JPS61249276A - Manufacture of abrasive cloth by diamond eutectoid plating - Google Patents

Abstract

PURPOSE:To improve durability and flexibility in abrasive cloth ever so high, by applying electroplating to both sides of the cloth given conductivity after installation in a state of overlapping with each other in a clipping part of an insulating sheet, and then applying diamond eutectoid plating to them, while setting the diamond with the electroplating. CONSTITUTION:Electroless plating is applied to cloth, and a clipping part of an insulating sheet is superposed on both sides of this cloth. Next, electro-nickel plating or electro-nickel alloy plating is applied to both these surfaces of the cloth. After-war, diamond eutectoid plating takes place with a nickel plating bath containing diamond and then this diamond is settled by electroplating, thus a plating film inclusive of diamond grains if formed on the cloth so excellent in coherence. The abrasive cloth securable in this way is excellent in durability, whereby it is able to grind a material consisting in super hardness in an effective manner and, what is more it is excellent in flexibility.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for producing a polishing cloth that can effectively polish materials having high hardness and has excellent durability and flexibility.

Conventional techniques and their problems Flexible abrasive cloths and abrasive papers for polishing highly hard materials such as steel, cemented carbide, stone, and ceramics are made by adding carbonized silicon (carbon random) to cloth or paper. ), those obtained by applying a mixture of fine particles such as diamond, glue, synthetic resin, etc. and drying are known.

However, such a polishing cloth has the drawback that it lacks flexibility when the mixture is applied thickly, and it lacks durability when it is applied too thinly.

There is a known method for producing a polishing cloth that can polish highly hard substances by subjecting the cloth to electroless plating and has excellent flexibility. However, such a method has problems in that workability is poor due to the slow deposition rate of electroless plating, and costs are high due to the expensive electroless plating solution.

The present inventor has conducted extensive research in order to find a polishing cloth that can effectively polish materials with high hardness and has excellent durability and flexibility. After that, a partially cut-out insulating sheet is pasted, and then electroplating is applied, followed by eutectoid plating of diamond using a nickel plating bath containing diamond, and then electroplating. By fixing the diamond with the polishing method, a plating film containing diamond particles can be formed on the cloth with good adhesion, and the polishing cloth obtained in this way has excellent durability and high hardness. Find a substance that can be effectively polished and has excellent flexibility.

That is, in the present invention, (aJ electroless plating is applied to cloth, (b) partially cut out insulating sheets are attached to both sides of the cloth so that the cut out parts overlap, (c) next, the cloth is coated with electroless plating, A diamond plate characterized by applying electrolytic nickel plating or electrolytic nickel alloy plating to both sides, (d) then diamond eutectoid plating, and (e) electrolytic nickel plating or Hirodenki nickel alloy plating. In the present invention, electroless plating is first applied to the cloth.

The method of electroless plating can be carried out according to a conventional method. For example, after degreasing the cloth by immersing it in an alkaline solution, washing it with water, dipping it in an aqueous hydrochloric acid solution, and washing it with water, the cloth is coated with the electroless plating method. What is necessary is to apply a catalyst and then perform electroless plating. The method for applying the catalyst may be any conventional method, such as the sensitizer activator method or the catalyst method.

There are no particular restrictions on electroless plating, and any known electroless plating bath can be used. For example, electroless steel plating, electroless nickel plating, electroless nickel alloy plating (
(Ni-we gold alloy, Hi-Co alloy, Nt-w alloy, etc.) may be used. The purpose of electroless plating is to impart conductivity to cloth, and the film thickness is usually 0.
．． The thickness may be approximately 5 to 2 μm. If the film thickness is too thick, it is not preferable because the life of the electroless plating bath will be reduced.

After electroless plating, it is washed with water and dried, but if the electroless plating film is thin, some of the plating may peel off during the next step of attaching an insulating sheet. For this reason,
For the purpose of preventing peeling of the plating film and improving the gloss of the electroless plating film, remove the electroplating from one side before drying.
It is preferable to apply the film to a thickness of about 5 to 8 μm. As an electroplater, normal copper plating, nickel plating, etc. may be used, and plating may be performed under normal conditions.

