time, the laser light absorption layer 2 is positioned at a place where welding is desired, as described above. Next, when laser light is irradiated from above the translucent body 1, the irradiation position is melted through the laser light absorption layer 2, and the melted portion is the lower processed member as shown in FIG. 3 (d). 3-2
Which results in good lap welding.
第４図（ａ）（ｂ）（ｃ）には、本発明方法により加
工部材を切断する場合の実施例が示されている。4 (a), (b) and (c) show an embodiment in the case of cutting a processed member by the method of the present invention.
すなわち、この実施例では、加工部材３を曲線に沿っ
て切断する場合の例であり、透光体１の片面には、第４
図（ｂ）のように任意曲線に沿ってレーザ光吸収層２が
形成されている。そして、切断に際し、この透光体１を
加工部材３の上部に接触させて配置し、次に透光体１の
上方からレーザ光を前記レーザ光吸収層２に沿って連続
的に移動させながら照射する。このとき、加工部材３の
溶接部がその表面から裏面に達する程度までレーザ光を
照射し乍ら移動させると、第４図（ｃ）のように、加工
部材３は前記レーザ光吸収層２の任意曲線に沿って切断
される。なお、前記レーザ光吸収層２を直線状に形成
し、加工部材３をこの直線に沿って切断できるのは勿論
である。That is, this embodiment is an example of cutting the processed member 3 along a curved line, and a fourth surface is provided on one surface of the light-transmissive body 1.
The laser light absorption layer 2 is formed along an arbitrary curve as shown in FIG. Then, at the time of cutting, the translucent body 1 is placed in contact with the upper portion of the processing member 3, and then laser light is continuously moved from above the translucent body 1 along the laser light absorption layer 2. Irradiate. At this time, when the welded portion of the processed member 3 is moved and irradiated with laser light to such an extent that it reaches the front surface to the back surface of the processed member 3, the processed member 3 is moved to the laser light absorption layer 2 as shown in FIG. 4 (c). It is cut along an arbitrary curve. It is needless to say that the laser light absorption layer 2 can be formed linearly and the processing member 3 can be cut along the line.
（発明の効果） 本発明は以上説明した通り、片面にレーダ光吸収層を
形成してなる透光体の前記片面に加工部材を複数突合せ
て接触して配置させ、又は前記片面に加工部材を複数重
ね合せて接触して配置させ、前記透光体の他面からレー
ザ光を前記加工部材に照射して、レーザ光の吸収率を高
め、これら加工部材を接合するように構成したので、特
に反射率の高い難加工材であってもレーザエネルギーを
効果的に活用して効率よく容易に接合できる。(Effects of the invention) As described above, the present invention arranges a plurality of processed members in abutting contact with one surface of a light-transmitting body having a radar light absorption layer formed on one surface, or a processed member is provided on the one surface. Since a plurality of laser light are irradiated from the other surface of the light-transmitting body to the processing members to increase the absorption rate of the laser light and the processing members are joined, Even difficult-to-process materials with high reflectance can be efficiently and easily joined by effectively utilizing laser energy.
また、本発明によれば、片面にレーザ光吸収層を蒸着
あるいはスパッタリング等の薄膜形成手段により形成し
てなる透光体の前記片面に加工部材を接触して配置さ
せ、前記透光体の他面からレーザ光を前記加工部材に照
射して、レーザ光の吸収率を高め、加工部材を切断する
ように構成したので、特に反射率の高い難加工材であっ
てもレーザエネルギーを効果的に活用して効率よく容易
に切断できる。Further, according to the present invention, a processing member is placed in contact with the one surface of the light-transmissive body formed by a thin film forming means such as vapor deposition or sputtering on one surface, and the laser light absorption layer is disposed on the other side of the light-transmissive body. Since the processing member is irradiated with laser light from the surface to increase the absorption rate of the laser light and cut the processing member, the laser energy can be effectively applied even for a difficult-to-process material having a high reflectance. It can be used to cut efficiently and easily.
また、本発明によれば、レーザ光吸収層のパターンを
変更することにより、種々の形状の加工部材同志を接合
し、あるいは、加工部材を種々の形状に切断できる。Further, according to the present invention, by changing the pattern of the laser light absorption layer, it is possible to join the processed members having various shapes or to cut the processed members into various shapes.
さらに、本発明によれば、加工部材に直接吸光剤を塗
布する従来技術に比較し、加工後の洗浄が容易であると
いう利点を有する。Further, according to the present invention, there is an advantage that cleaning after processing is easy as compared with the conventional technique in which the light absorbing agent is directly applied to the processed member.
第１図は透光体の片面に加工部材を接触配置し、他面か
らレーザ光を照射して加工を行う場合の概念図、第２図
は透光体の概略構成を示す側面図、第３図（ａ）は加工
部材の突合せ溶接を行う実施例を示す図、第３図（ｂ）
はそのＡ方向矢視図、第３図（ｃ）は加工部材の重ね合
せ溶接を行う実施例を示す図、第３図（ｄ）は溶接箇所
の断側面図、第４図（ａ）は加工部材の切断を行う実施
例を示す図、第４図（ｂ）はそのときに用いられる透光
体の外観図、第４図（ｃ）は加工部材が切断された状態
を示す図である。 １……透光体 1a……透光部材 ２……レーザ光吸収層 3,3−1,3−２……加工部材FIG. 1 is a conceptual diagram in which a processing member is arranged in contact with one surface of a light-transmitting body and laser light is irradiated from the other surface, and FIG. 2 is a side view showing a schematic configuration of the light-transmitting body. FIG. 3 (a) is a diagram showing an embodiment in which butt welding of processed members is performed, and FIG. 3 (b).
Is a view in the direction of the arrow A, FIG. 3 (c) is a view showing an embodiment in which lap welding of processed members is performed, FIG. 3 (d) is a cross-sectional side view of a welding portion, and FIG. 4 (a) is FIG. 4 (b) is an external view of a translucent body used at that time, and FIG. 4 (c) is a view showing a state in which the processed member is cut. . 1 ... translucent body 1a ... translucent member 2 ... laser light absorption layer 3,3-1, 3-2 ... processed member
───────────────────────────────────────────────────── フロントページの続き (72)発明者 久保 雅男 大阪府門真市大字門真1048番地 松下電 工株式会社内 (56)参考文献 特開 昭63−126687（ＪＰ，Ａ) 特開 昭63−43784（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masao Kubo 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works, Ltd. (56) References JP 63-126687 (JP, A) JP 63-43784 (JP, A)
Claims (2)
体の前記片面に加工部材を複数突合せて接触して配置さ
せ、又は前記片面に加工部材を複数重ね合せて接触して
配置させ、前記透光体の他面からレーザ光を前記加工部
材に照射して、レーザ光の吸収率を高め、これら加工部
材を接合してなることを特徴とするレーザによる加工方
法。1. A plurality of processed members are abutted on and arranged in contact with one surface of a light-transmitting body having a laser light absorption layer formed on one surface thereof, or a plurality of processed members are arranged in contact with each other on one side thereof. Then, a laser beam is applied to the processing member from the other surface of the translucent body to increase the absorption rate of the laser beam, and the processing members are joined together.
膜形成手段によりレーザ光吸収層を形成してなる透光体
の前記片面に加工部材を接触して配置させ、前記透光体
の他面からレーザ光を前記加工部材に照射して、レーザ
光の吸収率を高め、加工部材を切断することを特徴とす
るレーザによる加工方法。2. A processing member is placed in contact with one surface of a light-transmitting body having a laser light absorption layer formed on one surface by thin film forming means such as vapor deposition or sputtering, and the laser is applied from the other surface of the light-transmitting body. A laser processing method, which comprises irradiating the processed member with light to increase the absorption rate of laser light and cutting the processed member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1123052A JP2684414B2 (en) | 1989-05-17 | 1989-05-17 | Laser processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1123052A JP2684414B2 (en) | 1989-05-17 | 1989-05-17 | Laser processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02303696A JPH02303696A (en) | 1990-12-17 |
| JP2684414B2 true JP2684414B2 (en) | 1997-12-03 |
Family
ID=14851013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1123052A Expired - Fee Related JP2684414B2 (en) | 1989-05-17 | 1989-05-17 | Laser processing method |
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| Country | Link |
|---|---|
| JP (1) | JP2684414B2 (en) |
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| JP2006082232A (en) * | 2004-09-14 | 2006-03-30 | Fujitsu Ltd | Laser processing method |
| US7927991B2 (en) * | 2006-08-25 | 2011-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| TW201933665A (en) * | 2018-01-25 | 2019-08-16 | 日商東京威力科創股份有限公司 | Method for manufacturing thin film battery element |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0688148B2 (en) * | 1986-08-08 | 1994-11-09 | マツダ株式会社 | Laser engraving method on goods |
| JPS63126687A (en) * | 1986-11-14 | 1988-05-30 | Mitsubishi Electric Corp | Method for cutting resin plate |
-
1989
- 1989-05-17 JP JP1123052A patent/JP2684414B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02303696A (en) | 1990-12-17 |
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| LAPS | Cancellation because of no payment of annual fees |