JPH02303696A - Machining method utilizing laser beam - Google Patents
Machining method utilizing laser beamInfo
- Publication number
- JPH02303696A JPH02303696A JP1123052A JP12305289A JPH02303696A JP H02303696 A JPH02303696 A JP H02303696A JP 1123052 A JP1123052 A JP 1123052A JP 12305289 A JP12305289 A JP 12305289A JP H02303696 A JPH02303696 A JP H02303696A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- laser
- workpiece
- transparent body
- laser light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 16
- 238000003754 machining Methods 0.000 title abstract 2
- 238000010521 absorption reaction Methods 0.000 claims abstract description 19
- 230000031700 light absorption Effects 0.000 claims description 26
- 238000003672 processing method Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 8
- 230000001678 irradiating effect Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract 4
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000006096 absorbing agent Substances 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はレーザによる加工方法、特に照射されたレーザ
光の吸収率を高めて加工部材を加工するレーザによる加
工方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a laser processing method, and particularly to a laser processing method for processing a workpiece by increasing the absorption rate of irradiated laser light.
（従来の技術）
反射率の高い、すなわち吸収率の低い難加工材をレーザ
光線により加工する手段として、従来、例えば特開昭６
０−１５２３９０号公報に記載の技術が周知である。(Prior Art) As a means of processing difficult-to-process materials with high reflectance, that is, low absorption, using laser beams, for example, Japanese Patent Laid-Open No. 6
The technique described in Japanese Patent No. 0-152390 is well known.
この従来技術によれば、加工物の表面に予め黒鉛粉末等
の吸光剤を塗布し、加工物のレーザ光吸収率を高めて加
工するというものである。According to this conventional technique, a light absorbing agent such as graphite powder is applied to the surface of the workpiece in advance to increase the laser light absorption rate of the workpiece.
（発明が解決しようとする課題）
しかしながら、前述した従来のレーザ加工手段によると
、以下に述べるような種々の課題があった。(Problems to be Solved by the Invention) However, the conventional laser processing means described above has had various problems as described below.
■ 加工物の個々に吸光剤を予め塗布しなければならな
いため、手間がかかりコストアップとなる。■ Light absorbing agent must be applied to each workpiece in advance, which is time-consuming and increases costs.
■ 吸光剤を塗布する際に、任意の形状に塗布したり極
小部分に塗布するのが難しい。■ When applying a light absorber, it is difficult to apply it to an arbitrary shape or to a very small area.
■ 加工物が塗布剤により汚れ易く、この汚れを落とす
のに加工後の洗浄に手間がかかる。■ The workpiece is easily stained by the coating agent, and cleaning after processing is time-consuming to remove this stain.
この発明は斯る課題を解決するためになされたもので、
その目的とするところは、照射されたレーザ光の吸収率
を高めることにより、加工部材や加工箇所の大きさに拘
らず、また加工部材を汚すことなく、更に難加工材に対
しても容易に所望の加工を施すことのできるレーザによ
る加工方法を提供することにある。This invention was made to solve this problem.
The purpose of this is to increase the absorption rate of the irradiated laser light, regardless of the size of the workpiece or processing area, without contaminating the workpiece, and even on difficult-to-process materials. It is an object of the present invention to provide a processing method using a laser that can perform desired processing.
ＣｍＨを解決するための手段）
前記目的を達成するために、本発明方法は、片面にレー
ザ光吸収層を形成してなる透光体の前記片面に加工部材
を接触して配置させるか、または複数重ね合せて接触し
て配置させ、前記透光体の他面からレーザ光を前記加工
物に照射して、レーザ光の吸収率を高めることを特徴と
し、また、このようにレーザ光の吸収率を高めることに
よって、加工部材を接合したり、切断したり、あるいは
加工部材の表面改質を行ったり、更に加工部材に穴を明
けたりすることを特徴としている。Means for Solving CmH) In order to achieve the above object, the method of the present invention includes placing a processed member in contact with one side of a transparent body having a laser light absorption layer formed on one side, or The method is characterized in that a plurality of the light-transmitting bodies are stacked and arranged in contact with each other, and the workpiece is irradiated with laser light from the other surface of the transparent body to increase the absorption rate of the laser light. By increasing the rate, it is possible to join or cut workpieces, to modify the surface of workpieces, or to drill holes in workpieces.
（作用）
前記構成により、本発明方法においては、透光体の片面
に形成したレーザ光吸収層により、照射されたレーザ光
の吸収率を高めてそのレーザエネルギを効果的に活用し
、このエネルギが直接加工部材に供給される構成を有し
ているので、いわゆる反射率の高い難加工材に対しても
、容易に種々の加工を施すことが可能となる。(Function) With the above configuration, in the method of the present invention, the absorption rate of the irradiated laser light is increased by the laser light absorption layer formed on one side of the transparent body, and the laser energy is effectively utilized. Since it has a structure in which the material is directly supplied to the workpiece, it is possible to easily perform various kinds of processing even on so-called difficult-to-work materials with high reflectance.
また、前記透光体に形成されたレーザ光吸収層のパター
ンを変更することによって、簡単に所望形状あるいは任
意モードの加工を行うことが可能であり、更に、加工部
材には従来例のように直接吸光剤等が塗布されることが
ないので、加工後の洗浄が容易であり、作業工数が大幅
に削減されるという利点を育する。In addition, by changing the pattern of the laser light absorption layer formed on the transparent body, it is possible to easily process a desired shape or arbitrary mode, and furthermore, the workpiece can be processed in the same manner as in the conventional example. Since no light absorbing agent or the like is directly applied, cleaning after processing is easy and the number of work steps can be significantly reduced.
（実施例）
以下、図面に基づき本発明の好ましい実施例を説明する
。(Example) Hereinafter, preferred examples of the present invention will be described based on the drawings.
本発明方法においては、片面にレーザ光吸収層を形成し
てなる透光体の前記片面に加工部材を接触して配置させ
、前記透光体の他面からレーザ光を前記加工部材に照射
して、レーザ光の吸収率を高めるようにしたことを特徴
とする。In the method of the present invention, a workpiece is placed in contact with one side of a transparent body having a laser light absorption layer formed on one side, and a laser beam is irradiated onto the workpiece from the other side of the transparent body. The present invention is characterized in that the absorption rate of laser light is increased.
本実施例において、第１図には、透光体１の片面に加工
部材３を接触配置し、他面からレーザ光を照射して加工
を行う場合の実施例が示されており、第２図には、前記
透光体１の概略構成が示されている。In this embodiment, FIG. 1 shows an example in which a processing member 3 is arranged in contact with one side of a transparent body 1 and processing is performed by irradiating a laser beam from the other side. The figure shows a schematic configuration of the transparent body 1. As shown in FIG.
前記通光体１は、透光部材１ａの片面にレーザ光吸収層
２が形成されたものであり、透光部材ｌａとしては、例
えばＹＡＧレーザによる加工を行う場合には石英ガラス
が用いられる。The light transmitting body 1 has a laser light absorption layer 2 formed on one side of a light transmitting member 1a, and as the light transmitting member la, for example, quartz glass is used when processing is performed using a YAG laser.
前記レーザ光吸収層２としてはカーボンやニッケル等の
吸収率の高い材料が用いられ、照射されたレーザ光の吸
収率を高めてそのレーザエネルギを加工部材３に供給す
る役目をなす、このレーザ光吸収層２は前記透光部材１
ａの表面に蒸着あるいはスパッタリング等の手段によっ
て形成される。A material with high absorption rate such as carbon or nickel is used as the laser beam absorption layer 2, and this laser beam serves to increase the absorption rate of the irradiated laser beam and supply the laser energy to the workpiece 3. The absorption layer 2 is the transparent member 1
It is formed on the surface of a by means such as vapor deposition or sputtering.
第３図には、本発明方法により加工部材を溶接する場合
の実施例が示されている。FIG. 3 shows an embodiment in which workpieces are welded by the method of the invention.
すなわち、第３図（ａ）（ｂ）は突合せ溶接を行う場合
の例であり、この突合せ溶接を行うには、同図のように
、先ず、加工部材３−１．３−２の端面同士を互いに突
合せ、該突合せ面の上部に透光体ｌをそのレーザ光吸収
層２が接触するように配置する。このとき、突合せ面に
沿ってレーザ光吸収層２が位置するようにすることがポ
イントである。That is, FIGS. 3(a) and 3(b) are examples of butt welding. To perform this butt welding, first, as shown in the figure, the end faces of workpieces 3-1 and 3-2 are are abutted against each other, and a transparent body 1 is placed above the abutting surfaces so that its laser light absorbing layer 2 is in contact with the light-transmitting body 1. At this time, it is important to position the laser light absorption layer 2 along the abutting surfaces.
次に、上方からレーザ光を照射するわけであるが、その
照射位置を突合せ面に沿って移動させると、レーザ光吸
収層２によってレーザエネルギが効果的に活用され、こ
れにより加工部材３の突合せ面が順次溶融して溶接され
ることになる。Next, a laser beam is irradiated from above, and when the irradiation position is moved along the abutment surface, the laser energy is effectively utilized by the laser light absorption layer 2, which allows the workpieces 3 to be abutted. The surfaces will be sequentially melted and welded.
また、第３図（Ｃ）（６）は重ね合せ溶接を行う場合の
例であり、この場合は、加工部材３−１．３−２を上下
に重ね合せ、その上部に透光体ｌを前記と同様に接触さ
せて配置する。このとき、溶接を行いたい箇所にレーザ
光吸収層２を位置させることは前記と同様である０次に
、透光体１の上方からレーザ光を照射すると、その照射
位１はレーザ光吸収層２を介して溶融し、第３図（ロ）
のように、その溶融部分は下側の加工部材３−２にまで
達し、これによって良好な重ね合せ溶接が行われる。In addition, Fig. 3(C)(6) is an example of overlap welding. In this case, workpieces 3-1 and 3-2 are stacked one on top of the other, and a transparent material 1 is placed on top of the workpieces 3-1 and 3-2. Place them in contact in the same manner as above. At this time, positioning the laser light absorption layer 2 at the location where welding is desired is the same as described above. Next, when the laser light is irradiated from above the transparent body 1, the irradiation position 1 is the laser light absorption layer 2. Figure 3 (b)
As in, the molten portion reaches the lower workpiece 3-2, thereby achieving good lap welding.
第４図（ａ）［有］）（Ｃ）には、本発明方法により加
工部材を切断する場合の実施例が示されている。FIG. 4(a) (C) shows an embodiment in which a workpiece is cut by the method of the present invention.
すなわち、この実施例では、加工部材３を曲線に沿って
切断する場合の例であり、透光体１の片面には、第４図
（ｂ）のように任意曲線に沿ってレーザ光吸収層２が形
成されている。そして、切断に際し、この透光体１を加
工部材３の上部に接触させて配置し、次に透光体１の上
方からレーザ光を前記レーザ光吸収層２に沿って連続的
に移動させながら照射する。このとき、加工部材３の溶
融部がその表面から裏面に達する程度にまでレーザ光を
照射し乍ら移動させると、第４図（Ｃ）のように、加工
部材３は前記レーザ光吸収層２の任意曲線に沿って切断
される。なお、前記レーザ光吸収層２を直線状に形成し
、加工部材３をこの直線に沿って切断することができる
のは勿論である。That is, this embodiment is an example in which the workpiece 3 is cut along a curved line, and a laser light absorbing layer is cut on one side of the transparent body 1 along an arbitrary curved line as shown in FIG. 4(b). 2 is formed. When cutting, the transparent body 1 is placed in contact with the upper part of the workpiece 3, and then the laser beam is continuously moved from above the transparent body 1 along the laser light absorption layer 2. irradiate. At this time, when the workpiece 3 is moved while being irradiated with a laser beam to such an extent that the melted part reaches from the front surface to the back surface, the workpiece 3 is moved from the laser light absorbing layer 3 as shown in FIG. 4(C). is cut along an arbitrary curve. It is of course possible to form the laser light absorption layer 2 in a straight line and cut the workpiece 3 along this straight line.
第５図（ａ）（ロ）には、本発明方法により加工部材の
表面改質を行う場合の実施例が示されている。FIGS. 5(a) and 5(b) show an embodiment in which the surface of a workpiece is modified by the method of the present invention.
すなわち、この実施例では、加工部材３０表面に針状の
先端部４ａ、４ａ・・・を有する複数の突起４，４・・
・がある場合に、その先端部４ａのみに先端焼入れを施
す例である。That is, in this embodiment, a plurality of protrusions 4, 4, . . . having needle-like tip portions 4a, 4a, .
・This is an example in which only the tip portion 4a is hardened.
このような先端焼入れを行うには、先ず第５図（ａ）の
ように、各突起４，４・・・の先端部４ａ。To perform such tip hardening, first, as shown in FIG. 5(a), the tip portions 4a of each protrusion 4, 4, .