After the plating film is dried, an insulating sheet is pasted on the plating film. The insulating sheet is cut out in advance only in the portion to which diamond eutectoid plating is to be applied. The shape of the cutout of the insulating sheet is not particularly limited, but it is preferably circular or polygonal in order to widen the effective plating area.The area of the cutout and the spacing between adjacent cutouts are determined by the requirements of the polishing cloth. It may be determined as appropriate depending on the degree of flexibility required. Additionally, as the grain size of the diamond used increases, the plating thickness required to stably embed the diamond increases, so as the grain size of the diamond increases, it is better to widen the area of the cutout for better appearance. Become good.

For example, when using diamonds with a particle size of about 20 μm or less, the shape of the cutouts should be a circle or polygon with an area of about 0.015 cm, and the spacing between the cutouts should be 0.05-
0.1 cm, and when using diamond with a grain size of 40P-60 μm, the shape of the cutout should be 0.01 cm in area.
8cm! The interval between the cutouts is about 0.1 cm, and the particle size is 80 to 100 μm.
When using diamonds, the shape of the cutouts should be circular or polygonal with a size of about 025cm2, and the interval between the cutouts should be about 0.12cm, and when using diamonds with a grain size of 105 to 125μm, , the shape of the cutouts is circular or polygonal with an area of about 0.08cm1!, and the interval between the cutouts is 0.15cm.
It is sufficient to set the degree.

As the material of the insulating sheet, when immersed in the acid aqueous solution, alkaline aqueous solution, plating bath, etc. used in the present invention,
Any material that is susceptible to alteration, deterioration, etc. may be used, for example, paper, vinyl, etc. Insulating sheet thickness a
, O,t to about 9.5 mm. The insulating sheet can be plated with an acrylic or natural rubber adhesive, and then pasted on it.You can use a commercially available paper adhesive tape or an adhesive-adhesive insulating sheet. An insulating sheet with cutouts of the same shape may be used on the surface of the cloth, and vice versa, so that the positions of the cutouts match.

The insulating sheet is stretched over nine cloth, and in the next step, it may be plated as is, but it is preferable to fix the peripheral part of the cloth to a frame and perform plating. Expanding the purpose of fixing ■ Add strength to the cloth to prevent it from deforming during plating work, improve zero conductivity and make it easier for uniform current to flow over the entire surface of the cloth, as well as zero-order diamond. This makes it easier to embed the cloth into the diamond layer in the plating process, and (2) makes it easier to keep the distance between the cathode and anode (interelectrode distance) constant.

The material of the frame 1 is not particularly limited, and may be made of plastic, for example. The frame may have a round shape depending on the shape of the cloth, and may be used as a set of two by holding the peripheral part of the cloth in place. It is preferable to make the portion of the frame in contact with the cloth conductive with a metal plate, conductive paint, etc., and to leave the plating film exposed on the portion around the cloth to be fixed with the frame without applying an insulating sheet. By applying electricity to the frame, it is possible to apply current uniformly to the entire surface of the cloth.

In the above case, use an insulating sheet around the cloth!
Width line of the part where the plating film is exposed without IC attached,
It varies depending on the area of the cloth, but usually 0.4 to 1.5 cm.
It is sufficient to set the degree. The width and thickness of the frame can be determined as appropriate depending on the area of the cloth, etc., but for example, use a frame with a diameter of 1-2.5 cm and a thickness of 0.1-0.8 cm, and set the width of the part of the frame that will become a conductor. may be about 0.8^1.5 cm.

Next, before normal plating, such as degreasing with alkaline solution and acid immersion! After the l&m process, nickel plating or nickel alloy plating (Ni-Fe%N
t-co, N1-p, etc.). Through this plating process, the deposits on the front and back surfaces of the polishing cloth grow, and when the fibers are separated, the deposits are bonded together, creating a sticky coating that has sufficient adhesion to withstand use as a polishing cloth. becomes. The plating film thickness may be approximately 5P-80 μm on one side.

On the other hand, if an insulating sheet is not used and parts not required for plating are covered by screen printing, plating with good adhesion is rarely obtained. This is because some organic matter contained in the liquid used for screen printing remains between the chemically plated fibers, which inhibits the interaction between the electrolyte and the fibers, resulting in the formation of electrolyte deposits between the fibers. This is thought to be due to the ability to prevent growth.

Next, diamond eutectoid plating is performed. As the plating bath, a deposited layer of diamond particles may be used in a typical nickel plating bath such as a Watt bath or a 7-amino acid nickel bath. eye? The plating bath can be prepared by creating a layer of diamond particles in the plating bath and then adding the plating solution, or by adding the plating solution into the plating bath and adding diamond particles after the plating bath. The amount of the plating solution that may form the deposited layer may be such that the liquid level is about 9.5 cm or more from the surface of the diamond layer. If the amount of plating solution is too small, water will evaporate, the electrolyte will be concentrated, and the components of the plating bath may crystallize, which is undesirable, but if the amount of plating solution is too large, there will be no particular problem. .

As a method for diamond eutectoid plating, a method may be used in which a cloth subjected to the above treatment is buried in a layer of diamond particles in a plating bath and electricity is applied, and the current density is 8 to 8 μm/min.
It may be approximately dm''.

If the current density is too high, hydrogen gas will be generated and the amount of diamond deposited will decrease, which is undesirable.
The plating time may be set to a time for sufficient adhesion of diamond 6/d. For example, when plating is performed at a current density of 6 m/dm, plating may be performed for about 12 to 50 minutes.Generally, plating The amount of diamond adhesion increases as the time increases, but when plating is performed at 5 m/dm'', the amount of diamond adhesion does not increase much even if plating is performed for 25 minutes or more. However, increasing the plating time has the advantage of making the diamond adhesion distribution more uniform and improving adhesion. The temperature of the plating bath may be the same as that of a normal nickel plating bath, and is generally 46°C.
^ It should be about 566C.

The diamond used may be any general industrial diamond, ranging from fine powder with a particle size of 8 μm or less to a particle size of 100 ^
A wide range of thicknesses up to about 126 μm can be used.

After performing diamond eutectoid plating, the nickel plating is done! Or electrolytic nickel alloy plating (Nt-Fe,
The eutectoid diamond is fixed by N1-co, Hi-p. By performing electrolytic nickel plating or electrolytic nickel alloy plating, the diamond particles are strongly fixed to the plating film, and a polishing cloth with excellent durability can be obtained. The approximate thickness of the plating film may be approximately 40 to 80% of the particle size of the eutectoid diamond, and the plating may be performed according to a conventional method.

In the present invention, the following treatments can also be performed for the purpose of further improving the flexibility and deformability of the polishing cloth that has been subjected to the above-described treatments.

First, after final nickel plating or nickel alloy plating is performed, gold plating is applied to a thickness of about 0.8 to 8 μm. Chrome plating can be performed by a known method. Next, after removing the insulating sheet, the plated film is immersed in a 10% or more nitric acid aqueous solution to dissolve and remove the plating film located under the insulating sheet and not coated with diamond eutectoid plating.

Since chromium plating does not dissolve in nitric acid, only the chromium-plated area remains and the other areas of the polishing cloth are exposed, resulting in a polishing cloth with excellent flexibility and deformability.

The cloth to which the present invention can be applied must be one that does not easily swell, hydrolyze, saponify, deteriorate, etc. when lightly immersed in electrolyte, acid, or alkaline aqueous solutions, and can withstand normal use as a polishing cloth. Examples of such materials include acetate, nylon, acrylic, vinyl, polyester, and cotton. Further, the fineness and density of the cloth are not particularly limited and can be used in a wide range.

Effects of the Invention The polishing cloth obtained by the manufacturing method of the present invention has excellent adhesion of the plating film, can effectively polish substances having high hardness, and has excellent flexibility. It was,
Excellent durability due to good adhesion of diamond particles ◎Examples The present invention will be explained in more detail with reference to Examples.

