JPS61249790A - Metal mask - Google Patents
Metal maskInfo
- Publication number
- JPS61249790A JPS61249790A JP9274785A JP9274785A JPS61249790A JP S61249790 A JPS61249790 A JP S61249790A JP 9274785 A JP9274785 A JP 9274785A JP 9274785 A JP9274785 A JP 9274785A JP S61249790 A JPS61249790 A JP S61249790A
- Authority
- JP
- Japan
- Prior art keywords
- metal mask
- printed circuit
- stepped part
- circuit board
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は多様化するプリント基板において、段差を有す
るプリント基板の印刷用メタルマスクに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a metal mask for printing on a printed circuit board having steps, among the diversified printed circuit boards.
本発明はメタルマスクにおいて、表面に段差を設けたこ
とにより、プリント基板表面に段差が有る場合でも厚膜
印刷することを可能にしたものである。The present invention provides a metal mask with a step on its surface, thereby making it possible to perform thick film printing even when there is a step on the surface of a printed circuit board.
従来のメタルマスクを第2図に正面断面図で示す。11
はメタルマスクであり表裏面を貫通する印刷穴12a、
12b・・・・・・12r1f有する。印刷穴12a、
12b・・・・・・12nはプリント基板13の表面の
パターン14a、14b・・・・・・14nの位置に位
置出しして設けられている。プリント基板13の表面の
パターン14a、14b・・・・・・1411の印刷は
スキージ15を動かして半田ペースト等のペースト16
全印刷穴12a、12b・・・・・・12nに押し込ん
で行なう。A conventional metal mask is shown in a front sectional view in FIG. 11
is a metal mask with printing holes 12a penetrating the front and back surfaces,
12b...12r1f. printing hole 12a,
12b . . . 12n are provided on the surface of the printed circuit board 13 at positions corresponding to the patterns 14a, 14b . . . 14n. To print the patterns 14a, 14b...1411 on the surface of the printed circuit board 13, move the squeegee 15 to apply paste 16 such as solder paste.
This is done by pushing it into all the printing holes 12a, 12b...12n.
〔発明が解決しようとする問題点及び目的〕しかし前述
の従来技術では、段差の有るプリント基板に印刷するこ
とができないという問題点が有る。[Problems and Objectives to be Solved by the Invention] However, the above-mentioned prior art has a problem in that it is not possible to print on a printed circuit board with steps.
本発明はこのような問題点を解決するもので、その目的
とするところは、段差を有するプリント基板に印刷する
ことができるメタルマスク管提供するところにある。The present invention is intended to solve these problems, and its purpose is to provide a metal mask tube that can be printed on a printed circuit board having steps.
本発明のメタルマスクは、表裏に貫通する少なくとも1
つ以上穴を有するメタルマスクにおいて、メタルマスク
の表面に段差を設けたことを特徴とする。The metal mask of the present invention has at least one
A metal mask having three or more holes is characterized in that a step is provided on the surface of the metal mask.
本発明の上記の構成によれば、メタルマスクの表面に、
段差を有するため1段差のあるプリント基板に印刷する
ことができる。According to the above configuration of the present invention, on the surface of the metal mask,
Since it has a step difference, it is possible to print on a printed circuit board with a one step difference.
第1図は本発明のメタルマスクを正面断面図で示す。1
はメタルマスクであり表裏面全貫通する印刷穴2a、2
b・・・・・・2nを有し、また表面には段差6を有す
る。印刷穴za、2b・・・・・・2nはプリント基板
40表面のパターン5a、5b・・・・・・5nの位置
に位置出しして設けられ、段差6はプリント基板4の段
差に対応して設けられている。メタルマスク1は、 F
e、 Cu、 Alもしくは合金によりできている。プ
リント基板4の表面のパターン5a、5b・・・・・・
5nへの印刷はスキージ7を動かして、半田ペースト、
Ag−paペースト、Auペースト等の導体ペースト、
ルテニウム系抵抗ペースト、誘電体ペースト及び接着剤
等のペースト状印刷物8全印刷穴2a、2b・・・・・
・2nに押し込んで行な:う。FIG. 1 shows a metal mask of the present invention in a front sectional view. 1
is a metal mask with printing holes 2a and 2 that completely penetrate the front and back surfaces.
b...2n, and a step 6 on the surface. The printing holes za, 2b, . It is provided. Metal mask 1 is F
Made of e, Cu, Al or alloys. Patterns 5a, 5b on the surface of the printed circuit board 4...
To print on 5n, move squeegee 7 and apply solder paste,
Conductive pastes such as Ag-pa paste and Au paste,
Paste-like printed matter such as ruthenium-based resistance paste, dielectric paste, adhesive, etc. 8 All printing holes 2a, 2b...
・Push it into 2n: Uh.
