JPS61230398A - 高熱伝導多層セラミツク配線基板の製造方法 - Google Patents

高熱伝導多層セラミツク配線基板の製造方法

Info

Publication number
JPS61230398A
JPS61230398A JP60072166A JP7216685A JPS61230398A JP S61230398 A JPS61230398 A JP S61230398A JP 60072166 A JP60072166 A JP 60072166A JP 7216685 A JP7216685 A JP 7216685A JP S61230398 A JPS61230398 A JP S61230398A
Authority
JP
Japan
Prior art keywords
multilayer ceramic
conductor
substrate
aluminum nitride
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60072166A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0523078B2 (enrdf_load_stackoverflow
Inventor
嶋田　勇三
泰弘 黒川
和明 内海
秀男 高見沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60072166A priority Critical patent/JPS61230398A/ja
Publication of JPS61230398A publication Critical patent/JPS61230398A/ja
Publication of JPH0523078B2 publication Critical patent/JPH0523078B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP60072166A 1985-04-05 1985-04-05 高熱伝導多層セラミツク配線基板の製造方法 Granted JPS61230398A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60072166A JPS61230398A (ja) 1985-04-05 1985-04-05 高熱伝導多層セラミツク配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60072166A JPS61230398A (ja) 1985-04-05 1985-04-05 高熱伝導多層セラミツク配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61230398A true JPS61230398A (ja) 1986-10-14
JPH0523078B2 JPH0523078B2 (enrdf_load_stackoverflow) 1993-03-31

Family

ID=13481382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60072166A Granted JPS61230398A (ja) 1985-04-05 1985-04-05 高熱伝導多層セラミツク配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61230398A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0523078B2 (enrdf_load_stackoverflow) 1993-03-31

Similar Documents

Publication Publication Date Title
JPS6273799A (ja) 多層セラミツク配線基板
JP4610114B2 (ja) セラミック配線基板の製造方法
JPS60253295A (ja) 多層セラミツク基板の製造方法
JPH0636473B2 (ja) 多層セラミツク基板
JPS61230398A (ja) 高熱伝導多層セラミツク配線基板の製造方法
JPS61230396A (ja) 高熱伝導多層セラミツク配線基板の製造方法
JPS6310594A (ja) 高熱伝導多層セラミツク配線基板
JPS61230399A (ja) 高熱伝導多層セラミツク配線基板の製造方法
JP3171695B2 (ja) 窒化アルミニウム回路基板の製造方法
JPH01300584A (ja) 多層配線回路基板
JPS61230397A (ja) 高熱伝導多層セラミツク配線基板
JPH0636474B2 (ja) 多層セラミック配線基板の製造方法
JPS6276592A (ja) 多層セラミツク配線基板
JPH0443440B2 (enrdf_load_stackoverflow)
JPS6164189A (ja) セラミツク多層配線基板の製造方法
JPS6284594A (ja) 多層セラミツク配線基板
JPS63292693A (ja) 高熱伝導多層セラミック配線基板
JPS6276594A (ja) 多層セラミツク配線基板
JPH0445997B2 (enrdf_load_stackoverflow)
JPS6271294A (ja) 多層セラミツク配線基板
JPH0415637B2 (enrdf_load_stackoverflow)
JPH088415B2 (ja) 窒化アルミニウム多層配線基板の製造方法
JPH0415638B2 (enrdf_load_stackoverflow)
JPS6273797A (ja) 多層セラミツク配線基板
JPH0415639B2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term