JPS61236103A - Metal oxide chip varistor - Google Patents
Metal oxide chip varistorInfo
- Publication number
- JPS61236103A JPS61236103A JP60077802A JP7780285A JPS61236103A JP S61236103 A JPS61236103 A JP S61236103A JP 60077802 A JP60077802 A JP 60077802A JP 7780285 A JP7780285 A JP 7780285A JP S61236103 A JPS61236103 A JP S61236103A
- Authority
- JP
- Japan
- Prior art keywords
- metal oxide
- chip
- chip varistor
- electrode film
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thermistors And Varistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体電子部品等が組み込まれた電子回路を
内域、外電、サージ電圧に対し保護するためサージ吸収
用素子とし幅広く使用されている金属酸化物チップバリ
スタに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is widely used as a surge absorbing element to protect electronic circuits in which semiconductor electronic components are incorporated against internal, external, and surge voltages. The present invention relates to metal oxide chip varistors.
従来の金属酸化物チップバリスタは第５図に示す外形の
チップ１１の両端へ電極材料を付着し電極焼成を行なっ
ていた。そのため第５図のＡ′及びＢ′部のエツジに電
極材料が付着しにくいため第７図、第８図のＡ′及びＢ
′部のところの電極膜１２の厚さが薄くなっていた。極
端な場合は電極膜１２の段切れが生じるものがあった。In the conventional metal oxide chip varistor, electrode material is attached to both ends of a chip 11 having the external shape shown in FIG. 5, and the electrodes are fired. Therefore, it is difficult for the electrode material to adhere to the edges of parts A' and B' in Fig. 5.
The thickness of the electrode film 12 at the ' portion was thinner. In extreme cases, the electrode film 12 may be broken.
上述した従来のチップは第５図に示すとうりチップの１
１は直角の端部Ａ′及びＢ′を持っているため、そこに
電極膜１２用の導電材料を付着しようとしても付着しに
くい。そのためその部分の電極膜１２の第７図、第８図
に示すとうりＡ′及びＢ′のところが薄くなっている。The conventional chip mentioned above has one of the chips as shown in FIG.
1 has right-angled ends A' and B', it is difficult to attach a conductive material for the electrode film 12 thereto. Therefore, as shown in FIGS. 7 and 8, the electrode film 12 in those areas is thinner at A' and B'.
極端な場合は、電極膜１２の段切れが生じている。この
ように、電極膜１２の厚さが薄くなるとその部分の電力
容量が低下し電極焼損をおこす欠点があった。In extreme cases, the electrode film 12 is broken. As described above, when the thickness of the electrode film 12 becomes thinner, the power capacity of that portion decreases, resulting in electrode burnout.
本発明の金属酸化物々チップバリスタは、電極材料付着
前に金属酸化物チップの端部を面取りしたものを用い、
これに電極材料を被着している。The metal oxide multi-chip varistor of the present invention uses a metal oxide chip whose ends are chamfered before electrode material is attached,
An electrode material is applied to this.
面取りの方法は、いろいろあるが、その−例を次に記載
する。面宿りを行なうため振動研摩器の円筒形容器にチ
ップと純水を入れ回転運動をあたえる。その回転運動に
よりチップは互に撮れ合い研摩されて端部の面取りがな
される。面取りの最適条件は回転時間と回転数により得
ることが出来る。面取りされたチップに電極材料を付着
し電極焼成を行なうと、電極膜厚を端部でも厚くするこ
とが可能になった。There are various methods of chamfering, examples of which are described below. To perform surface engraving, chips and pure water are placed in a cylindrical container of a vibration polisher and a rotational motion is applied. The rotational movement causes the chips to be brought into contact with each other and polished to create a beveled edge. The optimum conditions for chamfering can be obtained by the rotation time and rotation speed. By attaching electrode material to the chamfered chip and firing the electrode, it became possible to increase the electrode film thickness even at the edges.
次に、図面を参照して本発明を説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例による面取りされた金属酸化
物チップバリスタ全体の斜視図であり第２図は金属酸化
物のチップの面取りした様子を示す斜視図である。この
ように、チップ１の端部Ａ及びＢ部は直角ではなく面取
りされているためアール（ＦＬ）が付いた面状となって
いる。FIG. 1 is a perspective view of the entire chamfered metal oxide chip varistor according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the chamfered state of the metal oxide chip. As described above, the ends A and B of the chip 1 are not at right angles but are chamfered, so that they have a rounded surface shape.
そのため１を櫃材料が付着しやすくなり従来の問題が解
決され電極焼成後の電極膜１２の厚さは第３図、第４図
に示す端部人及びＢのところで従来より厚く均一にする
ことが出来た。Therefore, the problem of the conventional method is solved by making it easier for the material to adhere to the electrode film 12, and the thickness of the electrode film 12 after firing the electrode can be made thicker and more uniform at the end portions and B shown in FIGS. 3 and 4 than before. was completed.
