JPS61232077A - レ−ザ加工装置 - Google Patents
レ−ザ加工装置Info
- Publication number
- JPS61232077A JPS61232077A JP60072774A JP7277485A JPS61232077A JP S61232077 A JPS61232077 A JP S61232077A JP 60072774 A JP60072774 A JP 60072774A JP 7277485 A JP7277485 A JP 7277485A JP S61232077 A JPS61232077 A JP S61232077A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- laser beam
- workpiece
- light
- emitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laser Beam Processing (AREA)
- Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60072774A JPS61232077A (ja) | 1985-04-08 | 1985-04-08 | レ−ザ加工装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60072774A JPS61232077A (ja) | 1985-04-08 | 1985-04-08 | レ−ザ加工装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61232077A true JPS61232077A (ja) | 1986-10-16 |
| JPH0366077B2 JPH0366077B2 (enExample) | 1991-10-16 |
Family
ID=13499055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60072774A Granted JPS61232077A (ja) | 1985-04-08 | 1985-04-08 | レ−ザ加工装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61232077A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310093A (ja) * | 1986-06-27 | 1988-01-16 | Komatsu Ltd | レ−ザ装置 |
| DE102007017363A1 (de) | 2007-04-03 | 2008-10-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zur Bearbeitung von Bauteilen |
| US8278594B2 (en) * | 2005-03-04 | 2012-10-02 | Hitachi Via Mechanics, Ltd. | Method and apparatus for perforating printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511436A (en) * | 1978-07-07 | 1980-01-26 | Fuji Heavy Ind Ltd | Urban waste collecting vehicle |
| JPS56134094A (en) * | 1980-02-26 | 1981-10-20 | Ferranti Ltd | Laser cutter |
-
1985
- 1985-04-08 JP JP60072774A patent/JPS61232077A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511436A (en) * | 1978-07-07 | 1980-01-26 | Fuji Heavy Ind Ltd | Urban waste collecting vehicle |
| JPS56134094A (en) * | 1980-02-26 | 1981-10-20 | Ferranti Ltd | Laser cutter |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310093A (ja) * | 1986-06-27 | 1988-01-16 | Komatsu Ltd | レ−ザ装置 |
| US8278594B2 (en) * | 2005-03-04 | 2012-10-02 | Hitachi Via Mechanics, Ltd. | Method and apparatus for perforating printed circuit board |
| DE102007017363A1 (de) | 2007-04-03 | 2008-10-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zur Bearbeitung von Bauteilen |
| DE102007017363B4 (de) * | 2007-04-03 | 2010-09-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zur Bearbeitung von Bauteilen |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0366077B2 (enExample) | 1991-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |