JP2755251B2 - Marking device and marking method for electronic component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a marking device and a marking method for electronic parts, and more particularly, to a device having good visibility.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a marking device and a marking method for an electronic component that have excellent durability and do not require setting change when changing display contents.

[0002]

2. Description of the Related Art Conventionally, when a seal is applied to an exterior surface of a product, a method of using ink and stamping the ink on the exterior surface is generally used. However, this conventional “printing method using ink” has low friction resistance and has a problem in visibility. In particular, in the case of stamping by the ink jet method, the problems of friction resistance and visibility are more remarkable because the viscosity of the ink used is low.

A method of engraving an exterior surface with a laser is also known. However, in the "engraving method by laser", the exterior surface and the engraved portion have the same color, so that there is still a problem in visibility.

In order to solve such "problems with respect to friction and visibility", for example, Japanese Patent Application Laid-Open Nos. Sho 61-228991 and Hei 4-7194 enclose characters or symbols on a marking surface. In addition, a technique is described in which an ink of a different color from the exterior surface is adhered only to the indented concave portion, thereby improving the stamping strength and visibility.

Here, the technique described in the above-mentioned Japanese Patent Application Laid-Open No. 61-228991 (hereinafter referred to as "conventional example 1") and the technique disclosed in the Japanese Patent Application Laid-Open No.
The technology described in Japanese Patent Publication No. 194 (hereinafter, referred to as “conventional example 2”) will be described in detail for each case.

[0006] Conventional example 1 is described as follows.
A method for imprinting an electronic component on a surface of the electronic component, the method including applying a laser to the surface, applying ink to the surface, and removing the adhering ink other than the engraved concave portion. The conventional example 1 will be specifically described with reference to FIG. FIG. 8 is a view for explaining a representative example of the conventional example 1 (an example in which a character “N” is displayed on the surface of an electronic component).
3A is a plan view of a stamped portion [a character display portion of “N”] of an electronic component, and FIG. 3B is a cross-sectional view taken along line AA of FIG.

In the first conventional example shown in FIGS. 8A and 8B, a concave portion (marked portion) 81 is first formed by laser engraving on the surface of the electronic component so as to indicate "N". I do. [In this case, the engraved portion is only the concave portion 81 indicating “N”,
Same color as (background). Next, ink of a color different from the background is placed on the concave portion (marked portion) 81.
After applying and baking 82, abrasive particles are sprayed from the top by blasting, and ink 82 is applied only to the concave portion (marked portion) 81.
And all the other inks are polished and removed.

In the conventional example 1 (the technique described in Japanese Patent Application Laid-Open No. 61-228991), by adopting the above-described method, it is possible to obtain a seal that does not disappear and that a clear seal can be obtained. It has.

On the other hand, the above-mentioned prior art 2 (the technique described in Japanese Patent Laid-Open No. 4-7194) discloses that "the marking of an electronic component (a plastic electronic component base material) is performed by engraving with laser light. 9. A method for marking an electronic component, which comprises applying a thermosetting powdery ink to the marking portion and coloring the marking portion with heat during the marking process. " This will be specifically described. FIG. 9 is a diagram illustrating a representative example of Conventional Example 2, and is a partial cross-sectional view of a stamp processing unit including a stamp processing facility.

First, the stamping equipment used in the conventional example 2 will be described. As shown in FIG.
A "laser emitting portion 91" for condensing the laser light 93 by a condensing lens 92 and emitting the laser light 93a to the engraved portion 90 as a laser condensing portion 93a;
And a “thermosetting powder ink blowing nozzle 94” for blowing the thermosetting powder ink 95 to the processing section. And
The laser discharge section 91 and the thermosetting powder ink jet nozzle 94
The thermosetting powder ink 95 is always sprayed immediately after the "marking portion 90" where the marking process is performed by the laser condensing 93a.

