JPS61237460A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS61237460A JPS61237460A JP7964385A JP7964385A JPS61237460A JP S61237460 A JPS61237460 A JP S61237460A JP 7964385 A JP7964385 A JP 7964385A JP 7964385 A JP7964385 A JP 7964385A JP S61237460 A JPS61237460 A JP S61237460A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electrode
- lead frame
- conductors
- electric insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、テープキャリア方式によりて製造さｎる半導
体集積回路に用いるリードフレームに関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame used in a semiconductor integrated circuit manufactured by a tape carrier method.
テープキャリア方式とは、ポリイミド樹脂等の絶縁性の
フレΦシプルなフィルム上に密着して設けられた導電性
のリードを有するリード７レーふと、半導体素子に設け
られた凸起電極とを直接に熱圧着する組み立て方式であ
る。このテープキャリア方式は、長尺状のフィルムに同
一のリードパターンを連続−して形成できるので、半導
体素子をリードフレームに熱圧着した後は、半導体素子
の電気的試験が自動的ｔｃできるという長所があり、広
く用いられている。The tape carrier method is a method in which a conductive lead is placed in close contact with an insulating flexible film such as polyimide resin, and a convex electrode provided on a semiconductor element is directly connected to the lead. It is an assembly method that uses heat and pressure bonding. This tape carrier method has the advantage that the same lead pattern can be continuously formed on a long film, so that after the semiconductor device is thermocompressed to the lead frame, the electrical test of the semiconductor device can be automatically performed by TC. and is widely used.
従来のテープキャリア方式用リードフレームの電極用リ
ード１１は、第２図の部分平面図に示すように、均質の
テープ状のポリイきド等の絶縁性フィルム５上に密着し
て設けられた銅々どの金属箔からなり、金属屑触法およ
び電気鍍金法等によって形成され、このリードの半導体
素子７が接続される側はデバイスホール６に突き出して
おり、その先端１１ａに半導体素子７の凸起電極が熱圧
着され、その後このリードの他端１６に探針を接触させ
て半導体素子７の電気的な特性を測定するようになって
いる。As shown in the partial plan view of FIG. 2, the electrode lead 11 of the conventional tape carrier type lead frame is made of a copper film closely attached to a homogeneous tape-shaped insulating film 5 made of polyimide or the like. The side of the lead to which the semiconductor element 7 is connected protrudes into the device hole 6, and the protruding electrode of the semiconductor element 7 is attached to the tip 11a of the lead. is thermocompressed, and then a probe is brought into contact with the other end 16 of this lead to measure the electrical characteristics of the semiconductor element 7.
上述した従来構造の電極用リードを有するリードフレー
ムは、電極用リード自体の電気抵抗による電圧降下によ
り、正確な電気的特性を得ることが困難となり、電気特
性選別を不安定なものとし、ひいては極端に製造歩留り
を低下させる原因となりていた。With the lead frame having the electrode lead of the conventional structure described above, it is difficult to obtain accurate electrical characteristics due to the voltage drop due to the electrical resistance of the electrode lead itself, making electrical property selection unstable, and even causing extreme This caused a decrease in manufacturing yield.
本発明のリードフレームは、従来のテープキャリア方式
におけるリードフレームの欠点を解消することを目的と
し、互いに電気的に絶縁された複数の導体により形成さ
れた電極用リードを有している。The lead frame of the present invention aims to eliminate the drawbacks of the conventional tape carrier type lead frame, and has electrode leads formed of a plurality of conductors electrically insulated from each other.
この構造のリードフレームを用いることによって、複数
の導体のうち一つの導体部を電流通路に使用し、他の導
体部を電位検出線として使用すると、リードフレームの
電気抵抗による電圧降下を保証することができ、正確な
電気特性測定を行うことができる。By using a lead frame with this structure, if one of the multiple conductors is used as a current path and the other conductor is used as a potential detection line, voltage drop due to the electrical resistance of the lead frame can be guaranteed. It is possible to perform accurate electrical property measurements.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の部分平面図である。FIG. 1 is a partial plan view of one embodiment of the present invention.
電極用リード１は、導体２と導体３および電気的絶縁物
４によって構成されており、電極用リード１の先端１ａ
は半導体素子７の凸起電極に熱圧着される。The electrode lead 1 is composed of a conductor 2, a conductor 3, and an electrical insulator 4, and the tip 1a of the electrode lead 1
is thermocompression bonded to the convex electrode of the semiconductor element 7.
電気的測定を行う場合は、測定器の探針を電極用リード
１の他端２ｂおよび３ｂに接触させる。When performing electrical measurements, the probe of the measuring device is brought into contact with the other ends 2b and 3b of the electrode lead 1.