なお段差6は、本実施例は1カ所であるが複数であって
もよいし、2段、3段と複数段となっていてもよい。In this embodiment, there is only one step 6, but there may be a plurality of steps, or there may be a plurality of steps, such as two or three steps.
以上述べたように本発明によればメタルマスクの表面に
段差を設けたことにより、段差を有するプリント基板に
印刷が可能なメタルマスクが提供できる。As described above, according to the present invention, by providing a step on the surface of the metal mask, a metal mask that can be printed on a printed circuit board having steps can be provided.
その結果、重ね合わせ基板やフレキシブル基板をコンポ
ジット基板にはり合わせる様な複雑な基板形態を取って
も、印刷が可能となった。また方式として、ディスペン
サーによる塗布や多点転写の様にコストup要素や技術
的むずかしさが軽減された。As a result, it has become possible to print even with complex substrate configurations such as stacked substrates or flexible substrates bonded to composite substrates. In addition, as a method, the cost-increasing factors and technical difficulty, such as application using a dispenser and multi-point transfer, have been reduced.
第1図は、本発明のメタルマスクの正面断面図〇1・・
・・・・・・・メタルマスク
2a、2b・・・・・・印刷穴
4・・・・・・・・・2枚が重ね合わされたプリント基
板sa、5b・・・・・・パターン
6・・・・・・・・・段差
7・・・・・・・・・スキージ
8・・・・・・−・ペースト状印刷物
第2図は、従来のメタルマスクの正面断面図。
以上Figure 1 is a front sectional view of the metal mask of the present invention〇1...
......Metal masks 2a, 2b...Printed holes 4...Printed circuit board sa, 5b...Pattern 6... . . . Step 7 . . . Squeegee 8 . . . Paste-like printed matter FIG. 2 is a front sectional view of a conventional metal mask. that's all
Claims (1)
マスクにおいて、前記メタルマスクの表面に段差を有す
ることを特徴とするメタルマスク。1. A metal mask having at least one hole penetrating the front and back surfaces, the metal mask having a step on its surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9274785A JPS61249790A (en) | 1985-04-30 | 1985-04-30 | Metal mask |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9274785A JPS61249790A (en) | 1985-04-30 | 1985-04-30 | Metal mask |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61249790A true JPS61249790A (en) | 1986-11-06 |
Family
ID=14063005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9274785A Pending JPS61249790A (en) | 1985-04-30 | 1985-04-30 | Metal mask |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61249790A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0295672U (en) * | 1989-01-13 | 1990-07-30 | ||
US6802250B2 (en) * | 2002-05-20 | 2004-10-12 | Taiwan Semiconductor Manufacturing Co., Ltd | Stencil design for solder paste printing |
JP2008047651A (en) * | 2006-08-11 | 2008-02-28 | Nippon Mektron Ltd | Screen printing method for flexible printed circuit board |
JP2009166391A (en) * | 2008-01-17 | 2009-07-30 | Ngk Insulators Ltd | Screen plate and manufacturing method for screen plate |
WO2011055487A1 (en) * | 2009-11-06 | 2011-05-12 | パナソニック株式会社 | Mask for screen printing, screen printing device and screen printing method employing same |
JP2013116586A (en) * | 2011-12-02 | 2013-06-13 | Micro-Tec Co Ltd | Screen print making |
-
1985
- 1985-04-30 JP JP9274785A patent/JPS61249790A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0295672U (en) * | 1989-01-13 | 1990-07-30 | ||
US6802250B2 (en) * | 2002-05-20 | 2004-10-12 | Taiwan Semiconductor Manufacturing Co., Ltd | Stencil design for solder paste printing |
JP2008047651A (en) * | 2006-08-11 | 2008-02-28 | Nippon Mektron Ltd | Screen printing method for flexible printed circuit board |
JP2009166391A (en) * | 2008-01-17 | 2009-07-30 | Ngk Insulators Ltd | Screen plate and manufacturing method for screen plate |
WO2011055487A1 (en) * | 2009-11-06 | 2011-05-12 | パナソニック株式会社 | Mask for screen printing, screen printing device and screen printing method employing same |
CN102596582A (en) * | 2009-11-06 | 2012-07-18 | 松下电器产业株式会社 | Mask for screen printing, screen printing device and screen printing method employing same |
JPWO2011055487A1 (en) * | 2009-11-06 | 2013-03-21 | パナソニック株式会社 | Mask for screen printing, screen printing apparatus and screen printing method using the same |
JP5310864B2 (en) * | 2009-11-06 | 2013-10-09 | パナソニック株式会社 | Mask for screen printing, screen printing apparatus and screen printing method using the same |
JP2013116586A (en) * | 2011-12-02 | 2013-06-13 | Micro-Tec Co Ltd | Screen print making |
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