Next, a description will be given of a method of marking an electronic component according to a second conventional example.
An electronic component base material (made of plastic) 97 is engraved by a laser condensing 93a from 91 to form a groove in the engraved portion 90. The formed groove is at a high temperature due to the processing heat of the laser. (Note that the arrows in FIG. 9 indicate the direction of laser processing.)
Immediately after the groove processing, the thermosetting powder ink 95 is sprayed immediately. As a result, the thermosetting powdered ink 95 is adhered and fixed only in the high-temperature groove, thereby forming an engraved character (ink 96). (Besides the grooves, the temperature is not high, so the thermosetting powder ink 95 is blown off.)

In the second conventional example, as described above, the engraving of the electronic component base material (made of plastic) 97 with a laser and the formation of the ink 96 of the engraved character can be performed simultaneously. This has the advantage that the polishing step by the blast method as in No. 1 is not required.

In addition to the conventional examples 1 and 2, a pair of mold dies for forming a package of a semiconductor device by a resin mold is provided. A mold provided with protrusions and the like corresponding to characters and symbols to be displayed. "
No. 0281: hereinafter referred to as “conventional example 3”). The conventional example 3 will be specifically described with reference to FIG. FIG. 10 is a view for explaining a typical example of Conventional Example 3 (the technique described in Japanese Patent Laid-Open No. 6-120281), and is a cross-sectional view of a main part of a mold.

As shown in FIG. 10, a mold mold according to Conventional Example 3 has an upper mold 101 having a cavity 104 formed inside.
And a lower mold 102, and a part of the upper mold 101 is provided with a marking section 103 which performs a protruding and retracting operation in accordance with the contents of engraving. The marking section 103 has the same mechanism as the marking section of the dot printer, and has a plurality of mark pins 103a corresponding to each dot of the inscription.
It is composed of

In the conventional example 3, as described above, the mark pins 103a constituting the marking portion 103 are made to protrude or recede from the other surface in correspondence with each dot of the inscription, and when the This is to engrave a concave or convex character or symbol on the package of the apparatus. As described above, in the conventional example 3, in the molding process, the mark is simultaneously formed.
King can be performed, and even if there are changes in characters or symbols displayed on the package, by deforming a part of the mold (i.e., by replacing the mark pin 103a), This has the advantage that an exterior having a different marking can be formed without replacing the mold itself.

[0016]

According to the conventional laser engraving method and the conventional examples 1 to 3, or the imprinting and engraving method in which these are combined, a unique engraving is displayed in advance every time the displayed contents are different. There was a problem that it had to be manufactured (first problem). The reason is that, once engraved, the display content cannot be changed, so the display content must be determined in advance when engraving, and accordingly, the engraving corresponding to the display content must be created in advance. Because it must be.

There is also a problem that every time the display content is changed, the setting of the marking device needs to be changed (second problem). In this case, even if it is not necessary to replace the laser device or the mold itself every time the content of the engraving is changed, at least a part of the laser device or the mold needs to be deformed or changed.

The present invention has been made in view of the first and second problems of the related art, and its object (problem) is to provide a method for imprinting while maintaining the imprint strength and visibility. The same package marked (engraved) can be used irrespective of the displayed content, and the setting of the engraving device does not need to be changed every time the displayed content is changed. Is to provide.

[0019]

Means for Solving the Problems The present invention is characterized in that: one or both of the molds has a convex shape for engraving a concave portion common to the display content to be marked on an electronic component, It is characterized in that it is not necessary to change the setting of the convex shape when changing the shape of the convex part. Also, a common concave part constituting a segment character is stamped on the surface of the electronic component, and ink is attached only to a necessary part of the concave part. Thus, characters, symbols, and the like are formed, thereby achieving the above-described object (object) of the present invention.

In other words, the electronic component marking apparatus according to the present invention provides an electronic component marking apparatus that uses a pair of dies, and one or both of the dies has a common display content for marking the electronic component. A marking for marking an electronic component, wherein the marking has a convex shape for engraving the concave portion, and the convex shape has a shape that does not require setting change when changing the display content. ” Item 1) is the gist.