以上説明したように本発明は、チップの面取りを行うこ
とによりチップ両端の第３図、第４図の端部Ａ及びＢの
′電極膜厚を厚くすることが可能となり、このため電極
の電力容量が大きくなり、従来の電極焼損がなくなった
。なお、電極膜厚の段切れもなくなり歩留り向上と共に
品質が向上した。As explained above, in the present invention, by chamfering the chip, it is possible to increase the thickness of the electrodes at the ends A and B in FIGS. 3 and 4 at both ends of the chip. Capacity is increased and conventional electrode burnout is eliminated. In addition, there was no step break in the electrode film thickness, resulting in improved yield and quality.
第１図は本発明の一実施例による金岡酸化物チップバリ
スタの斜視図である。第２図は本発明の一実施例に用い
る金属酸化物チップの斜視図である。第３図は本発明の
一実施例による１極焼成したチップバリスタの長辺部の
断面図である。第４図は本発明の一実施例による電極焼
成したチップバリスタの短辺部の断面図である。第５図
は従来の金属酸化物チップの斜視図である。第６図は従
来チップに電極焼成したチップバリスタの長辺部の断面
図である。第７図は従来チップに電極焼成したチップバ
リスタの短辺部の断面図である。
１．１１・・・・・・チップ、２．１２・・・・・・電
極膜。
代理人 弁理士 内 原 晋、
企り榎凹FIG. 1 is a perspective view of a Kanaoka oxide chip varistor according to an embodiment of the present invention. FIG. 2 is a perspective view of a metal oxide chip used in one embodiment of the present invention. FIG. 3 is a sectional view of a long side of a single-pole fired chip varistor according to an embodiment of the present invention. FIG. 4 is a sectional view of a short side of a chip varistor with fired electrodes according to an embodiment of the present invention. FIG. 5 is a perspective view of a conventional metal oxide chip. FIG. 6 is a cross-sectional view of the long side of a chip varistor in which electrodes are baked on a conventional chip. FIG. 7 is a cross-sectional view of the short side of a chip varistor in which the electrodes are baked into the conventional chip. 1.11... Chip, 2.12... Electrode film. Agent: Susumu Uchihara, patent attorney;
Claims (1)
物と、前記角部を包囲する金属膜で形成した電極とを有
することを特徴とする金属酸化物チップバリスタ。A metal oxide chip varistor comprising a rectangular plate-shaped metal oxide whose corners have been chamfered in advance, and an electrode formed of a metal film surrounding the corners.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60077802A JPS61236103A (en) | 1985-04-12 | 1985-04-12 | Metal oxide chip varistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60077802A JPS61236103A (en) | 1985-04-12 | 1985-04-12 | Metal oxide chip varistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61236103A true JPS61236103A (en) | 1986-10-21 |
Family
ID=13644135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60077802A Pending JPS61236103A (en) | 1985-04-12 | 1985-04-12 | Metal oxide chip varistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61236103A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02276203A (en) * | 1989-04-18 | 1990-11-13 | Matsushita Electric Ind Co Ltd | Laminated type thermistor |
| CN104361963A (en) * | 2014-11-19 | 2015-02-18 | 广州天极电子科技有限公司 | Surface mount thin-film resistor and manufacture method thereof |
-
1985
- 1985-04-12 JP JP60077802A patent/JPS61236103A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02276203A (en) * | 1989-04-18 | 1990-11-13 | Matsushita Electric Ind Co Ltd | Laminated type thermistor |
| CN104361963A (en) * | 2014-11-19 | 2015-02-18 | 广州天极电子科技有限公司 | Surface mount thin-film resistor and manufacture method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4503350A (en) | Piezoelectric resonator device with a laminated structure | |
| JPS61236103A (en) | Metal oxide chip varistor | |
| JPH0124883Y2 (en) | ||
| JPS637029B2 (en) | ||
| JPS6314853B2 (en) | ||
| EP0694936B1 (en) | Trapezoid- or arc-shaped chip component | |
| JPH0258803A (en) | Chip type thermistor | |
| JPH0537535Y2 (en) | ||
| JPH0547446Y2 (en) | ||
| JPS61116801A (en) | Chip varistor | |
| JPH0719121Y2 (en) | Ring varistor | |
| JPH043442Y2 (en) | ||
| JPS60202907A (en) | Chip varistor | |
| JPS60175406A (en) | Chip type electronic part | |
| JPS6116610Y2 (en) | ||
| JPS5961626U (en) | Chip type piezoelectric resonator structure | |
| JPS6150306A (en) | Chip type surge noise absorber | |
| JPH05267110A (en) | Manufacture of composite chip element | |
| JPH06251994A (en) | Chip type semiconductor ceramic composite part | |
| JPS61234006A (en) | Varistor | |
| JPS63128701A (en) | Chip film resistance element | |
| JPS6116502A (en) | Chip varistor | |
| JPS5975768U (en) | small motor | |
| JPS58150825U (en) | Chip-shaped composite parts | |
| JPS60202902A (en) | Ceramic varistor |