JPS61251180A - Mold for light emitting diode lamp - Google Patents
Mold for light emitting diode lampInfo
- Publication number
- JPS61251180A JPS61251180A JP60093075A JP9307585A JPS61251180A JP S61251180 A JPS61251180 A JP S61251180A JP 60093075 A JP60093075 A JP 60093075A JP 9307585 A JP9307585 A JP 9307585A JP S61251180 A JPS61251180 A JP S61251180A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- support member
- emitting diode
- led lamp
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、発光ダイオード（ＬＥＤ）ランプ用成形型に
関し、詳しくはＬＥＤランプの樹脂モールド（封止）時
に用いる成形型の改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mold for a light emitting diode (LED) lamp, and more particularly to an improvement in a mold used for resin molding (sealing) of an LED lamp.
本発明のＬＥＤランプ月成形成形型樹脂モールド時にお
ける支持部材（リフレクタ）の位置決めを、より正確に
行ない得るものであり、モールド樹脂におけるＬＥＤ光
の散乱の均一化、及び、外観不良の除去に貢献するもの
である。The support member (reflector) can be positioned more accurately during resin molding of the LED lamp moon molding mold of the present invention, and contributes to uniform scattering of LED light in the mold resin and elimination of appearance defects. It is something to do.
［先行の技術１
第１２図は、先行技術としてのＬＥＤランプ用成形成形
型１び該成形型１に収納されているＬＥＤランプの正面
図であり、第１１図は先行技術としてのＬＥＤランプの
斜視図である。[Prior art 1 Fig. 12 is a front view of a mold 1 for an LED lamp as a prior art and an LED lamp housed in the mold 1, and Fig. 11 is a front view of a mold 1 for an LED lamp as a prior art. FIG.
第１１図、及び第１２図に示すように、先行技術のＬＥ
Ｄランプの前記樹脂モールドは、ＬＥＤランプ用成形成
形型１内ＬＥＤ６及びリード部材３を支持させた支持部
材４を収納して位置決めし、これに液状の樹脂を注入し
、硬化させて行なっている。As shown in FIGS. 11 and 12, the prior art LE
The resin mold of the D lamp is made by accommodating and positioning the supporting member 4 supporting the LED 6 and the lead member 3 in the LED lamp molding mold 1, injecting liquid resin into this, and curing it. .
ここに、前記収納時における位置決めは、先行技術では
、第１２図に示す支持部材４の側壁外面の上部の各コー
ナーに突起部５を設け、該突起部５とＬＥＤランプ用成
形成形型１面との摩擦力を利用して行なっている。Here, in the prior art, the positioning at the time of storage is performed by providing a protrusion 5 at each corner of the upper part of the outer surface of the side wall of the support member 4 shown in FIG. This is done by using the frictional force between the
しかし、上記した先行技術のＬＥＤランプ用成形成形型
１いた樹脂モールドでは、樹脂の注入時及び硬化時に、
成形型１と支持部材４との相対的位置がずれ、外観不良
、光の散乱の不均一等の欠点を発生しがちであった。However, in the resin mold of the prior art LED lamp mold 1 mentioned above, during injection and curing of the resin,
The relative positions of the mold 1 and the support member 4 tend to shift, resulting in defects such as poor appearance and uneven light scattering.
なんとなれば、上記したように、先行技術での位置決め
は、前記支持部材の突起部５と、型１の内面との摩擦力
を利用して行なっているため、図の水平方向における位
置決めは正確にできるものの、図の垂直方向では、支持
部材４が、当初の保持位置から第１２図の下方へずれや
すいからである。This is because, as mentioned above, positioning in the prior art is performed using the frictional force between the protrusion 5 of the support member and the inner surface of the mold 1, so the positioning in the horizontal direction in the figure is accurate. However, in the vertical direction of the figure, the support member 4 tends to shift downward from the initial holding position in FIG.
［発明が解決しようとする問題点］
本発明は、かかる事情に鑑み案出されたものであり、樹
脂モールド時における上下方向の位置決めをも正確に行
ない得るＬＥＤランプ用成形成形型供するものである。[Problems to be Solved by the Invention] The present invention has been devised in view of the above circumstances, and provides a molding mold for an LED lamp that can accurately perform vertical positioning during resin molding. .