Further, the method of imprinting an electronic component according to the present invention is characterized in that a common concave portion constituting a segment character is stamped on the surface of the electronic component, and ink is applied only to a necessary portion of the concave portion. A method for imprinting an electronic component, which is characterized by imprinting a character "(claim 3).

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION An electronic component marking apparatus according to the present invention uses a pair of dies, and specifically uses a die including an upper die and a lower die having a cavity formed therein. Is what you do. And one or both of the molds (that is, upper mold and / or lower mold) are provided with a convex mold,
The convex type is a convex type having a shape that does not require setting change when changing display contents.

In the electronic component marking apparatus according to the present invention, the “convex shape that does not require setting change when changing the display content” is a “8-shaped” convex shape, and Is a preferred embodiment of the present invention (claim 2). Further, in the method of imprinting an electronic component according to the present invention, similarly, it is a preferable embodiment of the present invention that the segment character is a plurality of “8” characters (claim 4).

In the present invention, the number of "0-9" (or the symbol of "-") is arbitrarily imprinted by forming the figure "8" as described above and applying ink only to the necessary portions. By using a plurality of "8-shaped" shapes, a display content having an arbitrary number and an arbitrary number of digits can be obtained (see FIG. 5 described later). Therefore, according to the present invention, it is not necessary to change the marking device (engraving device) at all, even if it becomes necessary to change the contents of the seal display related to the numeral.

In the method of imprinting an electronic component according to the present invention, a concave portion is stamped on the surface of the electronic component, and the concave portion is formed with an ink.
(Ink of a color different from that of the electronic component) is applied, so that the display content is stamped in the concave portion, and the stamping strength is large and the visibility is good. It is.

[0026]

EXAMPLES Next, the present invention will be described in detail with reference to examples of the present invention. However, the present invention is not limited to the following examples, and does not depart from the gist of the present invention. Various modifications and changes are possible.

(Embodiment 1) FIG. 1 is a view for explaining an embodiment (Embodiment 1) of a marking device for electronic parts according to the present invention, and is a cross-sectional view of a marking device using a mold. 2
FIG. 2 is an enlarged perspective view of a segment stamping projection provided on the upper die of the stamping device of FIG. 1.

As shown in FIG. 1, the mold according to the first embodiment includes an upper mold 1 and a lower mold 2 each having a cavity 3 formed therein, and as shown in FIGS. The upper mold 1 is provided with three convex shapes (segment stamping convex portions 4) each having a shape representing "figure 8" at a part thereof.

In the first embodiment, as for the size of the display character, for example, if a display character of 10 mm square is required, the “figure 8” type of the segment engraving projection 4 is changed to 10 mm.
And In addition, the depth of the engraving is the projection 4
The thickness is determined by the thickness of the ink, but it is preferably set to, for example, about 0.5 to 1 mm in consideration of the depth to which the ink can be attached in the subsequent “ink attachment step”.

FIG. 3 is a perspective view of a package of the semiconductor device obtained according to the first embodiment. In the first embodiment,
First, using the mold shown in FIG. 1 and FIG. 2 described above, a “package 5 in which three concave portions 6 forming three characters“ 8 ”as segment characters are stamped at three places” shown in FIG. 3 is manufactured. .

Next, the ink is applied only to the necessary portion of the concave portion 6. This application step will be described with reference to FIG. (Note that FIG. 4 is a view for explaining an example of the ink applying step of the present invention, and is an enlarged view of a marking section including the ink applying apparatus.)

In the first embodiment, as shown in FIG. 4, the package 5 shown in FIG. 3 described above is fixed by a package position fixing plate 10 in order to specify its position. Ink 9 is jetted from a nozzle 8 of an ink jet printing device 7 to a predetermined portion of the concave portion 6 to obtain a desired number.
(Numbers "0-9") and symbols ("-" symbols). As the ink 9, ink of a color different from that of the package 5 is used to enhance visibility. The adhesion thickness of the ink 9 is determined by the moving speed of the nozzle 8 and the ejection amount.
The depth is not higher than the depth of the recess 6 (for example, about -0.1 mm to -0.3 mm with respect to the depth of the recess 6). As a result, the applied ink is prevented from directly contacting a finger or the like, and the marking strength (abrasion resistance) is increased.

In this manner, the "sealed package 11" as shown in FIG. 5 can be manufactured. FIG. 5 is a perspective view of the package stamped according to the first embodiment. In FIG. 5, “1-2” is displayed as the display content of the package 11. 12 in the figure
This is a marking portion to which the ink 9 has been applied.

In the first embodiment, as shown in FIG. 3 described above, the “5” -shaped concave portion 6 is engraved on the package 5 so that the numbers “0 to 9” (or the symbols “−”) are formed. ) Can be arbitrarily stamped, and the package 5 can be used as it is even if the numerical display contents are changed.
Therefore, according to the first embodiment, the package 5 can be shared even when different numbers are displayed, and the stamping device (die) shown in FIGS. It has the advantage of not having to be done.

(Embodiment 2) FIG. 6 is a view for explaining another embodiment (embodiment 2) of the segment-marking convex portion, and is an enlarged view of the semicircular segment-marking convex portion. Example 1
The segment engraving projections 4 used in (1) and (2) are rectangular as shown in FIGS. 1 and 2, but in the second embodiment, as shown in FIG. This is an example of use. In this case, the engraved package has a semicircular concave shape.

(Embodiment 3) FIG. 7 is a view for explaining another embodiment (Embodiment 3) of the projection for marking a segment.
It is an enlarged view of the convex part for segment marking different from Example 1 and 2. As shown in FIGS. 2 and 6, the segment engraving projections 4 and 4a used in the first and second embodiments have a "figure of eight".
It is a convex part of a shape, and it is possible to display “arbitrary numbers from 0 to 9” and “sign of −”. On the other hand, in the third embodiment, the segment-marking convex portion 4b is used as shown in FIG.
This is an example in which arbitrary English characters "Z, a to z" are displayed.

As described above, the marking device and the marking method for an electronic component according to the present invention have been specifically described with reference to the first to third embodiments. In addition, the following modifications and changes are possible. For example, in FIG. 1 described above, an example is provided in which only a part of the upper mold 1 is provided with the segment-marking projections 4, but this may be provided in the lower mold 2, or in the upper mold 1 and the lower mold 2. , And both are included in the present invention.

In the first embodiment, the stamping apparatus shown in FIGS. 1 and 2 is used to form a mold. However, in the method of stamping an electronic component according to the present invention, the mold is formed by the following method. Instead, any of molding means such as press molding, laser processing molding, and NC processing molding can be adopted, and these are also included in the present invention.

Further, in the first embodiment, an ink jet printing apparatus 7 shown in FIG. 4 is used, and the ink 9 is jetted and adhered only to a necessary portion of the concave portion 6. Alternatively, a mask printing method can be adopted. As for the accuracy of the marking position, a means for determining the position of the package 5 by the package position fixing plate 10 shown in FIG. 4 is employed. By adjusting the position, the positional accuracy can be further improved.

Further, in the first embodiment, as shown in FIG. 3, an "8-shaped" concave portion 6 is stamped at three places on the package 5, and "8-shaped" is used as a segment character. Although there are three examples, the present invention is not limited to this, and may be one or more. However, in the present invention, for example, it is preferable that the number is three or more so that the required number of digits is obtained in consideration of a change in the number display in the future.

Further, in the present invention, as the convex portion for engraving the segment, the "8-shaped" convex portion for displaying an arbitrary number from 0 to 9 and a minus sign as described in the first and second embodiments is used. When,
It is also possible to use in combination with "a convex portion displaying" A to Z, any alphabetic character of a to z "" shown in FIG. 7 of the third embodiment, which is also included in the present invention. is there.

[0042]

As described in detail above, the present invention is characterized in that one or both of the molds is provided with a convex shape for engraving a concave portion common to display contents to be marked on an electronic component; A feature of engraving a common concave portion constituting a segment character on the surface of the electronic component, and applying ink only to a necessary portion of the concave portion, whereby the setting of the engraving device is changed every time display contents are changed. The effect is that there is no need to change.

As described above, according to the present invention, it is not necessary to set the marking device irrespective of the display content, so that the lead time can be reduced and the manufacturing cost can be reduced. In addition, a “package engraved with a common recess constituting a segment character on the exterior surface” manufactured according to the present invention.
Can be the same package irrespective of the contents of the seal display, and therefore, it is possible to reduce the parts management cost due to the change of the display contents.

Further, according to the present invention, the display content is stamped in the concave portion, and therefore, there is an effect that a stamp having high stamping strength and good visibility can be obtained.

As described above, according to the present invention, it is possible to use the same package (stamped) regardless of the contents of the stamp (stamped) while maintaining the stamping strength and visibility. It is possible to provide an "electronic device marking device and marking method" that does not require setting change of the marking device every time the display content is changed.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an embodiment (Embodiment 1) of a marking device for electronic components according to the present invention, and is a cross-sectional view of a marking device using a mold.

FIG. 2 is an enlarged perspective view of a segment stamping projection provided on the upper die of the stamping apparatus of FIG.
It is a figure showing the example which provided one in three places.

FIG. 3 is a perspective view of a package of the semiconductor device obtained according to the first embodiment;

FIG. 4 is a diagram illustrating an example of an ink application process according to the present invention, and is an enlarged view of a marking portion including an ink application device.

FIG. 5 is a perspective view of the package stamped according to the first embodiment.

FIG. 6 is a view for explaining another embodiment (Example 2) of the segment engraving projection according to the present invention, and is an enlarged view of the semicircular segment engraving projection.

FIG. 7 is a view for explaining another embodiment (Embodiment 3) of the segment-marking projection according to the present invention.
It is an enlarged view of the convex part for segment marking of another type.

FIG. 8 is a diagram illustrating a typical example of Conventional Example 1 (a technique described in Japanese Patent Application Laid-Open No. 61-228991), in which (A)
FIG. 2 is a partial plan view of a seal portion of the electronic component, and FIG. 2B is a cross-sectional view taken along line AA of FIG.

FIG. 9 is a conventional example 2 (the technology described in Japanese Patent Application Laid-Open No. Hei 4-7194).
FIG. 4 is a diagram illustrating a representative example of FIG. 3 and is a partial cross-sectional view of a stamp processing unit including an example of a stamp processing facility.

FIG. 10 is a view for explaining a typical example of Conventional Example 3 (the technique described in Japanese Patent Application Laid-Open No. 6-120281), and is a cross-sectional view of a main part of a mold.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Upper mold 2 Lower mold 3 Cavity 4, 4a, 4c Segment stamping convex part 5 Package in which the concave mold which constitutes a segment character was imprinted 6 Concave part which constitutes a segment character 7 Inkjet marking device 8 Nozzle 9 Ink 10 Package position fixing plate DESCRIPTION OF SYMBOLS 11 Package which was stamped 12 Marking part 81 Depressed part 82 Ink 90 Engraved part 91 Laser emission part 92 Condensing lens 93 Laser light 93a Laser condensing 94 Thermosetting powder ink jet nozzle 95 Thermosetting Powdered ink 96 Ink 97 Electronic component base material (made of plastic) 101 Upper die 102 Lower die 103 Marking part 103a Mark pin 104 Cavity

Claims (4)

(57) [Claims] 1. An electronic component marking device, comprising: a pair of dies; and one or both of the dies having a convex shape for engraving a concave portion common to display contents to be marked on the electronic component; The convex part is a convex part having a shape that does not require setting change when changing the display content. 2. The marking device for an electronic component according to claim 1, wherein the convex shape is a “8-shaped” convex shape and includes a plurality of convex shapes. 3. An electronic component according to claim 1, wherein a common concave portion constituting a segment character is stamped on the surface of the electronic component, and ink is applied only to a necessary portion of the concave portion to thereby imprint an arbitrary character. Sealing method. 4. The method according to claim 3, wherein the segment characters are a plurality of “8” characters.