Example 1 Polyester cloth (fineness: 150dX250d.

d; denier, density, 78×66) was used for the following treatment.

■ After degreasing by immersing in a catalyst-imparting alkaline solution, immersing in an aqueous hydrochloric acid solution, and then adding 28 f//I of stannous chloride and 10 mj// of hydrochloric acid.
After 6 minutes of immersion in a mixed aqueous solution of J.
, 89/J% N acid was immersed in a mixed aqueous solution of 1.8 mJ/J for 5 minutes.

■Electroless nickel plating Electroless nickel plating bath (nickel chloride BOof//4,
/r-nic acid 6 Q f/A, ammonium chloride 50 f
//1. Using sodium hypophosphite 20 f/11 sodium hydroxide approximately 40 f/l, plating was performed at 50'C for 80 minutes to form a nickel plating film with a thickness of 1.2 μm on one side. .

■Electric nickel plating Sulfamino acid nickel plating bath (sulfamino acid nickel 4001/1% nickel chloride 101/I, boric acid 8
01/1. Bath temperature 60 using saccharin 1.51/4)
One side was plated with nickel to a thickness of 1 μm by plating for 1 minute at a current density of 5 μm/dm2 at °C1, followed by washing with water and drying.

■For attaching the insulating sheet, use double-sided adhesive tape (trade name: Nicetack, manufactured by Nichiban) as the insulating sheet, and wrap a circle with a diameter of 0.2 cm on the double-sided adhesive tape, with a gap between the edges of the circle. A large number of cutouts were made so that the distance was approximately 0.150 m. This double-sided paper adhesive tape is applied to the surface of electroplated cloth and I
Paste it so that the position of the cutout overlaps with the Ik side.

However, the double-sided adhesive tape was not applied to the periphery of the cloth, which had a width of about Q and was 5 cm.

The periphery of the cloth to which the double-sided paper adhesive tape was attached using the method described above was wrapped around an AB8 resin frame (width 1 cm).

(thickness: 0.15 cm) and fixed with K. On the surface of the frame in contact with the fabric, a width of about 0.5 cm at the center line of the frame was made conductive.

■After electrolytic nickel plating, alkaline degreasing, water washing, and hydrochloric acid aqueous solution immersion, the above ■
Using a 2-amino acid nickel plating bath similar to that used in the electrolytic nickel process, plating was carried out for about 25 minutes at a bath temperature of about 506C and a current density of about 5 A/dm2 to obtain a thickness of about 26 μm on one side. A plating film was formed on the surface.

■Diamond eutectoid plating Diamond particles with a particle size of 105 to 126 μm are deposited in a plating bath, and then a high concentration nickel sulfamate plating bath (bath composition: nickel sulfamate 460 fl
/l, nickel bromide 151/I.

Boric acid 801/1. Saccharin (1.5 f/j) was added so that the liquid level was approximately 0.8 cm higher than the surface of the diamond layer. The cloth fixed to the frame was then embedded in the diamond layer. The anodes were placed on both sides of the cloth so as to be parallel to the cloth. The liquid temperature of Mehitsuki bath is approximately 6560,
Plating was carried out for about 87 minutes at a current density of 5 dm2 to form a diamond cage eutectoid plating film on both sides of the cloth. The plating film thickness was approximately 87 μm on one side.

■ Electrolytic nickel plating Using the same sulfur nickel plating bath as in the electrolytic nickel plating process described in ■ above, the plating solution was heated at a bath temperature of 68°C, without stirring, and at a current density of 8 μm/drn'' and 10%.
Plating is performed for minutes (plating thickness is approximately 6 μm on one side).
m) Then, plating was performed for about 60 minutes at a current density of about 6 μm/dm'' under stirring (the plating thickness was about 60 μm on one side) to form an electrolytic nickel plating film.

After filling in the multiplication table as described above, it was washed with water, the insulating sheet was removed, and then dried to produce an abrasive cloth. The resulting polished cloth wire,
It was highly flexible, and when used for a long period of time, few diamond particles fell off, and excellent grinding performance was maintained until the polishing cloth itself deteriorated.

Example 2 In the steps ① and ② of Example 1, plating was carried out by placing a plastic plate on one side of the cloth fixed in a frame to cut off the flow of current to one side of the cloth. Example 1
In the same manner as above, an abrasive cloth in which diamond-embedded particles were eutectoided only on one side of the cloth was produced.

The resulting polished cloth wire had excellent flexibility, and even when used for a long period of time, the diamond particles did not shed or spread.

Example 8 Polyester cloth (fineness 150d x 250d.

Density 190X66) K'J! Electroless nickel plating was applied to one side to a thickness of about 1.6 μm in the same manner as in Example 1, and after washing with water, one side was plated in the same manner as in Example 1 (■) to a thickness of S μm. A nickel plating film was formed so that

Next, the area is 0.08cm! Double-sided paper adhesive tape (trade name: Nicetack, Ethipan 1!) with a number of circular cutouts with a spacing of 0.18 cm between adjacent circles.
1111 on both sides of the cloth that has been subjected to the above plating treatment]
The bales were aligned so that the positions of the punches overlapped. Double-sided paper adhesive tape was not applied to the round portion, approximately 1) and 5 cm wide around the periphery of the cloth.

Next, the periphery of the cloth to which the above-mentioned double-sided adhesive tape was pasted was wrapped around a frame made of vinyl chloride resin (width 1 cm).

It was fixed by sandwiching it between two (thickness: Qogcm). On the surface of the frame in contact with the fabric, a length of approximately 9.5 cm at the center line of the frame was made conductive.

Next, after going through the steps of alkaline degreasing, water washing, double acid aqueous solution immersion, and water washing, a nickel plating film was formed on the cutout part to a thickness of about 80 μm on one side in the same manner as in Example 1. Ta.

Subsequently, eutectoid plating of diamond particles was performed in the same manner as in Example 1, using a high 11 degree sulfamino acid nickel plating bath containing diamond particles.

However, the fabric was anodic, placed parallel to the sample only on one side of the sample, and diamond eutectoid plating was performed only on one side of the cloth. Bath temperature approx. 65°c1 Current density 6mm/d fil
Plating was carried out for about 88 minutes to form a diamond eutectoid plating film with a thickness of about 40 μm.

Next, a Watts bath (bath composition; nickel sulfate 8001/I
%Nickel chloride 80 filI, *Formic acid 8゜1/I%
Saccharin 1. Of/j), plating was performed with an anode installed only on the side facing the sample surface to which diamond eutectoid plating was applied. As for the plating method, first, the plating bath was heated to 15 m/dm2 at a current strength of 2 m/d m2 without stirring.
A method was used in which current was applied for about 50 minutes at a current density of 6 μm/drn'' for about 50 minutes (plating thickness on one side was about 50 μm) under stirring.

Next, after washing with water, using a chromium plating bath (bath composition: chromic anhydride 200 fil, sulfuric acid 2.5 f/1), chromium was applied to both sides of the sample at a bath temperature of 50' (3, current density 25 A/dml). Plating was performed.The plating thickness was about 0.5 μm on one side.Then, after washing with water and removing the insulating sheet, it was immersed in a nitric acid aqueous solution to remove the parts that were not plated. (other than the cutout) was dissolved to expose the cloth.The cloth was then washed with water and dried to produce an abrasive cloth.

The resulting polishing cloth has very good flexibility.
Even after long-term use, there was little shedding of the diamond particles, demonstrating excellent durability.

(that's all)

Claims (1)

[Claims] (1) (a) Apply electroless plating to the cloth, (b) Attach the partially cut out insulating sheet to both sides of the cloth so that the cut out parts overlap, (c) Next, apply electroless plating to both sides of the cloth. (d) followed by diamond eutectoid plating, and (e) electrolytic nickel plating or electronickel alloy plating. A method for manufacturing polishing cloth using eutectoid plating.