［問題点を解決するための手段及び作用］本発明は、Ｌ
ＥＤランプ用成形成形型部内面に、支持部材底部との間
隙を所定値に保持し得る支持用の突起部を形成すること
によって、前記目的を達成するものである。[Means and effects for solving the problems] The present invention provides L
The above object is achieved by forming a supporting protrusion on the inner surface of the ED lamp mold part that can maintain a gap with the bottom of the supporting member at a predetermined value.
即ち本発明は、
発光ダイオード及び該発光ダイオードに接続するリード
部材を支持する支持部材を収納し、液状樹脂を注入して
樹脂封止を行なうための発光ダイオードランプ用成形型
であって、
該成形型の側壁の内面形状は、前記支持部材の側壁の外
面形状に略合致し、
前記成形型の底部の内面には、前記支持部材の底部を、
所定間隙を保持しつつ支持する突起部が形成されている
ことを特徴とする発光ダイオードランプ用成形型である
。That is, the present invention provides a molding die for a light-emitting diode lamp, which accommodates a support member that supports a light-emitting diode and a lead member connected to the light-emitting diode, and injects liquid resin to perform resin sealing, the molding die comprising: The inner surface shape of the side wall of the mold substantially matches the outer surface shape of the side wall of the supporting member, and the inner surface of the bottom of the mold has the bottom of the supporting member;
This is a mold for a light emitting diode lamp, characterized in that a protrusion is formed to support the light emitting diode lamp while maintaining a predetermined gap.
上記において、ＬＥＤランプ用成形成形型その内部に支
持部材を収納して位置決めした後、樹脂を注入して硬化
させるために用いるものであり、その側壁の内部形状は
、収納すべき支持部材の側壁の外部形状に略合致する。In the above, the LED lamp mold is used to store and position the support member inside the mold, and then inject and harden the resin, and the internal shape of the side wall is the same as the side wall of the support member to be stored. It approximately matches the external shape of.
例えば、該支持部材の外部形状が略直方体であれば、Ｌ
ＥＤランプ用成形成形型部形状も、略直方体とする。For example, if the external shape of the support member is a substantially rectangular parallelepiped, L
The shape of the mold for the ED lamp is also approximately a rectangular parallelepiped.
ＬＥＤランプ用成形成形型部の内面には、支持部材の上
下方向の位置決めを行なうための突起部を設ける。該突
起部によって、成形型の底部の内面と支持部材の底部と
の間隙が所定値（該突起部の高さによって規定される所
定値）に保持され、ＬＥＤランプ前面の樹脂モールド部
の平行性が確保される。A protrusion for vertically positioning the support member is provided on the inner surface of the LED lamp molding die. The protrusion maintains the gap between the inner surface of the bottom of the mold and the bottom of the support member at a predetermined value (a predetermined value defined by the height of the protrusion), and maintains the parallelism of the resin mold part on the front surface of the LED lamp. is ensured.
前記突起部の形成位置及び大きさは、該突起部によって
ＬＥＤランプ前面の樹脂モールド部に必然的に形成され
る凹部が目立たない位置及び大きさであって、かつ、前
記ｌ！ＩＩ隙の保持を確実に成し得る位置とする。例え
ば、成形型底部内面と成形型側壁内面との境界部（特許
請求の範囲第２項に対応）、あるいは、成形型底部内面
が方形である場合は、該底部内面の各コーナー部（特許
請求の範囲第３項に対応）が、これに該当する。The position and size of the protrusion are such that the recess inevitably formed in the resin mold part on the front surface of the LED lamp is not noticeable, and the l! II.The position should be such that the gap can be maintained reliably. For example, the boundary between the inner surface of the bottom of the mold and the inner surface of the side wall of the mold (corresponding to claim 2), or if the inner surface of the bottom of the mold is rectangular, each corner of the inner surface of the bottom (corresponding to claim 2). (corresponding to scope 3) falls under this category.
成形型の材質としては、モールド用樹脂（エポキシ樹脂
、シリコン樹脂、フェノール樹脂等）と反応しないもの
を用いる。The material used for the mold is one that does not react with the molding resin (epoxy resin, silicone resin, phenol resin, etc.).
なお、成形型内にお、ける支持部材の水平方向の位置決
めは、先行技術どうり、支持部材の側壁の少なくとも一
部に設けた突設部と、成形型側壁内面との摩擦力を利用
して行なうことができる。Note that the horizontal positioning of the support member within the mold is performed using the frictional force between a protrusion provided on at least a portion of the side wall of the support member and the inner surface of the side wall of the mold, as in the prior art. It can be done.
かかる構成の本発明のＬＥＤランプ用成形成形型、樹脂
封止時における位置決めが、水平方向のみなら゛ず、垂
直方向においてもしっかりと成されるため、モールド樹
脂と支持部材とのずれの発生は防止される。With the LED lamp molding mold of the present invention having such a configuration, the positioning during resin sealing is performed not only in the horizontal direction but also in the vertical direction, so that misalignment between the mold resin and the supporting member can be avoided. Prevented.
［実施例］ 以下、本発明を具体的な実施例に基づいて説明する。[Example] The present invention will be described below based on specific examples.
第１図は、本発明の実施例のＬＥＤランプ用成彫型１と
、該成形型１に収納されている状態のＬＥＤランプを示
す正面図であり、第２図は、第１図のＬＥＤランプの斜
視図である。また第３図は本実施例の型１の斜視図であ
る。また第４〜６図は上記ＬＥＤランプで用いる支持部
材４を表わし、第４図は平面図、第５図は第４図のｖ−
ｖ線断面図、第６図は側面図である。また、第７〜９図
は上記ＬＥＤランプを表わし、第７図は平面図、第８図
は正面図、第９図は側面図である。FIG. 1 is a front view showing an LED lamp mold 1 according to an embodiment of the present invention and the LED lamp housed in the mold 1, and FIG. 2 is a front view of the LED lamp shown in FIG. FIG. 3 is a perspective view of the lamp. Further, FIG. 3 is a perspective view of the mold 1 of this embodiment. 4 to 6 show the support member 4 used in the LED lamp, FIG. 4 is a plan view, and FIG.
FIG. 6 is a side view. Moreover, FIGS. 7-9 show the said LED lamp, FIG. 7 is a top view, FIG. 8 is a front view, and FIG. 9 is a side view.
第１及び第３図に示すように、本実施例はＬＥＤランプ
用成形成形型１て、内部形状が略直方体である成形型１
の底部内面の各コーナー部に突起部１１を形成したもの
を用いる場合である。As shown in FIGS. 1 and 3, the present embodiment is a mold 1 for an LED lamp, the mold 1 having an approximately rectangular internal shape.
This is a case where a protrusion 11 is formed at each corner of the inner surface of the bottom part.
本実施例の成形型１を用いる樹脂モールドは、以下の如
くして行なわれる。Resin molding using the mold 1 of this example is carried out as follows.
まず、ＬＥＤ６及び該ＬＥＤ６に接続するリード部材３
を支持部材（リフレクタ）４に支持させ、これを成形型
１内に収納して位置決めをする。First, the LED 6 and the lead member 3 connected to the LED 6
is supported by a support member (reflector) 4, and is housed in the mold 1 and positioned.
ここに、ＬＥＤ６としては、一般の化合物半導体を用い
ている。該ＬＥＤ６は、リードフレーム３のポンディン
グパッド３１上に１つおきに載置され、隣接するポンデ
ィングパッドに金線７でワイヤボンディングされている
。Here, as the LED 6, a general compound semiconductor is used. The LEDs 6 are placed on every other bonding pad 31 of the lead frame 3 and are wire-bonded to adjacent bonding pads with gold wires 7.
また、リードフレーム３としては、ＬＥＤ専用のリード
フレームを用いている。これは、各８個のポンディング
パッド３１が２列平行に並び、各ポンディングパッド３
゛１からは、各１つづつのリード端子３０が導出されて
いるものである。Further, as the lead frame 3, a lead frame dedicated to LEDs is used. In this case, two rows of eight bonding pads 31 are arranged in parallel, and each of the bonding pads 31
One lead terminal 30 is led out from ``1''.
