JPS61231174A - Manifold for vapor growth - Google Patents
Manifold for vapor growthInfo
- Publication number
- JPS61231174A JPS61231174A JP7377385A JP7377385A JPS61231174A JP S61231174 A JPS61231174 A JP S61231174A JP 7377385 A JP7377385 A JP 7377385A JP 7377385 A JP7377385 A JP 7377385A JP S61231174 A JPS61231174 A JP S61231174A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- manifold
- line
- valve
- supplying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、CVD法特に半導体の製造において、半導体
基板上に化合物半導体や絶縁膜や多結晶を化学反応によ
り被着する場合に用いられる気相ガスの切換弁に関する
ものである。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a chemical vapor deposition method used in the CVD method, particularly in the production of semiconductors, to deposit compound semiconductors, insulating films, and polycrystals on semiconductor substrates by chemical reactions. This relates to phase gas switching valves.
(従来の技術)
半導体の気相成長皮膜としては、AItGaAs系の半
導体レーザを例にとればGaAs基板上に成長ガスとし
てAsI(l 、TMGSTMAドーピングガスとして
Hz S e % D E Z nを使用し、GaAs
−A!GaAsの多層構造を形成する。(Prior Art) As a semiconductor vapor phase growth film, for example, in an AItGaAs semiconductor laser, AsI(l) is used as a growth gas on a GaAs substrate, and Hz S e % D E Z n is used as a TMGSTMA doping gas. , GaAs
-A! A multilayer structure of GaAs is formed.
しかして上記各ガスの反応器への供給と排気とは、各ガ
スごとに流量調節のMFCと反応器ラインへ送る弁と、
排気ラインへ送る弁の2個弁を互いに連結管で接続して
用いていた。However, the supply and exhaust of each of the above gases to the reactor involves an MFC that controls the flow rate of each gas and a valve that sends the gas to the reactor line.
Two valves for sending the gas to the exhaust line were connected to each other by a connecting pipe.
しかるに、Qa−Asの結晶はGaとAsとが交互に上
下左右に1022個/cflI3存在している。However, in the Qa-As crystal, 1022/cflI3 crystals of Ga and As exist alternately on the top, bottom, left and right.
しかして半導体レーザーでは不純物Seをドーピングし
てn型に、Znをドーピングしてp型を作リ、このとき
ドーピングする密度はIQ111個/1り程度であり、
従ってGa−Asの1万個に1個が5e−1PZnで置
きかわることになる。そこで、Seは電子が1個放出し
てn型に、Znは電子が1個足らずにp型になるが、n
型とp型の接合部分には0.1μmのp型A I G
a A s (Z n)の極めて薄い皮膜があり、この
AlGaAsの成長速度は1時間に1μm程度であるか
ら、この膜成長には約6分間を必要とすることになる。However, in a semiconductor laser, the impurity Se is doped to make the n-type, and Zn is doped to make the p-type, and the doping density at this time is about 111 IQ pieces/1.
Therefore, 1 out of 10,000 pieces of Ga-As will be replaced with 5e-1PZn. Therefore, Se emits one electron and becomes n-type, and Zn loses one electron and becomes p-type, but n
A 0.1 μm p-type A I G is placed at the junction between the type and p-type.
There is an extremely thin film of a As (Z n), and since the growth rate of this AlGaAs is about 1 μm per hour, about 6 minutes are required for the film to grow.
しかして、このp型のAlGaAs (Zn)の前にn
型AJGaAs (Se)を使用しており、これが切
換えバルブより反応器へ達する供給ライン中に残存して
いわゆるよどみがあると、これが前記した0、1pmp
型Aj!GaAsの中に入りSeとZnが結合してp型
を殺してしまう。例えばこのよどみのラインがlawの
小量でもこの電子量はばく大なもので容易にZnを殺し
てしまう。この成長時間が長ければある程度その影響も
少ないがただの6分間ではよどみラインから少量づつS
eが供給ラインへ流れ出しその数が1011個/a11
3即ち前記した如(Znを殺す欠点が生ずる。However, before this p-type AlGaAs (Zn), n
Type AJGaAs (Se) is used, and if it remains in the supply line leading from the switching valve to the reactor and there is so-called stagnation, this will cause the 0 to 1 pmp mentioned above.
Type Aj! It enters GaAs and combines with Se and Zn, killing the p-type. For example, even if this stagnation line has a small amount of law, the amount of electrons is large enough to easily kill Zn. If this growth time is long, the effect will be less to some extent, but if it is only 6 minutes, a small amount of S will be removed from the stagnation line.
e flows into the supply line and the number is 1011 pieces/a11
3. That is, as mentioned above, the disadvantage of killing Zn occurs.
(発明が解決しようとする問題点)
上記従来例における、1種の成長ガスに対して供給管と
排気管とに切換える切換弁2個を連結管で接続したもの
においては、2個の弁のOn10ff操作や又前記MF
Cの微流量調整、機械的緩み等も多く更に最も重大な問
題点としては前記した如く1種の成長ガスに対して2個
づつのバルブが使用され且つこれらが連結管や供給管、
排気管に接続される機構的制約によって生ずるバルブよ
り反応器に達する供給管路が長くなることであってこの
ためにこの長い管路内に残存する気相ガス量が多くなる
ことである。(Problems to be Solved by the Invention) In the conventional example described above, in which two switching valves that switch between a supply pipe and an exhaust pipe for one type of growth gas are connected by a connecting pipe, On10ff operation and the above MF
The most serious problem is that, as mentioned above, two valves are used for each type of growth gas, and these are connected to connecting pipes, supply pipes,
The main problem is that the supply line leading to the reactor is longer than the valve due to mechanical constraints connected to the exhaust pipe, which increases the amount of gas phase gas remaining in this long line.
(問題点を解決するための手段)
本発明は上記問題点を解決するために、1気相ガスに対
して1個の開又は閉の作動のみを迅速に行なう例えば電
磁気或はエア等を用いたマニホールドを気相ガスの種類
に応じた複数個並びに反応器へ通ずる供給ライン及び排
気ライン等を単一のブロック内に構成し、且つ上記マニ
ホールドは弁体の両側に弁座を有しその中間に気相ガス
供給口を開口して少くとも供給ラインの短縮と両ライン
並びにマニホールドのブロック状による小型化とにより
解決するものである。(Means for Solving the Problems) In order to solve the above problems, the present invention uses, for example, electromagnetism or air to quickly perform one opening or closing operation for one gas phase gas. A plurality of manifolds corresponding to the type of gas phase gas, a supply line leading to the reactor, an exhaust line, etc. are configured in a single block, and the manifold has valve seats on both sides of the valve body and a valve seat in the middle. This problem can be solved by at least shortening the supply line by opening a gas phase gas supply port in the front and reducing the size of both lines and the manifold by making them block-shaped.
(実施例)
次に図面に示した本発明の1実施例にもとづき詳細に説
明する。(Example) Next, an example of the present invention shown in the drawings will be described in detail.
1はブロックであり、これに図示されていない気相ガス
成長のための反応器内へ連通する排気ライン2と、気相
ガスの供給ライン3とが形成されており、この両ライン
2.3間に1気相ガス毎に例えば電磁装置4.4a・・
・が迅速な開弁、閉弁を行なう弁杆5.5a・・・を介
して弁体6.6a・・・を有し、この弁体6.6a・・
・の作動両端に供給弁座7.7a・・・及び排気弁座8
.8a・・・が形成されていて、この両弁座7.7a・
・・と8.8a・・・との間に気相ガスボンベ(図示せ
ず)と連結する導入口9.9a・・が開口マニホールド
A、Aa・・・が構成されるものである。Reference numeral 1 designates a block, on which are formed an exhaust line 2 that communicates with the inside of a reactor for vapor phase gas growth (not shown) and a gas phase gas supply line 3, both of which lines 2.3. For example, an electromagnetic device 4.4a...
- has a valve body 6.6a... via a valve rod 5.5a... which performs quick valve opening and closing, and this valve body 6.6a...
Supply valve seat 7.7a... and exhaust valve seat 8 at both operating ends of ・
.. 8a... is formed, and both valve seats 7.7a.
The opening manifolds A, Aa, . . . are constituted by an inlet port 9.9a, which is connected to a gas phase gas cylinder (not shown), between .
(作用)
排気ライン2並びに供給ライン3にはそれぞれキャリヤ
ガスが流れている。今1例を第3図の略図で説明すると
、排気ライン2と供給ライン3とには矢印方向にキャリ
ヤガスとしてHtが2127111n常時流れており、
マニホールドAの導入口9よりはDEZnを200cc
/win 、同じ(Aaの9aよりH,Seを100c
c/win 、同じ(Abの9bよりAsH,を500
cc/win常時流している。(Function) Carrier gas flows through the exhaust line 2 and the supply line 3, respectively. To explain one example using the schematic diagram in FIG. 3, 2127111n Ht is constantly flowing as a carrier gas in the direction of the arrow in the exhaust line 2 and the supply line 3.
200cc of DEZn from inlet 9 of manifold A
/win, same (H, Se 100c from 9a of Aa
c/win, same (AsH from 9b of Ab, 500
cc/win is always running.
しかして図示の状態はマニホールドAaの弁体6a(第
1図参照)が供給弁座7aを開放し、排気弁座8aを閉
じているので導入口9aより流れる気相ガスHzseは
、供給ライン3内を流れるキャリヤガスH8に運ばれて
反応器に達する。このときマニホールドAは弁体6−−
−が供給弁座H2に運ばれて排気される。In the illustrated state, however, the valve element 6a of the manifold Aa (see FIG. 1) opens the supply valve seat 7a and closes the exhaust valve seat 8a, so that the gas phase gas Hzse flowing from the inlet 9a flows through the supply line 3. It reaches the reactor carried by the carrier gas H8 flowing inside. At this time, manifold A is valve body 6--
- is carried to the supply valve seat H2 and exhausted.