このとき例えば、導体２を電流通路として使用し、導体
３を電位検出線として使用すると、この電極用リードｌ
の電位は先端ｉｓにおいて検出されるため、リード自体
の電気抵抗の変動をうけずに常に正確な電気特性を測定
することになる。At this time, for example, if conductor 2 is used as a current path and conductor 3 is used as a potential detection line, this electrode lead l
Since the potential of the lead is detected at the tip is, accurate electrical characteristics can always be measured without being affected by fluctuations in the electrical resistance of the lead itself.
このような、複数本の導体を有する電極用リード１を形
成するには、まず絶縁性フィルム５上に密着して設けら
れている金属箔にエツチング加工を施して、電気的絶縁
物４を設ける部分をスリット状に除去し、次いでこの除
去部分に耐熱性樹脂あるいはガラスなどを埋め込んで押
圧し、金属箔と電気的絶縁物４とを圧着する。その後、
この堰め込んだ電気的絶縁物４０両側に沿りて、導体２
゜３になる部分を残してその他の部分をエツチング除去
すれば互いに絶縁された複数本の導体を有する電極用リ
ード１が形成できる。In order to form such an electrode lead 1 having a plurality of conductors, first, the metal foil provided in close contact with the insulating film 5 is etched to form the electrical insulator 4. A portion is removed in the form of a slit, and then a heat-resistant resin or glass is embedded in the removed portion and pressed to bond the metal foil and the electrical insulator 4 together. after that,
Along both sides of this electrical insulator 40, the conductor 2
By etching and removing the other portions, leaving the portion where the temperature is 3°, the electrode lead 1 having a plurality of mutually insulated conductors can be formed.
この電極用リードｌを有するリードフレームは、その後
半導体素子の熱圧着工程などの加熱工程を通るため、耐
熱性樹脂としてはポリイミド系の樹脂が適している。Since the lead frame having the electrode leads 1 is then subjected to a heating process such as a thermocompression bonding process for semiconductor elements, a polyimide resin is suitable as the heat-resistant resin.
以上説明したように、本発明は、１本の電極用リードを
複数の互いに絶縁された導体により構成することＫよ口
、リード抵抗による電圧降下を完全に保証することがで
き、正確な電気的特性の測定により製造歩留りを一段と
向上できる効果を有するものである。As explained above, the present invention can completely guarantee the voltage drop due to lead resistance by configuring one electrode lead from a plurality of mutually insulated conductors, and provide accurate electrical This has the effect of further improving manufacturing yield by measuring the characteristics.
第１図は本発明のリードの一部分を示す平面図、第２図
は従来のリードフレームの一部分を示す平面図である。
１．１１・・・・・・電極用リード、１５Ｌ、ｌｌ＆
・・・・・・先端、ｌｂ 、 ２ｂ 、 ３ｂ−、、、
他端、２，３ ・・・・・・導体、４・・・・・・電気
的絶縁物、５・・・・・・絶縁性フィルム、６・・・・
・・デバイスホール、７・・・・−半導体素子。FIG. 1 is a plan view showing a portion of a lead according to the present invention, and FIG. 2 is a plan view showing a portion of a conventional lead frame. 1.11... Electrode lead, 15L, ll&
・・・・・・Tip, lb, 2b, 3b-,,,
Other end, 2, 3...Conductor, 4...Electrical insulator, 5...Insulating film, 6...
...Device hole, 7...-Semiconductor element.
Claims (1)
設けたテープキャリア方式に用いるリードフレームにお
いて、少なくとも１本の電極用リードが互いに電気的に
絶縁された複数本の導体より形成されていることを特徴
とするリードフレーム。In a lead frame used for a tape carrier method in which electrode leads are closely attached to a tape-shaped insulating film, at least one electrode lead is formed from a plurality of conductors that are electrically insulated from each other. A lead frame characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7964385A JPS61237460A (en) | 1985-04-15 | 1985-04-15 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7964385A JPS61237460A (en) | 1985-04-15 | 1985-04-15 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61237460A true JPS61237460A (en) | 1986-10-22 |
Family
ID=13695788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7964385A Pending JPS61237460A (en) | 1985-04-15 | 1985-04-15 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61237460A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04176141A (en) * | 1990-11-08 | 1992-06-23 | Nec Corp | Lead frame |
| US20100244209A1 (en) * | 2009-03-31 | 2010-09-30 | Sanyo Electric Co., Ltd. | Circuit device and method for manufacturing the same |
-
1985
- 1985-04-15 JP JP7964385A patent/JPS61237460A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04176141A (en) * | 1990-11-08 | 1992-06-23 | Nec Corp | Lead frame |
| US20100244209A1 (en) * | 2009-03-31 | 2010-09-30 | Sanyo Electric Co., Ltd. | Circuit device and method for manufacturing the same |
| US8829685B2 (en) * | 2009-03-31 | 2014-09-09 | Semiconductor Components Industries, Llc | Circuit device having funnel shaped lead and method for manufacturing the same |
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