４ａ・・・に透光体１のレーザ光吸収層２が接触するよ
うにして配置する。そして、透光体１の上方からレーザ
光を照射し、前記先端部４ａをレーザエネルギにて加熱
する０次に、この加熱部を適宜の手段により急激に冷却
することで、先端焼入れが行われる。The laser light absorbing layer 2 of the transparent body 1 is placed in contact with 4a. Then, a laser beam is irradiated from above the transparent body 1 to heat the tip portion 4a with laser energy. Next, this heating portion is rapidly cooled by an appropriate means to harden the tip. .
第６図（ａ）（ロ）には、本発明方法により加工部材に
穴を明ける場合の実施例が示されている。FIGS. 6(a) and 6(b) show an embodiment in which a hole is made in a workpiece by the method of the present invention.
すなわち、この実施例で、は加工部材３の所望の位置に
貫通孔５を形成する場合の例であり、先ず第６図（ａ）
のように加工部材３の上部に透光体ｌを接触配置する。That is, in this embodiment, is an example in which a through hole 5 is formed at a desired position of a workpiece 3, and first, as shown in FIG.
A transparent body 1 is placed in contact with the upper part of the workpiece 3 as shown in FIG.
そして、上方からレーザ光を照射すると、そのレーザビ
ームの径に応じた、又は孔が大きい場合にはレーザビー
ムを円形状に移動させることにより、所望径の孔５が形
成される。Then, when a laser beam is irradiated from above, a hole 5 with a desired diameter is formed according to the diameter of the laser beam, or by moving the laser beam in a circular shape if the hole is large.
なお、レーザ光吸収層２は、本実施例のように透光部材
１ａの片面に一様に形成されたものを用いて、孔を形成
したい部分にのみレーザ光を照射する方法であっても良
いし、また、前記吸収層２を、形成される孔に対応した
円形状のパターンに形成して、その部分にレーザ光を照
射する方法であっても良い。Note that even if the laser light absorbing layer 2 is uniformly formed on one side of the light-transmitting member 1a as in this embodiment, the laser light may be irradiated only to the portion where the hole is to be formed. Alternatively, the absorbing layer 2 may be formed into a circular pattern corresponding to the holes to be formed, and the portion may be irradiated with a laser beam.
第７図（ａ）（ロ）（Ｃ）には、レーザ光吸収層２を予
め楕円状に形成しておいて、加工部材３に楕円形状の孔
６を形成する実施例が示されている。このように、レー
ザ光吸収層２を任意パターンに予め形成しておくことに
より、加工部材をそのレーザ光吸収層２と同一の形状に
加工することが可能である。7(a), (b), and (c) show an embodiment in which the laser light absorption layer 2 is formed in an elliptical shape in advance and an elliptical hole 6 is formed in the workpiece 3. . By forming the laser light absorption layer 2 in advance in an arbitrary pattern in this way, it is possible to process the workpiece into the same shape as the laser light absorption layer 2.
第８図（ａ）（ロ）には、加工部材にリングモード加工
を施す場合の実施例が示されている。この場合、レーザ
光吸収層２は予めドーナツ状に形成されており、照射さ
れたレーザ光により加工部材３にはリングモードの凹部
７が形成される。この点、従来方法によると、レンズ形
状やレーザモード分布等で調整しなければならなかった
ものが、本実施例によれば、レーザ吸収層２のパターン
の変更のみで任意形状、任意モードの加工が可能となる
。FIGS. 8(a) and 8(b) show an embodiment in which a workpiece is subjected to ring mode processing. In this case, the laser light absorption layer 2 is previously formed in a donut shape, and a ring mode recess 7 is formed in the workpiece 3 by the irradiated laser light. In this respect, according to the conventional method, adjustments had to be made to the lens shape, laser mode distribution, etc., but according to this embodiment, any shape and mode can be processed by simply changing the pattern of the laser absorption layer 2. becomes possible.
（発明の効果）
本発明は以上説明した通り、片面にレーザ光吸収層を形
成してなる透光体の前記片面に加工部材を接触して配置
させるか、または複数重ね合せて接触して配置させ、前
記透光体の他面からレーザ光を前記加工物に照射して、
レーザ光の吸収率を高め、加工部材の接合、切断、孔明
、あるいは表面改質を行うことにより、特に反射率の高
い難加工材であってもレーザエネルギを効果的に活用し
て効率良く容易に加工を施すことができる。(Effects of the Invention) As described above, the present invention is characterized in that a processed member is placed in contact with one side of a transparent body formed with a laser light absorption layer formed on one side, or a plurality of processed members are placed in contact with each other in a stacked manner. and irradiating the workpiece with laser light from the other surface of the transparent body,
By increasing the absorption rate of laser light and performing bonding, cutting, drilling, or surface modification of workpieces, even difficult-to-process materials with particularly high reflectivity can be effectively utilized to efficiently and easily use laser energy. can be processed.
また、レーザ光吸収層のパターンを変更することによっ
て、加工部材に様々な形状・モードの加工を施すことが
できる。Furthermore, by changing the pattern of the laser light absorption layer, the workpiece can be processed into various shapes and modes.
さらに、本発明によれば、加工部材に直接吸光剤を塗布
する従来技術に比較し、加工後の洗浄が容易であるとい
う利点を存する。Furthermore, the present invention has the advantage that it is easier to clean after processing, compared to the conventional technique in which a light absorbing agent is applied directly to a processed member.
第１図は透光体の片面に加工部材を接触配置し、他面か
らレーザ光を照射して加工を行う実施例を示す図、第２
図は透光体の概略構成を示す側面図、第３図（ａ）は加
工部材の突合せ溶接を行う実施例を示す図、第３図俣）
はその入方向矢視図、第３図（Ｃ）は加工部材の重ね合
せ溶接を行う実施例を示す図、第３図（句は溶接箇所の
断側面図、第４図（ａ）は加工部材の切断を行う実施例
を示す図、第４図し）はそのときに用いられる透光体の
外観図、第４図（Ｃ）は加工部材が切断された状態を示
す図、第５図（ａ）は加工部材表面の先端焼入れを行う
実施例を示す図、第５囲い）は焼入れ後の状態を示す図
、第６図（ａ）は加工部材に貫通孔を形成する実施例を
示す図、第６図（ｂ）は加工後の状態を示す断側面図、
第７図（ａ）はレーザ光吸収層を楕円状に形成した透光
体の外観図、第７回し）は加工後の状態を示す平面図、
第７図（Ｃ）は同断側面図、第８図（ａ）はリングモー
ド加工を施す場合に用いられる透光体の外観図、第８図
（ｂ）は加工後の状態を示す断側面図である。
１・・・透光体
】ａ・・・透光部材
２・・・レーザ光吸収層
３．３−１．３−２・・・加工部材
４・・・突起
４ａ・・・先端部
５・・・貫通孔
６・・・楕円孔
第１ 区
第３図
（ａ）
（ｂ）
（Ｃ）
箪４図
（Ｇ）
（ｂ）
（ｃ）
第５図
（ａ）
（ｂ）
互
第６図
（ｂ）Figure 1 is a diagram showing an embodiment in which a processing member is placed in contact with one side of a transparent body and the processing is performed by irradiating a laser beam from the other side.
The figure is a side view showing the schematic structure of the transparent body, Figure 3 (a) is a diagram showing an example of butt welding of processed parts, Figure 3 (mata)
3(C) is a diagram showing an example of overlapping welding of workpieces, FIG. FIG. 4 (C) is a diagram showing an example of cutting a member, and FIG. 4 (C) is an external view of a transparent body used at that time. (a) is a diagram showing an example in which the tip of the surface of the workpiece is hardened, box 5) is a diagram showing the state after hardening, and Figure 6 (a) is an example in which a through hole is formed in the workpiece. Figure 6(b) is a cross-sectional side view showing the state after processing,
FIG. 7(a) is an external view of a transparent body with a laser light absorption layer formed in an elliptical shape, and FIG. 7(a) is a plan view showing the state after processing.
FIG. 7(C) is a side view of the same cross-section, FIG. 8(a) is an external view of the transparent body used when performing ring mode processing, and FIG. 8(b) is a cross-sectional side view showing the state after processing. It is. 1...Transparent body]a...Transparent member 2...Laser light absorption layer 3.3-1.3-2...Processed member 4...Protrusion 4a...Tip portion 5. ...Through hole 6...Oval hole No. 1 Section Fig. 3 (a) (b) (C) Chest 4 Fig. (G) (b) (c) Fig. 5 (a) (b) Alternative Fig. 6 (b)
Claims (5)
記片面に加工部材を接触して配置させ、前記透光体の他
面からレーザ光を前記加工部材に照射して、レーザ光の
吸収率を高めることを特徴とするレーザによる加工方法
。(1) A workpiece is placed in contact with one side of a transparent body having a laser light absorption layer formed on one side, and a laser beam is irradiated onto the workpiece from the other side of the transparent body. A laser processing method characterized by increasing light absorption.
記片面に加工部材を複数重ね合せて接触して配置させ、
前記透光体の他面からレーザ光を前記加工部材に照射し
て、レーザ光の吸収率を高め、これら加工部材を接合し
てなることを特徴とするレーザによる加工方法。(2) Laying a plurality of processed members on one side of a transparent body having a laser light absorption layer formed on one side and arranging them in contact with each other;
A method of processing using a laser, characterized in that the workpiece is irradiated with laser light from the other surface of the transparent body to increase the absorption rate of the laser light, and the workpieces are joined together.
記片面に加工部材を接触して配置させ、前記透光体の他
面からレーザ光を前記加工部材に照射して、レーザ光の
吸収率を高め、加工部材を切断することを特徴とするレ
ーザによる加工方法。(3) A processing member is placed in contact with one side of a transparent body having a laser light absorption layer formed on one side, and a laser beam is irradiated onto the processing member from the other side of the transparent body, so that the laser beam is A laser processing method characterized by increasing the absorption rate of light and cutting the workpiece.
記片面に加工部材を接触して配置させ、前記透光体の他
面からレーザ光を前記加工部材に照射して、レーザ光の
吸収率を高め、加工部材の表面改質を行うことを特徴と
するレーザによる加工方法。(4) A processing member is placed in contact with one side of a transparent body formed with a laser light absorption layer formed on one side, and a laser beam is irradiated onto the processing member from the other side of the transparent body, so that the laser beam is A laser processing method characterized by increasing the absorption rate of light and modifying the surface of the workpiece.
記片面に加工部材を接触して配置させ、前記透光体の他
面からレーザ光を前記加工部材に照射して、レーザ光の
吸収率を高め、加工部材に穴をあけることを特徴とする
レーザによる加工方法。(5) A processing member is placed in contact with one side of a transparent body formed with a laser light absorption layer formed on one side, and a laser beam is irradiated onto the processing member from the other side of the transparent body, so that the laser beam is A laser processing method that increases the absorption rate of light and creates holes in the workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1123052A JP2684414B2 (en) | 1989-05-17 | 1989-05-17 | Laser processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1123052A JP2684414B2 (en) | 1989-05-17 | 1989-05-17 | Laser processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02303696A true JPH02303696A (en) | 1990-12-17 |
| JP2684414B2 JP2684414B2 (en) | 1997-12-03 |
Family
ID=14851013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1123052A Expired - Fee Related JP2684414B2 (en) | 1989-05-17 | 1989-05-17 | Laser processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2684414B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006082232A (en) * | 2004-09-14 | 2006-03-30 | Fujitsu Ltd | Laser processing method |
| KR101439103B1 (en) * | 2006-08-25 | 2014-09-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method for manufacturing semiconductor device |
| WO2019146512A1 (en) * | 2018-01-25 | 2019-08-01 | 東京エレクトロン株式会社 | Method for manufacturing thin film battery element |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6343784A (en) * | 1986-08-08 | 1988-02-24 | Mazda Motor Corp | Laser marking method onto commodity |
| JPS63126687A (en) * | 1986-11-14 | 1988-05-30 | Mitsubishi Electric Corp | Method for cutting resin plate |
-
1989
- 1989-05-17 JP JP1123052A patent/JP2684414B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6343784A (en) * | 1986-08-08 | 1988-02-24 | Mazda Motor Corp | Laser marking method onto commodity |
| JPS63126687A (en) * | 1986-11-14 | 1988-05-30 | Mitsubishi Electric Corp | Method for cutting resin plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006082232A (en) * | 2004-09-14 | 2006-03-30 | Fujitsu Ltd | Laser processing method |
| KR101439103B1 (en) * | 2006-08-25 | 2014-09-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method for manufacturing semiconductor device |
| WO2019146512A1 (en) * | 2018-01-25 | 2019-08-01 | 東京エレクトロン株式会社 | Method for manufacturing thin film battery element |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2684414B2 (en) | 1997-12-03 |
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