HzSeの供給ライン3への流れが、弁座7aと弁体6
aの当接で停止されて他の気相ガスの弁が供給ライン側
へ開放されると、マニホールドAaの弁体6aが、マニ
ホールドAの弁体6の如く位置するので気相ガスの残量
のよどみ部分は第1図のマニホールドAの図でSで示す
極めて小量のスペースのみである0本発明は特にMOC
VD装置用として好適で且つシール部分にはテフロン材
を使用することによって一層効果的である。The flow of HzSe to the supply line 3 is caused by the valve seat 7a and the valve body 6.
When valves for other gaseous gases are opened to the supply line side by contact with a, the valve body 6a of manifold Aa is positioned like the valve body 6 of manifold A, so the remaining amount of gaseous gas The stagnation area is only an extremely small space indicated by S in the diagram of manifold A in Figure 1.
It is suitable for use in VD equipment, and is even more effective by using Teflon material for the sealing part.
しかして前記した如く気相ガスのよどみ部分Sが極めて
小量なので弁体の切換えによる気相ガスの供給流れと°
ともにキャリヤガスの流れに乗って運び出され他の気相
ガスの供給時に混入することなく好ましい気相成長が得
られ、しかも−単体のブロック内に構成したので小型化
は勿論取扱上にも多くの利点を有するものである。However, as mentioned above, since the stagnation part S of the gas phase gas is extremely small, the supply flow of the gas phase gas by switching the valve body is
Both are carried out along with the flow of the carrier gas, allowing for favorable vapor phase growth without being mixed in when other vapor phase gases are supplied.Moreover, since they are constructed in a single block, they are not only compact, but also easy to handle. It has advantages.
図は本発明の実施の1例を示したもので第1図は部分欠
切正面図、第2図は同じく側面図、第3図は各ラインの
略図である。
符号、A % A a s A b・・・はマニホール
ド、Sは気相ガスのよどみ部分、1はブロック、2は排
気ライン、3は供給ライン、6.6a・・・は弁体、7
.7a・・・は供給弁座、8.8a・・・は排気弁座、
9.9a・°・・は気相ガス導入口。
第2図
党3図The drawings show an example of the implementation of the present invention; FIG. 1 is a partially cutaway front view, FIG. 2 is a side view, and FIG. 3 is a schematic diagram of each line. Code, A % A a s A b... is the manifold, S is the stagnation part of gas phase gas, 1 is the block, 2 is the exhaust line, 3 is the supply line, 6.6a... is the valve body, 7
.. 7a... is a supply valve seat, 8.8a... is an exhaust valve seat,
9.9a.°... is the gas phase gas inlet. Figure 2 Party Figure 3
Claims (1)
容器に連結する反応ガスの供給ラインと、非供給時のガ
ス放出のための排気ラインとを単独ブロック内に並列に
構成して供給方向並びに排気方向とに所定量のキャリヤ
ガスを流通せしめ、上記両ラインの間に、弁体を中心に
その作動両側にそれぞれ弁座を形成し、各弁座を介して
弁杆側を前記排気ラインに、他側を供給ラインに接続す
るとともに、前記両弁座間に気相ガスラインを開口せし
めて気相ガスに連結した開、閉両作用のみのマニホール
ドを用いた一体ブロックより成り弁座より供給ライン間
における気相ガスのよどみ量を僅少にして他のガスとの
混合を回避し且つ小型化したことを特徴とする気相成長
用マニホールド。In a manifold in a gas-phase chemical reaction device, a supply line for a reaction gas connected to a reaction vessel and an exhaust line for releasing gas when not supplied are configured in parallel in a single block, and are arranged in the supply direction and the exhaust direction. A predetermined amount of carrier gas is allowed to flow, and between the above two lines, valve seats are formed on both operating sides of the valve body, and through each valve seat, the valve rod side is connected to the exhaust line, and the other side is connected to the exhaust line. The gas phase between the valve seat and the supply line is connected to the supply line, and consists of an integral block using a manifold that can only open and close, and is connected to the gas phase by opening the gas phase gas line between the two valve seats. A manifold for vapor phase growth characterized by minimizing the amount of gas stagnation to avoid mixing with other gases and being miniaturized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7377385A JPS61231174A (en) | 1985-04-08 | 1985-04-08 | Manifold for vapor growth |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7377385A JPS61231174A (en) | 1985-04-08 | 1985-04-08 | Manifold for vapor growth |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61231174A true JPS61231174A (en) | 1986-10-15 |
JPH0559988B2 JPH0559988B2 (en) | 1993-09-01 |
Family
ID=13527861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7377385A Granted JPS61231174A (en) | 1985-04-08 | 1985-04-08 | Manifold for vapor growth |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61231174A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990011822A2 (en) * | 1989-04-03 | 1990-10-18 | Unit Instruments, Inc. | Gas flow control apparatus |
-
1985
- 1985-04-08 JP JP7377385A patent/JPS61231174A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990011822A2 (en) * | 1989-04-03 | 1990-10-18 | Unit Instruments, Inc. | Gas flow control apparatus |
WO1990011822A3 (en) * | 1989-04-03 | 1990-11-15 | Unit Instr Inc | Gas flow control apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH0559988B2 (en) | 1993-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |