JPS6125314A

JPS6125314A - Elastic wave device

Info

Publication number: JPS6125314A
Application number: JP14642684A
Authority: JP
Inventors: Akio Nishino; 西野　明夫
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 1984-07-13
Filing date: 1984-07-13
Publication date: 1986-02-04

Abstract

PURPOSE:To suppress sufficiently reflection on an end face and to eliminate a stress to be exerted on an element chip due to thermal expansion by covering the end face and a rear face of the element tip by a reflection absorbing agent and bonding the element tip to a stem. CONSTITUTION:An input electrode 9 and an output electrode 10 are arranged on a substrate 8. Then the end face and rear face of the element chip 12 are covered by the reflection absorbing agent 11. Then the element chip 12 is bonded to the stem 13. The reflection on the end face is suppressed sufficiently by covering the end face and the rear face of the element chip by the reflection absorbing agent in this way. Further, the stress onto the element chip due to the thermal expansion between the stem and the element chip is eliminated.

Description

【発明の詳細な説明】産業上の利用分野本発明はテレビジョン受像機やビデオチーブレコーダの
ＶＩＰ回路等に用いる弾性波装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an elastic wave device used in VIP circuits of television receivers and video recorders.

従来例の構成とその問題点従来この種の弾性波装置は、第１図に示すように基板１
上に入力電極２と出力電極３を配置し、入出力電極２，
３間に弾性波が伝搬する。このとき、電極から発生した
弾性波の端面反射を抑圧する反射吸収剤（シリコン樹脂
）４を塗布し、エポキシ樹脂了でステムｅに接着してい
た。Structure of conventional example and its problems Conventionally, this type of elastic wave device has a substrate 1 as shown in FIG.
An input electrode 2 and an output electrode 3 are placed on top, and the input and output electrodes 2,
An elastic wave propagates between the two. At this time, a reflection absorbing agent (silicon resin) 4 for suppressing end face reflection of elastic waves generated from the electrodes was applied, and it was adhered to the stem e with epoxy resin.

しかし、上記のような構成では、弾性波の端面反射を十
分に抑圧できず、またステムｅと素子チップ６の熱膨張
率の差から、素子チップ６に応力が加わり、特性劣化の
原因となっていた。However, with the above configuration, it is not possible to sufficiently suppress the end face reflection of elastic waves, and stress is applied to the element chip 6 due to the difference in thermal expansion coefficient between the stem e and the element chip 6, causing characteristic deterioration. was.

発明の目的本発ＢＡは、上記のような従来の欠点を解消し、端面反
射の影響の少ない、かつ特性の安定した弾性波装置を提
供しようとするものである。OBJECTS OF THE INVENTION The present BA is intended to eliminate the above-mentioned conventional drawbacks and to provide an acoustic wave device that is less affected by end face reflection and has stable characteristics.

発明の構成上記目的を達成するために本発明による弾性波装置は、
電極から発生した弾性波の端面反射を吸収する反射吸収
剤（シリコン樹脂）で素子チノグの端面と裏面を覆い、
素子チップをステムに接着する構成とすることにより、
端面反射を抑圧するとともに、熱膨張により素子チップ
にかかる応力をなくすものである。Structure of the Invention In order to achieve the above object, an elastic wave device according to the present invention has the following features:
The end and back surfaces of the element chinog are covered with a reflection absorber (silicon resin) that absorbs end-face reflections of elastic waves generated from the electrodes.
By configuring the element chip to be glued to the stem,
This suppresses end-face reflection and eliminates the stress applied to the element chip due to thermal expansion.

実施例の説明以下、添付図面に基づいて本発明の一実施例について説
明する。第２図において、基板８上に入力電極９と出力
電極１ｏを配置後、反射吸収剤１１で素子チップ１２の
端面と裏面を覆い、ステム１３に接着する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. In FIG. 2, after arranging the input electrode 9 and the output electrode 1o on the substrate 8, the end and back surfaces of the element chip 12 are covered with a reflection absorbent 11 and bonded to the stem 13.

発明の効果上記実施例から明らかなように本発明の弾性波装置は、
反射吸収剤で端面と裏面を覆ったことにより、弾性波の
端面反射による、リップル部分の減衰量が減少し、かつ
ステムと素子チップの熱膨張差による、素子チップへの
応力がなくなシ、信頼性の向上と高性能化をはかること
ができるものである。Effects of the Invention As is clear from the above embodiments, the elastic wave device of the present invention has the following features:
By covering the end and back surfaces with a reflection absorbing agent, the amount of attenuation in the ripple portion due to the end face reflection of elastic waves is reduced, and stress on the element chip due to the difference in thermal expansion between the stem and the element chip is eliminated. This makes it possible to improve reliability and performance.

[Brief explanation of the drawing]

第１図は、従来例の弾性波装置の分解斜視図、第２図は
本発明の一実施例の弾性波装置の分解斜視図である。８・・・・基板、９・・・・・・入力電極、１ｏ・・・
・・出力電極、１１・・・・・・反射吸収剤、１２・・
・・・素子チップ、１３・・・・・・ステム。代理人の氏名　弁理士　中　尾　敏　男　ほか１名＋　
　　　　　　ＪFIG. 1 is an exploded perspective view of a conventional elastic wave device, and FIG. 2 is an exploded perspective view of an elastic wave device according to an embodiment of the present invention. 8...Substrate, 9...Input electrode, 1o...
...Output electrode, 11...Reflection absorber, 12...
...Element chip, 13...Stem. Name of agent: Patent attorney Toshio Nakao and 1 other person +
J

Claims

[Claims]

After arranging input and output electrodes on a substrate, the end and back surfaces of the element chip, where elastic waves propagate between input and output, are covered with silicone resin, and the elastic wave device is bonded to a stem.