また、支持部材４としては、第４〜６図に示すように外
形が略直方体を成す４つの側壁４０を主たる構成要素と
するＰＢＴ製の白色の枠体を用いている。該枠体の上面
と下面とは、２列の帯状の貫通孔４０００ （前記２列
のポンディングパッド群がそれぞれ該貫通孔４０００に
位置する）で連通されている。なお、第１図において、
ＬＥ［）ランプ用成形型は、透明として描かれている。Further, as the support member 4, a white frame body made of PBT is used, the main constituent elements of which are four side walls 40 having a substantially rectangular external shape, as shown in FIGS. 4 to 6. The upper surface and lower surface of the frame body are communicated with each other through two rows of band-shaped through holes 4000 (the two rows of bonding pad groups are located in the through holes 4000, respectively). In addition, in Figure 1,
The mold for the LE[) lamp is depicted as transparent.
また、支持部材４の第１図の下部４０１は、凹部を成す
。該凹部は、第１図において前記４つの側壁の下端部か
ら上方へ所定の傾斜角で切れ込み（第４図では紙面上方
から下方へ切れ込む）、前記帯状の貫通孔４０００の各
辺に至る形状である。Further, a lower portion 401 of the support member 4 in FIG. 1 forms a recessed portion. The recess has a shape that cuts upward from the lower ends of the four side walls at a predetermined inclination angle in FIG. be.
ここに、前記所定の傾斜角で切れ込む各面４ａが、それ
ぞれ、ＬＥＤから発する光を前方（第１図の下方）へ送
り出すための反射面として機能する。Here, each surface 4a cut at the predetermined angle of inclination functions as a reflecting surface for sending the light emitted from the LED forward (downward in FIG. 1).
なお、前記２列の貫通孔の仕切り部４ｂも、前記反射面
として機能するべく、所定の傾斜を成す。Note that the partition portions 4b of the two rows of through holes also form a predetermined inclination so as to function as the reflective surfaces.
また、本実施例において、支持部材４の各側壁４０の外
面には、上下方向に帯状に伸びる突設部４２が形成され
ている。該突設部４２は、前記型１の内面との摩擦力に
よって、支持部材４の水平方向の位置決めを行なう。Further, in this embodiment, a protrusion 42 extending vertically in a strip shape is formed on the outer surface of each side wall 40 of the support member 4. The protrusion 42 positions the support member 4 in the horizontal direction by frictional force with the inner surface of the mold 1.
かかるＬＥＤ、リードフレーム３、及び支持部材４を、
該支持部材４のＬＥＤ設置面（反射面）を下にしてＬＥ
Ｄランプ用成形成形型１内納し、位置決めを行なう。Such an LED, lead frame 3, and support member 4,
Place the support member 4 with the LED installation surface (reflection surface) facing down.
A mold 1 for forming the D lamp is placed inside and positioned.
水平方向の位置決めは、前述の如く、支持部材４の側壁
外面の突設部４２とＬＥＤランプ用成形成形型１壁内面
との摩擦力を利用して行なう。As described above, the horizontal positioning is performed using the frictional force between the protrusion 42 on the outer surface of the side wall of the support member 4 and the inner surface of the wall of the LED lamp molding die 1.
一方垂直方向の位置決めは、ＬＥＤランプ用成形成形型
１部内面の各コーナー部に形成されている４つの突起部
１１（第１．３図）によって、支持部材４の底部と成形
型１の底部内面との間隙を、該突起部１１の高さによっ
て規定される所定値に保持することによって行なう。On the other hand, vertical positioning is achieved by four protrusions 11 (Fig. 1.3) formed at each corner of the inner surface of the LED lamp mold 1. This is done by maintaining the gap with the inner surface at a predetermined value defined by the height of the protrusion 11.
このようにして位置決めした後、エポキシ樹脂をＬＥＤ
ランプ用成形成形型１内入し、硬化させる。After positioning in this way, attach the epoxy resin to the LED
It is put into the lamp molding mold 1 and hardened.
