JPS61228991A - Printing on electronic part - Google Patents

Abstract

PURPOSE:To print clearly and enable forming a print which does not disappear, by placing different color inks into incised parts formed by laser marking. CONSTITUTION:A predetermined mark is incised in the surface of an electronic part by laser marking, then an ink 2 is applied to the surface, and the surplus of ink 2 adhered to the parts other than the incised parts 1 is removed by blasting or brushing. In this case, it is particularly effective that the particle diameter of an abrasive power used in blasting or the diameter of a brush used in brushing is set to be larger than the width of the laser incision. Accordingly, clear print which does not disappear can be obtained, and manufacturing cost can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for marking electronic components, and particularly to a method for marking clearly and permanently.

Many semiconductor devices such as ICs and other electronic components are extremely small, and it is necessary to stamp each type name and symbol (loft number, manufacturing date, etc.) on these small components as well.

However, the stamped mark must not disappear or become unclear during handling, and must remain clearly visible.

[Prior art and problems to be solved by the invention] Usually,
The method for marking electronic components such as ICs is to spread the marking ink liquid to a certain thickness with a roller and attach it to the type surface.
Furthermore, the type ink is passed through a transfer roller to electronic components (
A method is adopted in which a stamp is placed on the part to be stamped (parts to be stamped), and a stamping machine that automates this process is used.

Furthermore, in recent years, so-called laser engraving machines have come into use, which irradiate laser light to engrave predetermined characters on the surface of electronic components.

However, the former ink stamping method tends to peel off when rubbed during handling, and there is a risk that the ink stamp may become unclear or disappear.

On the other hand, the latter laser engraving method is a stamping method that eliminates the drawbacks of this method, and the laser is irradiated onto the stamped part to melt the surface and make it concave, so it will not disappear due to friction. However, since this laser engraving method only engraves, it is the same color as the background and is not clear, especially electronic parts with uneven surfaces, such as resin-sealed semiconductor devices with matte surfaces. , which has the disadvantage of being difficult to read.

The present invention proposes a stamping method that solves these problems.

[Means for solving the problem] The problem is that after a predetermined mark is laser engraved on the surface of an electronic component, and then ink is applied to the surface, the excess ink adhering to the outside of the engraved recess is removed by a blasting method. This problem can be solved by a method of marking on electronic parts, which removes the markings by a brushing method or the like.

At this time, it is particularly effective to make the particle size of the abrasive particles sprayed by the blasting method or the brush diameter of the brushing method larger than the width of the laser marking.

[Function] That is, the present invention fills the laser-engraved portion with ink of a different color to make the print clearer.

In this way, a clear and permanent print is formed.

[Example] Hereinafter, embodiments will be described in detail with reference to the drawings.

1 to 3 show partial views of the stamping part of an electronic component in the stamping process according to the present invention, in which [a] is a plan view, and (b) is a sectional view thereof.

The figure shows a plan view and a cross-sectional view of the letter "N", and Figures 1(a) and 1(b) are views immediately after laser engraving, and as shown, the engraved part is in the recess 1. The colors are the same. Next, as shown in FIGS. 2(a) and 2(b), an ink 10 of a different color from the background is applied onto the stamped portion using a roller and cured.

Next, abrasive particles are sprayed onto the ink by a blasting method so that the ink 10 remains only inside the concave stamped part and everything else is polished and removed, as shown in Figure 3(a) and (bl). Examples of the blasting method include a sandblasting method and a liquid honing method, and a brushing method using a brush.

At this time, it is desirable that the particle size of the abrasive particles be larger than the width of the laser marking, so that the abrasive particles do not enter the concave marking portion filled with the applied ink.

Therefore, only the ink on the surface can be removed by blasting or the like, and the ink inside the stamped part can remain, resulting in a clear stamp. For example, on the surface of black sealing resin,
If a white pigment ink is applied, an extremely clear mark can be obtained, and the mark will not disappear due to friction.

Further, the stamping method according to the present invention can be easily automated. Namely, laser engraving, mark imprinting.

Separate automatic machines are commercially available for blasting.
By combining these, it is possible to create a continuous high-speed automatic stamping machine, and furthermore, full automation is facilitated by linking the preceding and following processes and linking with production management.

FIG. 4 illustrates a perspective view of an automatic stamping machine to which the stamping method according to the present invention is applied. That is, electronic components such as ICs are placed on the loader section 11, and are sent one by one to the laser printing section 12. The laser printing section 12 has two laser heads, one for marking general characters and the other for special marks such as company logos. When laser engraved,
The paper is sent to the inking section 13, where ink is applied, and the ink is pre-baked at the precure section 14. 15 is an automatic sheet reversing mechanism section, and 16 is an unloader section.

Note that 17 indicates a personal computer that controls laser printing.

This is because, although the above example does not include an ink removal step, this example uses a method of processing ink removal and printing all at once. As seen in this example, the laser marking method according to the present invention can be easily automated.

Further, ink removal may be performed not only by a blasting method or a brushing method, but also by other removal methods.

However, when marking a resin-sealed IC, the surface is polished by a blasting or brushing method in order to remove the release agent and resin flash on the lead wires after molding. It is extremely convenient because it also serves as ink removal in the stamping method.

As described above, according to the marking method according to the present invention, there is no need to use type for laser marking, and
It is possible to significantly shorten the time required for stamping, and furthermore, there is no need for visual inspection of the mark, thereby reducing manufacturing costs.

[Effects of the Invention] As is clear from the above description, the stamping method according to the present invention has the advantage that a clear stamp that does not disappear can be obtained and manufacturing costs can be reduced.

[Brief explanation of the drawing]

1 to 3 are partial views of the stamping part of an electronic component in the stamping process according to the present invention ((a) in the same figure is a plan view, and in the same figure is a sectional view), and FIG. 4 is a partial view of the stamping part of the electronic component in the stamping process according to the present invention. FIG. 2 is a perspective view of an automatic stamping machine according to an embodiment. In the figure, 1 is a marking section, 2 is ink, 12 is a laser printing section of an automatic machine, and 13 is an inking section of an automatic machine.

Claims (2)

[Claims] (1) A predetermined mark is laser engraved on the surface of the electronic component,
Next, after applying ink to the surface, the ink adhering to the outside of the marking recess is removed. (2) The above ink removal is performed by a blasting method, and the particle size of the abrasive particles sprayed by the blasting method is
2. The method of marking an electronic component according to claim 1, wherein the width of the laser marking recess is larger than the width of the laser marking recess.