こうして、第２図図示のように凹部２０を有するＬＥＤ
ランプが得られる。該ＬＥＤランプでは、樹脂モールド
時におい
て、上記したように支持部材４の型１内における位置決
めが、垂直方向、水平方向ともにしっかりと成されてい
る。このため、支持部材４と樹脂モールド部２との相対
的位置のずれの発生が防止される。したがって、ＬＥＤ
の前方側（第２図の上側）の樹脂モールド部２の平行性
が良く、反射光の散乱の均一化が良好である。In this way, the LED having the recess 20 as shown in FIG.
You will get a lamp. In this LED lamp, during resin molding, the supporting member 4 is firmly positioned in the mold 1 in both the vertical and horizontal directions as described above. Therefore, the relative positional deviation between the support member 4 and the resin molded part 2 is prevented from occurring. Therefore, the LED
The parallelism of the resin molded part 2 on the front side (the upper side in FIG. 2) is good, and the scattering of reflected light is well made uniform.
また、本実施例では、水平方向の位置決めを行なうため
の突設部４２を、支持部材４の各側壁の外面上に、図示
のように、上下方向に帯状に伸びるようにして形成して
いる。このため樹脂封止時において発生する気泡が樹脂
外へ排除されやすい。Further, in this embodiment, protrusions 42 for horizontal positioning are formed on the outer surface of each side wall of the support member 4 so as to extend vertically in the form of a band, as shown in the figure. . Therefore, air bubbles generated during resin sealing are easily removed from the resin.
即ち、気泡は、各コーナー部に溜まりやすいのであるが
、先行技術では、前記したように、支持部材４の上方に
あたるコーナー部の突設部５（第１２図参照）で位置決
めを行なっていたため、該突設部５が気泡の排除を妨げ
ていたのであるが、本実施例では、かかる欠点も改善さ
れている。That is, bubbles tend to accumulate at each corner, but in the prior art, as described above, positioning was performed using the protrusion 5 (see FIG. 12) at the corner above the support member 4. Although the protruding portion 5 hindered the removal of air bubbles, this drawback has also been improved in this embodiment.
なお、上記実施例では、成形型底部内面の突起部を各コ
ーナー部に設けているが、これは、底部内面と側壁内面
との境界部の辺の中央部に設けてもよい。その場合は、
製造されるＬＥＤランプは、第１０図のように樹脂モー
ルド部の上面の各辺の中央部に凹部２１が形成された形
状となる。In the above embodiment, the projections on the inner surface of the bottom of the mold are provided at each corner, but they may be provided at the center of the side of the boundary between the inner surface of the bottom and the inner surface of the side wall. In that case,
The manufactured LED lamp has a shape in which a recess 21 is formed in the center of each side of the upper surface of the resin molded part, as shown in FIG.
［発明の効果］
以上要するに本発明は、ＬＥＤＥＤランプ形型の底部内
面に、支持部材底部との間隙を所定値に保持し得る支持
用の突起部を形成することによって、樹脂封止時におけ
る垂直方向の位置決めをも正確に行ない得るようにした
ＬＥＤＥＤランプ形型である。[Effects of the Invention] In short, the present invention provides a support protrusion that can maintain a predetermined gap with the bottom of the support member on the inner surface of the bottom of the LED lamp-shaped mold. It is an LED lamp type that allows for accurate directional positioning.
実施例に述べたところからも明らかなように、本発明の
ＬＥＤＥＤランプ形型を用いて製造したＬＥＤランプは
、樹脂モールド部と支持部材との相対的位置のずれがな
い。したがってＬＥＤに発する光の散乱の均一化が良好
である。As is clear from the examples described, in the LED lamp manufactured using the LED lamp mold of the present invention, there is no deviation in the relative position of the resin mold part and the support member. Therefore, the scattering of the light emitted from the LED can be made uniform.
第１図は、本発明の実施例のＬＥＤＥＤランプ形型及び
該成形型に収納されているＬＥＤランプの正面図であり
、第２図は、第１図のＬＥＤランプの斜視図である。第
３図は本実施例の型１の斜視図である。また第４〜６図
は上記ＬＥＤランプで用いる支持部材４を表わし、第４
図は平面図、第５図は第４図のｖ−ｖ線断面図、第６図
は側面図である。また、第７〜９図は上記ＬＥＤランプ
を表わし、第７図は平面図、第８図は正面図、第９図は
側面図である。第１０図は、突起部の位置を変えたＬＥ
ＤＥＤランプ形型によって製造したＬＥＤランプの斜視
図である。第１１図は従来のＬＥＤランプの斜視図であ
り、第１２図は、従来のＬＥＤランプ用成形成形型１び
該成形型１に収納されているＬＥＤランプの正面図であ
る。
１・・・型 １１・・・突起部２・・・樹脂モ
ールド部FIG. 1 is a front view of an LED lamp mold according to an embodiment of the present invention and an LED lamp housed in the mold, and FIG. 2 is a perspective view of the LED lamp of FIG. 1. FIG. 3 is a perspective view of the mold 1 of this embodiment. Moreover, FIGS. 4 to 6 show the support member 4 used in the above-mentioned LED lamp.
The figure is a plan view, FIG. 5 is a sectional view taken along the line v--v in FIG. 4, and FIG. 6 is a side view. Moreover, FIGS. 7-9 show the said LED lamp, FIG. 7 is a top view, FIG. 8 is a front view, and FIG. 9 is a side view. Figure 10 shows the LE with the protrusion position changed.
FIG. 1 is a perspective view of an LED lamp manufactured by a DED lamp type mold. FIG. 11 is a perspective view of a conventional LED lamp, and FIG. 12 is a front view of a conventional LED lamp mold 1 and an LED lamp housed in the mold 1. 1...Mold 11...Protrusion 2...Resin mold part
Claims (3)
リード部材を支持する支持部材を収納し、液状の樹脂を
注入して樹脂封止を行なうための発光ダイオードランプ
用成形型であつて、 該成形型の側壁の内面形状は、前記支持部材の側壁の外
面形状に略合致し、 前記成形型の底部の内面には、前記支持部材の底部を、
所定間隙を保持しつつ支持する突起部が形成されている
ことを特徴とする発光ダイオードランプ用成形型。(1) A mold for a light-emitting diode lamp, which accommodates a support member that supports a light-emitting diode and a lead member connected to the light-emitting diode, and injects liquid resin to perform resin sealing, the mold The inner surface shape of the side wall of the support member substantially matches the outer surface shape of the side wall of the support member, and the bottom of the support member is formed on the inner surface of the bottom of the mold.
A mold for a light emitting diode lamp, characterized in that a protrusion is formed to support the light emitting diode lamp while maintaining a predetermined gap.
、該成形型の底部の内面との境界部に形成されている特
許請求の範囲第１項記載の発光ダイオードランプ用成形
型。(2) The mold for a light emitting diode lamp according to claim 1, wherein the protrusion is formed at a boundary between the lower part of the inner surface of the side wall of the mold and the inner surface of the bottom of the mold. .
部は、該成形型の底部の内面の各コーナー部に形成され
ている特許請求の範囲第１項記載の発光ダイオードラン
プ用成形型。(3) The light-emitting diode lamp according to claim 1, wherein the inner surface of the bottom of the mold is rectangular, and the projections are formed at each corner of the inner surface of the bottom of the mold. Molding mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60093075A JPS61251180A (en) | 1985-04-30 | 1985-04-30 | Mold for light emitting diode lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60093075A JPS61251180A (en) | 1985-04-30 | 1985-04-30 | Mold for light emitting diode lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61251180A true JPS61251180A (en) | 1986-11-08 |
Family
ID=14072391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60093075A Pending JPS61251180A (en) | 1985-04-30 | 1985-04-30 | Mold for light emitting diode lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61251180A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3379139A4 (en) * | 2015-11-20 | 2019-07-31 | Koito Manufacturing Co., Ltd. | Lamp fitting unit |
-
1985
- 1985-04-30 JP JP60093075A patent/JPS61251180A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3379139A4 (en) * | 2015-11-20 | 2019-07-31 | Koito Manufacturing Co., Ltd. | Lamp fitting unit |
| US10845021B2 (en) | 2015-11-20 | 2020-11-24 | Koito Manufacturing Co., Ltd. | Lamp unit |
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